JPH09293131A - Electronic tag and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic tag where the surface part of film-like resin is melted and it is adhered to external resin at the time of molding an external part and the connection of the external part and film-like resin is highly reliable by combining resins satisfying a condition that melting point or softening point of film-like resin is lower than the molding temperature of resin of external part. SOLUTION: The internal part 35 of an electronic tag 20 is filled by means of film-like resin 34 and the filled internal part is set in a metallic mold 37. Resin 39 having compatibility is filled to film-like resin 34 in the metallic mold at temperature higher than the melting point or softening point of film-like resin 34 so as to form external resin 33. Thus, the face part of film-like resin 34 melts at the time of molding external resin 33 and it is adhered to external resin 33 and the electronic tag 20 with high reliability on connection between the external part and film-like resin 34 is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used as a transponder storing tag information in an electronic tag identification system including a transponder and an interrogator for automatically identifying tag information attached to articles and the like. The present invention relates to a method for manufacturing an electronic tag.

[0002]

2. Description of the Related Art In recent years, as a system for automatically reading and identifying tag information attached to articles and the like,
An RFID tag identification system called a data carrier system, which is capable of handling a larger amount of information, has excellent environment resistance, and is capable of remote reading, has been actively developed in place of the barcode system known from the past.

This electronic tag identification system is composed of a transponder called an electronic tag attached to an article or the like and an interrogator connected to the host side, and magnetic and induction are provided between the transponder and the interrogator. The feature is that contactless communication is performed via a transmission medium such as an electromagnetic field and a microwave (radio wave).

The information transmission system of the electronic tag identification system includes an electromagnetic coupling system, an electromagnetic induction system, a microwave system, an optical communication system and the like. Among these methods, the electromagnetic coupling method and the microwave method can use the energy of the transmission signal from the interrogator as the driving power for the responder. For this reason, there is a further advantage that there is no fear that the response performance is degraded or the use limit is reduced due to the approaching life of the battery as in the case where the battery is used as a drive source.

[0005]

The internal components such as the antenna and the IC chip constituting the electronic tag are covered with a resin exterior part (hereinafter referred to as exterior resin) for protecting the internal parts from the external environment. I have. Since the infiltration of water etc. into the RFID tag may cause fatal damage to the internal components, precise sealing of the internal components with the exterior resin is essential for realizing a highly reliable RFID tag. .

[0006] The dense sealing of the internal parts by the exterior resin
This is most efficiently achieved if the exterior resin of the entire electronic tag can be integrally molded. However, the electronic tag is
Since the C package does not have a portion such as a lead frame or the like that can position the component in a floating state in the molding die, it is difficult to obtain the exterior resin by molding once.

Conventionally, in the manufacture of an electronic tag, the internal parts of the electronic tag are put in a resin case which is made in advance, and another resin part is put on the lid, and the case and the lid are glued and heat-sealed. The method of joining such as ultrasonic welding is exclusively used.

However, when the case and the lid are joined with an adhesive, there is a concern that the joint interface may separate during use due to external impact, expansion and contraction due to temperature change, etc., and moisture or the like may enter from there. . In addition, in the method using heat welding or ultrasonic welding, the appearance of the joint is deteriorated and the cost is high.

A method is also conceivable in which a resin case and internal parts are put in a mold, a portion to be a lid is resin-molded, and at the same time, the surface of the case is melted by the heat of the resin to melt and integrate the case and the lid. However, in this method, when the same kind of resin is used so as to obtain good bonding strength as the resin used as the case material and the molding resin, the surface of the resin case is melted and the case and the lid are integrated. Therefore, the resin temperature at the time of molding has to be considerably higher than the normal temperature, which causes discoloration and decomposition of the resin, and also causes problems such as peeling and deformation due to molding shrinkage.

The present invention is intended to solve such problems, and an object thereof is to provide an electronic tag which is excellent in environment resistance and durability and which can improve the production efficiency, and a manufacturing method thereof.

[0011]

In order to achieve the above-mentioned object, the electronic tag of the present invention transmits and receives signals in a non-contact manner between a circuit component including a storage element for storing tag information and an external device. In an electronic tag including an antenna for performing as an internal component, a film-shaped resin encapsulating the internal component, and an exterior part for protecting the internal component encapsulated by the film-shaped resin are provided. The exterior part is made of resins having compatibility with each other, and the melting point or softening point of the film-shaped resin is lower than the molding temperature of the resin for the exterior part.

Further, the method for manufacturing an electronic tag of the present invention comprises, as internal components, a circuit component including a storage element for storing tag information and an antenna for transmitting and receiving a signal to and from an external device in a non-contact manner. In the method of manufacturing an electronic tag, an internal component is encapsulated with a film-shaped resin, and the internal component encapsulated with the film-shaped resin is set in a molding die,
A resin having compatibility with the film-shaped resin is injected into the mold at a temperature higher than the melting point or softening point of the film-shaped resin to mold the exterior part.

According to the present invention, the effect of preventing invasion of moisture or the like by the film-like resin is increased, and the internal parts can be more reliably protected from the external environment.

Further, according to the present invention, the film-shaped resin can be used as a support for fixing the internal parts to the floating position in the mold at the time of molding the exterior part. It becomes possible to perform integral molding, and also from this point, it becomes possible to realize an electronic tag having excellent environmental resistance.

Furthermore, according to the present invention, since it is possible to integrally mold the exterior portion with resin, productivity is improved and cost is reduced.

Further, according to the present invention, the film-like resin and the resin for the exterior part are compatible with each other, and the melting point or softening point of the film-like resin is lower than the molding temperature of the resin for the exterior part. Since the combination of the resins is satisfied, the surface portion of the film-like resin is melted and adhered to the exterior resin at the time of molding the exterior portion, and an electronic tag with high reliability in joining the exterior portion and the film-like resin can be obtained.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a functional block diagram showing the overall configuration of the electronic tag identifying system according to the present invention.

As shown in the figure, this electronic tag identification system includes an interrogator 10 and a responder (hereinafter referred to as an electronic tag).
20.

The interrogator 10 stores a main control unit 11 that controls the entire interrogator 10, an interface unit 12 that controls input and output of data to and from a host device, and tag information received from the electronic tag 20. A storage unit 13 such as a readable / writable RAM, a signal conversion unit 14 that converts transmission information from a parallel signal to a serial signal, and a reception signal from the electronic tag 20 from a serial signal to a parallel signal, and a transmission signal For example, ASK (Amplitude Shift
Keying) system, a FSK (Frequency Shift Keying) system, or the like, and a modulation unit 15 for modulating a signal for transmission, a demodulation unit 16 for demodulating a received signal, a transmission antenna 17, and a reception antenna 18. .

The electronic tag 20 includes a main control section 21 for controlling the entire electronic tag 20 and an EEP for accumulating tag information.
A storage unit 22 such as a ROM that does not require a power supply backup, a signal conversion unit 23 that converts transmission information from a parallel signal to a serial signal, and converts a reception signal from the interrogator 10 from a serial signal to a parallel signal, Modulation unit 24 that modulates a signal for transmission by ASK method, FSK method, etc.
And a demodulation unit 25 for demodulating a received signal, and a transmission antenna 2
6 and a receiving antenna 27. next,
A basic communication procedure of the electronic tag identification system will be described.

The interrogator 10 first transmits an interrogation signal to the electronic tag 20 for reading tag information. When the electronic tag 20 enters the receivable range of the interrogation signal, it receives the interrogation signal and transmits the tag information stored in the storage unit 22 as a response signal. The interrogator 10 receives and decodes this response signal, and sends it to the host device as tag identification information.

FIG. 2 is a plan view showing the electronic tag 20, and FIG. 3 is a sectional view thereof. In these figures, 31 is an IC chip, and each functional circuit section except the transmitting / receiving antennas 26 and 27 shown in FIG. 1 is built in this IC chip 31. Reference numeral 32 is an antenna portion corresponding to the transmission / reception antennas 26 and 27 shown in FIG. 1, 33 is an exterior resin, and 34 is a film resin. As the antenna 32, for example, a coil antenna formed by winding a resin-coated copper wire in a coil shape, or an antenna patterned in a spiral shape using a conductive paste on a substrate is used.

The exterior resin 33 and the film resin 34 are made of different types of resins having compatibility with each other. At least the surface portion of the film-shaped resin 34 is melted by the resin heat at the time of molding the exterior resin 33, whereby the exterior resin 3
Melt adhesion with 3 has been achieved. Therefore, the melting point or softening point of the film resin is required to be lower than the molding temperature of the exterior resin.

As a combination of resins satisfying the above conditions, for example, a film resin such as polystyrene, an exterior resin such as polyphenylene ether, a film resin such as polyvinyl chloride, and an exterior resin such as polymethylmethacrylate, There are combinations such as polypropylene for film resin and polypropylene / nylon 66 alloy for exterior resin.

A combination of acrylonitrile / butadiene / styrene copolymer resin as the film resin and an alloy of acrylonitrile / butadiene / styrene copolymer resin and polycarbonate resin as the exterior resin, that is, the film resin is alloyed into the exterior resin, A combination using a resin having an increased melting point or a softening point, or conversely, a combination of polyethylene and polyethylene terephthalate in the film-like resin and polyethylene terephthalate in the exterior resin, that is, by alloying the exterior resin in the film-like resin, A combination using a resin whose melting point or softening point is lowered can be mentioned.

Further, even in a combination of resins which are originally incompatible with each other, a compatibilizing agent may be added to either one so as to be compatible with the other resin. Furthermore, if necessary, glass fiber, talc,
Fillers such as silica and mica may be added.

Hereinafter, a method of manufacturing an electronic tag having such a configuration will be described with reference to FIGS.

First, the internal parts of the electronic tag including the IC chip 31 and the antenna 32 are sealed (sealed) with the film-like resin 34. For example, as shown in FIG. 4, the internal parts 35 of the electronic tag are arranged between the upper and lower film-shaped resins 34, and these are passed between a pair of heat rolls 36a and 36b, so that the internal parts 35 and the film-shaped resin 34 are formed. The resin 34 is brought into close contact with the entire surface and the upper and lower film-shaped resins 34 are welded to each other.

In the step of enclosing the electronic tag internal component, a hot press, a hot stamp or the like can be used instead of the hot roll. In this method, it is possible to adopt a method in which the upper and lower film-like resins are welded only around the internal parts of the electronic tag. If the electronic tag internal component can be hermetically sealed in a fixed position, the electronic tag internal component and the film-shaped resin may not be completely adhered to each other in this manner.

The shape of the film-shaped resin is not limited to a simple sheet shape, but a tubular or bag-like shape may be used. Further, in order to improve the supply efficiency of the film-shaped resin, as shown in FIG. 4, two elongated film-shaped resins wound in a roll shape may be simultaneously drawn out and used. Further, the above operation may be performed in a vacuum so that air does not enter between the film-like resin, for example, the electronic tag internal parts may be sealed with the film-like resin using a vacuum press or the like.

Next, as shown in FIGS. 5 and 6, the electronic tag internal component 35 enclosed in the film resin 34 is set in a molding die 37, and the film resin 34 is placed in the die 37. Resin 39 compatible with (a resin heated to a temperature higher than the melting point or softening point of the film-shaped resin 34)
Is press-fitted to mold the exterior resin 33. As a result, at least the surface portion of the film-shaped resin 34 is melted and the resin 3
9, and the film-like resin 34 and the exterior resin 33 are melt-bonded to each other.

At this time, for example, the film-like resin 34 protruding from both ends of the mold 37 is pulled from both sides so that the electronic tag internal component 35 in the mold 37 does not move by the resin pressure. . Alternatively, the film-like resin 34 is strongly sandwiched between the molds 37 while the film-like resin 34 is being tensioned when the molding die is clamped, or a hole provided in the film-like resin 34 is inserted into a pin standing on the mold 37. Also, the position of the electronic tag internal component 35 can be fixed in the mold 37.

Thus, according to the electronic tag of the present embodiment, the film-like resin 34 increases the effect of preventing the intrusion of water and the like, and the internal parts 35 can be protected more reliably from the external environment. Further, since the film-shaped resin 34 can be used as a support for fixing the internal parts to the floating position in the mold when the exterior resin 33 is molded, the exterior resin 33 can be integrally molded, From this point as well, it becomes possible to realize an electronic tag having excellent environment resistance. Furthermore, since the exterior resin 33 can be integrally molded, it is possible to provide an electronic tag having high mechanical strength and improved productivity and reduced cost.

Further, in the electronic tag of this embodiment, the film resin 34 and the exterior resin 33 are compatible with each other, and the melting point or softening point of the film resin 34 is lower than the molding temperature of the exterior resin 33. Since the exterior resin 33 is formed of a combination of resins that satisfy the conditions, the surface portion of the film-like resin 34 is melted and adhered to the exterior resin 33 during the molding of the exterior resin 33, so that the exterior resin 33 and the film-like resin 34 have high bonding reliability. An electronic tag is obtained.

[0036]

Embodiments of the present invention will be described below.

First, the plane size is 6 mm × 6 mm and the thickness is 0.
An internal component of the electronic tag was manufactured by electrically joining an IC chip of 5 mm and an antenna wound in a loop shape of 20 mm in diameter.

Next, as shown in FIG. 4, a width of 30 mm,
An electronic tag internal component 35 is sandwiched between two film-shaped resins 34 made of polystyrene resin having a thickness of 0.05 mm,
The film-shaped resins 34 were welded to each other while the air inside was removed by using the heat rollers 36a and 36b at a temperature of 180 ° C., and the electronic tag internal component 35 was sealed in the film-shaped resin 34. At this time, a long film-like resin was used, and the electronic tag internal parts were continuously enclosed at intervals of 10 cm.

Next, as shown in FIGS. 5 and 6, an injection molding die 37 having a space having a diameter of 35 mm and a thickness of 3 mm.
Internal parts 3 enclosed in the film-like resin 34
5 is inserted into the film while applying tension, the mold 37 is clamped, and the mold clamping force is used to fix the internal component 35 at a fixed position in the mold space, and then polyphenylene ether heated to 260 ° C. from the molding machine nozzle 38. The resin 39 was press-fitted into the mold 37 to form the exterior resin 33 of the electronic tag, and the internal component 35 was bonded and fixed in the exterior resin 33 together with the film resin 34.

Next, the mold 37 is opened, and the film-shaped resin 3
4 is shifted by 10 cm, the next internal component 35 is inserted into the mold space, the exterior resin 33 is molded again, and the film-like resin 34 around the molded exterior resin 33 is replaced with the exterior resin 3.
3 was cut along the outer shape to complete the electronic tag.

[0041]

As described above, according to the present invention, the effect of preventing moisture and the like from being invaded by the film-like resin is increased, and the internal parts can be more reliably protected from the external environment.

Further, according to the present invention, the film-shaped resin can be used as a support for fixing the internal parts to the floating position in the mold at the time of molding the exterior part. It becomes possible to perform integral molding, and also from this point, it becomes possible to realize an electronic tag having excellent environmental resistance.

Further, according to the present invention, since it is possible to integrally mold the exterior part with resin, the productivity is improved and the cost is reduced.

Further, according to the present invention, the film-like resin and the resin for the exterior portion are compatible with each other, and the melting point or softening point of the film-like resin is lower than the molding temperature of the resin for the exterior portion. Since the combination of the resins is satisfied, the surface portion of the film-like resin is melted and adhered to the exterior resin at the time of molding the exterior portion, and an electronic tag with high reliability in joining the exterior portion and the film-like resin can be obtained.

[Brief description of drawings]

FIG. 1 is a functional block diagram showing the overall configuration of an electronic tag identification system.

FIG. 2 is a plan view showing the electronic tag of FIG.

FIG. 3 is a sectional view of the electronic tag of FIG.

FIG. 4 is a diagram showing a process of encapsulating electronic tag internal parts in a film-shaped resin.

FIG. 5 is a diagram showing a process of setting an electronic tag internal component enclosed in a film-shaped resin in a molding die.

FIG. 6 is a diagram showing a molding process of the exterior resin.

[Explanation of symbols]

 20 ... Electronic tag 31 ... IC chip 32 ... Antenna 33 ... Exterior resin 34 ... Film-like resin 35 ... Electronic tag internal parts 36a, 36ba ... Heat roll 37 ... Mold for molding

Claims (2)

[Claims] 1. An electronic tag comprising, as internal components, a circuit component including a storage element for storing tag information and an antenna for transmitting and receiving signals to and from an external device in a non-contact manner. A film-shaped resin, and an exterior part that protects the internal parts sealed with the film-shaped resin, wherein the film-like resin and the exterior part are made of resins having compatibility with each other, and An electronic tag, wherein the melting point or softening point of the resin is lower than the molding temperature of the resin for the exterior part. 2. A method for manufacturing an electronic tag, comprising a circuit component including a storage element for storing tag information and an antenna for transmitting and receiving a signal to and from an external device in a non-contact manner as internal components. A part is sealed with a film resin, the internal part sealed with the film resin is set in a molding die, and a resin having compatibility with the film resin is placed in the mold. A method of manufacturing an electronic tag, comprising injecting at a temperature higher than a melting point or a softening point of the film-shaped resin to mold the exterior part.