JPH09283649A - Electronic component housing package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To adhere moisture to a high-frequency transmission line and prevent changes in impedance of a micro strip line, by setting the distance between the surface of a high-frequency transmission line housed inside of a space formed by an insulating board and a first cover member and the inner surface of the first cover member to a predetermined value or greater. SOLUTION: A bowl-like first cover member 7 is joined with the upper surface of an insulating board 1 via a first sealing member 8, and a high-frequency transmission line 2 is hermetically housed in an inner space formed by the insulating board 1 and the first cover member 7. Therefore, moisture contained in the atmosphere is adhered to the high-frequency transmission line 2, thereby enabling effective prevention of generation of any change in impedance of a micro strip line formed by an earthing conductor 6 arranged within the insulating board 1 and the high-frequency transmission line 2. Also, since the distance L between the inner surface of the first cover member 7 and the surface of the high-frequency transmission line 2 is set to 200μm or greater, the dielectric constant of the first cover member 7 does not affect the high-frequency transmission line 2 and the micro strip line may be set to a desired value.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage package used for storing electronic components mounted in communication equipment such as mobile phones.

[0002]

2. Description of the Related Art Conventionally, a large number of electronic devices are incorporated in communication equipment such as mobile phones. In recent years, communication devices such as mobile phones have been rapidly reduced in size and increased in functionality, and electronic devices mounted therein are also required to be downsized and multifunctional, and are used in electronic devices at the same time. There is a growing demand for electronic component storage packages that are smaller and have more functions.

For example, as shown in FIG. 2, a duplexer using a SAW (surface acoustic wave element) filter for switching between transmission and reception of a mobile phone generally has a ground conductor 22 inside and a main surface side. The high-frequency transmission line 23 has two recesses 2 in which the SAW filter is mounted and accommodated on the other main surface side.
And an insulating substrate 21 made of an electrically insulating material such as an aluminum oxide sintered body having No. 4 and two concave portions 24 attached to the other main surface side of the insulating substrate 21 and in which the SAW filter is mounted and accommodated. An electronic component storing package including a lid member 25 is prepared, and the transmitting SA is provided in each of the two recesses 24 provided in the insulating substrate 21 of the electronic component storing package.
The W filter 26a and the receiving SAW filter 26b are housed, and the electrodes of the SAW filters 26a and 26b are connected to a predetermined metallized wiring layer 27 via bonding wires 28. Thereafter, the insulating substrate 21 is covered with a lid member 25. The SAW filters 26a and 26b for transmission / reception are hermetically housed inside a container formed of the insulating substrate 21 and the lid member 25 by joining them through a sealing member such as glass, resin, or brazing material.

In such a duplexer, since the transmitting SAW filter 26a and the receiving SAW filter 26b have different pass band impedances, for example, a receiving SAW is used.
The filter 26b includes a high frequency transmission line 23 and a ground conductor 22.
A microstrip line formed by sandwiching a part of the insulating substrate 21 between and is connected to the SAW filter 26 for transmission and reception by performing phase rotation.
The impedances of a and 26b are matched with the circuit impedance.

In the package for housing electronic components, the high frequency transmission line 2 provided on the one main surface side of the insulating substrate 21.
3 is made of a refractory metal material such as tungsten or molybdenum, and gold having an extremely small electric resistance value is deposited on the surface by a plating method.

The high-frequency transmission line 23 is covered with a coating material 29 made of an organic resin such as epoxy resin, so that the high-frequency transmission line 23 is effectively prevented from being oxidized and corroded.

[0007]

However, in this conventional package for housing electronic components, the high-frequency transmission line provided on the one main surface side of the insulating substrate is covered with a covering material made of an organic resin. Since the organic resin that forms the material has poor moisture resistance, the moisture contained in the atmosphere easily penetrates, and when the moisture penetrates into the coating material, the relative permittivity of the coating material changes and the high-frequency transmission line and the ground conductor are separated. There is a drawback that the impedance of the formed microstrip line changes, and the impedance of each of the transmitting and receiving SAW filters cannot be accurately matched to the circuit impedance.

[0008]

According to the present invention, there is provided an insulating substrate having a grounding conductor inside, a high frequency transmission path on one main surface side, and a mounting portion on which another electronic surface is mounted. A first lid member is attached to one main surface side of the insulating substrate via a first sealing member and accommodates a high-frequency transmission path inside, and a second sealing member is provided on the other main surface side of the insulating substrate. A second lid member that is attached via the second lid member that houses the electronic component of the electronic component mounting portion inside, and is a package for storing an electronic component, wherein a surface of the high-frequency transmission path and an inner surface of the first lid member are provided. The distance between them is 200 μm
The above is the feature.

The present invention is also characterized in that the melting temperature of the first sealing member is higher than the melting temperature of the second sealing member.

According to the electronic component storage package of the present invention, the high-frequency transmission line provided on the one main surface side of the insulating substrate is stored inside the void formed by the insulating substrate and the first lid member. Therefore, moisture contained in the atmosphere does not adhere to the high-frequency transmission line, and the impedance of the microstrip line formed by the ground conductor arranged inside the insulating substrate and the high-frequency transmission line does not change.

Further, since the distance between the high frequency transmission line and the inner surface of the first lid member is 200 μm or more, the relative permittivity of the first lid member does not affect the high frequency transmission line, which also results in insulation. There is no change in the impedance of the microstrip line formed by the ground conductor and the high-frequency transmission line arranged inside the substrate.

Further, the melting temperature of the first sealing member for attaching and joining the first lid member to the one main surface side of the insulating substrate is the second for attaching and joining the second lid member to the other main surface side of the insulating substrate. Since the temperature is higher than the melting temperature of the sealing member, after mounting the electronic component on the insulating substrate, the second lid member is attached and bonded to the other main surface side of the insulating substrate via the second sealing member. When airtightly sealing the electronic component inside the container formed by the second lid member and the second lid member,
The first sealing member that attaches and bonds the first lid member to the insulating substrate is softened and melted by the heat of heating and melting the sealing member, and the container formed by the insulating substrate and the first lid member is hermetically sealed. Therefore, the high-frequency transmission line is formed inside the container formed by the insulating base and the first lid member, and the electronic component is formed inside the container formed by the insulating base and the second lid member in an airtight manner. It is possible to store a desired function as an electronic device for a long period of time.

[0013]

Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment in which the electronic component storing package of the present invention is used as a duplexer for switching between transmission and reception of a mobile telephone, 1 is an insulating substrate, and 2 is a high frequency transmission line.

On the lower surface of the insulating substrate 1, there is an S for transmission and reception.
It has two recesses 1a in which an AW filter is mounted and housed, and each of the recesses 1a has a SAW filter 3a for transmission.
The receiving SAW filter 3b is attached and fixed via an adhesive.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, and a glass ceramic sintered body. When it is made of an aluminum oxide sintered body, it is made into a sludge form by adding and mixing an appropriate binder and solvent to raw material powders of aluminum oxide, silicon oxide, calcium oxide, magnesium oxide, etc. A ceramic green sheet is obtained by adopting the method to form a sheet, and thereafter, the ceramic green sheet is punched into an appropriate shape by a punching method and, if necessary, a plurality of sheets are laminated, and finally the ceramic green sheet. It is produced by firing the sheet at a temperature of about 1600 ° C. in a reducing atmosphere.

The insulating substrate 1 is a SAW for transmission / reception.
Two recesses 1a in which the filters 3a and 3b are mounted and housed
A plurality of metallized wiring layers 4 are adhered and formed from the periphery to the lower surface, and the electrodes of the SAW filters 3a and 3b for transmission and reception are electrically connected to the recessed portion 1a of the metallized wiring layer 4 via bonding wires 5. Connected to the
Further, the part led out to the lower surface of the insulating substrate 1 is connected to an external electric circuit.

The metallized wiring layer 4 is made of tungsten,
A metal paste made of a high melting point metal powder such as molybdenum and obtained by adding and mixing an appropriate binder and a solvent to the high melting point metal powder such as tungsten is previously screen-printed on the ceramic green sheet serving as the insulating substrate 1 in advance. By printing and applying a predetermined pattern by a method, the insulating substrate 1 is adhered and formed from the periphery of the recess 1a to the lower surface.

A nickel layer and a gold layer are sequentially deposited on the surface of the metallized wiring layer 4 by adopting a plating method, and a bonding wire to the metallized wiring layer 4 is formed by the nickel layer and the gold layer. The connection of No. 5 is made strong.

Further, a high-frequency transmission line 2 is embedded on the upper surface of the insulating substrate 1, and a ground conductor 6 is embedded therein. A part of the insulating substrate 1 is interposed between the high-frequency transmission line 2 and the ground conductor 6. A microstrip line is formed by sandwiching. This microstrip line is connected to, for example, a SAW filter 3b for reception, and by performing phase rotation, the SAW filter 3a for transmission.
Even if the pass band impedances of the receiving SAW filter 3b are different from each other, both of them are matched to the same circuit impedance.

The high frequency transmission line 2 formed on the upper surface of the insulating substrate 1 and the grounding conductor 6 embedded in the insulating substrate 1 are each made of a refractory metal powder such as tungsten or molybdenum, and are metallized as described above. By a method similar to that for the wiring layer 4, specifically, a metal paste obtained by adding and mixing an appropriate binder and solvent to a refractory metal powder such as tungsten is prepared, and this is used as a ceramic green sheet to be the insulating substrate 1. The high-frequency transmission line 2 is adhered to the upper surface of the insulating substrate 1 and the ground conductor 6 is adhered from the inside of the insulating substrate 1 to the lower surface of the insulating substrate 1 by printing and applying a predetermined pattern by a screen printing method known in the prior art. It

On the surface of the high-frequency transmission line 2, a coating 2a made of a metal material having an electric resistivity of 7 μΩ · cm or less such as gold is deposited by using, for example, an electrolytic plating method. The electric resistance value of the high-frequency transmission line 2 is made extremely small by the 2a, and the propagation loss is made extremely small even when a high-frequency transmission signal or a reception signal is passed through the high-frequency transmission line 2.

Further, a bowl-shaped first lid member 7 is provided on the upper surface of the insulating substrate 1 via a first sealing member 8 so as to accommodate the high frequency transmission line 2 formed on the upper surface inside. The high frequency transmission line 2 is hermetically housed in the internal space formed by the insulating substrate 1 and the first lid member 7.

The first lid member 7 is made of, for example, the same electrically insulating material as the insulating substrate 1, and has the high frequency transmission line 2 inside.
Since airtightly accommodates the moisture contained in the atmosphere to the high frequency transmission line 2, the impedance of the microstrip line formed by the ground conductor 6 disposed inside the insulating substrate 1 and the high frequency transmission line 2 is increased. It effectively prevents changes from being introduced.

The distance L between the inner surface of the first lid member 7 and the surface of the high frequency transmission line 2 provided on the upper surface of the insulating substrate 1 is L.
Is 200 μm or more, so that the relative permittivity of the first lid member 7 does not affect the high frequency transmission line 2 and is formed by the ground conductor 6 and the high frequency transmission line 2 arranged inside the insulating substrate 1. The impedance of the formed microstrip line can be set to a desired value.

The distance L between the inner surface of the first lid member 7 and the surface of the high frequency transmission line 2 provided on the upper surface of the insulating substrate 1 is 2
When the thickness is less than 00 μm, the high frequency transmission line 2 is affected by the relative permittivity of the first lid member 7, and the impedance of the microstrip line formed by the ground conductor 6 and the high frequency transmission line 2 arranged inside the insulating substrate 1 is reduced. It changes abruptly, and it becomes impossible to accurately obtain a desired impedance.
Therefore, the distance L between the inner surface of the first lid member 7 and the surface of the high frequency transmission line 2 provided on the upper surface of the insulating substrate 1 is 200 μm.
Specified above.

Further, the first lid member 7 is joined to the upper surface of the insulating substrate 1 via the first sealing member 8 so as to accommodate the high frequency transmission line 2 inside, and the first sealing member 8 is formed. Is a second part for attaching and joining the second lid member 9 to the insulating substrate 1 described later.
The melting temperature is higher than that of the sealing member 10, for example, lead oxide 3
0 to 50% by weight, lead fluoride 10 to 20% by weight, bismuth oxide 3 to 13% by weight, boron oxide 1 to 5% by weight, zinc oxide 1 to 5% by weight, lead titanate-based compound 25 to 45% by weight
Glass consisting of is preferably used.

The attachment and joining of the first lid member 7 to the insulating substrate 1 via the first sealing member 8 is carried out by, for example, 30 to 50% by weight of lead oxide and 10 to 20% by weight of lead fluoride. , Bismuth oxide 3 to 13% by weight, boron oxide 1 to 5% by weight, zinc oxide 1 to 5% by weight, lead titanate compound 25 to 45% by weight, etc. The glass paste thus obtained is previously applied by printing on the lower surface side of the first lid member 7 by a screen printing method or the like, and then the glass paste on which the first lid member 7 is adhered is insulated on the upper surface of the insulating substrate 1. The substrate 1 is placed in contact with the upper surface of the substrate 1 and then heated to a temperature of about 320 to 400 ° C. to burn off the organic solvent and solvent in the glass paste and heat and melt the glass powder. Be seen.

Thus, according to this electronic component storing package, the transmitting SAW filter 3a and the receiving SAW filter 3 are provided in the two recesses 1a provided on the lower surface of the insulating substrate 1.
b is bonded and fixed via an adhesive, and the electrodes of the SAW filters 3a and 3b are fixed to the predetermined metallized wiring layer 4
To the lower surface of the insulating substrate 1 with the second lid member 9 and the second sealing member 10.
The SAW filter 3a for transmission / reception is attached inside the container formed by the insulating substrate 1 and the second lid member 9 by attaching and bonding via the
By air-tightly housing 3b, it becomes a duplexer as a product.

The second lid member 9 attached to the lower surface side of the insulating substrate 1 is made of, for example, a metal material such as iron-nickel-cobalt alloy or iron-nickel alloy, or an aluminum oxide sintered material similar to the insulating substrate 1. When formed of an inorganic insulating material such as a tie, and when formed of a metal material, an ingot (lump) of iron-nickel-cobalt alloy or the like is subjected to a conventionally known metal processing method such as a rolling method or a punching method. In the case of being formed by the above method, or formed of an inorganic insulating material, it is manufactured by the same method as the above-mentioned insulating substrate 1.

The second sealing member 10 for attaching and joining the second lid member 9 to the lower surface side of the insulating substrate 1 is, for example, the first sealing member made of gold-tin alloy, gold-germanium alloy, tin-lead alloy or the like. A material having a melting temperature lower than the melting temperature of the sealing member 8 is preferably used, and the melting temperature of the second sealing member 10 is set lower than the melting temperature of the first sealing member 8.
When the lid member 9 is attached and joined via the second sealing member 10 and the SAW filters 3a and 3b for transmission and reception are hermetically sealed inside the container formed by the insulating substrate 1 and the second lid member 9. , The first sealing member 8 that attaches and joins the first lid member 7 to the insulating substrate 1 is softened and melted by the heat of heating and melting the second sealing member 10, and the insulating substrate 1 and the first lid member 7 The airtight seal of the container formed by does not break, so that the high-frequency transmission line 2 is provided inside the container formed by the insulating base 1 and the first lid member 7, the insulating base 1 and the second lid member 9 are formed. SAW filter 3a for transmission and reception inside the container formed by
It becomes possible to house 3b in an airtight manner and to exhibit desired functions as an electronic device for a long period of time.

The present invention is not limited to the above-mentioned embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-mentioned embodiment, two SAW filters are used. The duplexer used in the mobile phone used has been described as an example, but the present invention is not limited to this, and the high frequency transmission path is provided on the one main surface side of the insulating substrate having the ground conductor inside, It is also applicable to other electronic devices such as a voltage controlled oscillator formed by mounting electronic components on the main surface side.

Further, in the above-mentioned embodiment, the concave portion 1a in which the two electronic components are mounted and accommodated is formed on the lower surface side of the insulating substrate 1, but the number may be one or three or more.

Further, in the above-described embodiment, the bowl-shaped first lid member 7 is attached and joined to the upper surface side of the insulating substrate 1 via the first sealing member 8. Provided, first
The lid member 7 may have a flat plate shape.

[0034]

According to the electronic component storage package of the present invention, the high-frequency transmission line provided on the one main surface side of the insulating substrate is stored inside the void formed by the insulating substrate and the first lid member. As a result, moisture contained in the atmosphere does not adhere to the high frequency transmission line, and the impedance of the microstrip line formed by the ground conductor arranged inside the insulating substrate and the high frequency transmission line does not change.

Further, since the distance between the high frequency transmission line and the inner surface of the first lid member is 200 μm or more, the relative permittivity of the first lid member does not affect the high frequency transmission line, which also results in insulation. There is no change in the impedance of the microstrip line formed by the ground conductor and the high-frequency transmission line arranged inside the substrate.

Further, the melting temperature of the first sealing member for attaching and joining the first lid member to the one main surface side of the insulating substrate is the second for attaching and joining the second lid member to the other main surface side of the insulating substrate. Since the temperature is higher than the melting temperature of the sealing member, after mounting the electronic component on the insulating substrate, the second lid member is attached and bonded to the other main surface side of the insulating substrate via the second sealing member. When airtightly sealing the electronic component inside the container formed by the second lid member and the second lid member,
The first sealing member that attaches and bonds the first lid member to the insulating substrate is softened and melted by the heat of heating and melting the sealing member, and the container formed by the insulating substrate and the first lid member is hermetically sealed. Therefore, the high-frequency transmission line is formed inside the container formed by the insulating base and the first lid member, and the electronic component is formed inside the container formed by the insulating base and the second lid member in an airtight manner. It is possible to store a desired function as an electronic device for a long period of time.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of an electronic component storage package according to the present invention.

FIG. 2 is a sectional view of a conventional electronic component storage package.

[Explanation of symbols]

 1 ... Insulating substrate 2 ... High-frequency transmission path 3a, 3b ... SAW filter as an electronic component 6 ... Ground conductor 7 ... First lid member 8 ... .... first sealing member 9 ... second lid member 10 ... second sealing member

Claims (2)

[Claims] 1. An insulating substrate having a ground conductor inside, a high-frequency transmission line on one main surface side, and a mounting portion on which the electronic component is mounted on the other main surface side; and one main surface side of the insulating substrate. A first sealing member that is attached to the inside of the first high-frequency transmission path
An electronic component storage package comprising a lid member and a second lid member which is attached to the other main surface side of the insulating substrate via a second sealing member and accommodates the electronic component of the electronic component mounting portion inside. An electronic component storage package, wherein the distance between the surface of the high-frequency transmission path and the inner surface of the first lid member is 200 μm or more. 2. The package for storing electronic components according to claim 1, wherein the melting temperature of the first sealing member is higher than the melting temperature of the second sealing member.