JPH09255759A - Conductive composition - Google Patents
Conductive compositionInfo
- Publication number
- JPH09255759A JPH09255759A JP10060896A JP10060896A JPH09255759A JP H09255759 A JPH09255759 A JP H09255759A JP 10060896 A JP10060896 A JP 10060896A JP 10060896 A JP10060896 A JP 10060896A JP H09255759 A JPH09255759 A JP H09255759A
- Authority
- JP
- Japan
- Prior art keywords
- conductive composition
- conductive
- epoxy resin
- sulfonamide
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント回路基板
の導体回路形成用塗料や電磁波シールド用塗料、導電性
接着剤として利用される導電性組成物に関するものであ
る。特に回路基板上にスクリーン印刷等の方法で塗布
し、乾燥又は加熱硬化することにより、導電性及び接着
性の優れた導電性塗膜を形成できる導電性組成物に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating composition for forming a conductor circuit on a printed circuit board, a coating composition for electromagnetic waves, and a conductive composition used as a conductive adhesive. In particular, the present invention relates to a conductive composition capable of forming a conductive coating film having excellent conductivity and adhesiveness by applying the composition on a circuit board by a method such as screen printing and drying or heating and curing.
【０００２】[0002]
【従来の技術】導電性組成物は、導電性粉末を熱硬化性
樹脂又は熱可塑性樹脂からなる樹脂バインダの溶液に分
散させたものである。導電性粉末としては従来から銀粉
末が広く使用されてきたが、近年これに代わる材料とし
て、安価で導電性が優れマイグレーションを起こさな
い、銅粉末やニッケル粉末などの卑金属粉末が注目され
ている。しかし卑金属粉末、特に銅粉末は酸化され易い
欠点があり、貯蔵中や硬化させた後にも酸化して導電性
を失うので、長期間高い導電性を維持することが困難で
ある。特に接着性、硬化性、耐熱性が優れており、銀系
の組成物においてバインダ樹脂として普通に用いられて
いるエポキシ樹脂は、卑金属フィラーの酸化を促進する
傾向があるため、単独では卑金属粉末を用いた導電性組
成物のバインダ樹脂として使用できない。一方フェノー
ル樹脂、メラミン樹脂等の酸化防止作用を有する樹脂バ
インダは、特にプリント回路基板の銅箔に対する接着性
が不十分である。そこで、接着機能を持たせる目的でエ
ポキシ樹脂を１０％程度配合する試みもあるが、導電性
の低下は避けられない。2. Description of the Related Art A conductive composition is prepared by dispersing a conductive powder in a solution of a resin binder made of a thermosetting resin or a thermoplastic resin. Conventionally, silver powder has been widely used as the conductive powder, but in recent years, base metal powders such as copper powder and nickel powder, which are inexpensive, have excellent conductivity and do not cause migration, have been attracting attention as alternative materials. However, the base metal powder, particularly the copper powder, has a drawback that it is easily oxidized and oxidizes and loses conductivity even during storage or after curing, so that it is difficult to maintain high conductivity for a long time. Epoxy resin, which is particularly excellent in adhesiveness, curability, and heat resistance, and which is commonly used as a binder resin in silver-based compositions, tends to accelerate the oxidation of the base metal filler. It cannot be used as a binder resin for the conductive composition used. On the other hand, resin binders such as phenolic resins and melamine resins which have an antioxidant effect have particularly insufficient adhesiveness to the copper foil of the printed circuit board. Therefore, there is an attempt to blend an epoxy resin in an amount of about 10% for the purpose of imparting an adhesive function, but a decrease in conductivity cannot be avoided.
【０００３】酸化防止剤を添加することによって導電性
の低下を防止する方法も、種々試みられている。例え
ば、特公平１−３５０２５等にはハイドロキノン、カテ
コール、ピロガロールなどのヒドロキシベンゼン類を配
合して銅粉末表面の酸化を防止することが記載されてい
る。又、特公平２−４８１８３等にはトリエタノールア
ミン、エチレンジアミン等の脂肪族アミン類を添加する
ことが記載されている。しかしヒドロキシベンゼン系の
化合物は効果が小さく、単独では銅の酸化防止には不十
分であり、実際にはアミン類と併用することが多い。
又、脂肪族アミン類は酸化防止効果は大きいが、エポキ
シ樹脂との反応性が高い欠点があり、塗料が著しく増粘
したり硬化変質したりする。本発明者らは、先にスルホ
ンアミド類が顕著な酸化防止作用を有しており、エポキ
シ樹脂系の組成物にも配合し得ることを見出し、特許出
願を行ったが（特願平５−３４５７１９）、更に研究を
重ね、本発明を完成するに至った。Various methods have been tried for preventing the decrease in conductivity by adding an antioxidant. For example, JP-B 1-35025 and the like disclose that hydroxybenzenes such as hydroquinone, catechol and pyrogallol are blended to prevent oxidation of the surface of copper powder. In addition, Japanese Patent Publication No. 48183/1990 describes adding aliphatic amines such as triethanolamine and ethylenediamine. However, the hydroxybenzene-based compound has a small effect, and it is not sufficient to prevent the oxidation of copper by itself, and in practice, it is often used in combination with amines.
Further, although aliphatic amines have a large antioxidation effect, they have a drawback that they have a high reactivity with an epoxy resin, so that the viscosity of the coating material remarkably increases or the quality of the coating material deteriorates. The present inventors previously found that sulfonamides have a remarkable antioxidant effect and can be compounded in an epoxy resin composition, and filed a patent application (Japanese Patent Application No. 345719) and further researches have led to the completion of the present invention.
【０００４】[0004]
【発明が解決しようとする課題】本発明の目的は、塗料
適性、印刷性を損なうことなく効果的に導電性粉末の酸
化を防止し、このことによって、基板、特に銅箔に対す
る密着性を向上させるためにバインダとしてエポキシ樹
脂を用いても、導電性が低下せず、長期に且って導電性
の優れた導電性塗膜を形成し得る導電性組成物を提供す
ることにある。The object of the present invention is to effectively prevent the oxidation of the conductive powder without impairing the paint suitability and printability, thereby improving the adhesion to the substrate, especially the copper foil. Even if an epoxy resin is used as a binder for this purpose, it is to provide a conductive composition capable of forming a conductive coating film having excellent conductivity for a long time without lowering the conductivity.
【０００５】[0005]
【課題を解決するための手段】本発明は、エポキシ樹脂
にスルホンアミド類やスルホニルカルボン酸イミド類を
付加させることにより、エポキシ樹脂自身に酸化防止作
用を持たせたものである。本発明は、 「１． バインダ樹脂と、導電性粉末と、必要に応じて
溶剤とからなる導電性組成物であって、バインダ樹脂が
エポキシ基の一部にスルホンアミド、スルホニルカルボ
ン酸イミド及びこれ等の誘導体から選んだ１または２以
上の化合物を付加させたエポキシ樹脂を含有することを
特徴とする導電性組成物。 ２． スルホンアミド、スルホニルカルボン酸イミドの
誘導体がカルボン酸誘導体、アミン誘導体、アルコール
誘導体またはエーテル誘導体である、１項に記載された
導電性組成物。 ３． スルホンアミド、スルホニルカルボン酸イミド及
びこれ等の誘導体の付加量がエポキシ当量の０．１〜５
０％である、１項または２項に記載された導電性組成
物。 ４．バインダ樹脂を導電性粉末１００重量部に対して１
〜６０重量部配合した、１項ないし３項のいずれか１項
に記載された導電性組成物。 ５． 導電性粉末が銅、ニッケル、鉄、コバルトの金属
粉末、これらの金属を含む合金粉末、及びこれらの金属
又は合金で被覆された粉末から選ばれる１種又は２種以
上である、１項ないし４項のいずれか１項に記載された
導電性組成物。 ６． 導電性粉末がさらに銀、パラジウム、金、等の貴
金属を添加した粉末である、５項に記載された導電性組
成物。」に関する。According to the present invention, the epoxy resin itself has an antioxidant effect by adding sulfonamides or sulfonylcarboxylic acid imides to the epoxy resin. The present invention provides a conductive composition comprising "1. a binder resin, a conductive powder, and optionally a solvent, in which the binder resin has a sulfonamide, a sulfonylcarboxylic acid imide and a portion thereof as an epoxy group. Conductive composition characterized by containing an epoxy resin to which one or more compounds selected from derivatives such as 2. A sulfonamide or sulfonylcarboxylic acid imide derivative is a carboxylic acid derivative, an amine derivative, The electrically conductive composition according to item 1, which is an alcohol derivative or an ether derivative 3. The addition amount of sulfonamide, sulfonylcarboxylic acid imide and derivatives thereof is 0.1 to 5 of epoxy equivalent.
The electrically conductive composition according to item 1 or 2, which is 0%. 4. 1 part of binder resin to 100 parts by weight of conductive powder
The conductive composition according to any one of items 1 to 3, which is mixed in an amount of -60 parts by weight. 5. 1 to 4 wherein the conductive powder is one or more selected from metal powders of copper, nickel, iron and cobalt, alloy powders containing these metals, and powders coated with these metals or alloys. The conductive composition according to any one of items. 6. The electroconductive composition according to item 5, wherein the electroconductive powder is a powder to which a noble metal such as silver, palladium, or gold is further added. About.
【０００６】[0006]
【発明の実施の形態】スルホンアミドとしては、ブチル
スルホンアミド、ヘキシルスルホンアミド、オクチルス
ルホンアミド、ドデシルスルホンアミド、ヘキサデシル
スルホンアミド、オレイルスルホンアミド、リノレイル
スルホンアミド、ミリストレイルスルホンアミドや弗素
置換アルキルスルホンアミドなどの脂肪族スルホンアミ
ドや、ベンゼンスルホンアミド、アルキルベンゼンスル
ホンアミド、ナフタレンスルホンアミド、トルエンスル
ホンアミド、ベンジルスルホンアミド、ヒドロキシベン
ゼンスルホンアミド、アミノベンゼンスルホンアミド、
安息香酸スルホンアミド、ベンゼンジスルホンジアミ
ド、ナフタレンジスルホンジアミドなどの芳香族スルホ
ンアミド、これらのＮ−アルキル置換体などが挙げられ
る。BEST MODE FOR CARRYING OUT THE INVENTION Examples of the sulfonamide include butyl sulfonamide, hexyl sulfonamide, octyl sulfonamide, dodecyl sulfonamide, hexadecyl sulfonamide, oleyl sulfonamide, linoleyl sulfonamide, myristoyl sulfonamide and fluorine-substituted alkyl. Aliphatic sulfonamides such as sulfonamide, benzene sulfonamide, alkylbenzene sulfonamide, naphthalene sulfonamide, toluene sulfonamide, benzyl sulfonamide, hydroxybenzene sulfonamide, aminobenzene sulfonamide,
Examples thereof include aromatic sulfonamides such as benzoic acid sulfonamide, benzenedisulfondiamide and naphthalene disulfondiamide, and N-alkyl substituted products thereof.
【０００７】スルホニルカルボン酸イミドは、通常のイ
ミドのアシル基の一方がスルホニル基で置換えられた構
造のイミドであり、ｏ−スルホベンズイミドなどがあげ
られる。スルホンアミド及びスルホニルカルボン酸イミ
ドの誘導体としては、例えばアミノ基又はイミノ基のＨ
がカルボン酸、アミン、アルコール又はポリアルキレン
グリコール等のエーテルで置換されたＮ誘導体が使用さ
れる。これらのスルホンアミド類、スルホニルカルボン
酸イミド類は２種以上を併用して付加させてもよい。The sulfonylcarboxylic acid imide is an imide having a structure in which one of the acyl groups of a usual imide is substituted with a sulfonyl group, and examples thereof include o-sulfobenzimide. Derivatives of sulfonamides and sulfonylcarboxylic acid imides include, for example, H of an amino group or imino group.
N derivatives in which are substituted with carboxylic acids, amines, alcohols or ethers such as polyalkylene glycols are used. These sulfonamides and sulfonylcarboxylic acid imides may be added in combination of two or more.
【０００８】エポキシ樹脂に付加させるスルホンアミド
類、スルホニルカルボン酸イミド類の量は、エポキシ当
量の０．１〜５０％が適当である。０．１％より少ない
と酸化防止効果が弱く、５０％を越えるとエポキシ樹脂
の接着性、硬化性が損われ、バインダとして機能しなく
なる。これらの化合物をエポキシ樹脂に付加させる方法
は特に限定されない。例えば樹脂に適当量のスルホンア
ミド類やスルホニルカルボン酸イミド類を混合、撹拌す
るか、又は混合した後加熱処理することによって反応を
行わせる。The amount of sulfonamides and sulfonylcarboxylic acid imides added to the epoxy resin is appropriately 0.1 to 50% of the epoxy equivalent. If it is less than 0.1%, the antioxidant effect is weak, and if it exceeds 50%, the adhesiveness and curability of the epoxy resin are impaired, and the binder does not function as a binder. The method of adding these compounds to the epoxy resin is not particularly limited. For example, the reaction is carried out by mixing an appropriate amount of sulfonamides or sulfonylcarboxylic acid imides with the resin, stirring, or by mixing and then heating the mixture.
【０００９】エポキシ樹脂は、通常使用されるものでよ
く、例えば、ビスフェノール型エポキシ樹脂、クレゾー
ルノボラック型エポキシ樹脂、フェノールノボラック型
エポキシ樹脂、脂環式エポキシ樹脂などが挙げられる。The epoxy resin may be one usually used, and examples thereof include bisphenol type epoxy resin, cresol novolac type epoxy resin, phenol novolac type epoxy resin, and alicyclic epoxy resin.
【００１０】バインダ樹脂には、本発明のエポキシ樹脂
の他に、必要に応じて種々の熱硬化性樹脂及び熱可塑性
樹脂を併用することができる。併用する樹脂としては、
メラミン樹脂、ポリエステル樹脂、アルキッド樹脂、ア
クリル樹脂、ビニル樹脂、セルロース誘導体や他のエポ
キシ樹脂などが挙げられる。バインダ樹脂の配合割合
は、導電性粉末１００重量部に対して１〜６０重量部程
度が望ましい。１重量部より少ないと印刷性が損われ、
又接着性が低下すると共に抵抗値も大きくなる。６０重
量部を越えると抵抗値が増大する。As the binder resin, in addition to the epoxy resin of the present invention, various thermosetting resins and thermoplastic resins can be used in combination as required. As the resin used in combination,
Examples thereof include melamine resin, polyester resin, alkyd resin, acrylic resin, vinyl resin, cellulose derivative and other epoxy resins. The mixing ratio of the binder resin is preferably about 1 to 60 parts by weight with respect to 100 parts by weight of the conductive powder. If it is less than 1 part by weight, the printability will be impaired,
In addition, the adhesiveness decreases and the resistance value increases. If it exceeds 60 parts by weight, the resistance value increases.
【００１１】導電性粉末としては、銅、ニッケル、鉄、
コバルトなどの卑金属粉末や、銀、パラジウム、金など
の貴金属粉末の１種又は２種以上が使用される。又これ
らの金属を含む合金粉末、例えば銀−銅合金、銀−パラ
ジウム一銅合金、洋白、リン青銅、真鍮、半田０の粉末
や、これらの金属又は合金で被覆された粉末を用いても
よい。これらの導電性粉末は、従来法により種々の脂肪
酸類やカップリング剤などで表面処理して用いることも
できる。As the conductive powder, copper, nickel, iron,
One or more kinds of base metal powder such as cobalt and noble metal powder such as silver, palladium and gold are used. Also, alloy powders containing these metals, such as silver-copper alloy, silver-palladium-copper alloy, nickel silver, phosphor bronze, brass, solder 0 powder, and powders coated with these metals or alloys may be used. Good. These conductive powders can also be used after being surface-treated with various fatty acids, coupling agents and the like by a conventional method.
【００１２】組成物には更に、塗布適性等を調節するた
めに通常使用される溶剤を必要に応じて配合することが
できる。この他、従来から導電性組成物に通常配合され
ている他の添加剤、例えば界面活性剤、消泡剤、可塑
剤、揺変剤、分散剤などを適宜添加することもできる。The composition may further contain, if necessary, a solvent which is usually used for controlling coating suitability and the like. In addition to these, other additives that have been conventionally compounded in the conductive composition, such as a surfactant, a defoaming agent, a plasticizer, a thixotropic agent, and a dispersant, may be appropriately added.
【００１３】[0013]
実施例１ １００ｇの油化シェルエポキシ（株）ビスフェノールＦ
型エポキシ樹脂エピコート８０７に、０．５ｇのオクチ
ルベンゼンスルホンアミドを加え、８０℃で１時間加熱
処理して、エポキシ基の一部にオクチルベンゼンスルホ
ンアミドが付加したエポキシ樹脂Ａを得た。このエポキ
シ樹脂Ａに表１に示される各成分を混合し、３本ロール
ミルで混練して導電性組成物を製造した。なお配合量は
全て重量部である。得られた組成物を銅箔／ガラスエポ
キシ樹脂基板上に１０ｍｍ×１０ｍｍの正方形パターン
に塗布し、１６０℃の温度で３０分間硬化処理を行っ
た。硬化塗膜の比抵抗値を表１に併せて示す。Example 1 100 g of oiled shell epoxy Bisphenol F
0.5 g of octylbenzenesulfonamide was added to the type epoxy resin Epicoat 807 and heat-treated at 80 ° C. for 1 hour to obtain an epoxy resin A in which octylbenzenesulfonamide was added to a part of the epoxy groups. Each component shown in Table 1 was mixed with this epoxy resin A and kneaded with a three-roll mill to produce a conductive composition. The blending amounts are all parts by weight. The obtained composition was applied onto a copper foil / glass epoxy resin substrate in a square pattern of 10 mm × 10 mm and cured at a temperature of 160 ° C. for 30 minutes. The specific resistance value of the cured coating film is also shown in Table 1.
【００１４】実施例２、実施例３ 成分を表１に示すようにした以外は実施例１と同様にし
て導電性組成物を得た。導電性組成物を実施例１と同様
にして基板上に塗布硬化させ、硬化塗膜の比抵抗値を表
１に示す。Example 2 and Example 3 A conductive composition was obtained in the same manner as in Example 1 except that the components shown in Table 1 were used. The conductive composition was applied and cured on the substrate in the same manner as in Example 1, and the specific resistance value of the cured coating film is shown in Table 1.
【００１５】[0015]
【表１】 [Table 1]
【００１６】実施例４ エポキシ樹脂に付加させるオクチルベンゼンスルホンア
ミドを１０ｇとする以外は実施例１と同様にして、エポ
キシ樹脂の一部にオクチルベンゼンスルホンアミドが付
加したエポキシ樹脂Ｂを得た。このエポキシ樹脂Ｂを用
い、下記の各成分を混合し、３本ロールミルで混練して
導電性組成物を製造した。 電解銅粉末 １００ 重量部 フェノール樹脂 ２７ 重量部 エポキシ樹脂Ｂ １．８重量部 ラウリン酸 １ 重量部 エチルカルビトール １０ 重量部 得られた組成物を実施例１と同様にしてそれぞれ銅箔／
ガラスエポキシ樹脂基板上に塗布、硬化させたところ、
硬化塗膜の比抵抗値は３３×１０−５Ωｃｍであった。Example 4 An epoxy resin B in which octylbenzenesulfonamide was added to a part of the epoxy resin was obtained in the same manner as in Example 1 except that the amount of octylbenzenesulfonamide added to the epoxy resin was changed to 10 g. Using the epoxy resin B, the following components were mixed and kneaded with a three-roll mill to produce a conductive composition. Electrolytic copper powder 100 parts by weight Phenolic resin 27 parts by weight Epoxy resin B 1.8 parts by weight Lauric acid 1 part by weight Ethylcarbitol 10 parts by weight The obtained composition was treated in the same manner as in Example 1 to obtain copper foil /
When applied and cured on a glass epoxy resin substrate,
The specific resistance value of the cured coating film was 33 × 10 −5 Ωcm.
【００１７】実施例５ オクチルベンゼンスルホンアミドに代えてｏ−スルホベ
ンズイミド０．５ｇをエポキシ樹脂に付加させる以外は
実施例１と同様にして、エポキシ樹脂の一部にｏ−スル
ホベンズイミドが付加したエポキシ樹脂Ｃを得た。この
エポキシ樹脂Ｃをエポキシ樹脂Ａに代えて用いる以外は
実施例２と同様にして、導電性組成物を製造した。同様
に基板上に塗布して硬化処理を行い、硬化塗膜の比抵抗
を測定したところ２０×１０−５Ωｃｍであった。Example 5 O-sulfobenzimide was added to a part of the epoxy resin in the same manner as in Example 1 except that 0.5 g of o-sulfobenzimide was added to the epoxy resin instead of octylbenzenesulfonamide. The epoxy resin C was obtained. A conductive composition was produced in the same manner as in Example 2 except that this epoxy resin C was used instead of the epoxy resin A. Similarly, when it was applied onto a substrate and cured, and the specific resistance of the cured coating film was measured, it was 20 × 10 −5 Ωcm.
【００１８】比較例１ エポキシ樹脂Ａに代えて、オクチルベンゼンスルホンア
ミドを付加させないエポキシ樹脂エピコート８０７を使
用する以外は実施例１と同様にして、導電性組成物を得
た。同様に基板上に塗布して硬化処理を行った。硬化塗
膜の比抵抗を測定したところ、全く導通を示さなかっ
た。Comparative Example 1 A conductive composition was obtained in the same manner as in Example 1 except that the epoxy resin A was replaced with an epoxy resin Epicoat 807 without addition of octylbenzenesulfonamide. Similarly, it was applied onto the substrate and cured. When the specific resistance of the cured coating film was measured, no conduction was shown.
【００１９】[0019]
【発明の効果】本発明で用いるエポキシ樹脂は、それ自
身が酸化防止作用を有するので、印刷性等を損なうこと
なく、導電性粉末の酸化が効果的に防止される。従って
導電性組成物の貯蔵中や硬化後にも導電性粉末が酸化す
ることがなく、初期導電性が優れ、かつ長期にわたって
高い導電性を維持することができる。又、これによりバ
インダとしてエポキシ樹脂を使用することが可能になる
ため、基板や銅箔に対する密着強度が大きい導電性塗膜
を形成することができる。Since the epoxy resin used in the present invention has an antioxidant function by itself, the conductive powder is effectively prevented from being oxidized without impairing printability. Therefore, the conductive powder does not oxidize during storage or after curing of the conductive composition, the initial conductivity is excellent, and high conductivity can be maintained for a long period of time. Further, this makes it possible to use an epoxy resin as a binder, so that it is possible to form a conductive coating film having a high adhesion strength to a substrate or a copper foil.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｂ 1/22 Ｈ０１Ｂ 1/22 Ｃ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location H01B 1/22 H01B 1/22 C
Claims (6)
応じて溶剤とからなる導電性組成物であって、バインダ
樹脂がエポキシ基の一部にスルホンアミド、スルホニル
カルボン酸イミド及びこれ等の誘導体から選んだ１また
は２以上の化合物を付加させたエポキシ樹脂を含有する
ことを特徴とする導電性組成物。1. A conductive composition comprising a binder resin, a conductive powder, and, if necessary, a solvent, wherein the binder resin contains a sulfonamide, a sulfonylcarboxylic acid imide and a part thereof in an epoxy group. A conductive composition comprising an epoxy resin to which one or more compounds selected from derivatives are added.
イミドの誘導体がカルボン酸誘導体、アミン誘導体、ア
ルコール誘導体またはエーテル誘導体である、請求項１
に記載された導電性組成物。2. The derivative of sulfonamide or sulfonylcarboxylic acid imide is a carboxylic acid derivative, an amine derivative, an alcohol derivative or an ether derivative.
The electrically conductive composition described in.
イミド及びこれ等の誘導体の付加量がエポキシ当量の
０．１〜５０％である、請求項１または２に記載された
導電性組成物。3. The conductive composition according to claim 1, wherein the addition amount of sulfonamide, sulfonylcarboxylic acid imide and derivatives thereof is 0.1 to 50% of the epoxy equivalent.
に対して１〜６０重量部配合した、請求項１ないし３の
いずれか１項に記載された導電性組成物。4. The conductive composition according to claim 1, wherein 1 to 60 parts by weight of a binder resin is mixed with 100 parts by weight of the conductive powder.
トの金属粉末、これらの金属を含む合金粉末、及びこれ
らの金属又は合金で被覆された粉末から選ばれる１種又
は２種以上である、請求項１ないし４のいずれか１項に
記載された導電性組成物。5. The conductive powder is one or more selected from metal powders of copper, nickel, iron and cobalt, alloy powders containing these metals, and powders coated with these metals or alloys. The conductive composition according to any one of claims 1 to 4.
金、等の貴金属を添加した粉末である、請求項５に記載
された導電性組成物。6. The conductive powder is further silver, palladium,
The conductive composition according to claim 5, which is a powder to which a noble metal such as gold is added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10060896A JP3185659B2 (en) | 1996-03-19 | 1996-03-19 | Conductive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10060896A JP3185659B2 (en) | 1996-03-19 | 1996-03-19 | Conductive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09255759A true JPH09255759A (en) | 1997-09-30 |
| JP3185659B2 JP3185659B2 (en) | 2001-07-11 |
Family
ID=14278571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10060896A Expired - Lifetime JP3185659B2 (en) | 1996-03-19 | 1996-03-19 | Conductive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3185659B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6797407B2 (en) | 2000-12-21 | 2004-09-28 | The Furukawa Electric Co., Ltd. | Metallic plate material for electric/electronic instrument and electric/electronic instrument using same |
| JP2008288601A (en) * | 2008-05-26 | 2008-11-27 | Sony Chemical & Information Device Corp | Electrical device |
| US7491290B2 (en) | 2002-02-21 | 2009-02-17 | Sony Chemical & Information Device Corporation | Two-pack type adhesive |
-
1996
- 1996-03-19 JP JP10060896A patent/JP3185659B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6797407B2 (en) | 2000-12-21 | 2004-09-28 | The Furukawa Electric Co., Ltd. | Metallic plate material for electric/electronic instrument and electric/electronic instrument using same |
| US7491290B2 (en) | 2002-02-21 | 2009-02-17 | Sony Chemical & Information Device Corporation | Two-pack type adhesive |
| JP2008288601A (en) * | 2008-05-26 | 2008-11-27 | Sony Chemical & Information Device Corp | Electrical device |
| JP4700082B2 (en) * | 2008-05-26 | 2011-06-15 | ソニーケミカル＆インフォメーションデバイス株式会社 | Electrical equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3185659B2 (en) | 2001-07-11 |
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