JPH09271725A - Washer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the recontamination of a substrate to be washed due to the splashing of a washing liquid by blocking a space around a holding means for horizontally holding a substrate to be washed by a shielding member having a cylindrical sidewall and jetting the washing liquid while rotating the shielding member together with the holding means. SOLUTION: A substrate 16 to be washed is mounted on a holding base 6, and is attracted and fixed to the holding base 6 through a suction hole of a rotating shaft 5 by a suction device. To the rotating shaft 5, a shielding member 8 consisting of a support plate 11 and a cylindrical sidewall 9 is fitted by a connecting ring 10 to block a space around the holding base 6. Therefore, when the rotating shaft 5 is rotated, the shielding member 8 is also rotated in the same direction together with both the substrate 16 to be washed and the holding base 6. A washing liquid is jetted to the substrate 16 to be washed from a cylindrical type high frequency vibration nozzle 12 in this state, and at the same time, the nozzle 12 is reciprocated in the radial direction by a driving arm 13 to wash the substrate 16. In this way, even when the device is miniaturized and consequently the substrate to be washed is brought close to the shielding member, the recontamination of the substrate due to the splashed washing liquid is prevented.

Description

Detailed Description of the Invention

[0001]

[0001] The present invention relates to a liquid crystal glass substrate,
The present invention relates to an apparatus for cleaning substrates to be cleaned such as semiconductor wafers and magnetic disks.

[0002]

2. Description of the Related Art Conventionally, liquid crystal glass substrates, semiconductor wafers,
An apparatus for cleaning a substrate to be cleaned, such as a magnetic disk, has a holding table for holding the substrate to be cleaned, a rotating means for rotating the holding table, and a cleaning liquid arranged outside the apparatus around the holding table. It is composed of a shielding member having a cylindrical wall portion for preventing scattering and a cleaning liquid ejecting means for ejecting a cleaning liquid onto the substrate to be cleaned held on the holding table.
In order to clean a substrate to be cleaned, such as a semiconductor wafer, by such a cleaning device, the wafer is held horizontally on the holding table, and while the holding member is rotated, the cleaning liquid is ejected from the cleaning liquid ejecting means onto the wafer surface. It is made by jetting.

However, in the cleaning apparatus having the above-described structure, the cleaning liquid scattered on the wafer surface during cleaning, particularly the cleaning liquid scattered in the horizontal direction, collides with the cylindrical wall portion of the shielding member, so that the droplets are scattered on the wafer surface. Will be attached back. Since the cleaning liquid droplets contain contaminants such as particles attached to the surface of the shielding member, the result is re-contamination of the wafer.

Scattering of the cleaning liquid by such a shielding member,
It is possible to sufficiently separate the holding member and the shielding member in order to prevent recontamination of the substrate to be cleaned.
There is a problem that the device becomes large.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to provide a cleaning device which can prevent re-contamination of a substrate to be cleaned due to scattering of a cleaning liquid and can be downsized.

[0006]

A cleaning device according to the present invention comprises a holding means for holding a substrate to be cleaned in a horizontal state; a shielding member having a cylindrical side wall for closing a space around the holding means; Rotating means for integrally rotating the holding means and the shielding member; a cleaning liquid spraying means for spraying a cleaning liquid onto the surface of the substrate to be cleaned held by the holding means; is there.

According to the cleaning apparatus of the present invention, the cylindrical wall portion for holding the substrate to be cleaned such as a semiconductor wafer in the holding means and closing the holding means and the space around the holding means. The cleaning liquid, for example, pure water, is sprayed from the cleaning liquid spraying device onto the rotating substrate to be cleaned while rotating the shield member having the structure integrally (synchronously) by the rotating device, thereby improving the surface of the substrate to be cleaned. Can be washed.

When the cleaning liquid is ejected onto the substrate to be cleaned from the cleaning liquid ejecting means, the cleaning liquid is scattered on the surface of the substrate to be cleaned, and in particular, the cleaning liquid scattered horizontally like the tangential direction of the rotation trajectory of the substrate. It collides with the inner surface of the cylindrical wall of the shielding member around it. In such a collision of the cleaning liquid with the inner surface of the cylindrical wall of the shielding member, the shielding member is rotated integrally with the holding means for holding the substrate to be cleaned, so that the collision of the cleaning liquid is mitigated. It is possible to prevent the splash of the cleaning liquid from returning to the substrate to be cleaned. As a result, it is possible to prevent contamination due to the reattachment of the cleaning liquid to the substrate to be cleaned.

Another cleaning apparatus according to the present invention is a holding means for holding a substrate to be cleaned in a horizontal state; a cylindrical shield member having a bottom for closing a space around the holding means; the holding means and the Rotating means for rotating the shielding member integrally; Differential pressure generating member having a plurality of openings formed at equal circumferential pitch on the peripheral edge of the shielding member or on the side wall near the bottom portion; held by the retaining means And a cleaning liquid ejecting means for ejecting a cleaning liquid onto the surface of the cleaned substrate.

The differential pressure generating member may include a plurality of openings formed in the side wall of the bottom portion of the shielding member or a side wall near the bottom portion at equal pitches, and differential pressure pipes communicating with the openings. preferable.

According to such another cleaning apparatus of the present invention, the substrate to be cleaned such as the semiconductor wafer is held by the holding means, and the holding means and the peripheral space of the holding means are closed. The surface of the substrate to be cleaned by spraying a cleaning liquid, for example, pure water, onto the rotating substrate to be cleaned from the cleaning liquid spraying device while integrally (synchronously) rotating the shielding member having the wall portion by the rotating device. Can be washed well.

When the holding means and the bottomed cylindrical shielding member are integrally rotated by the rotating means,
Since the differential pressure generating member having a plurality of openings opened at equal pitches is provided on the bottom peripheral edge of the shielding member or the side wall near the bottom for closing the peripheral space of the holding means, the bottomed bottom is provided. The air in the cylindrical shielding member is exhausted through the plurality of openings, and an airflow is generated from the center of the rotating substrate to be cleaned toward the periphery thereof. In particular, the differential pressure generating member is provided with a plurality of openings that are opened at an equal circumferential pitch on the bottom peripheral edge of the shielding member or on the side wall near the bottom, and the openings are communicated with these openings, respectively, and the lower end thereof is arranged in the rotation direction of the shielding member. The pressure difference near the differential pressure pipe decreases when the shielding member rotates by rotating the shielding member so that the air inside the bottomed cylindrical shielding member is opened. Is sucked in and exhausted, so that a strong air flow is generated from the center of the rotating substrate to be cleaned toward the periphery thereof. As a result, the cleaning liquid scattered on the surface of the substrate to be cleaned by spraying the cleaning liquid hardly reaches the inner surface of the cylindrical side wall of the shielding member, and the surface of the substrate to be cleaned by the differential pressure generating member It is forcibly discharged toward the plurality of openings of the differential pressure generating member by riding on the air flow from the center toward the peripheral edge.
Moreover, a part of the cleaning liquid is scattered on the surface of the substrate to be cleaned,
In particular, even if the cleaning liquid that has been horizontally scattered as the tangential direction of the rotation trajectory of the substrate collides with the inner surface of the cylindrical wall portion of the shielding member, the shielding member holds the substrate to be cleaned as described above. Since it is rotated integrally with the holding means, the collision of the cleaning liquid is mitigated and the splash of the cleaning liquid can be prevented from returning to the substrate to be cleaned.

Therefore, it is possible to prevent the cleaning liquid after cleaning from re-adhering to and contaminating the substrate to be cleaned by the integral rotation of the holding means and the shielding member and the disposition of the differential pressure generating member on the shielding member. It can be prevented more effectively.

Still another cleaning apparatus according to the present invention is a holding means for holding the substrate to be cleaned in a horizontal state; a cylindrical shield member having a bottom for closing the space around the holding means;
Rotating means for integrally rotating the holding means and the shielding member; a plurality of openings formed at an equal circumferential pitch on a bottom peripheral edge or a side wall near the bottom of the shielding member, and each of these openings. A first differential pressure generating member having a differential pressure pipe which is communicated with the lower end and has an opening formed so as to turn its back with respect to the rotation direction of the shielding member; opened at an equal circumferential pitch near the center of the bottom of the shielding member. A second differential pressure generating member having a plurality of openings and a differential pressure tube communicating with each of the openings and having an opening formed at the lower end so as to face the rotation direction of the shielding member; held by the holding means. A cleaning liquid spraying means for spraying the cleaning liquid onto the surface of the substrate to be cleaned is provided.

According to still another cleaning apparatus of the present invention as described above, a cylindrical shape for holding the substrate to be cleaned such as a wafer in the holding means and closing the holding means and the peripheral space of the holding means. The surface of the substrate to be cleaned by spraying a cleaning liquid, for example, pure water, onto the rotating substrate to be cleaned from the cleaning liquid spraying device while integrally (synchronously) rotating the shielding member having the wall portion by the rotating device. Can be washed well.

When the holding means and the bottomed cylindrical shield member are integrally rotated by the rotating means,
Since the first differential pressure generating member is provided on the bottom peripheral edge or the side wall near the bottom of the shielding member for closing the peripheral space of the holding means, the shielding member is rotated at the lower end in the rotation direction of the shielding member. On the other hand, the air pressure in the vicinity of the differential pressure tube having an opening formed so as to turn its back is lowered, and the air in the bottomed cylindrical shielding member is sucked and exhausted from the lower end opening of the differential pressure tube. Therefore, a strong airflow is generated from the center of the surface of the rotating substrate to be cleaned toward the periphery thereof.
Further, when the holding means and the shielding member are integrally rotated by the rotating means, the second differential pressure generating member is provided near the center of the bottom portion of the shielding member. The atmospheric pressure near the opening formed in the lower end of the differential pressure tube of the differential pressure generating member facing the rotation direction of the shielding member becomes high, that is, the atmospheric pressure is higher than the atmospheric pressure inside the shielding member, and the differential pressure pipe and the opening are provided. Through which air is introduced into the shielding member. For this reason, a strong airflow is generated from the vicinity of the center of the back surface of the rotating substrate to be cleaned through the peripheral edge thereof toward the plurality of openings of the first differential pressure generating member. As a result, by spraying the cleaning liquid onto the substrate to be cleaned, the cleaning liquid scattered on the surface hardly reaches the inner surface of the cylindrical side wall of the shielding member,
The first differential pressure generating member is forcibly discharged toward a plurality of openings of the first differential pressure generating member by riding on an air flow from the center of the surface of the substrate to be cleaned toward the peripheral edge thereof. At the same time, it is possible to prevent the scattered cleaning liquid from flowing around to the back surface of the substrate due to the air current flowing from the vicinity of the center of the back surface of the substrate toward the peripheral edge thereof by the second differential pressure generating member.

Further, a part of the cleaning liquid is scattered on the surface of the substrate to be cleaned, and in particular, the cleaning liquid which is horizontally scattered along the tangential direction of the rotation trajectory of the substrate is applied to the inner surface of the cylindrical wall portion of the shielding member. Even if a collision occurs, since the shielding member is rotated integrally with the holding unit that holds the substrate to be cleaned as described above, it works to mitigate the collision of the cleaning liquid, and the splash of the cleaning liquid causes the cleaning liquid to be cleaned. It is possible to prevent returning to the substrate.

Therefore, by integrally rotating the holding means and the shielding member and disposing the first and second differential pressure generating members on the shielding member, the cleaning liquid after cleaning is reattached to the substrate to be cleaned. It is possible to prevent contamination.

As the cleaning liquid jetting means used in the cleaning apparatus according to the present invention, for example, a shower nozzle, a high frequency vibrating nozzle or the like can be used. Particularly, as the cleaning liquid ejecting means, a vibrator is built in the nozzle main body so as to face the discharge port, the cleaning liquid is supplied into the main body through a cleaning liquid supply pipe, and the cleaning liquid aerated with high frequency sound waves is rotated. By spraying onto the substrate, it becomes possible to precisely clean the surface of the substrate to be cleaned.

The cleaning liquid ejecting means allows reciprocating motion between the center and the periphery of the substrate to be cleaned held by the holding means. By thus reciprocally moving the cleaning liquid ejecting means, the entire surface of the substrate to be cleaned can be cleaned well.

[0021]

Embodiments of the present invention will now be described in detail with reference to the drawings. (Embodiment 1) FIG. 1 is a sectional view showing a cleaning apparatus of Embodiment 1, and FIG. 2 is a top view of FIG.

Reference numeral 1 in the drawing is a bottomed rectangular tubular cleaning liquid receiving tank having a circular opening 2 in the upper surface and two small holes 3 in the bottom. The two suction pipes 4 are connected to the bottom of the receiving tank 1 so as to communicate with the small holes 3, respectively. A rotary shaft 5 having a suction hole (not shown) formed in the axial direction.
Penetrates through the center of the bottom of the receiving tank 1 and is rotatably supported by a bearing (not shown). The suction hole of the rotary shaft 5 is communicated with a suction device (not shown). A disk-shaped holding table 6 for vacuum-chucking the substrate to be cleaned is attached to the upper end of the rotary shaft 5. An annular groove 7 that communicates with a suction hole formed in the rotary shaft 5 is provided on the upper surface of the holding table 6.

The shield member 8 is rotatably arranged in the receiving tank 1. The shielding member 8 has the upper end at the receiving tank 1
A cylindrical side wall 9 arranged in the opening hole 2 of the receiving tank 1 so as to be flush with the upper surface of the receiving tank 1, a connecting ring 10 fitted to the rotating shaft 5, and one end of the connecting ring 10 in the horizontal direction. It is composed of four support plates 11 which are radially connected to each other and whose other end is integrally attached to the lower end of the cylindrical wall portion 9. The cylindrical high-frequency vibrating nozzle 12 is disposed above the receiving tank 1, and the holding arm 6 is provided by a driving arm 13.
The substrate to be cleaned held by is reciprocated in the radial direction (arrow direction). The high-frequency vibrating nozzle 12 has a nozzle body 15 having a discharge port 14 at the tip, and the nozzle body 15
A vibrator (not shown) built in so as to face the discharge port 14, a high-frequency oscillator (not shown) arranged outside the nozzle body 15 for vibrating the vibrator, It has a structure including a supply pipe (not shown) connected to the main body 15 for supplying a cleaning liquid.

Next, the operation of the above-described cleaning device of the first embodiment will be described. The substrate to be cleaned, for example, the semiconductor wafer 16 is placed on the holding table 6, and a suction device (not shown) is operated to suck the annular groove 7 formed on the holding table 6 through the suction hole of the rotary shaft 5 to thereby remove the substrate. The wafer 16 is vacuum chucked on the holding table 6. When the rotating shaft 5 is rotated by a motor (not shown) in this state, the wafer 16 vacuum-chucked to the holding table 6 and the shielding member 8 are integrally rotated, for example, in the clockwise direction. In such rotation of the wafer 16, the cylindrical high-frequency vibration nozzle 1
By supplying a cleaning liquid, for example, pure water, into the main body 15 through a supply pipe (not shown) while vibrating a vibrator (not shown) built in the nozzle body 15 of No. 2 into a high frequency sound wave. The pure water that has flown on is ejected from the discharge port 14. At the same time, the drive arm 13 reciprocates the high-frequency vibration nozzle 12 in the radial direction of the rotating wafer 16 so that pure water carried by high-frequency sound waves is sprayed over the entire surface of the wafer 16 so that the surface of the wafer 16 is exposed. To be washed.

The high frequency vibrating nozzle 1 is attached to the wafer 16.
When pure water is sprayed from 2, the pure water is scattered on the surface of the wafer 16, and particularly the pure water scattered horizontally as in the tangential direction of the rotation trajectory of the wafer 16 is scattered by the shielding member 8 around the wafer 16. It collides with the inner surface of the cylindrical side wall 9. When the pure water collides with the inner surface of the cylindrical side wall 9 of the shielding member 8 in this manner, the shielding member 8 is rotated integrally with the holding table 6 that holds the wafer 16, so that the inner surface of the cylindrical side wall 9 is covered. Since the scattered pure water is cast along the surface and acts so as to mitigate the collision of the pure water, it is possible to prevent splash of pure water after cleaning from returning to the surface of the wafer 16.
In addition, the purified water that has been cast along the inner surface of the cylindrical side wall 9 passes between the plurality of support plates 11 of the shielding member 8 and drops to the bottom of the receiving tank 1 to form the small hole 3 and the suction pipe. It is discharged to the outside through 4.

Therefore, by the integral rotation of the holding table 6 and the shielding member 8, even if the distance between the wafer 16 and the shielding member 8 is shortened, the pure water after cleaning is kept in the wafer 1.
Since it is possible to prevent redeposition on the surface and contamination, it is possible to realize a small-sized cleaning device capable of cleaning with high cleanliness.

(Embodiment 2) FIG. 3 is a sectional view showing a cleaning apparatus according to a second embodiment. Reference numeral 21 in the drawing is a bottomed rectangular tubular cleaning liquid receiving tank having a circular opening hole 22 in the upper surface and two small holes 23 in the bottom portion. The two suction pipes 24 are connected to the bottom of the receiving tank 21 so as to communicate with the small holes 23, respectively. A rotary shaft 25 having a suction hole (not shown) formed in the axial direction penetrates the center of the bottom of the receiving tank 21 and is supported by a bearing (not shown). The suction hole of the rotary shaft 25 communicates with a suction device (not shown). A disk-shaped holding table 26 for vacuum chucking the substrate to be cleaned is attached to the upper end of the rotary shaft 25.
An annular groove (not shown) communicating with the suction hole formed in the rotary shaft 25 is provided on the upper surface of the holding table 26.

The flat guide plate 27 in the shape of a truncated cone is attached to the inner surface of the bottom portion, and the bottomed cylindrical shielding member 29 having eight openings 28 at equal circumferential pitch is provided at the center portion. The receiving tank 21 with the rotating shaft 25 attached
Is located within. The shielding member 29 is arranged so that its upper end is flush with the upper surface of the receiving tank 21 in the opening hole 22 of the receiving tank 21. For example, eight differential pressure pipes 30 having a shape obtained by cutting the lower end of the cylindrical pipe in an oblique direction are connected to the bottom surface of the shielding member 29 so as to communicate with the openings 28, respectively. In each of the differential pressure pipes 30, the opening 31 at the lower end is oriented in the tangential direction of the bottomed cylindrical shielding member 29, and the opening 31 is positioned so as to turn its back with respect to the rotation direction of the shielding member 29. There is. The opening 28 and the differential pressure pipe 30 constitute a differential pressure generating member.

The cylindrical high-frequency vibrating nozzle 32 is arranged above the receiving tank 21, and the driving arm 33 allows the holding table 2 to be held.
The substrate to be cleaned held in 6 is reciprocated in the radial direction. The high-frequency vibrating nozzle 32 has a nozzle body 35 having a discharge port 34 at its tip, a vibrator (not shown) built in the nozzle body 35 so as to face the discharge port 34, and the nozzle body 35. A high-frequency oscillator (not shown) for oscillating the vibrator, which is arranged outside the
It has a structure including a supply pipe (not shown) connected to the main body 34 for supplying a cleaning liquid.

Next, the operation of the above-described cleaning device of the second embodiment will be described. A substrate to be cleaned, for example, a semiconductor wafer 36 is placed on the holding table 26, and a suction device (not shown) is operated to suck an annular groove (not shown) formed in the holding table 26 through a suction hole of the rotary shaft 25. By doing so, the wafer 36 is vacuum chucked on the holding table 26. When the rotating shaft 25 is rotated by a motor (not shown) in this state, the wafer 36 vacuum-chucked to the holding table 26 and the shielding member 29 are integrally rotated, for example, in the clockwise direction. In such a rotation of the wafer 36, a cleaning liquid such as pure water is supplied to a supply pipe (not shown) while a vibrator (not shown) built in the nozzle body 35 of the cylindrical high frequency vibration nozzle 32 is vibrated by a high frequency oscillator. ) To supply the water to the inside of the main body 35, pure water riding on high frequency sound waves is ejected from the ejection port 34. At the same time, the drive arm 33 causes the high-frequency vibration nozzle 32 to reciprocate in the radial direction of the rotating wafer 36,
Pure water carried by high frequency sound waves is sprayed over the entire surface of the wafer 36 to clean the surface of the wafer 36.

Further, the holding table 2 is supported by the rotary shaft 25.
When 6 and the bottomed cylindrical shielding member 29 are integrally rotated, the shielding member 29 for closing the peripheral space of the holding table 26 is opened at the peripheral edge of the bottom portion at an equal circumferential pitch. A differential pressure generating member including a plurality of openings 28 and a differential pressure pipe 30 that communicates with each of the openings 28 and has an opening 31 formed at its lower end so as to turn its back to the rotation direction of the shielding member 29. Since the shielding member 29 is rotated, the atmospheric pressure in the vicinity of each of the differential pressure pipes 30 is lowered during rotation, and the air in the cylindrical bottomed shielding member 29 is sucked and exhausted from the openings 31 at the lower ends thereof. It Therefore, a strong air flow is generated from the center of the rotating wafer 36 toward the peripheral edge thereof as indicated by the arrow. as a result,
The pure water scattered on the surface of the wafer 36 by spraying the pure water does not almost reach the inner surface of the cylindrical side wall of the shielding member 29. It is forcibly discharged toward the plurality of openings 28 of the differential pressure generating member by riding on the airflow toward the peripheral edge thereof.

Further, when the pure water is jetted from the high-frequency vibration nozzle 32 onto the wafer 36, even if some of the pure water scattered on the surface of the wafer 36 comes to the inner surface of the cylindrical side wall of the shielding member 29, The shielding member 29 is the wafer 3
6 is rotated integrally with a holding table 26 for holding 6, and the scattered pure water toward the inner surface of the cylindrical side wall is cast along the surface to work to mitigate the collision of the pure water. It is possible to prevent the splash of pure water from returning to the surface of the wafer 36 from the inner surface of the cylindrical side wall of the shielding member 29.

The deionized water discharged through the plurality of openings 28 and the differential pressure pipe 31 of the shielding member 29 and the deionized pure water cast along the inner surface of the cylindrical side wall of the shielding member 29 are It falls to the bottom of the receiving tank 21, and is discharged to the outside through the small hole 23 and the suction pipe 24.

Therefore, the wafer 36 and the shielding member 29 are rotated by integrally rotating the holding table 26 and the shielding member 29 and disposing the differential pressure generating member on the shielding member 29.
Since it is possible to more reliably prevent the deionized water after cleaning from re-attaching to the surface of the wafer 36 and contaminating it even if the distance between and is shortened, it is possible to realize a small cleaning device capable of cleaning with high cleanliness.

(Embodiment 3) FIG. 4 is a sectional view showing a cleaning apparatus of Embodiment 3. The same members as those in FIG. 3 described in the second embodiment described above are designated by the same reference numerals, and the description thereof will be omitted.

At the bottom of the cleaning liquid receiving tank 21 in the shape of a rectangular cylinder with a bottom, an annular projection 37 is located inside the plurality of differential pressure tubes 30 of the differential pressure generating members (first differential pressure generating members). It is formed so as to be close to the bottom surface portion of the shielding member 29. In the bottom portion of the shielding member 29 located between the rotating shaft 25 and the annular protrusion 37, for example, four openings 38 are opened at an equal circumferential pitch. For example, four differential pressure tubes 39 having a shape obtained by cutting the lower end of the cylindrical pipe in an oblique direction are connected to the bottom surface of the shielding member 29 so as to communicate with the openings 37, respectively. Each differential pressure pipe 3
9, the lower end opening 40 has the bottomed cylindrical shielding member 29.
Is positioned so as to face the tangential direction of the shield member 29 and to face the rotation direction of the shielding member 29. The opening 38 and the differential pressure pipe 39 form a second differential pressure generating member.

Next, the operation of the above-described cleaning device of the third embodiment will be described. A substrate to be cleaned, for example, a semiconductor wafer 36 is placed on the holding table 26, and a suction device (not shown) is operated to suck an annular groove (not shown) formed in the holding table 26 through a suction hole of the rotary shaft 25. By doing so, the wafer 36 is vacuum chucked on the holding table 26. When the rotating shaft 25 is rotated by a motor (not shown) in this state, the wafer 36 vacuum-chucked to the holding table 26 and the shielding member 29 are integrally rotated, for example, in the clockwise direction. In such a rotation of the wafer 36, a cleaning liquid such as pure water is supplied to a supply pipe (not shown) while a vibrator (not shown) built in the nozzle body 35 of the cylindrical high frequency vibration nozzle 32 is vibrated by a high frequency oscillator. ) To supply the water to the inside of the main body 35, pure water riding on high frequency sound waves is ejected from the ejection port 34. At the same time, the drive arm 33 causes the high-frequency vibration nozzle 32 to reciprocate in the radial direction of the rotating wafer 36,
Pure water carried by high frequency sound waves is sprayed over the entire surface of the wafer 36 to clean the surface of the wafer 36.

Further, the holding table 2 is supported by the rotary shaft 25.
When 6 and the bottomed cylindrical shielding member 29 are integrally rotated, the shielding member 29 for closing the peripheral space of the holding table 26 is opened at the peripheral edge of its bottom at an equal circumferential pitch. A differential pressure generating member including a plurality of openings 28 and a differential pressure pipe 30 that communicates with each of the openings 28 and has an opening 31 formed at its lower end so as to turn its back to the rotation direction of the shielding member 29. Since the (first differential pressure generating member) is provided, the atmospheric pressure in the vicinity of each of the differential pressure pipes 30 is lowered when the shielding member 29 is rotated, and the opening 3 at the lower end thereof is provided.
The air in the shield member 29 having a cylindrical shape with a bottom is sucked in and exhausted from 1. Therefore, a strong air flow is generated from the center of the rotating wafer 36 toward the peripheral edge thereof as indicated by the arrow.

Further, by the rotating shaft 25, the holding table 2
When 6 and the shielding member 29 are integrally rotated, a plurality of openings are formed in the vicinity of the center of the bottom of the shielding member 29 surrounded by the rotating shaft 25 and the annular protrusion 37 at an equal circumferential pitch. A second portion composed of a portion 38 and a differential pressure pipe 39 which communicates with each of the openings 38 and has an opening 40 formed at the lower end so as to face the rotation direction of the shielding member 29.
Since the differential pressure generating member is provided, the atmospheric pressure near the opening 40 formed at the lower end of the differential pressure pipe 39 of the second differential pressure generating member becomes high during rotation of the shielding member 29, that is, inside the shielding member 29. The atmospheric pressure becomes higher than the atmospheric pressure, and the air in the space defined by the rotary shaft 25, the annular protrusion 37 and the bottom of the shielding member 29 flows into the shielding member 29 through the differential pressure pipe 39 and the opening 38. It Therefore, the wafer 3 rotating as indicated by the arrow
A strong airflow is generated from near the center of the back surface of 6 toward the plurality of openings 28 of the first differential pressure generating member through the periphery thereof.

As a result, the pure water scattered on the surface of the wafer 36 by spraying the pure water on the surface of the wafer 36 does not almost reach the inner surface of the cylindrical side wall of the shielding member 29, and the pure water is generated by the first differential pressure generating member. It is forcibly discharged toward the plurality of openings 28 of the first differential pressure generating member along with the air flow from the center of the surface of the wafer 36 toward the periphery thereof. at the same time,
It is possible to prevent the scattered pure water from flowing around to the back surface of the wafer 36 due to the air flow from the vicinity of the center of the back surface of the wafer 36 toward the peripheral edge thereof by the second differential pressure generating member.

Furthermore, when the pure water is sprayed from the high frequency vibration nozzle 32 onto the wafer 36, the wafer 36 is
Even if a part of the pure water scattered on the surface is formed on the inner surface of the cylindrical side wall of the shielding member 29, the shielding member 29 is rotated integrally with the holding table 26 holding the wafer 36, and the inner surface of the cylindrical side wall is rotated. Since pure water directed to the surface of the shielding member 29 is cast along the surface to alleviate the collision of the pure water, splashes of pure water after cleaning are transferred from the inner surface of the cylindrical side wall of the shielding member 29 to the surface of the wafer 36. You can prevent it from returning.

Pure water discharged through the plurality of openings 28 and the differential pressure pipe 31 of the first differential pressure generating member arranged in the shielding member 29 and the inner surface of the cylindrical side wall of the shielding member 29. The pure water after casting that has been washed falls to the bottom of the receiving tank 21, and is discharged to the outside through the small hole 23 and the suction pipe 24.

Therefore, by integrally rotating the holding table 26 and the shielding member 29 and disposing the first and second differential pressure generating members on the shielding member 29, the wafer 36 and the shielding member 29 are separated from each other. Since it is possible to more reliably prevent the deionized water after cleaning from reattaching to the surface of the wafer 36 and contaminating it even if the distance is reduced, it is possible to realize a small cleaning device capable of cleaning with high cleanliness.

In the first to third embodiments, a cylindrical type high frequency vibrating nozzle is used, and sweeping is performed within the radius of the substrate to be cleaned (eg, semiconductor wafer). The same effect can be obtained by using a bar-type high-frequency vibrating nozzle having an elongated cleaning liquid outlet instead of.

Although pure water was used as the cleaning liquid in Examples 1 to 3, other chemical liquids may be used as the cleaning liquid instead of pure water. Although the semiconductor wafer is used as the substrate to be cleaned in the above-mentioned embodiments, the invention can be similarly applied to a liquid crystal glass substrate, a semiconductor wafer, a magnetic disk and the like.

[0046]

As described above in detail, according to the cleaning apparatus of the present invention, even if the substrate to be cleaned and the shielding member are brought close to each other, recontamination of the substrate to be cleaned due to the scattering of the cleaning liquid can be prevented. As a result, it is possible to achieve miniaturization, and it is possible to effectively use the method for manufacturing fine and high-density semiconductor devices, liquid crystal glass substrates, magnetic disks, etc., which require cleaning with high cleanliness.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a cleaning device according to a first embodiment of the present invention.

FIG. 2 is a plan view of the cleaning device of FIG.

FIG. 3 is a sectional view showing a cleaning apparatus according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a cleaning device according to a third embodiment of the present invention.

[Explanation of symbols]

 1, 21 ... Receiving tank, 4, 24 ... Suction tube, 5, 25 ... Rotating shaft, 6, 26 ... Holding base, 8, 29 ... Shielding member, 12, 32 ... Cylindrical high-frequency vibration nozzle, 16, 36 ... Semiconductor wafer 28, 38 ... Opening portion, 30, 39 ... Differential pressure pipe.

Claims (5)

[Claims] 1. A holding means for holding a substrate to be cleaned in a horizontal state; a shielding member having a cylindrical side wall for closing a peripheral space of the holding means; the holding means and the shielding member are integrally rotated. A cleaning device comprising: rotating means for causing the cleaning liquid to be sprayed onto the surface of the substrate to be cleaned held by the holding means; 2. A holding means for holding the substrate to be cleaned in a horizontal state; a cylindrical shield member having a bottom for closing a space around the holding means; the holding means and the shield member are integrally rotated. Rotating means for controlling the pressure difference; a differential pressure generating member having a plurality of openings formed on the side wall of the bottom portion of the shielding member or on the side wall near the bottom portion at an equal pitch; on the surface of the substrate to be cleaned held by the holding means. A cleaning liquid spraying unit for spraying the cleaning liquid. 3. The differential pressure generating member is provided with a plurality of openings formed in the side wall of the bottom portion of the shielding member or at a side wall near the bottom portion at an equal circumferential pitch, and communicated with these openings, respectively.
The cleaning device according to claim 2, wherein the cleaning device comprises a differential pressure tube having an opening formed at its lower end so as to turn its back with respect to the rotation direction of the shielding member. 4. A holding means for holding the substrate to be cleaned in a horizontal state; a cylindrical shield member having a bottom for closing a space around the holding means; the holding means and the shielding member are integrally rotated. Rotating means for causing a plurality of openings to be formed in the side wall of the bottom edge of the shielding member or a side wall near the bottom at an equal circumferential pitch, and a plurality of openings which are respectively communicated with these openings and whose lower end with respect to the rotation direction of the shielding member. First differential pressure generating member having a differential pressure tube having an opening formed so that its back is turned to a back; a plurality of opening portions opened at an equal circumferential pitch near the center of the bottom portion of the shielding member, and communicated with these opening portions, respectively. A second differential pressure generating member having a differential pressure tube having an opening formed at the lower end so as to face the rotation direction of the shielding member; cleaning liquid ejecting means for ejecting the cleaning liquid onto the surface of the substrate to be cleaned held by the holding means. Equipped with A cleaning device characterized in that 5. The cleaning apparatus according to claim 1, wherein the cleaning liquid jetting means is a high frequency vibration nozzle.