JPH10137710A - Washing treatment device and its washing treatment - Google Patents
Washing treatment device and its washing treatmentInfo
- Publication number
- JPH10137710A JPH10137710A JP8304713A JP30471396A JPH10137710A JP H10137710 A JPH10137710 A JP H10137710A JP 8304713 A JP8304713 A JP 8304713A JP 30471396 A JP30471396 A JP 30471396A JP H10137710 A JPH10137710 A JP H10137710A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- cleaned
- brush
- cleaning brush
- washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005406 washing Methods 0.000 title abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 41
- 238000004140 cleaning Methods 0.000 claims description 262
- 238000000034 method Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 abstract description 35
- 238000012546 transfer Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 32
- 238000012545 processing Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は半導体ウエハや液
晶ガラス基板などの被洗浄物を洗浄ブラシを用いて洗浄
する洗浄処理装置および洗浄処理方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus and a cleaning method for cleaning an object to be cleaned such as a semiconductor wafer or a liquid crystal glass substrate using a cleaning brush.
【0002】[0002]
【従来の技術】半導体製造装置や液晶製造装置などにお
いては、被洗浄物としての半導体ウエハやガラス基板に
回路パタ−ンを形成するリソグラフィプロセスがある。
このリソグラフィプロセスは、周知のように上記半導体
ウエハにレジストを塗布し、このレジストに回路パタ−
ンが形成されたマスクを介して光を照射し、ついでレジ
ストの光が照射されない部分(あるいは光が照射された
部分)を除去し、除去された部分を現像、剥離あるいは
エッチングなどの処理するという一連の工程を数十回繰
り返すことで回路パタ−ンが形成される。2. Description of the Related Art In a semiconductor manufacturing apparatus and a liquid crystal manufacturing apparatus, there is a lithography process for forming a circuit pattern on a semiconductor wafer or a glass substrate as an object to be cleaned.
In this lithography process, as is well known, a resist is applied to the semiconductor wafer and a circuit pattern is applied to the resist.
Irradiating light through a mask on which the resist is formed, then removing the part of the resist that is not irradiated with light (or the part irradiated with light), and processing the removed part by developing, peeling or etching. By repeating a series of steps several tens of times, a circuit pattern is formed.
【0003】上記一連の各工程において、上記半導体ウ
エハが汚染されていると回路パタ−ンを精密に形成する
ことができなくなり、不良品の発生原因となる。したが
って、それぞれの工程で回路パタ−ンを形成する際に
は、レジストや塵埃などの微粒子が残留しない清浄な状
態に上記半導体ウエハを洗浄するということが行われて
いる。In the above-mentioned series of steps, if the semiconductor wafer is contaminated, it becomes impossible to form a circuit pattern precisely, which causes defective products. Therefore, when forming a circuit pattern in each step, the semiconductor wafer is washed in a clean state in which fine particles such as resist and dust do not remain.
【0004】上記被洗浄物を洗浄する装置としては、複
数枚の半導体ウエハを洗浄液が収容された洗浄タンク内
に漬けて洗浄するバッチ式と、1枚の被洗浄物を回転さ
せ、その被洗浄物に対して洗浄液を噴射させて洗浄する
枚葉式とがあり、被洗浄物の大型化にともない洗浄効果
の高い枚葉式が用いられる傾向にある。[0004] As the apparatus for cleaning the object to be cleaned, there are a batch type in which a plurality of semiconductor wafers are immersed in a cleaning tank containing a cleaning liquid for cleaning, and a method for rotating one object to be cleaned, and There is a single-wafer type in which a cleaning liquid is sprayed on an object to perform cleaning, and a single-wafer type having a high cleaning effect tends to be used as an object to be cleaned becomes larger.
【0005】枚葉式の洗浄処理装置には被洗浄物を回転
させながら洗浄するスピン洗浄方式があり、このスピン
洗浄方式において、洗浄効果をより一層高めるために
は、回転駆動される被洗浄物の上面に洗浄ブラシを接触
させ、その接触部分に洗浄液を供給して洗浄するという
ことが行われている。A single-wafer type cleaning apparatus includes a spin cleaning method for cleaning an object to be cleaned while rotating the object. In this spin cleaning method, the object to be rotated is driven in order to further enhance the cleaning effect. A cleaning brush is brought into contact with the upper surface of the substrate, and a cleaning liquid is supplied to the contact portion for cleaning.
【0006】被洗浄物に洗浄ブラシを接触させること
で、この被洗浄物に付着した微粒子や金属イオンなどの
異物を効率よく洗浄除去することができる。しかしなが
ら、被洗浄物から除去された異物は上記洗浄ブラシに転
移し、その転移量は累積的に増加することになるから、
上記被洗浄物の洗浄時に洗浄ブラシに転移した異物が上
記被洗浄物に逆転移し、被洗浄物の清浄度が低下すると
いうことがあった。[0006] By bringing the cleaning brush into contact with the object to be cleaned, foreign substances such as fine particles and metal ions adhering to the object to be cleaned can be efficiently cleaned and removed. However, the foreign matter removed from the object to be cleaned is transferred to the cleaning brush, and the transfer amount is cumulatively increased.
In some cases, foreign matter transferred to the cleaning brush during the cleaning of the object to be cleaned is reversely transferred to the object to be cleaned, and the cleanliness of the object to be cleaned is reduced.
【0007】[0007]
【発明が解決しようとする課題】このように、被洗浄物
の洗浄効果を向上させるために、被洗浄物に洗浄ブラシ
を接触させて洗浄するようにすると、洗浄ブラシに転移
した異物が増加することで、その異物が被洗浄物に逆転
移するということがあった。As described above, if a cleaning brush is brought into contact with an object to be cleaned in order to improve the effect of cleaning the object to be cleaned, foreign matter transferred to the cleaning brush increases. As a result, the foreign matter may be transferred back to the object to be cleaned.
【0008】この発明の目的とするところは、被洗浄物
を洗浄ブラシで洗浄する場合に、この洗浄ブラシによっ
て被洗浄物から除去された異物が被洗浄物に逆転移する
ことがないようにした洗浄処理装置および洗浄処理方法
を提供することにある。An object of the present invention is to prevent foreign matter removed from an object to be cleaned by the cleaning brush from being transferred back to the object to be cleaned when the object to be cleaned is cleaned with the cleaning brush. An object of the present invention is to provide a cleaning apparatus and a cleaning method.
【0009】[0009]
【課題を解決するための手段】請求項1の発明は、所定
の状態で保持された被洗浄物に洗浄液を供給するととも
に、回転駆動される洗浄ブラシを接触させて洗浄する洗
浄処理装置において、上記被洗浄物を所定の状態で保持
する保持手段と、上記洗浄ブラシを旋回運動および上下
運動させるとともに上記保持手段に保持された上記被洗
浄物を洗浄するときにこの被洗浄物に上記洗浄ブラシを
接触させる駆動手段と、上記被洗浄物を洗浄した上記洗
浄ブラシを洗浄するための洗浄手段とを具備したことを
特徴とする。According to a first aspect of the present invention, there is provided a cleaning apparatus for supplying a cleaning liquid to an object to be cleaned held in a predetermined state, and for bringing the cleaning object into contact with a cleaning brush which is driven to rotate. Holding means for holding the object to be cleaned in a predetermined state, and a cleaning brush for rotating the cleaning brush up and down and moving the cleaning brush on the object to be cleaned when cleaning the object to be cleaned held by the holding means. And cleaning means for cleaning the cleaning brush which has cleaned the object to be cleaned.
【0010】請求項2の発明は、請求項1の発明におい
て、上記洗浄手段は、上記保持手段の近傍で、上記駆動
手段によって旋回させられる上記洗浄ブラシの旋回運動
の領域内に設けられていることを特徴とする。According to a second aspect of the present invention, in the first aspect of the present invention, the cleaning means is provided in the vicinity of the holding means and in the area of the swiveling motion of the cleaning brush swiveled by the driving means. It is characterized by the following.
【0011】請求項3の発明は、請求項1または請求項
2の発明において、上記洗浄手段は、洗浄液が供給され
る洗浄槽と、この洗浄槽内の洗浄液に超音波振動を付与
する超音波振動子とからなることを特徴とする。According to a third aspect of the present invention, in the first or second aspect of the invention, the cleaning means includes a cleaning tank to which a cleaning liquid is supplied, and an ultrasonic wave for applying ultrasonic vibration to the cleaning liquid in the cleaning liquid. And a vibrator.
【0012】請求項4の発明は、請求項1乃至請求項3
のいずれかに記載の発明において、上記洗浄手段は、洗
浄液が供給される洗浄槽と、この洗浄槽内設けられ上記
洗浄ブラシを接触させるための接触部材とからなること
を特徴とする。The invention according to claim 4 is the invention according to claims 1 to 3.
In the invention according to any one of the above, the cleaning means comprises a cleaning tank to which a cleaning liquid is supplied, and a contact member provided in the cleaning tank for contacting the cleaning brush.
【0013】請求項5の発明は、請求項4の発明におい
て、上記接触部材は多数の通孔を有する多孔部材からな
ることを特徴とする。請求項6の発明は、所定の状態で
保持された被洗浄物に洗浄液を供給するとともに、回転
駆動される洗浄ブラシを接触させて洗浄する洗浄方法に
おいて、上記被洗浄物を所定の状態で保持する保持工程
と、この保持工程で保持された上記被洗浄物を洗浄ブラ
シで洗浄するワ−ク洗浄工程と、このワ−ク洗浄工程で
上記被洗浄物が洗浄されたならば上記洗浄ブラシを退避
させる退避工程と、この退避工程のあとで洗浄された被
洗浄物を搬出し未洗浄の被洗浄物を供給するときに上記
洗浄ブラシを洗浄するブラシ洗浄工程とを具備したこと
を特徴とする。According to a fifth aspect of the present invention, in the fourth aspect, the contact member is formed of a porous member having a large number of through holes. According to a sixth aspect of the present invention, there is provided a cleaning method in which a cleaning liquid is supplied to an object to be cleaned held in a predetermined state, and the cleaning is performed by bringing a cleaning brush that is driven to rotate into contact with the cleaning liquid. A cleaning step of cleaning the object to be cleaned held in the holding step with a cleaning brush, and a cleaning brush if the object to be cleaned is cleaned in the work cleaning step. A retreating step of retreating, and a brush cleaning step of cleaning the cleaning brush when carrying out the uncleaned object after carrying out the cleaned object after the retreating step. .
【0014】請求項1の発明によれば、被洗浄物を洗浄
した洗浄ブラシを洗浄するための洗浄手段を設けたこと
で、この洗浄手段で被洗浄物を洗浄した洗浄ブラシを洗
浄することができる。そのため、清浄な洗浄ブラシで被
洗浄物を洗浄できるから、洗浄ブラシから被洗浄物に異
物が逆転移するのが防止される。According to the first aspect of the present invention, since the cleaning means for cleaning the cleaning brush which has cleaned the object to be cleaned is provided, the cleaning means can clean the cleaning brush which has cleaned the object to be cleaned. it can. For this reason, the object to be cleaned can be cleaned with the clean cleaning brush, so that foreign substances are prevented from being reversely transferred from the cleaning brush to the object to be cleaned.
【0015】請求項2の発明によれば、洗浄ブラシを洗
浄する洗浄手段を、洗浄ブラシの旋回運動の領域内に設
けたことにより、被洗浄物を洗浄しないときに、上記洗
浄ブラシを旋回させて洗浄することができる。According to the second aspect of the present invention, the cleaning means for cleaning the cleaning brush is provided in the area of the swiveling motion of the cleaning brush, so that the cleaning brush is rotated when the object to be cleaned is not cleaned. Can be washed.
【0016】請求項3の発明によれば、超音波振動が付
与された洗浄液で洗浄ブラシを洗浄するようにしたこと
で、洗浄ブラシの洗浄効果を高めることができる。請求
項4の発明によれば、洗浄ブラシを洗浄する洗浄槽内
に、この洗浄ブラシを接触させるための接触部材を設け
たことで、洗浄ブラシに付着した異物を効率よく除去す
ることができる。According to the third aspect of the present invention, the cleaning effect of the cleaning brush can be enhanced by cleaning the cleaning brush with the cleaning liquid to which the ultrasonic vibration is applied. According to the fourth aspect of the present invention, since the contact member for contacting the cleaning brush is provided in the cleaning tank for cleaning the cleaning brush, foreign substances attached to the cleaning brush can be efficiently removed.
【0017】請求項5の発明によれば、接触部材が多数
の通孔を有する多孔部材からなることで、洗浄槽内の洗
浄液に超音波振動を付与するときに、その超音波振動が
上記通孔を通過して接触部材に接触した洗浄ブラシに確
実に作用する。According to the fifth aspect of the present invention, since the contact member is formed of a porous member having a large number of through-holes, the ultrasonic vibration is applied to the cleaning liquid in the cleaning tank when the ultrasonic vibration is applied. It reliably acts on the cleaning brush that has passed through the hole and has come into contact with the contact member.
【0018】請求項6の発明によれば、洗浄ブラシによ
り被洗浄物を洗浄したならば、この洗浄ブラシを退避さ
せて洗浄された被洗浄物を搬出して未洗浄の被洗浄物を
供給する間に、上記洗浄ブラシを洗浄するようにしたこ
とで、被洗浄物を洗浄処理するために要するタクトタイ
ムを長くせずに洗浄ブラシを洗浄することができる。According to the sixth aspect of the present invention, when the object to be cleaned is cleaned by the cleaning brush, the cleaning brush is retracted, the cleaned object to be cleaned is carried out, and the uncleaned object is supplied. In the meantime, the cleaning brush is cleaned, so that the cleaning brush can be cleaned without increasing the tact time required for cleaning the object to be cleaned.
【0019】[0019]
【発明の実施形態】以下、この発明の一実施形態を図面
を参照して説明する。図2はこの発明の洗浄処理装置の
保持手段としてのスピン処理装置Aを示す。このスピン
処理装置Aはスピンカップ1を備えている。このスピン
カップ1は上面が開放した有底状の下カップ1aと、こ
の下カップ1aに対してスライド自在に設けられ周壁の
上端部が径方向内方に向かって傾斜した上カップ1bと
からなり、この上カップ1bは図示しない駆動機構によ
って図に鎖線で示すように下降させることができるよう
になっている。An embodiment of the present invention will be described below with reference to the drawings. FIG. 2 shows a spin processing apparatus A as a holding means of the cleaning processing apparatus of the present invention. The spin processing device A has a spin cup 1. This spin cup 1 comprises a bottomed cup 1a having an open upper surface, and an upper cup 1b provided slidably with respect to the lower cup 1a and having an upper end portion of a peripheral wall inclined radially inward. The upper cup 1b can be lowered by a drive mechanism (not shown) as shown by a chain line in the figure.
【0020】上記下カップ1aの底部には、周辺部に複
数の排出管2の一端が接続され、中心部には周囲がフラ
ンジ3によって囲まれた挿通孔4が形成されている。こ
の挿通孔4には支持軸5が挿通されている。この支持軸
5の上部は、スピンカップ1の内部に突出し、下端部
は、上記スピンカップ1の下方に配置されたベ−ス板6
に固定されている。上記排気管2は図示しない気水分離
器を介して吸引ポンプに接続されている。上記排気管2
に洗浄液、ミスト、気体が吸引されると、上記気水分離
器によって水分と気体とが分離され、水分は図示しない
廃液タンクへ排出されるようになっている。At the bottom of the lower cup 1a, one end of a plurality of discharge pipes 2 is connected to the periphery, and an insertion hole 4 whose periphery is surrounded by a flange 3 is formed at the center. The support shaft 5 is inserted through the insertion hole 4. The upper part of the support shaft 5 projects into the inside of the spin cup 1, and the lower end thereof has a base plate 6 disposed below the spin cup 1.
It is fixed to. The exhaust pipe 2 is connected to a suction pump via a steam separator (not shown). Exhaust pipe 2
When the cleaning liquid, mist, and gas are sucked in, the water and gas are separated by the water / water separator, and the water is discharged to a waste liquid tank (not shown).
【0021】上記支持軸5には回転チャック11が回転
自在に設けられている。この回転チャック11は、中心
部に通孔12aが穿設された円盤状のベ−ス12を有す
る。このベ−ス12の下面、つまり上記通孔12aと対
応する位置には筒状の支持部13が垂設されている。こ
の支持部13は上記支持軸5に外嵌されていて、上部と
下部とがそれぞれ軸受14によって上記支持軸5に回転
自在に支持されている。A rotary chuck 11 is rotatably provided on the support shaft 5. The rotary chuck 11 has a disk-shaped base 12 having a through hole 12a formed in the center. At the lower surface of the base 12, that is, at a position corresponding to the through hole 12a, a cylindrical support portion 13 is vertically provided. The support portion 13 is fitted around the support shaft 5, and the upper and lower portions are rotatably supported by the support shaft 5 by bearings 14.
【0022】上記支持部13の下端部の外周面には従動
プ−リ15が設けられている。上記ベ−ス板6にはモ−
タ16が設けられ、このモ−タ16の回転軸16aには
駆動プ−リ17が嵌着されている。この駆動プ−リ17
と上記従動プ−リ15とにはベルト18が張設されてい
る。したがって、上記モ−タ16が作動すれば、上記支
持部13と一体に上記回転チャック11が回転駆動され
るようになっている。A driven pulley 15 is provided on the outer peripheral surface of the lower end of the support portion 13. The base plate 6 has a metal
A motor 16 is provided, and a driving pulley 17 is fitted on a rotating shaft 16a of the motor 16. This drive pulley 17
A belt 18 is stretched between the driven pulley 15 and the driven pulley 15. Therefore, when the motor 16 operates, the rotary chuck 11 is driven to rotate integrally with the support portion 13.
【0023】上記ベ−ス12の上面には周方向に90度
間隔で4本の支柱19が立設されている。各支柱19の
上端部には支持ピン21aと、この支持ピン21aより
も外方で、しかも支持ピン21aよりも背の高い係合ピ
ン21bとが突設されている。On the upper surface of the base 12, four columns 19 are erected at intervals of 90 degrees in the circumferential direction. A support pin 21a and an engagement pin 21b outside the support pin 21a and taller than the support pin 21a protrude from the upper end of each of the columns 19.
【0024】上記支柱19の上端には、被処理物として
たとえば半導体ウエハ22が周辺部の下面を支持ピン2
1aに支持され、外周面を上記係合ピン21bに係合さ
せて着脱可能に保持される。したがって、上記半導体ウ
エハ22は回転チャック11と一体的に回転駆動される
ようなっている。On the upper end of the column 19, for example, a semiconductor wafer 22 as an object to be processed is placed on the lower surface of the peripheral portion by the support pin 2.
1a, and is detachably held by engaging the outer peripheral surface with the engaging pin 21b. Therefore, the semiconductor wafer 22 is driven to rotate integrally with the rotary chuck 11.
【0025】上記支持軸5には、上端に支持軸5よりも
大径で、円錐状をなした頭部5aが設けられている。こ
の支持軸5には、先端を上記頭部5aの上面に開口させ
たN2 などの不活性ガスのガス供給路30と、先端を同
じく上記頭部5aの上面にノズル孔32aを介して開口
させた洗浄液供給路30aとが軸方向に沿って形成され
ている。上記ガス供給路30は図示しないガス供給源に
連通し、上記洗浄液供給路は同じく図示しない洗浄液の
供給源に連通している。The support shaft 5 is provided at its upper end with a conical head 5a having a diameter larger than that of the support shaft 5. The support shaft 5 has a gas supply path 30 of an inert gas such as N 2 having a tip opened to the upper surface of the head 5a, and a tip opened to the upper surface of the head 5a through a nozzle hole 32a. The cleaning liquid supply path 30a thus formed is formed along the axial direction. The gas supply path 30 communicates with a gas supply source (not shown), and the cleaning liquid supply path also communicates with a supply source of a cleaning liquid (not shown).
【0026】上記ガス供給路30に供給された不活性ガ
スと、上記洗浄液供給路30aに供給された洗浄液は、
それぞれ上記半導体ウエハ22の下面に向かって噴射さ
れるようになっている。The inert gas supplied to the gas supply path 30 and the cleaning liquid supplied to the cleaning liquid supply path 30a are:
Each is jetted toward the lower surface of the semiconductor wafer 22.
【0027】上記回転チャック11に保持される半導体
ウエハ22の上面側には、この半導体ウエハ22の上面
を洗浄するため洗浄ツ−ル31が配置されている。この
洗浄ツ−ル31は、洗浄ブラシ31aと、チャック31
bと、回転モ−タ31cと、このモ−タの回転軸31d
とから構成されている。上記洗浄ブラシ31aは旋回機
構32によって上記半導体ウエハ22の径方向に沿って
旋回駆動されるようになっている。On the upper surface side of the semiconductor wafer 22 held by the rotary chuck 11, a cleaning tool 31 for cleaning the upper surface of the semiconductor wafer 22 is arranged. The cleaning tool 31 includes a cleaning brush 31a and a chuck 31.
b, a rotating motor 31c, and a rotating shaft 31d of this motor.
It is composed of The cleaning brush 31a is turned by a turning mechanism 32 along the radial direction of the semiconductor wafer 22.
【0028】つまり、旋回機構32は中空筒状の水平ア
−ム33を有する。この水平ア−ム33の先端部内には
洗浄ツ−ル31の回転モ−タ31cがその回転軸31d
を垂直にして内蔵されている。この回転軸31dは上記
水平ア−ム33の下面から突出し、そこには上記洗浄ブ
ラシ31aがチャック31bを介して着脱自在に取り付
けられている。That is, the turning mechanism 32 has a horizontal arm 33 having a hollow cylindrical shape. A rotating motor 31c of the cleaning tool 31 has a rotating shaft 31d in the tip of the horizontal arm 33.
It is built vertically. The rotating shaft 31d protrudes from the lower surface of the horizontal arm 33, and the cleaning brush 31a is detachably attached thereto via a chuck 31b.
【0029】上記水平ア−ム33には図示しない洗浄液
の供給源に接続された第1の供給管35が挿通されてい
る。この第1の供給管35の先端部は上記水平ア−ム3
3の先端部から下方に向かって導出され、その先端開口
は上記洗浄ブラシ31aの外周面に向けられている。し
たがって、上記第1の供給管35からは洗浄液が洗浄ブ
ラシ31aの径方向外方から供給されるようになってい
る。A first supply pipe 35 connected to a cleaning liquid supply source (not shown) is inserted through the horizontal arm 33. The tip of the first supply pipe 35 is connected to the horizontal arm 3
3 is drawn downward from the front end of the cleaning brush 31a, and the front end opening is directed to the outer peripheral surface of the cleaning brush 31a. Therefore, the cleaning liquid is supplied from the first supply pipe 35 from outside in the radial direction of the cleaning brush 31a.
【0030】上記水平ア−ム33の基端部は軸線を垂直
にした旋回軸36の上端に連結されている。この旋回軸
36の下端部は上記ベ−ス板6に形成された通孔6aか
らその下方へ突出している。The base end of the horizontal arm 33 is connected to the upper end of a pivot 36 whose axis is vertical. The lower end of the pivot shaft 36 projects downward from a through hole 6a formed in the base plate 6.
【0031】上記旋回軸36の下端部は、上下動自在に
設けられた支持体37に回転自在に支持されている。こ
の支持体37は中空箱型状をなしていて、その上部壁に
は上記旋回軸36を挿通するための挿通孔38が形成さ
れ、内部には上記挿通孔38から挿入された旋回軸36
の下端部を回転自在に支持するために軸受39が設けら
れている。旋回軸36の下端は上記軸受39から突出
し、そこには従動プ−リ40が嵌着されている。The lower end of the turning shaft 36 is rotatably supported by a support 37 provided to be vertically movable. The support 37 has a hollow box shape, and has an upper wall formed with an insertion hole 38 for inserting the turning shaft 36 therein, and inside the turning shaft 36 inserted through the insertion hole 38.
A bearing 39 is provided to rotatably support the lower end of the housing. The lower end of the turning shaft 36 projects from the bearing 39, and a driven pulley 40 is fitted therein.
【0032】上記支持体37の一側面には一対のガイド
41が上下方向に沿って所定間隔で設けられ、このガイ
ド41はレ−ル43にスライド自在に係合している。こ
のレ−ル43は上記ベ−ス板6の下面に垂設された取付
板42の一側面に上下方向に沿って設けられている。A pair of guides 41 are provided on one side of the support 37 at predetermined intervals along the vertical direction, and the guides 41 are slidably engaged with the rails 43. The rail 43 is provided on one side surface of a mounting plate 42 suspended from the lower surface of the base plate 6 along the vertical direction.
【0033】上記取付板42には上下駆動源としての上
下駆動シリンダ44が設けられている。この上下駆動シ
リンダ44のロッド44aは上記支持体37に下端面に
ブラケット45を介して連結されている。したがって、
上下駆動シリンダ44が作動すれば、上記支持体37を
介して上記水平ア−ム33が所定の範囲内で上下駆動さ
れるようになっている。The mounting plate 42 is provided with a vertical drive cylinder 44 as a vertical drive source. The rod 44a of the vertical drive cylinder 44 is connected to the support 37 via a bracket 45 at the lower end surface. Therefore,
When the vertical drive cylinder 44 operates, the horizontal arm 33 is vertically driven within a predetermined range via the support 37.
【0034】つまり、水平ア−ム33が下降すると、上
記洗浄ブラシ31aが上記回転チャック11に保持され
た半導体ウエハ22の上面に所定の圧力で接触し、上昇
すると、上カップ1bの上方に位置して洗浄装置Bへ旋
回可能となる。That is, when the horizontal arm 33 is lowered, the cleaning brush 31a comes into contact with the upper surface of the semiconductor wafer 22 held by the rotary chuck 11 at a predetermined pressure, and when the cleaning brush 31a is raised, the cleaning brush 31a is positioned above the upper cup 1b. Then, it is possible to turn to the cleaning device B.
【0035】上記支持体37の他側には上記上下駆動シ
リンダ44とで駆動手段を構成する揺動駆動部46が設
けられている。この揺動駆動部46は上記支持体37の
他側面に取付けられた収納ボックス47を有する。この
収納ボックス47の下面にはモ−タ48が設けられてい
る。このモ−タ48の回転軸48aは上記収納ボックス
47内に突出し、この内部に設けられた減速部49に連
結されている。この減速部49の出力軸51には駆動プ
−リ52が嵌着されている。On the other side of the support 37, there is provided an oscillating drive 46 which constitutes a drive means with the vertical drive cylinder 44. The swing drive unit 46 has a storage box 47 attached to the other side surface of the support 37. A motor 48 is provided on the lower surface of the storage box 47. The rotation shaft 48a of the motor 48 projects into the storage box 47, and is connected to a speed reduction portion 49 provided inside the storage box 47. A drive pulley 52 is fitted on the output shaft 51 of the speed reducer 49.
【0036】上記支持体37と上記収納ボックス47と
の内部空間は開口部53によって連通している。上記開
口部53には、上記駆動プ−リ52と従動プ−リ40と
に張設されたタイミングベルト50が挿通されている。An internal space between the support 37 and the storage box 47 is communicated by an opening 53. A timing belt 50 stretched between the driving pulley 52 and the driven pulley 40 is inserted through the opening 53.
【0037】したがって、上記モ−タ48が作動して上
記減速部49の出力軸51が正逆方向に駆動されると、
その回転がタイミングベルト53を介して旋回軸36に
伝達されるから、この旋回軸36とともに水平ア−ム3
3の先端部に設けられた洗浄ブラサイ31aが半導体ウ
エハ22の表面を揺動するようになっている。Therefore, when the motor 48 is operated and the output shaft 51 of the speed reduction section 49 is driven in the forward and reverse directions,
Since the rotation is transmitted to the turning shaft 36 via the timing belt 53, the horizontal arm 3 is moved together with the turning shaft 36.
The cleaning brush 31a provided at the tip of the third wafer 3 swings on the surface of the semiconductor wafer 22.
【0038】上記旋回軸36の旋回角度は装置全体の運
転を制御する制御装置54によって設定されるようにな
っている。図1に示すように上記スピン処理装置Aの近
傍で、上記水平ア−ム33の揺動運動によって水平面上
を旋回する上記洗浄ブラシ31aの旋回運動の領域内に
は、この洗浄ブラシ31aを洗浄するための洗浄装置B
が設けられている。The turning angle of the turning shaft 36 is set by a control device 54 for controlling the operation of the entire apparatus. As shown in FIG. 1, in the area of the swirling motion of the cleaning brush 31a that swivels on a horizontal plane by the swinging motion of the horizontal arm 33 near the spin processing device A, the cleaning brush 31a is cleaned. Cleaning device B for cleaning
Is provided.
【0039】上記洗浄装置Bは図3に示すように上面が
開口した有底筒状の洗浄槽61を有する。この洗浄槽6
1の底部には開口部62が形成され、この開口部62
は、振動板63によって液密に閉塞されている。この振
動板63の下面には超音波振動子64が接着固定されて
いる。この超音波振動子64は超音波発振器65に接続
されている。したがって、上記超音波発振器65を作動
させることによって超音波振動子64が超音波振動する
ようになっている。As shown in FIG. 3, the cleaning device B has a bottomed cylindrical cleaning tank 61 having an open upper surface. This washing tank 6
1 has an opening 62 formed at the bottom thereof.
Are closed in a liquid-tight manner by the diaphragm 63. An ultrasonic vibrator 64 is adhesively fixed to the lower surface of the vibrating plate 63. The ultrasonic transducer 64 is connected to an ultrasonic oscillator 65. Therefore, the ultrasonic oscillator 64 is ultrasonically vibrated by operating the ultrasonic oscillator 65.
【0040】上記洗浄槽61の内部の高さ方向中途部の
内周面にはブラケット66が設けられている。このブラ
ケット66には、たとえば金網やパンチングメタルある
は多数の通孔67aが形成された合成樹脂板などの接触
部材としての多孔部材67が支持されている。A bracket 66 is provided on the inner peripheral surface of the washing tank 61 at an intermediate position in the height direction. The bracket 66 supports a porous member 67 as a contact member such as a wire mesh, a punched metal, or a synthetic resin plate having a large number of through holes 67a.
【0041】さらに、この洗浄槽61には、第2の供給
管68によって洗浄液が供給される。この洗浄液は洗浄
槽61の上面開口からオ−バフロ−する。オ−バフロ−
した洗浄液はドレンパン69で受けられ、このドレンパ
ン69に接続された排液管70を通って排出される。Further, a cleaning liquid is supplied to the cleaning tank 61 through a second supply pipe 68. This cleaning liquid overflows from the upper opening of the cleaning tank 61. Overflow
The cleaning liquid thus collected is received by a drain pan 69 and discharged through a drain pipe 70 connected to the drain pan 69.
【0042】上記多孔部材67には、図中鎖線で示すよ
うに洗浄ブラシ31aを回転させながら、または回転を
停止した状態で揺動させながら接触させて洗浄する。そ
のとき、上記洗浄槽61内の洗浄液を伝播する超音波振
動が上記多孔部材67の通孔67aを通過して上記洗浄
ブラシ31aに作用するから、上記洗浄ブラシ31aを
効率よく超音波洗浄することができるようになってい
る。The porous member 67 is cleaned by rotating the cleaning brush 31a as shown by a chain line in the drawing or by swinging the cleaning brush 31a while the rotation is stopped. At this time, since the ultrasonic vibration propagating the cleaning liquid in the cleaning tank 61 passes through the through hole 67a of the porous member 67 and acts on the cleaning brush 31a, the cleaning brush 31a is efficiently ultrasonically cleaned. Is available.
【0043】つぎに、上記構成の洗浄処理装置によって
半導体ウエハ22を洗浄処理するときの工程を説明す
る。スピン処理装置Aの回転チャック11に半導体ウエ
ハ22が供給保持されると、揺動駆動部46のモ−タ4
8が作動して水平ア−ム33が上記スピン処理装置Aの
上方に旋回位置決めされる。Next, steps for cleaning the semiconductor wafer 22 by the cleaning apparatus having the above-described structure will be described. When the semiconductor wafer 22 is supplied and held by the rotary chuck 11 of the spin processing apparatus A, the motor 4 of the swing drive unit 46
8, the horizontal arm 33 is pivotally positioned above the spin processing device A.
【0044】ついで、水平ア−ム33の先端部に設けら
れた洗浄ブラシ31aを回転させるとともに供給管35
から洗浄液を噴射させながら上下駆動シリンダ44を作
動させて水平ア−ム33を所定距離だけ下降させる。Next, the cleaning brush 31a provided at the end of the horizontal arm 33 is rotated and the supply pipe 35 is rotated.
The horizontal arm 33 is lowered by a predetermined distance by operating the vertical drive cylinder 44 while injecting the cleaning liquid from above.
【0045】それによって、上記洗浄ブラシ31aが回
転チャック11に保持された半導体ウエハ22の上面に
所定圧で接触するとともにその接触部分に洗浄液が噴射
される。その状態で上記水平ア−ム33は上記半導体ウ
エハ22の径方向に沿って往復旋回、すなわち揺動さ
せ、回転チャック1を低速で回転させることで、上記半
導体ウエハ22は上面全体がブラシ洗浄されることにな
る。As a result, the cleaning brush 31a comes into contact with the upper surface of the semiconductor wafer 22 held by the rotary chuck 11 at a predetermined pressure, and the cleaning liquid is sprayed on the contact portion. In this state, the horizontal arm 33 reciprocates, that is, swings along the radial direction of the semiconductor wafer 22, and the rotary chuck 1 is rotated at a low speed, so that the entire upper surface of the semiconductor wafer 22 is brush-cleaned. Will be.
【0046】このとき、支持軸5に形成された洗浄液供
給路30aから半導体ウエハ22の下面に向けて洗浄液
を噴射すれば、その下面も同時に洗浄することができ
る。上記半導体ウエハ22の洗浄が終了すると、水平ア
−ム33は上昇し、洗浄装置Bの上方へ旋回する。つい
で、水平ア−ム33は下降し、その先端部に設けられた
洗浄ブラシ31aは回転しながら、または回転が停止し
た状態で揺動させながら洗浄槽61内に支持された多孔
部材67に接触させる。At this time, if the cleaning liquid is sprayed from the cleaning liquid supply passage 30a formed on the support shaft 5 toward the lower surface of the semiconductor wafer 22, the lower surface can be cleaned at the same time. When the cleaning of the semiconductor wafer 22 is completed, the horizontal arm 33 rises and pivots above the cleaning device B. Next, the horizontal arm 33 descends, and the cleaning brush 31a provided at the tip thereof contacts the porous member 67 supported in the cleaning tank 61 while rotating or swinging while the rotation is stopped. Let it.
【0047】それによって、洗浄ブラシ31aは上記多
孔部材67に擦られるから、付着した異物が効率よく除
去される。それと同時に、超音波発振器65を作動させ
ることによって超音波振動子64が超音波振動し、洗浄
槽61内の洗浄液に超音波振動を付与する。この超音波
振動が上記多孔部材67の通孔67aを通って上記洗浄
ブラシ31aに作用するから、そのことによっても上記
洗浄ブラシ31aの洗浄効果が高められる。As a result, the cleaning brush 31a is rubbed against the porous member 67, so that the adhered foreign matter is efficiently removed. At the same time, the ultrasonic oscillator 64 is ultrasonically vibrated by operating the ultrasonic oscillator 65 to apply ultrasonic vibration to the cleaning liquid in the cleaning tank 61. Since this ultrasonic vibration acts on the cleaning brush 31a through the through hole 67a of the porous member 67, the cleaning effect of the cleaning brush 31a is also enhanced.
【0048】なお、洗浄ブラシ31aの洗浄時に、水平
ア−ム33を上記洗浄槽61の内径寸法の範囲内で往復
旋回させれば、上記洗浄ブラシ31aの洗浄をより一層
効率よく行うことができる。If the horizontal arm 33 is reciprocated within the range of the inner diameter of the cleaning tank 61 during cleaning of the cleaning brush 31a, the cleaning of the cleaning brush 31a can be performed more efficiently. .
【0049】洗浄ブラシ31aが洗浄装置Bによって洗
浄されている間に、上記スピン処理装置Aではスピンカ
ップ1の上カップ1aが下降駆動され、回転チャック1
1に保持された半導体ウエハ22が外部に露出する。つ
いで、図示しないたとえばロボットによって洗浄された
半導体ウエハ22が上記回転チャック11から排出さ
れ、そこに未洗浄の半導体ウエハ22が供給されたの
ち、上記上カップ1aが上昇駆動される。While the cleaning brush 31a is being cleaned by the cleaning device B, in the spin processing device A, the upper cup 1a of the spin cup 1 is driven downward, and the rotary chuck 1 is rotated.
The semiconductor wafer 22 held at 1 is exposed to the outside. Then, the semiconductor wafer 22 cleaned by, for example, a robot (not shown) is discharged from the rotary chuck 11, and the uncleaned semiconductor wafer 22 is supplied thereto. Then, the upper cup 1a is driven up.
【0050】つまり、上記スピン処理装置Aから洗浄さ
れた半導体ウエハ22を搬出し、未洗浄の半導体ウエハ
22を供給する間に、上記洗浄ブラシ31aの洗浄が終
了する。したがって、回転チャック11へ未洗浄の半導
体ウエハ22を供給し終えたならば、上記水平ア−ム3
3を上昇させて旋回し、洗浄ブラシ31aをスピン処理
装置Aの回転チャック11の上方に位置させた後、下降
させることで、清浄な洗浄ブラシ31aで上記回転チャ
ック11に保持された半導体ウエハ22を洗浄すること
ができるから、上記洗浄ブラシ31aによる洗浄時に、
そのブラシ31から半導体ウエハ22へ異物が転移する
のを防止できる。That is, the cleaning of the cleaning brush 31a is completed while the cleaned semiconductor wafer 22 is carried out from the spin processing apparatus A and the uncleaned semiconductor wafer 22 is supplied. Therefore, when the supply of the uncleaned semiconductor wafer 22 to the rotary chuck 11 is completed, the horizontal arm 3
3, the cleaning brush 31a is positioned above the rotary chuck 11 of the spin processing apparatus A, and then lowered, whereby the semiconductor wafer 22 held on the rotary chuck 11 by the clean cleaning brush 31a is lowered. Can be washed, so that when washing with the washing brush 31a,
Transfer of foreign matter from the brush 31 to the semiconductor wafer 22 can be prevented.
【0051】しかも、洗浄ブラシ31aの洗浄は、回転
チャック11に対して半導体ウエハ22を着脱する間に
行うようにしているから、半導体ウエハ22を洗浄する
ために要するタクトタイムが長くなるようなことがな
い。つまり、洗浄ブラシ31aを洗浄するようにして
も、処理能率の低下を招くことがない。In addition, since the cleaning of the cleaning brush 31a is performed while the semiconductor wafer 22 is being attached to and detached from the rotary chuck 11, the tact time required for cleaning the semiconductor wafer 22 may be increased. There is no. That is, even if the cleaning brush 31a is cleaned, the processing efficiency does not decrease.
【0052】図4(a)〜(c)は洗浄槽61内に保持
される接触部材の変形例を示す。同図(a)は洗浄ブラ
シ31aと接触する面が平面に形成された樹脂製の平板
71であり、同図(b)は洗浄ブラシ31aと接触する
面に複数の凸条72aが所定間隔で所定方向に沿って形
成された凸条板72である。同図(c)は洗浄ブラシ3
1aと接触する板面に複数の突起73aが突設された樹
脂成型品等を取着した突起板73である。FIGS. 4A to 4C show modified examples of the contact member held in the cleaning tank 61. FIG. FIG. 7A shows a flat plate 71 made of resin having a flat surface in contact with the cleaning brush 31a, and FIG. 7B shows a plurality of ridges 72a on the surface in contact with the cleaning brush 31a at predetermined intervals. It is a convex strip 72 formed along a predetermined direction. FIG. 3C shows the cleaning brush 3.
A projection plate 73 to which a resin molded product or the like having a plurality of projections 73a projecting from a plate surface in contact with 1a is attached.
【0053】図4(a)〜(c)に示された接触部材に
おいて、上記一実施形態と同様に通孔を穿設しておけ
ば、各接触板の下面側からの超音波振動を上面側、つま
り洗浄ブラシ31aに作用させることができる。In the contact members shown in FIGS. 4 (a) to 4 (c), if a through hole is formed in the same manner as in the above embodiment, the ultrasonic vibration from the lower surface side of each contact plate can be applied to the upper surface. Side, that is, the cleaning brush 31a.
【0054】なお、上記一実施形態では洗浄装置の洗浄
槽内に洗浄ブラシを接触させるための接触部材を設けた
が、接触部材を設けなくとも、洗浄液に超音波振動を付
与するだけで、所定の洗浄効果を得ることができる。In the above-described embodiment, the contact member for bringing the cleaning brush into contact with the cleaning tank of the cleaning device is provided. However, even if the contact member is not provided, only the ultrasonic vibration is applied to the cleaning liquid. Cleaning effect can be obtained.
【0055】また、洗浄ブラシとしてはブラシ毛からな
るものだけに限られず、被洗浄物の上を揺動して異物を
除去できるような構成のものであればよく、たとえばス
ポンジブラシやその他の材料を用いたものであってもよ
い。Further, the cleaning brush is not limited to a brush made of brush bristles, but may be of any configuration that can swing over the object to be cleaned to remove foreign matter, such as a sponge brush or other material. May be used.
【0056】さらに、水平ア−ムを上下駆動する駆動手
段としてはシリンダに代わりねじ軸を用いるようにして
もよく、ねじ軸を用いれば、上記水平ア−ムの高さ方向
の位置決めを精度よく設定することができる。Further, a screw shaft may be used in place of the cylinder as a driving means for vertically driving the horizontal arm. If a screw shaft is used, the positioning of the horizontal arm in the height direction can be performed with high accuracy. Can be set.
【0057】[0057]
【発明の効果】請求項1の発明によれば、被洗浄物を洗
浄した洗浄ブラシを洗浄するための洗浄手段を設けたこ
とで、この洗浄手段で被洗浄物を洗浄した洗浄ブラシを
洗浄することができる。そのため、清浄な洗浄ブラシで
被洗浄物を洗浄できるから、洗浄ブラシから被洗浄物に
異物が逆転移するのが防止される。According to the first aspect of the present invention, since the cleaning means for cleaning the cleaning brush which has cleaned the object to be cleaned is provided, the cleaning brush which has cleaned the object to be cleaned by this cleaning means is cleaned. be able to. Therefore, the object to be cleaned can be cleaned with a clean cleaning brush, so that foreign substances are prevented from being transferred from the cleaning brush to the object to be cleaned in reverse.
【0058】請求項2の発明によれば、洗浄ブラシを洗
浄する洗浄手段を、洗浄ブラシの旋回運動の領域内に設
けたことにより、被洗浄物を洗浄しないときに、上記洗
浄ブラシを旋回させて洗浄することができる。According to the second aspect of the present invention, the cleaning means for cleaning the cleaning brush is provided in the area of the turning movement of the cleaning brush, so that the cleaning brush is turned when the object to be cleaned is not cleaned. Can be washed.
【0059】請求項3の発明によれば、超音波振動が付
与された洗浄液で洗浄ブラシを洗浄するようにしたこと
で、洗浄ブラシの洗浄効果を高めることができる。請求
項4の発明によれば、洗浄ブラシを洗浄する洗浄槽内
に、この洗浄ブラシを接触させるための接触部材を設け
たことで、洗浄ブラシに付着した異物を効率よく除去す
ることができる。According to the third aspect of the present invention, the cleaning effect of the cleaning brush can be enhanced by cleaning the cleaning brush with the cleaning liquid to which ultrasonic vibration has been applied. According to the fourth aspect of the present invention, since the contact member for contacting the cleaning brush is provided in the cleaning tank for cleaning the cleaning brush, foreign substances attached to the cleaning brush can be efficiently removed.
【0060】請求項5の発明によれば、接触部材が多数
の通孔を有する多孔部材からなることで、洗浄槽内の洗
浄液に超音波振動を付与するときに、その超音波振動が
上記通孔を通過して接触部材に接触した洗浄ブラシに確
実に作用する。According to the fifth aspect of the present invention, when the contact member is formed of a porous member having a large number of through holes, the ultrasonic vibration is applied to the cleaning liquid in the cleaning tank when the ultrasonic vibration is applied to the cleaning liquid. It reliably acts on the cleaning brush that has passed through the hole and has come into contact with the contact member.
【0061】請求項6の発明によれば、洗浄ブラシによ
り被洗浄物を洗浄したならば、この洗浄ブラシを退避さ
せて洗浄された被洗浄物を搬出して未洗浄の被洗浄物を
供給する間に、上記洗浄ブラシを洗浄するようにしたこ
とで、被洗浄物を洗浄処理するために要するタクトタイ
ムを長くせずに洗浄ブラシを洗浄することができる。According to the sixth aspect of the present invention, when the object to be cleaned is cleaned by the cleaning brush, the cleaning brush is retracted, the cleaned object to be cleaned is carried out, and an uncleaned object is supplied. In the meantime, the cleaning brush is cleaned, so that the cleaning brush can be cleaned without increasing the tact time required for cleaning the object to be cleaned.
【図1】この発明の一実施形態の全体構成を示す平面
図。FIG. 1 is a plan view showing the overall configuration of an embodiment of the present invention.
【図2】同じくスピン処理装置の概略的構成を一部断面
して示す側面図。FIG. 2 is a side view showing a schematic configuration of the spin processing apparatus in a partially sectioned manner.
【図3】同じく洗浄装置の断面図。FIG. 3 is a sectional view of the cleaning device.
【図4】(a)〜(c)はそれぞれ接触部材の変形例を
示す断面図。FIGS. 4A to 4C are cross-sectional views each showing a modification of a contact member.
A…スピン処理装置(保持手段) B…洗浄装置(洗浄手段) 31a…洗浄ブラシ 44…上下駆動シリンダ(駆動手段) 46…旋回駆動部(駆動手段) 61…洗浄槽 64…超音波振動子 67…多孔部材(接触部材) 67a…通孔 A: Spin processing device (holding device) B: Cleaning device (cleaning device) 31a: Cleaning brush 44: Vertical drive cylinder (drive device) 46: Revolving drive unit (drive device) 61: Cleaning tank 64: Ultrasonic vibrator 67 ... Porous member (contact member) 67a ... Through hole
Claims (6)
液を供給するとともに、回転駆動される洗浄ブラシを接
触させて洗浄する洗浄処理装置において、 上記被洗浄物を所定の状態で保持する保持手段と、 上記洗浄ブラシを旋回運動および上下運動させるととも
に上記保持手段に保持された上記被洗浄物を洗浄すると
きにこの被洗浄物に上記洗浄ブラシを接触させる駆動手
段と、 上記被洗浄物を洗浄した上記洗浄ブラシを洗浄するため
の洗浄手段とを具備したことを特徴とする洗浄処理装
置。1. A cleaning apparatus for supplying a cleaning liquid to an object to be cleaned held in a predetermined state and for cleaning the cleaning object by contacting a cleaning brush which is driven in rotation, wherein the object to be cleaned is held in a predetermined state. Holding means, driving means for rotating the cleaning brush and vertical movement, and for bringing the cleaning brush into contact with the cleaning object when cleaning the cleaning object held by the holding means; and A cleaning means for cleaning the cleaning brush after cleaning the cleaning brush.
で、上記駆動手段によって旋回させられる上記洗浄ブラ
シの旋回運動の領域内に設けられていることを特徴とす
る請求項1記載の洗浄処理装置。2. The cleaning process according to claim 1, wherein said cleaning means is provided in the vicinity of said holding means and in an area of a turning movement of said cleaning brush turned by said driving means. apparatus.
浄槽と、この洗浄槽内の洗浄液に超音波振動を付与する
超音波振動子とからなることを特徴とする請求項1また
は請求項2記載の洗浄処理装置。3. The cleaning means according to claim 1, wherein the cleaning means comprises a cleaning tank to which a cleaning liquid is supplied, and an ultrasonic vibrator for applying ultrasonic vibration to the cleaning liquid in the cleaning liquid. 3. The cleaning apparatus according to 2.
浄槽と、この洗浄槽内設けられ上記洗浄ブラシを接触さ
せるための接触部材とからなることを特徴とする請求項
1乃至請求項3のいずれかに記載の洗浄処理装置。4. The cleaning means according to claim 1, wherein said cleaning means comprises a cleaning tank to which a cleaning liquid is supplied, and a contact member provided in said cleaning tank for contacting said cleaning brush. The cleaning treatment device according to any one of the above.
部材からなることを特徴とする請求項4記載の洗浄処理
装置。5. The cleaning apparatus according to claim 4, wherein said contact member comprises a porous member having a large number of through holes.
液を供給するとともに、回転駆動される洗浄ブラシを接
触させて洗浄する洗浄方法において、 上記被洗浄物を所定の状態で保持する保持工程と、 この保持工程で保持された上記被洗浄物を洗浄ブラシで
洗浄するワ−ク洗浄工程と、 このワ−ク洗浄工程で上記被洗浄物が洗浄されたならば
上記洗浄ブラシを退避させる退避工程と、 この退避工程のあとで洗浄された被洗浄物を搬出し未洗
浄の被洗浄物を供給する間に上記洗浄ブラシを洗浄する
ブラシ洗浄工程とを具備したことを特徴とする洗浄処理
方法。6. A cleaning method in which a cleaning liquid is supplied to an object to be cleaned held in a predetermined state, and the cleaning is performed by bringing a cleaning brush that is driven to rotate into contact therewith, wherein the object to be cleaned is held in a predetermined state. A work cleaning step of cleaning the object to be cleaned held in the holding step with a cleaning brush; and retreating the cleaning brush if the object to be cleaned is cleaned in the work cleaning step. A cleaning process comprising: a retreating step; and a brush cleaning step of carrying out the object to be cleaned washed after the retreating step and cleaning the cleaning brush while supplying an uncleaned object to be cleaned. Method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30471396A JP4047406B2 (en) | 1996-11-15 | 1996-11-15 | Cleaning processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30471396A JP4047406B2 (en) | 1996-11-15 | 1996-11-15 | Cleaning processing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10137710A true JPH10137710A (en) | 1998-05-26 |
JP4047406B2 JP4047406B2 (en) | 2008-02-13 |
Family
ID=17936323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30471396A Expired - Lifetime JP4047406B2 (en) | 1996-11-15 | 1996-11-15 | Cleaning processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4047406B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2313009A (en) * | 1995-11-30 | 1997-11-12 | Motorola Inc | Doherty-type amplifier and tuning method |
JP2008211253A (en) * | 2008-05-19 | 2008-09-11 | Shibaura Mechatronics Corp | Substrate processing apparatus, brush cleaning device |
KR20140126685A (en) * | 2013-04-23 | 2014-10-31 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate processing apparatus and a processed substrate menufacturing method |
JP2014216392A (en) * | 2013-04-23 | 2014-11-17 | 株式会社荏原製作所 | Substrate processing apparatus and method for manufacturing processed substrate |
US20150027489A1 (en) * | 2013-07-23 | 2015-01-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for cleaning wafer and scrubber |
JP2017176978A (en) * | 2016-03-29 | 2017-10-05 | 王子ホールディングス株式会社 | Transportation component purifier, safety device for purifier and method for manufacturing web |
JP2021044465A (en) * | 2019-09-13 | 2021-03-18 | 株式会社ディスコ | Cleaning device |
CN115069710A (en) * | 2022-06-27 | 2022-09-20 | 广东韶钢松山股份有限公司 | Laser ranging device and bridge crane |
-
1996
- 1996-11-15 JP JP30471396A patent/JP4047406B2/en not_active Expired - Lifetime
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2313009A (en) * | 1995-11-30 | 1997-11-12 | Motorola Inc | Doherty-type amplifier and tuning method |
JP2008211253A (en) * | 2008-05-19 | 2008-09-11 | Shibaura Mechatronics Corp | Substrate processing apparatus, brush cleaning device |
KR20140126685A (en) * | 2013-04-23 | 2014-10-31 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate processing apparatus and a processed substrate menufacturing method |
JP2014216392A (en) * | 2013-04-23 | 2014-11-17 | 株式会社荏原製作所 | Substrate processing apparatus and method for manufacturing processed substrate |
US9673067B2 (en) | 2013-04-23 | 2017-06-06 | Ebara Corporation | Substrate processing apparatus and processed substrate manufacturing method |
US20150027489A1 (en) * | 2013-07-23 | 2015-01-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for cleaning wafer and scrubber |
US9478444B2 (en) * | 2013-07-23 | 2016-10-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanisms for cleaning wafer and scrubber |
JP2017176978A (en) * | 2016-03-29 | 2017-10-05 | 王子ホールディングス株式会社 | Transportation component purifier, safety device for purifier and method for manufacturing web |
JP2021044465A (en) * | 2019-09-13 | 2021-03-18 | 株式会社ディスコ | Cleaning device |
CN115069710A (en) * | 2022-06-27 | 2022-09-20 | 广东韶钢松山股份有限公司 | Laser ranging device and bridge crane |
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