JPH09270472A - Surface-mounting holder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent gas from penetrating into a case at sealing by a method wherein a metal ring is additionally provided as a component part to a sealing part, a cap is formed into a protrudent shape, and a solder sealing member is interposed between the metal ring and the cap. SOLUTION: A metallized layer 14 plated with a metal layer 15 is provided to the circumferential edge of the opening of a holder base 11, and a plated metal ring 18 whose inner circumference is larger than the inner circumference 11' of the opening of the holder base 11 and outer circumference is equal to or smaller than the outer circumference 11" of the holder base 11 is provided onto the metallized layer 14. Furthermore, a protrudent cap 12 whose outer circumference is smaller than the inner circumference 18' of the metal ring 18 but larger than the inner circumference 11' of the opening of the holder base 11. Furthermore, a solder sealing material 17 is provided to the circumferential edge of the opening of the holder base 11, the inner circumferential side 18' of the metal ring 18, and the outer circumferential side of the cap 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount holder.

[0002]

2. Description of the Related Art Piezoelectric electronic components such as crystal oscillators, crystal oscillators and filters are widely used for mobile communication such as mobile phones and PHS. In recent years, there has been an increasing demand for smaller and thinner devices, and there has been a demand for smaller and thinner component electronic components as well, and for these electronic components, attention has been focused on surface mount ceramic packages. .

In the surface-mounting cage, the metallized interface plated on the peripheral edge of the opening surface of the cage base and the interface of the plated planar cap are fusion-bonded with a sealing material. FIG. 1 is a cross-sectional view of a conventional surface mount cage. The surface mounting cage has a ceramic cage base 1 and a cap 2, and the cage base 1 has a bottomed space portion 3 for housing and holding a piezoelectric electronic component. A metallization layer 4 and a metal plating layer 5 are formed on the peripheral portion of the opening surface. Solder is used as the sealing material 7, and seals the interface between the metallized layer 4 having the metal plating layer 5 and the interface of the planar cap 2 having the metal plating layer 6 on the peripheral edge of the opening surface of the cage base 1. It has stopped.

[0004]

The gas generated when the solder melts at the time of sealing penetrates into the inside of the retainer and deteriorates the characteristics of the piezoelectric electronic component. It is possible to previously melt and attach the solder to the interface between the cage base and the cap in order to eliminate gas generation, but the manufacturing process becomes long.

Since the cap is not positioned, the accuracy of the cap position at the time of sealing cannot be ensured and a leak due to the cap displacement occurs. Further, if the sealing area is reduced due to miniaturization, the bonding strength of the sealing portion is reduced.

[0006]

A retainer base for accommodating and holding a piezoelectric element, a cap for covering the retainer base, and a solder seal for airtightly contacting a peripheral portion of an opening surface of the retainer base and a surface of the cap. In a surface-mounting cage with a sealed structure made of a material, a metallized layer plated on the peripheral edge of the opening surface of the cage base, and the inner circumference of the ring on the metallized layer is within the peripheral edge of the open surface of the cage base. A metal ring that is larger than the circumference and whose outer circumference is equal to or smaller than the outer circumference of the cage base opening surface, and an outer circumference that is smaller than the inner circumference of the metal ring and larger than the cage base opening surface peripheral edge. The structure has a convex cap to be held, a solder sealing material that is airtightly bonded to the peripheral edge of the opening surface of the cage base, the inner peripheral side surface of the metal ring, and the outer peripheral side surface of the cap.

[0007]

2 is a sectional view showing an embodiment of the present invention. 3 and 4 are enlarged cross-sectional views of the joining portion, FIG. 3 shows the shape when the jig is set, and FIG. 4 shows the shape after the fusion joining.

A holder base 11 for accommodating and holding a piezoelectric element, and a cap 12 for covering the holder base 11.
In the surface mounting cage having a sealing structure composed of the solder sealing material 17 that hermetically contacts the opening peripheral edge of the cage base 11 and the surface of the cap 12, a metal plating is applied to the peripheral edge of the cage opening of the cage base 11. A metallized layer 14 provided with layer 15,
On the metallized layer 14, the inner circumference of the ring 18 is larger than the inner circumference 11 ′ of the peripheral edge of the opening surface of the cage base 11 and the outer circumference of the ring 18 is the outer circumference 1 of the peripheral edge of the opening surface of the cage base 11.
A metal ring 18 having a plating equal to or smaller than 1 ″, and a convex shape having an outer circumference smaller than the inner circumference 18 ′ of the metal ring 18 and larger than the inner circumference 11 ′ of the peripheral edge of the cage base 11. The cap 12, the peripheral edge portion of the opening surface of the cage base 11, the inner peripheral side surface 18 ′ of the metal ring, and the solder sealing material 17 that airtightly contacts the outer peripheral side surface of the cap 12.
Is a structure having.

In FIG. 3, the cage base 11 and the metal ring 18 are positioned by being guided by the outer periphery of the sealing jig 19. The metal ring 18, the cap 12, and the solder sealing material 17 position each other.

When heated in the state of FIG. 3, the solder sealing material 17
Melts into the state shown in FIG. If necessary, by applying a load in the direction of the arrow shown in FIG. 3 to the cap 12 when heating, the fixation of the cap 12 and the adhesion between the retainer base 11 and the cap 12 can be enhanced.

[0011]

The metal ring is added as a component to the sealing portion, the cap is formed in a convex shape, and the solder sealing material is interposed between the metal ring and the cap, so that the following effects are obtained.

Since the metal ring, the solder sealing material, and the cap position each other, the entire position can be easily positioned by guiding the outer circumference of the metal ring.

Since the solder encapsulant does not enter between the cage base and the cap, it becomes difficult for gas to enter the inside of the cage during melting of the solder encapsulant.

Since the solder sealing material is airtightly bonded to the peripheral edge of the opening surface of the cage base, the inner peripheral side surface of the metal ring, and the outer peripheral side surface of the cap 12, the bonding area is large and leakage does not occur. Also, the bonding strength is improved. This effect enables miniaturization.

[Brief description of drawings]

FIG. 1 is a sectional view of a surface-mounting cage according to a conventional technique.

FIG. 2 is a cross-sectional view of one embodiment of the present invention.

FIG. 3 is an enlarged cross-sectional view of a joint portion.

FIG. 4 is an enlarged cross-sectional view of a joint portion.

[Explanation of symbols]

 1 Cage Base 2 Cap 3 Bottomed Space 4 Metallization Layer 5 Metal Plating Layer 6 Metal Plating Layer 7 Sealing Material 11 Cage Base 11 'Inner Perimeter of Opening Edge of Cage Base 11' 'Cage Base Outer peripheral edge of opening face 12 Cap 14 Metallized layer 15 Metal plating layer 17 Solder encapsulant 18 Metal ring 18 'Inner perimeter of metal ring 19 Encapsulation jig

Claims (1)

[Claims] 1. A holder base for accommodating and holding a piezoelectric element, a cap for covering the holder base, and a sealing member made of a solder sealing material that is in airtight contact with the peripheral edge of the opening surface of the holder base and the cap surface. In the surface mount cage with a stop structure,
The metallized layer plated on the peripheral edge of the cage base opening surface, and the inner circumference of the ring on the metallized layer is larger than the inner circumference of the cage base opening surface peripheral edge, and the outer periphery of the ring is the cage base opening surface. A metal ring plated equal to or smaller than the outer circumference of the peripheral edge, a convex cap having an outer circumference smaller than the inner circumference of the metal ring and larger than the peripheral edge of the opening surface of the cage base, and the peripheral edge of the opening surface of the cage base. A surface mount cage characterized in that it has a solder sealing material that is airtightly bonded to the inner peripheral side surface of the metal part and the metal ring and the outer peripheral side surface of the cap.