JPH09278080A - Container case for semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve various problems resulting from foreign materials like mold dregs or solder chips which have stuck to a semiconductor package. SOLUTION: This container package is used to contain a semiconductor package 4 provided with the package body 5 and the lead terminal 7 extended from the package body 5. A brush 10 for removing foreign materials is provided in the lead container 8 in the state at least it contacts the front end of the lead terminal 7, in an IC tray 1 provided with a package receiver 6 on which the package body 5 is put, and the lead container 8 formed along the periphery of the package receiver 6, in the tray body 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage case for a semiconductor package which is used during transportation between manufacturing processes and shipping of products.

[0002]

2. Description of the Related Art Generally, in a semiconductor manufacturing process, a sealing process (molding process, etc.) for hermetically sealing a semiconductor element (chip) and a subsequent finishing process (flash removing process,
Through a soldering process, a lead processing process, a marking process, etc.), a semiconductor package having an external appearance is obtained. Finally, the product is sent to a sorting process including an electrical characteristic inspection, a visual inspection, etc., and only products judged to be good products are shipped as products. At this time, the semiconductor packages that have been subjected to the lead processing are placed in the tray, for example, in a predetermined number for each lot. After that, the sheets are sequentially conveyed to each process while being stored in the tray. Further, even when the product is shipped, the semiconductor package may be stored in the tray and carried out.

FIG. 6 is a diagram for explaining the structure of a conventional IC tray, in which (a) is a partial perspective view thereof.
FIG. 7B is a sectional view of a main part in a package housed state. In the IC tray 30 shown in FIG. 6, the package housing recesses 32 are arranged in a grid pattern on the upper surface side of the tray body 31. The semiconductor package 33 is provided in each recess 32.
Package receiving portion 3 on which the package main body 34 is placed
5 and a lead accommodating portion 37 for accommodating the lead terminals (outer leads) 36 extending from the package body 34.
Are provided. In addition, the semiconductor package 3 is actually
When 3 is stored in the IC tray 30, the lead terminal 36 extending from the package body 34 is held in a floating state in order to prevent the lead from being deformed by an external force.

[0004]

By the way, the semiconductor package 33 which has undergone the molding process and the soldering process
Foreign matter such as mold debris and solder scraps may be attached to the. In such a case, if the semiconductor package 33 with foreign matter attached is stored in the IC tray 30 and sent to the sorting step, various problems may occur there. For example, if mold residue or solder scraps are attached to the lead terminal 36, the lead terminal 37 does not come into proper contact with the terminal portion of the adapter socket or the like during the electrical characteristic inspection, and a contact check indicates a contact failure. However, even if the product is determined to be non-defective, the actual characteristic check (function test) may result in NG. Further, there is a possibility that the foreign matter adhered to the lead terminal 36 may be transferred to the contact portion of the measurement system, and this foreign matter may be accumulated to prevent normal inspection. Furthermore, in visual inspection, there is a possibility that a large amount of foreign matter adheres to the product, or it may become defective because it adheres to locations where it should not adhere. There was also

Such a problem is that even if foreign matter does not adhere to the IC tray 30 at the time of storing the semiconductor package 33, the IC tray 30 is used for transporting the semiconductor package 33 to which the foreign matter has adhered before. If this is the case, then this is a potential problem as well. That is, it is conceivable that foreign matter may be scattered inside the IC tray 30 due to vibration during transportation or natural fall, and the foreign matter may be attached (reattached) to the lead terminal 37 to cause the same problem as described above.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor package which can solve various problems caused by foreign matters such as mold dust and solder scraps adhering to the semiconductor package. To provide a storage case.

[0007]

The present invention has been made to achieve the above-mentioned object, and is for accommodating a semiconductor package having a package body and lead terminals extending from the package body, A storage case for a semiconductor package, comprising: a package receiving section on which a package body is placed; and a lead receiving section provided along a peripheral edge of the package receiving section to accommodate a lead terminal, in a case body. As a characteristic part thereof, a foreign substance removing brush is provided in the lead accommodating portion in a state of being in contact with at least the tip portion of the lead terminal.

In the case of the semiconductor package having the above-mentioned structure, when foreign matter is attached to the lead terminals of the semiconductor package housed in the case body, the foreign matter is rubbed against the foreign matter removing brush provided in the lead housing portion. Are removed. Further, since the foreign matter removed from the lead terminal in this way and the foreign matter scattered by vibration during transportation are all trapped in the foreign matter removing brush, they are not reattached to the package body or the lead terminal.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Below, for example, QFP (Quad Flat P
An embodiment of the present invention when applied to an IC tray used when accommodating an ackage type semiconductor package will be described in detail with reference to the drawings. FIG. 1 is a diagram for explaining the structure of an IC tray to which the present invention is applied,
In the figure, (a) is a partial perspective view thereof, and (b) is a sectional view of an essential part in a package housed state. IC shown in FIG.
In the tray 1, recesses 3 for storing packages are arranged in a grid pattern on the upper surface side of the tray body 2. These recesses 3 are separated from each other by a partition wall 3a inclined at a predetermined angle. Further, in each of the recesses 3, a package receiving portion 6 on which the package body 5 of the semiconductor package 4 is placed, and a lead receiving portion for receiving the lead terminal (outer lead) 7 extending from the package body 6. And 8 are provided. Of these, the package receiving portion 6 is formed in a quadrangular shape in plan view following the outer shape of the package body 4, and a protrusion guide 9 is provided on the peripheral portion thereof. The protrusion guide 9 serves as a guide for regulating the position of the package body 4 placed on the package receiving portion 6. On the other hand, the lead accommodating portion 8 is formed in a groove shape along the peripheral edge of the package receiving portion 6, and the groove depth and the groove width correspond to the shape of the lead terminal 7 to be accommodated. .

By the way, when the semiconductor package 4 to be accommodated is the QFP type, the lead terminals 7 extend from the four sides of the package body 4, and correspondingly, the lead accommodating portion 8 as shown in the figure. Package receiving part 4 of 4
It will be provided along the side. On the other hand, the semiconductor package 4 to be stored is SOP (Small Outline).
In the case of the Package type, since the lead terminals 7 extend from two sides (usually the long side) of the package body 4, the lead accommodating portion 8 is also provided along the corresponding two sides of the package receiving portion 6. Will be done. Also, the illustrated I
The C-tray 1 is formed with concavities and convexities (not shown) corresponding to the shape of the concave portion 3 and the shape of the semiconductor package 4 on the lower surface side of the tray main body 2, so that a plurality of stacks can be performed.

Here, in the IC tray 1 of the present embodiment, a foreign matter removing brush 10 is provided in the lead accommodating portion 8 as a characteristic component. The foreign matter removing brush 10 is made of, for example, natural bristles or nylon bristles, which are planted on the bottom of the lead housing portion 8. Further, the length of the foreign matter removing brush 10 is set so that the bristle tip portion thereof contacts the tip portion of the lead terminal 7, that is, the ground portion (solder joint portion) when the semiconductor package 4 is mounted on a printed circuit board or the like. ing. Further, the hardness of the foreign matter removing brush 10 is appropriately set to such a degree that the lead terminal 7 is not deformed by using the quality, length, thickness and the like of the bristles as parameters.

Here, when the foreign matter removing brush 10 is provided in the lead accommodating portion 8, the groove width of the lead accommodating portion 8 is ensured to be wide, and the foreign matter removing brush 10 is flocked so as to cover the entire groove width. In other words, even if the package body 5 is displaced in the package receiving portion 6, the foreign substance removing brush 10 can be surely brought into contact with the tip end portion of the lead terminal 7. Further, the foreign material removal brush 1 is provided so that the groove width of the lead housing portion 8 is sufficiently wide and the lead housing portion 8 is entirely covered.
By flocking 0, even the semiconductor packages 4 having slightly different lengths and shapes of the lead terminals 7 can be handled by the common IC tray 1.

Next, a procedure for actually manufacturing the IC tray 1 will be briefly described with reference to FIG. First, in manufacturing a tray, a molding resin as a raw material of the tray body 2 is injected into a mold, and the tray body 2 is molded by an injection molding machine or the like (process flow: F1). At this time, the recesses 3 are formed in the tray body 2 in a grid pattern, and the package receiving portions 6 and the lead accommodating portions 8 are formed in each of the recesses 3. At the same time, the bottom portion of the lead accommodating portion 8 is used for flocking. Many holes are formed. As the arrangement pattern of the holes, various patterns such as a matrix pattern, a zigzag pattern, or a combination thereof can be adopted. The holes of the lead accommodating portion 8 may be formed separately by using a hole punching machine, but it is more efficient to form the holes at the same time when forming the tray as described above.

Next, a bundle of bristles, for example, nylon bristles (a bundle of about 20 to 40 bristles) which is a material of the foreign matter removing brush 10.
Is cut into a predetermined length, the cut bunch is folded in two in a U shape, and a bristle clip piece (for example, a thin brass plate piece) is sandwiched between the folded pieces, and this is held in the lead accommodating section. Push in every 8 holes to fix (F2). Such flocking work can be efficiently performed by using a commercially available flocking machine.

Then, in order to bring the foreign matter removing brush 10 into contact with the tip portions of the lead terminals 7 extending from the package body 5, the bristled hair bundles planted in the lead accommodating portion 8 are cut into uniform lengths. (F3). Also in this case, the tips of the hairs can be efficiently trimmed by using a commercially available hair trimming machine. Further, after the hair tips are cut and aligned, a hair tip treatment such as rounding the hair tips using sandpaper or the like is performed, and the surface of the lead terminal 7 is not damaged, which is extremely suitable. According to the above manufacturing procedure, FIG.
The IC tray 1 shown in can be obtained.

The method of manufacturing the IC tray 1 described here is an application of a method of manufacturing a household cleaning brush or a toothbrush. In particular, the manufacturing method other than this is used to obtain the IC tray 1. It doesn't matter if you do so.

As described above, in the IC tray 1 of this embodiment, the foreign substance removing brush 10 is provided in the lead accommodating portion 8 in a state of being in contact with the tip portions of the lead terminals 7 extending from the package body 5. When the semiconductor package 5 is housed in the IC tray 1, the lead terminal 7 and the foreign matter removing brush 10 rub against each other, or both rub due to vibration during transportation in the package housed state. The adhered foreign matter (mold residue, solder scraps, etc.) can be removed by the foreign matter removing brush 10.

The foreign matter removed by rubbing against the foreign matter removing brush 10 and the foreign matter peeled off from the lead terminals 7 due to vibration during transportation or natural fall are trapped in the foreign matter removing brush 10. As a result, the foreign matter is prevented from diffusing inside the IC tray 1, so that the foreign matter is not attached (reattached) to the lead terminals 7. Therefore, it is possible to supply the semiconductor package 4 in which the foreign matter is not attached to at least the tip end portion of the lead terminal 7 to the transportation destination or the shipping destination where the semiconductor package 4 is taken out from the IC tray 1.

In the above embodiment, the brush length is set so that the bristle tips of the foreign matter removing brush 10 just come into contact with the tip portions of the lead terminals 7, but this is the sorting step described in the prior art. This is because the foreign matters are mainly attached to the tip portions of the lead terminals 7 and various problems at the time of mounting the package. In addition to this, various methods for aligning the bristles of the foreign matter removing brush 10 are also available. A modified example of is conceivable. For example, as shown in FIG. 3, it is conceivable to align the bristles of the foreign substance removing brush 10 in accordance with the bent shape of the lead terminal 7 extending from the package body 5.
In this case, not only the tip portion of the lead terminal 7 but also the foreign matter removing brush 10 can be brought into uniform contact with the entire lead, so that the foreign matter removing efficiency at the time of housing the package can be remarkably improved.

Further, the package form to be stored in the IC tray 1 is not limited to the QFP or SOP type in which the lead terminal 7 has the gull wing shape as described above. For example, the lead terminal has the J shape. QF
J (Quad Flat J-Leaded Package) and SOJ (Small Outli
A semiconductor package having lead terminals extending from the package body, such as a ne J-Leaded Package) type and a DIP (Dual Inline Package) type in which the lead terminals are L-shaped, can be accommodated as a whole.

FIG. 4 is a cross-sectional view of an essential part showing a tray structure when the above-mentioned QFJ or SOJ type semiconductor package is a storage object. In this case, since the lead terminals 7 extending from the package body 4 are J-shaped, the lead terminals 7 are placed in the lead accommodating portion 8 in a state of being in contact with the curved portions of the lead ends (solder joint portions during package mounting). A foreign matter removing brush 10 is provided.

Further, in the above-described embodiment, the configuration in which the foreign matter removing brush 10 is directly planted on the bottom of the lead accommodating portion 8 has been taken as an example, but other than this, as shown in FIG. Removable brush support member 1
1 may be arranged at the bottom of the lead accommodating portion 8 and the foreign substance removing brush 10 may be planted on the brush supporting member 11. The brush supporting member 11 is removably attached to the case body 2 by a screw fastening, a coupling means such as a locking claw, or the like. More specifically, for example, when the semiconductor package 4 to be stored is the QFP type, the lead storage portion 8
A rectangular frame type brush support member 11 having a shape similar to that of the tray main body 2 is adopted by fitting the brush support member 11 into the lead accommodating portion 8 and fastening the four corners with the above-mentioned coupling means.
The brush support member 11 is fixed to the. Further, a large number of holes are formed in the brush support member 11, and the foreign matter removal brush 10 is planted by fixing a bunch of hairs in each hole by the same manufacturing procedure as described above.

By implanting the foreign matter removing brush 10 on the brush supporting member 11 which is separate from the tray body 2 in this manner, the following various effects can be obtained. For example, even if the foreign matter removing effect of the foreign matter removing brush 10 deteriorates, the tray body 2 can be replaced with a new foreign matter removing brush 10 very easily without wasting the tray body 2. Further, even when the design of the lead shape is changed or the form of the lead to be handled is changed, it is possible to easily deal with the matter by preparing the foreign matter removing brush 10 having the bristles adjusted accordingly and exchanging it. Further, even when removing the foreign matter stuck in the foreign matter removing brush 10, the brush support member 11 can be removed from the tray main body 2 to perform batch brush cleaning, so that periodical maintenance can be efficiently performed.

In the present embodiment, the case where the present invention is applied to the IC tray has been described, but the present invention is not limited to the application to the IC tray and is used, for example, when accommodating a DIP type semiconductor package. The present invention can be applied to a stick-shaped magazine (hereinafter, referred to as a stick magazine) that has been used, and a carrier part of a measurement handler (a cradle used for positioning and changing the direction of a semiconductor package). Of these, when applied to stick magasin, the magazine body may be divided into upper and lower parts, and a foreign matter removal brush may be implanted in the entire longitudinal direction of the groove portion corresponding to the lead accommodating portion, or the package entrance / exit portions at both ends of the magazine. Therefore, it is only necessary to implant the foreign matter removing brush within the range of several cm inside the magazine.

Incidentally, considering that the DIP type semiconductor package is stored in the stick magazine to which the present invention is applied, when the tip portion of the lead terminal 7 and the foreign substance removing brush 10 are arranged in parallel to each other, the lead is formed. There is a concern that the surface of the foreign matter removing brush 10 may be weakened and the sufficient foreign matter removing effect may not be obtained.
Further, as a countermeasure, if the flocking density of the foreign substance removing brush 10 is excessively increased, the contact resistance at the time of housing the semiconductor package becomes large, which may cause a problem such as lead bending.

Therefore, in the present embodiment, the above-mentioned problems are solved by adopting the following means.
That is, when configuring the foreign matter removal brush 10,
For example, the bristles forming the foreign substance removing brush 10 are evenly slanted or the direction of the bristles is changed with the center of the groove width of the lead accommodating portion 8 as a boundary, and both bristles are bristles. Flock hair so that it intersects. Thereby, the foreign matter removing brush 10
Since the tip of the hair can be reliably brought into contact with the surface of the lead, a sufficient foreign matter removing effect can be obtained even with a stick magazine without excessively increasing the flocking density of the foreign matter removing brush 10. Incidentally, such means can be similarly adopted when applied to the IC tray 1.

By the way, conventionally, when a semiconductor package is stored in a storage case such as an IC tray or a stick magazine to carry out a transfer work between processes or a shipping work to a customer, at the time of the assembly process or the transfer up to that time. There is a risk that static electricity is charged in the semiconductor package due to the generated vibration and the semiconductor element inside the package is destroyed by this static electricity.

As a countermeasure against such electrostatic breakdown, in the present embodiment, the foreign matter removing brush 10 having conductivity is adopted in constructing the storage case. In this case, as the material of the foreign matter removing brush 10, for example, by adopting modified polyphenylene ether (PPE) similar to engineering plastic,
The resistance value showing the conductivity of the brush was suppressed to about 10 ³ to 10 ⁵ Ω.

If the foreign substance removing brush 10 having conductivity is adopted as described above, the semiconductor package 4 is charged by the lead terminals 7 coming into contact with the foreign substance removing brush 10 when the semiconductor package 4 is stored in the storage case. The generated static electricity is gradually discharged to the brush side through the lead terminal 7. As a result, the semiconductor package 4 is prevented from being charged due to vibration during transportation, so that electrostatic breakdown of the semiconductor element can be prevented in advance.

The conductive foreign matter removing brush 10
The material of is not limited to engineering plastics such as modified polyphenylene ether, but is, for example, a conductive resin in which a conductor such as copper, silver, or graphite is dispersed in a polymer material, or a conductive material that exhibits metallic or semiconductor-like conductivity. A molecule or the like can also be adopted.

[0031]

As described above, according to the present invention, even if foreign matter (mold residue, solder scraps, etc.) adheres to the lead terminals of the semiconductor package housed in the case body,
The foreign matter can be removed from the lead terminal by rubbing against a foreign matter removal brush provided in the lead housing portion. In addition, foreign matter removed from the lead terminals and foreign matter scattered by vibration during transportation are all trapped in the foreign matter removal brush, which prevents the foreign matter from reattaching to the package body or the lead terminals. it can. As a result, since the semiconductor package can be supplied to the destination step of the inter-step transportation with the foreign matter removed from the lead terminal, various problems caused by the foreign matter attached to the lead terminal, for example, the sorting step. It is possible to prevent the occurrence of contact failure, appearance failure, etc. in advance.
In addition, since the semiconductor package can be provided to the customer of the shipping destination with the foreign matter removed from the lead terminals, there is no fear of complaints after shipping.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a structure of an IC tray to which the present invention is applied.

FIG. 2 is a diagram illustrating a manufacturing procedure of an IC tray.

FIG. 3 is a diagram showing a modified example of a foreign matter removing brush.

FIG. 4 is a diagram showing an application example to another package form.

FIG. 5 is a diagram illustrating another embodiment of the present invention.

FIG. 6 is a diagram illustrating a structure of a conventional IC tray.

[Explanation of symbols]

 1 IC tray (storage case) 2 Tray main body (case main body) 4 Semiconductor package 5 Package main body 6 Package receiving portion 7 Lead terminal 8 Lead storage portion 10 Foreign substance removal brush 11 Brush support member

Claims (3)

[Claims] 1. A package for accommodating a semiconductor package having a package body and lead terminals extending from the package body, for accommodating the package terminal on which the package body is mounted and the lead terminal. In a storage case of a semiconductor package having a lead accommodating portion provided along a peripheral edge of the package receiving portion in a case body, the lead accommodating portion is in a state of being in contact with at least a tip portion of the lead terminal. A storage case for a semiconductor package, which is provided with a foreign matter removing brush. 2. The storage case for a semiconductor package according to claim 1, wherein the foreign matter removing brush has conductivity. 3. The semiconductor package according to claim 1, further comprising a brush supporting member detachably attached to the case body, and the foreign substance removing brush is planted on the brush supporting member. Storage case.