JP4700082B2 - Electrical equipment - Google Patents

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JP4700082B2
JP4700082B2 JP2008136645A JP2008136645A JP4700082B2 JP 4700082 B2 JP4700082 B2 JP 4700082B2 JP 2008136645 A JP2008136645 A JP 2008136645A JP 2008136645 A JP2008136645 A JP 2008136645A JP 4700082 B2 JP4700082 B2 JP 4700082B2
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adhesive
epoxy resin
resin
electrode
silane coupling
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JP2008288601A (en
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隆行 松島
雅男 斉藤
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Dexerials Corp
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Sony Chemical and Information Device Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731—Location prior to the connecting process
    • H01L2224/73101—Location prior to the connecting process on the same surface
    • H01L2224/73103—Bump and layer connectors
    • H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Description

本発明は接着剤にかかり、特に、基板に半導体チップやＴＣＰを熱圧着により接続する接着剤に関する。   The present invention relates to an adhesive, and more particularly to an adhesive for connecting a semiconductor chip or TCP to a substrate by thermocompression bonding.

従来より、半導体チップや基板等の貼付対象物を貼り合わせ、電気装置を製造するために、熱硬化性樹脂であるエポキシ樹脂を含有し、該エポキシ樹脂の熱重合により硬化する熱硬化型の接着剤が用いられている。   Conventionally, a thermosetting adhesive that contains an epoxy resin that is a thermosetting resin and is cured by thermal polymerization of the epoxy resin in order to bond an object to be bonded such as a semiconductor chip or a substrate and manufacture an electrical device. The agent is used.

エポキシ樹脂の熱重合反応を促進するために、一般に接着剤には硬化剤が用いられており、例えば、イミダゾール化合物のように、エポキシ樹脂の重合触媒として機能する硬化剤や、メルカプタン化合物やアミン化合物のように硬化剤自体がエポキシ樹脂と付加反応し、重合体を形成する硬化剤が広く用いられている。
イミダゾール化合物を硬化剤として用いた場合は接着剤を短時間で硬化させることが可能であるが、接着剤を１８０℃以上の高温に加熱する必要があり、加熱によって貼付対象物に伸びや反り等の変形が生じる場合がある。 In order to accelerate the thermal polymerization reaction of the epoxy resin, a curing agent is generally used for the adhesive. For example, a curing agent that functions as a polymerization catalyst for an epoxy resin, such as an imidazole compound, a mercaptan compound, or an amine compound. As described above, a curing agent that undergoes an addition reaction with an epoxy resin to form a polymer is widely used.
When an imidazole compound is used as a curing agent, it is possible to cure the adhesive in a short time, but it is necessary to heat the adhesive to a high temperature of 180 ° C. or higher. May occur.

アミン化合物やメルカプタン化合物を硬化剤として用いると、接着剤をより低温で硬化させることができるが、接着剤は硬化に要する時間がイミダゾール化合物の場合よりも長くなり、生産性が低くなってしまう。また、低温で硬化する接着剤は常温でもエポキシ樹脂の重合反応が進行するため、接着剤の保存性が著しく劣る。いずれにしろ、低温、短時間で硬化し、かつ、保存性の高い接着剤を得ることは困難であった。
特開昭５６−１８６４３号公報 特開平７−２６２３５号公報 特開２００１−２８９３号公報 特開平９−２５５７５９号公報 When an amine compound or a mercaptan compound is used as a curing agent, the adhesive can be cured at a lower temperature. However, the adhesive requires a longer time for curing than in the case of an imidazole compound, and the productivity is lowered. In addition, the adhesive that cures at a low temperature undergoes a polymerization reaction of the epoxy resin even at room temperature, so that the storage stability of the adhesive is remarkably inferior. In any case, it has been difficult to obtain an adhesive that cures at a low temperature in a short time and has high storage stability.
JP-A-56-18643 Japanese Patent Laid-Open No. 7-26235 JP 2001-2893 A Japanese Patent Laid-Open No. 9-255759

本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、保存性に優れ、かつ、低温、短時間の条件で硬化可能な接着剤を提供することにある。   The present invention was created in order to solve the disadvantages of the prior art described above, and an object of the present invention is to provide an adhesive that is excellent in storage stability and can be cured under conditions of low temperature and short time.

上記課題を解決するために、請求項１記載の発明は、第一のエポキシ樹脂と、前記第一のエポキシ樹脂にシランカップリング剤が添加されたペースト状の第一の接着材料と、第二のエポキシ樹脂と、前記第二のエポキシ樹脂に金属キレート又は金属アルコラートが添加されたペースト状の第二の接着材料とを用意し、前記第一、第二の接着材料のいずれかに導電性粒子を含有させ、ガラス基板と、前記ガラス基板上に配置された第一の電極とを有する第一の貼付対象物に、前記第一の接着材料を塗布して第一の塗布層を形成し、第二の電極を有する第二の貼付対象物に、前記第二の接着材料を塗布して第二の塗布層を形成し、前記第二の電極が配置された側の面を、前記第一の電極が配置された面に向けさせ、前記第一、第二の貼付対象物を相対的に移動させ、前記第二の塗布層を前記第一の塗布層に押し当てて密着させ、前記第二の貼付対象物を、前記第一、第二の電極間に導電性粒子が挟みこまれるまで加熱及び押圧し、更に、加熱及び押圧することにより、前記第二のエポキシ樹脂に添加された前記金属キレート又は前記金属アルコラートと前記シランカップリング剤とを反応させて硬化成分を連鎖反応させ、前記第一と第二のエポキシ樹脂を重合させることにより、前記第一、第二の塗布層全体を硬化させた電気装置である。
請求項２記載の発明は、請求項１記載の電気装置であって、前記シランカップリング剤がエポキシ環を有することを特徴とする電気装置である。
In order to solve the above-mentioned problems, the invention according to claim 1 includes a first epoxy resin, a paste-like first adhesive material in which a silane coupling agent is added to the first epoxy resin, and a second An epoxy resin and a paste-like second adhesive material in which a metal chelate or a metal alcoholate is added to the second epoxy resin, and conductive particles are provided in either the first or second adhesive material. A first applied layer by applying the first adhesive material to a first sticking object having a glass substrate and a first electrode disposed on the glass substrate, The second adhesive material is applied to a second sticking object having a second electrode to form a second coating layer, and the surface on the side where the second electrode is arranged is the first surface. The first and second objects to be applied are The second coating layer is pressed against and closely adhered to the first coating layer, and the second pasting object is sandwiched between the first and second electrodes. It is heated and pressed until it is mixed , and further, by heating and pressing, the metal chelate or metal alcoholate added to the second epoxy resin reacts with the silane coupling agent to cause a chain reaction of the curing component. And the first and second epoxy resins are polymerized to cure the first and second coating layers.
A second aspect of the present invention is the electric device according to the first aspect, wherein the silane coupling agent has an epoxy ring.

本発明は上記のように構成されており、第一の硬化剤と第二の硬化剤とが反応して硬化剤成分が生成し、初めて第一、第二の樹脂成分は重合するので、第一、第二の接着材料がそれぞれ分離されている状態では、第一、第二の樹脂成分は硬化しない。
一般に用いられる二液型の接着剤では、硬化剤と樹脂成分とを使用前に混合する必要があり、混合後は直ちに樹脂成分の重合反応が進行するので、混合後の接着剤の保存性が悪い。 The present invention is configured as described above, and the first curing agent and the second curing agent react to form a curing agent component, and the first and second resin components are polymerized for the first time. In the state where the first and second adhesive materials are separated from each other, the first and second resin components are not cured.
In a two-component adhesive that is generally used, it is necessary to mix the curing agent and the resin component before use, and since the polymerization reaction of the resin component proceeds immediately after mixing, the storage stability of the adhesive after mixing is improved. bad.

しかしながら、本発明では第一、第二の接着材料をそれぞれ別々の貼付対象物に貼付又は塗布し、一方の貼付対象物上の第一の接着材料に他方の貼付対象物上の第二の接着材料を密着させれば、少なくとも第一、第二の接着材料の界面で第一、第二の硬化剤が反応して硬化成分が遊離し、該硬化成分によって第一、第二の樹脂成分を連鎖的に重合させることができる。従って、本発明では接着剤の使用前に第一、第二の接着材料を混合する工程が必要なく、貼付対象物を貼り合わせる直前まで第一、第二の樹脂成分が重合しない。   However, in the present invention, the first and second adhesive materials are each applied or applied to separate application objects, and the second adhesion on the other application object is applied to the first adhesive material on one application object. When the materials are brought into close contact, the first and second curing agents react at the interface of at least the first and second adhesive materials to release the cured components, and the first and second resin components are separated by the cured components. It can be polymerized in a chain. Therefore, in the present invention, there is no need to mix the first and second adhesive materials before using the adhesive, and the first and second resin components are not polymerized until just before the object to be pasted is bonded.

第一、第二の樹脂成分としては、第一、第二の樹脂成分が互いに共重合するものを用いることができるが、硬化成分によって第一の樹脂成分と、第二の樹脂成分がそれぞれ単独重合可能なものを用いれば、第一、第二の接着材料が完全に混ざり合わなくても樹脂成分の重合反応を進行させることができる。   As the first and second resin components, those in which the first and second resin components are copolymerized with each other can be used. However, the first resin component and the second resin component are each independent depending on the curing component. If a polymerizable material is used, the polymerization reaction of the resin component can be advanced even if the first and second adhesive materials are not completely mixed.

また、第一の樹脂成分と、第二の樹脂成分にそれぞれ同じ種類の樹脂を用いた場合には、第一、第二の接着材料同士が混ざりやすいだけではなく、第一、第二の接着材料の熱膨張率の差が少なくなるので、第一、第二の接着材料の界面に生じる内部応力が小さく、結果、硬化した状態の第一、第二の接着材料の界面破壊が起きにくい。   In addition, when the same resin is used for the first resin component and the second resin component, the first and second adhesive materials are not only easily mixed, but also the first and second adhesive materials Since the difference in the coefficient of thermal expansion of the material is reduced, the internal stress generated at the interface between the first and second adhesive materials is small, and as a result, the interface failure between the cured first and second adhesive materials does not easily occur.

第一、第二の接着材料の粘度が高い場合や、第一、第二の接着材料がフィルム状に成形されている場合は、第一、第二の接着材料を加熱しながら第二の貼付対象物を押圧すれば、第一、第二の接着材料が加熱によって軟化するので、第一、第二の接着剤がより混ざりやすくなる。
第一、第二の硬化剤にそれぞれシランカップリング剤と金属キレートを用い、熱硬化性樹脂としてエポキシ樹脂を用いた場合の反応を下記反応式（１）〜（４）に示す。 When the viscosity of the first and second adhesive materials is high, or when the first and second adhesive materials are formed into a film, the second application is performed while heating the first and second adhesive materials. If the object is pressed, the first and second adhesive materials are softened by heating, so that the first and second adhesives are more easily mixed.
Reactions when a silane coupling agent and a metal chelate are used for the first and second curing agents and an epoxy resin is used as the thermosetting resin are shown in the following reaction formulas (1) to (4).

Figure 0004700082
Figure 0004700082

反応式（１）左式に示すシランカップリング剤はケイ素に結合するアルコキシ基（ＲＯ）を有している。シランカップリング剤が大気中や接着剤中の水と接触すると、アルコキシ基が加水分解されシラノールとなる（反応式（１）右式）。
反応式（２）左式に一例として金属キレートであるアルミニウムキレートを示す。アルミニウムキレートの中心金属であるＡｌには配位子Ｒが結合している。 Reaction Formula (1) The silane coupling agent shown in the left formula has an alkoxy group (RO) bonded to silicon. When the silane coupling agent comes into contact with water in the atmosphere or adhesive, the alkoxy group is hydrolyzed to silanol (reaction formula (1), right formula).
As an example, the left side of the reaction formula (2) shows an aluminum chelate which is a metal chelate. A ligand R is bonded to Al, which is the central metal of the aluminum chelate.

シランカップリング剤と金属キレートとが混ざった状態で第一、第二の接着材料を加熱すると、シランカップリング剤が加水分解されてなるシラノールと、アルミニウムキレートとが加熱によって反応し、酸素原子を介してシラノールのケイ素がアルミニウムに結合する（反応式（２）右式）。
その状態のアルミニウムキレートに、他のシラノールが平衡反応で配位すると、反応式（３）右式に示すようにブレステッド酸点を生じ、活性化したプロトンが生成される。 When the first and second adhesive materials are heated in a state where the silane coupling agent and the metal chelate are mixed, the silanol obtained by hydrolysis of the silane coupling agent and the aluminum chelate react by heating, and oxygen atoms are converted. Silanol silicon bonds to aluminum (reaction formula (2), right formula).
When other silanols coordinate with the aluminum chelate in that state by an equilibrium reaction, a Breasted acid point is generated as shown in the right equation of the reaction formula (3), and activated protons are generated.

反応式（４）に示すように、エポキシ樹脂の末端に位置するエポキシ環が活性化したプロトンによって開環し、他のエポキシ樹脂のエポキシ環と重合する（カチオン重合）。
反応式（２）、（３）に示す反応は従来の接着剤が硬化する温度（１８０℃以上）よりも低い温度で進行するので、本発明の二液型接着剤は従来よりも低温、短時間で硬化する。
第一、第二の硬化剤としてシランカップリング剤を用いる場合、シランカップリング剤に水を添加し、予めシランカップリング剤を加水分解しておけば、樹脂成分が重合する反応がより迅速に進行する。 As shown in Reaction Formula (4), the epoxy ring located at the end of the epoxy resin is opened by activated protons and polymerized with the epoxy ring of another epoxy resin (cation polymerization).
Since the reactions shown in the reaction formulas (2) and (3) proceed at a temperature lower than the temperature at which the conventional adhesive is cured (180 ° C. or higher), the two-part adhesive of the present invention is lower in temperature and shorter than the conventional one. Cure in time.
When using a silane coupling agent as the first and second curing agents, if water is added to the silane coupling agent and the silane coupling agent is hydrolyzed in advance, the reaction of polymerizing the resin component becomes faster. proceed.

本発明によれば、シランカップリング剤と金属キレートとの反応により、エポキシ樹脂がカチオン重合するので、従来の接着剤よりも低温、短時間第一、第二の接着材料を硬化させることができる。また、第一の硬化剤と第二の硬化剤はそれぞれ別々の接着剤材料に添加されているので、二成分型接着剤の使用前には第一、第二の樹脂成分の重合反応が起こらず、結果、本発明の二成分型接着剤の保存性が高い。   According to the present invention, since the epoxy resin is cationically polymerized by the reaction between the silane coupling agent and the metal chelate, the first and second adhesive materials can be cured at a lower temperature and in a shorter time than conventional adhesives. . In addition, since the first curing agent and the second curing agent are added to separate adhesive materials, the polymerization reaction of the first and second resin components takes place before the two-component adhesive is used. As a result, the storage stability of the two-component adhesive of the present invention is high.

以下に本発明の二成分型接着剤について詳細に説明する。
熱硬化性樹脂であり、エポキシ樹脂からなる第一の樹脂成分に、シランカップリング剤からなる第一の硬化剤と、導電性粒子とを添加、混合し、第一の接着材料を作製する。この状態では第一の接着材料はペースト状である。
これとは別に、第一の樹脂成分に用いたものと同じエポキシ樹脂からなる第二の樹脂成分に、金属キレート（又は金属アルコラート）からなる第二の硬化剤と、導電性粒子とを添加、混合し、ペースト状の第二の接着材料を作製する。 The two-component adhesive of the present invention will be described in detail below.
A first curing agent made of a silane coupling agent and conductive particles are added to and mixed with a first resin component made of an epoxy resin, which is a thermosetting resin, to produce a first adhesive material. In this state, the first adhesive material is pasty.
Separately, to the second resin component made of the same epoxy resin as used for the first resin component, a second curing agent made of a metal chelate (or metal alcoholate) and conductive particles are added, Mix to produce a paste-like second adhesive material.

第一の接着材料は硬化剤としてシランカップリング剤を、第二の接着材料は硬化剤として金属キレートをそれぞれ有しているが、第一、第二の接着材料は互いに分離されており、シランカップリング剤と金属キレートが接触しないので、硬化成分は生成されない。従って、第一、第二の接着材料が分離されている状態では、第一、第二の樹脂成分が重合せず、本発明の二成分型接着剤は硬化しない。   The first adhesive material has a silane coupling agent as a curing agent, and the second adhesive material has a metal chelate as a curing agent, but the first and second adhesive materials are separated from each other. Since the coupling agent and the metal chelate are not in contact, no curing component is produced. Therefore, in the state where the first and second adhesive materials are separated, the first and second resin components are not polymerized, and the two-component adhesive of the present invention is not cured.

図１（ａ）の符号２１は剥離フィルムを示している。ペースト状の第一の接着材料と第二の接着材料とを、それぞれ別の剥離フィルム２１表面に所定量塗布、乾燥すると、剥離フィルム２１表面に塗布された第一、第二の接着材料がフィルム状に成形され、第一、第二の接着フィルムとなる。   The code | symbol 21 of Fig.1 (a) has shown the peeling film. When a predetermined amount of the paste-like first adhesive material and the second adhesive material are applied to the surface of the separate release film 21 and dried, the first and second adhesive materials applied to the surface of the release film 21 are films. To form first and second adhesive films.

図１（ｂ）の符号２５と図２の符号３５は、それぞれ第一、第二の接着フィルムを示しており、第一、第二の接着フィルム２５、３５中にはそれぞれ導電性粒子２７が分散されている。剥離フィルム２１と、剥離フィルム２１上に形成された第一、第二の接着フィルム２５、３５とで、第一、第二の接着シート２０、３０がそれぞれ構成される。   Reference numeral 25 in FIG. 1B and reference numeral 35 in FIG. 2 indicate first and second adhesive films, respectively, and conductive particles 27 are respectively present in the first and second adhesive films 25 and 35. Is distributed. The release film 21 and the first and second adhesive films 25 and 35 formed on the release film 21 constitute first and second adhesive sheets 20 and 30, respectively.

図３（ａ）の符号１１は貼付対象物であるＬＣＤ（Ｌｉｑｕｉｄ Ｃｒｙｓｔａｌ Ｄｉｓｐｌａｙ）を示しており、ＬＣＤ１１はガラス基板１２を有している。他方、図４（ａ）の符号１５は貼付対象物であるＴＣＰ（Ｔａｐｅ Ｃａｒｒｉｅｒ Ｐａｃｋａｇｅ）を示しており、ＴＣＰ１５はベースフィルム１６を有している。
ＬＣＤ１１のガラス基板１２表面と、ＴＣＰ１５のベースフィルム１６表面には、それぞれ第一、第二の電極１３、１７が複数本配置されている。ここでは、第一、第二の電極１３、１７が４本ずつ図示されている。 Reference numeral 11 in FIG. 3A denotes an LCD (Liquid Crystal Display) that is an object to be pasted, and the LCD 11 has a glass substrate 12. On the other hand, reference numeral 15 in FIG. 4A indicates a TCP (Tape Carrier Package) that is an object to be pasted, and the TCP 15 has a base film 16.
A plurality of first and second electrodes 13 and 17 are arranged on the surface of the glass substrate 12 of the LCD 11 and the surface of the base film 16 of the TCP 15, respectively. Here, four first and second electrodes 13 and 17 are shown.

ＬＣＤ１１とＴＣＰ１５の第一、第二の電極１３、１７が配置された面に、第一、第二の接着シート２０、３０の第一、第二の接着フィルム２５、３５が配置された側の面をそれぞれ別々に押し当てる。ここでは、ＬＣＤ１１に第一の接着フィルム２５を押し当て（図３（ｂ））、ＴＣＰ１５に第二の接着フィルム３５を押し当てた（図４（ｂ））。   On the surface where the first and second electrodes 13 and 17 of the LCD 11 and the TCP 15 are arranged, the first and second adhesive films 25 and 35 of the first and second adhesive sheets 20 and 30 are arranged on the side. Press each side separately. Here, the first adhesive film 25 was pressed against the LCD 11 (FIG. 3B), and the second adhesive film 35 was pressed against the TCP 15 (FIG. 4B).

ＬＣＤ１１と第一の接着フィルム２５との接着力と、ＴＣＰ１５と第二の接着フィルム３５との接着力は、それぞれ剥離フィルム２１と第一、第二の接着フィルム２５、３５との接着力よりも大きいので、各剥離フィルム２１をめくると、剥離フィルム２１が第一、第二の接着フィルム２５、３５からそれぞれ剥離され、第一の接着フィルム２５がＬＣＤ１１上に、第二の接着フィルム３５がＴＣＰ１５上にそれぞれ残る。   The adhesive force between the LCD 11 and the first adhesive film 25 and the adhesive force between the TCP 15 and the second adhesive film 35 are larger than the adhesive force between the release film 21 and the first and second adhesive films 25 and 35, respectively. Since the release film 21 is turned over, the release film 21 is peeled off from the first and second adhesive films 25 and 35, the first adhesive film 25 is on the LCD 11, and the second adhesive film 35 is TCP15. Each remains on top.

図３（ｃ）、図４（ｃ）はそれぞれ剥離フィルム２１が剥離された後のＬＣＤ１１とＴＣＰ１５とを示しており、ＬＣＤ１１の第一の電極１３は第一の接着フィルム２５に覆われ、ＴＣＰ１５の第二の電極１７は第二の接着フィルム３５に覆われている。   FIGS. 3C and 4C show the LCD 11 and the TCP 15 after the release film 21 is peeled off. The first electrode 13 of the LCD 11 is covered with the first adhesive film 25, and the TCP 15 The second electrode 17 is covered with a second adhesive film 35.

ＴＣＰ１５の第二の電極１７が配置された側の面を、ＬＣＤ１１の第一の電極１３が配置された側の面に向け、ＬＣＤ１１とＴＣＰ１５とを互いに平行に配置した後、ＴＣＰ１５とＬＣＤ１１とを相対的に移動させ、図５（ａ）に示すように、第一の電極１３と第二の電極１７とを対向する位置で静止させる（位置合わせ）。
次いで、ＴＣＰ１５上の第二の接着フィルム３５をＬＣＤ１１上の第一の接着フィルム２５に押し当て、第一、第二の接着フィルム２５、３５を互いに密着させる（図５（ｂ））。 The surface of the TCP 15 on the side where the second electrode 17 is disposed is directed to the surface of the LCD 11 on the side where the first electrode 13 is disposed, and the LCD 11 and the TCP 15 are disposed in parallel to each other. As shown in FIG. 5A, the first electrode 13 and the second electrode 17 are stopped at positions facing each other (positioning).
Next, the second adhesive film 35 on the TCP 15 is pressed against the first adhesive film 25 on the LCD 11, and the first and second adhesive films 25 and 35 are brought into close contact with each other (FIG. 5B).

ＴＣＰ１５を押圧しながら全体を加熱すると、加熱によって第一、第二の接着フィルム２５、３５が軟化し、押圧によって第二の電極１７が第一、第二の接着フィルム２５に押し込まれる。このとき、少なくとも第一、第二の接着フィルム２５、３５の界面部分で、第一、第二の接着フィルム２５、３５を構成する第一の接着材料と第二の接着材料とが互いに混ざり合い、第一、第二の接着フィルム２５、３５が一体化する。   When the whole is heated while pressing the TCP 15, the first and second adhesive films 25 and 35 are softened by the heating, and the second electrode 17 is pressed into the first and second adhesive films 25 by the pressing. At this time, the first adhesive material and the second adhesive material constituting the first and second adhesive films 25 and 35 are mixed with each other at least at the interface between the first and second adhesive films 25 and 35. The first and second adhesive films 25 and 35 are integrated.

更に押圧を続け、第二の電極１７を更に第一、第二の接着フィルム２５、３５に押し込むと、第二の電極１７と第一の電極１３との間に導電性粒子２７が挟み込まれる。
その状態で更に加熱押圧を続けると、第一、第二の接着材料に含まれるシランカップリング剤と、金属キレートとが加熱によって反応して硬化成分であるカチオンが遊離し、第一、第二の樹脂成分を構成するエポキシ樹脂がカチオン重合する。エポキシ樹脂が重合することによって、第一、第二の接着フィルム２５、３５は一体化した状態で全体が硬化する。 When the pressing is further continued and the second electrode 17 is further pushed into the first and second adhesive films 25 and 35, the conductive particles 27 are sandwiched between the second electrode 17 and the first electrode 13.
When the heating and pressing are further continued in this state, the silane coupling agent contained in the first and second adhesive materials and the metal chelate react with each other by heating to release cations which are curing components, and the first and second The epoxy resin constituting the resin component is cationically polymerized. When the epoxy resin is polymerized, the entire first and second adhesive films 25 and 35 are cured in an integrated state.

図５（ｃ）の符号２９は硬化した第一、第二の接着フィルムからなる接着剤層を示している。ＬＣＤ１１とＴＣＰ１５は導電性粒子２７を介して電気的に接続されているだけでは無く、硬化した接着剤層２９を介して機械的にも接続されている。図５（ｃ）の符号１０はＬＣＤ１１とＴＣＰ１５が接続されてなる電気装置を示している。   Reference numeral 29 in FIG. 5C indicates an adhesive layer made of the cured first and second adhesive films. The LCD 11 and the TCP 15 are not only electrically connected via the conductive particles 27 but also mechanically connected via the cured adhesive layer 29. Reference numeral 10 in FIG. 5C denotes an electric device in which the LCD 11 and the TCP 15 are connected.

以上は、第一、第二の接着材料をフィルム状に成形する場合について説明したが、本発明はこれに限定されるものではない。
図６（ａ）の符号１１は図３（ａ）に示したものと同じＬＣＤを、図７（ａ）の符号１５は図４（ａ）に示したものと同じＴＣＰをそれぞれ示している。ＬＣＤ１１の第一の電極１３が配置された側の面と、ＴＣＰ１５の第二の電極１６が配置された側の面に、第一、第二の電極１３、１７を覆うように、ペースト状の第一、第二の接着材料をそれぞれ別々に塗布し、塗布層を形成する。 The above describes the case where the first and second adhesive materials are formed into a film, but the present invention is not limited to this.
Reference numeral 11 in FIG. 6A denotes the same LCD as that shown in FIG. 3A, and reference numeral 15 in FIG. 7A denotes the same TCP as that shown in FIG. A paste-like shape is formed so as to cover the first and second electrodes 13 and 17 on the surface of the LCD 11 on which the first electrode 13 is disposed and on the surface of the TCP 15 on which the second electrode 16 is disposed. The first and second adhesive materials are separately applied to form an application layer.

図６（ｂ）の符号４５はＬＣＤ１１に形成された第一の接着材料の塗布層を、図７（ｂ）の符号５５はＴＣＰ１５に形成された第二の接着材料の塗布層をそれぞれ示している。
ＬＣＤ１１とＴＣＰ１５の塗布層４５、５５が形成された面を互いに向かい合わせ（図８（ａ））、図５（ａ）〜（ｃ）に示すように、位置合わせ後、加熱押圧すれば電気装置が得られる。図８（ｂ）の符号５０はその状態の電気装置を示しており、ＬＣＤ１１とＴＣＰ１５とは硬化した接着剤層５９を介して接続されている。 Reference numeral 45 in FIG. 6B denotes a first adhesive material application layer formed on the LCD 11, and reference numeral 55 in FIG. 7B denotes a second adhesive material application layer formed on the TCP 15. Yes.
The surfaces of the LCD 11 and the TCP 15 on which the coating layers 45 and 55 are formed face each other (FIG. 8 (a)), and as shown in FIGS. Is obtained. Reference numeral 50 in FIG. 8B shows the electric device in that state, and the LCD 11 and the TCP 15 are connected via a cured adhesive layer 59.

〈実施例１〉
エポキシ樹脂である脂環式エポキシ樹脂セロキサイド（ダイセル化学工業（株）社製の商品名「２０２１Ｐ」）４０重量部と、エポキシ樹脂であるビスフェノールＡ型エポキシ樹脂（油化シェルエポキシ（株）社製の商品名「ＥＰ１００９」）６０重量部を溶剤に溶解した樹脂液とを混合し、第一の樹脂成分を作製した。 <Example 1>
40 parts by weight of alicyclic epoxy resin ceroxide (trade name “2021P” manufactured by Daicel Chemical Industries, Ltd.), which is an epoxy resin, and bisphenol A type epoxy resin (Oka Shell Epoxy Co., Ltd.), which is an epoxy resin (Trade name “EP1009”) was mixed with a resin solution obtained by dissolving 60 parts by weight in a solvent to prepare a first resin component.

第一の樹脂成分１００重量部に対し、第一の硬化剤であるエポキシシランカップリング剤（信越化学工業（株）社製の商品名「ＫＢＭ−４０３」）５重量部と、導電性粒子１０重量部とを添加、混合し、ペースト状の第一の接着材料を作製した。
これとは別に、上記第一の樹脂成分と同じ樹脂を同じ配合比率で混合してなる第二の樹脂成分を用意し、第二の樹脂成分１００重量部と、第二の硬化剤である金属キレート（エチルアセトアセテートアルミニウムジイソプロピレート（川研ファインケミカル（株）社製の商品名「ＡＬＣＨ」））２重量部と、導電性粒子１０重量部とを添加、混合し、ペースト状の第二の接着材料を作製した。 With respect to 100 parts by weight of the first resin component, 5 parts by weight of an epoxy silane coupling agent (trade name “KBM-403” manufactured by Shin-Etsu Chemical Co., Ltd.), which is the first curing agent, and conductive particles 10 A part by weight was added and mixed to prepare a paste-like first adhesive material.
Separately, a second resin component prepared by mixing the same resin as the first resin component at the same blending ratio is prepared, and 100 parts by weight of the second resin component and a metal that is the second curing agent are prepared. 2 parts by weight of chelate (ethyl acetoacetate aluminum diisopropylate (trade name “ALCH” manufactured by Kawaken Fine Chemical Co., Ltd.)) and 10 parts by weight of conductive particles are added and mixed to form a paste-like second An adhesive material was prepared.

剥離フィルム２１として表面が剥離処理されたＰＥＴフィルムを用い、該剥離フィルム２１表面に第一、第二の接着材料を別々に塗布、乾燥し、膜厚１０μｍの第一、第二の接着フィルム２５、３５を作製した。
これらの接着フィルム２５、３５を用いて、図３（ａ）〜（ｃ）、図４（ａ）〜（ｃ）、図５（ａ）〜（ｃ）の工程で実施例１の電気装置１０を作製した。 A PET film whose surface is peeled is used as the release film 21, and the first and second adhesive materials are separately applied to the surface of the release film 21 and dried, and the first and second adhesive films 25 having a film thickness of 10 μm are dried. , 35 were produced.
Using these adhesive films 25 and 35, the electric device 10 of the first embodiment in the steps of FIGS. 3 (a) to (c), FIGS. 4 (a) to (c), and FIGS. 5 (a) to (c). Was made.

ここではＴＣＰ１５としてベースフィルム１６表面に２５μｍ幅の第二の電極１７が２５μｍ間隔で配置されたものを、ＬＣＤ１１としては、表面積１ｃｍ2当たりのシート抵抗が１０ΩのＩＴＯ（Ｉｎｄｉｕｍ Ｔｉｎ Ｏｘｉｄｅ）電極１３が形成されたものをそれぞれ用い、１２０℃に維持した熱圧着ヘッドをＴＣＰ１５とＬＣＤ１１とが重なりあった部分に１０秒間押しつけて加熱押圧し、第一の接着フィルム２５を１２０℃まで昇温させて接続を行った。実施例１の電気装置１０を用いて下記に示す「剥離強度試験」を行った。 Here, the TCP 15 is a base film 16 having a 25 μm wide second electrode 17 arranged on the surface of the base film 16 at an interval of 25 μm, and the LCD 11 is an ITO (Indium Tin Oxide) electrode 13 having a sheet resistance of 10Ω per 1 cm 2 of surface area. Using each formed one, the thermocompression bonding head maintained at 120 ° C. was pressed against the overlapping portion of TCP 15 and LCD 11 for 10 seconds and heated to press the first adhesive film 25 to 120 ° C. for connection. Went. The following “peel strength test” was performed using the electrical apparatus 10 of Example 1.

〔剥離強度試験〕
引張り試験機を用い、電気装置１０のＴＣＰ１５をＬＣＤ１１の面方向に対して９０°方向に引張速度５０ｍｍ／分で引張り、ＴＣＰ１５がＬＣＤ１１から剥離されるときの剥離強度（単位：Ｎ／ｃｍ）を測定した。剥離強度試験の測定結果を下記表１に記載する。 [Peel strength test]
Using a tensile tester, the TCP 15 of the electrical device 10 is pulled at a pulling speed of 50 mm / min in the direction of 90 ° with respect to the surface direction of the LCD 11, and the peel strength (unit: N / cm) when the TCP 15 is peeled from the LCD 11 It was measured. The measurement results of the peel strength test are shown in Table 1 below.

Figure 0004700082
Figure 0004700082

＜実施例２＞
実施例１で用いたものと同じ脂環式エポキシ樹脂セロキサイド（ダイセル化学工業（株）社製の商品名「２０２１Ｐ」）５０重量部と、実施例１で用いたものより分子量が小さいビスフェノールＡ型エポキシ樹脂（油化シェルエポキシ（株）社製の商品名「ＥＰ１００１」）５０重量部とを混合し、７０℃に保温しながら攪拌混合してペースト状の第一、第二の樹脂成分を作製した。 <Example 2>
50 parts by weight of the same alicyclic epoxy resin ceroxide (trade name “2021P” manufactured by Daicel Chemical Industries, Ltd.) used in Example 1 and bisphenol A type having a molecular weight smaller than that used in Example 1 50 parts by weight of an epoxy resin (trade name “EP1001” manufactured by Yuka Shell Epoxy Co., Ltd.) is mixed and mixed while stirring at 70 ° C. to produce paste-like first and second resin components. did.

第一の樹脂成分１００重量部に対して実施例１に用いたものと同じ第一の硬化剤５重量部と、導電性粒子１０重量部とを添加、混合し、ペースト状の第一の接着材料を作製した。これとは別に、第二の樹脂成分１００重量部に対し、実施例１に用いたものと同じ第二の硬化剤２重量部と、導電性粒子１０重量部とを添加、混合し、ペースト状の第二の接着材料を作製した。   The same first curing agent as used in Example 1 and 100 parts by weight of conductive particles are added to and mixed with 100 parts by weight of the first resin component, and the paste-like first adhesive is added. The material was made. Separately, with respect to 100 parts by weight of the second resin component, 2 parts by weight of the same second curing agent as used in Example 1 and 10 parts by weight of conductive particles are added, mixed, and pasted. A second adhesive material was prepared.

これら第一、第二の接着材料を用い、図６（ａ）、（ｂ）、図７（ａ）、（ｂ）、図８（ａ）、（ｂ）の工程で、実施例１に用いたＬＣＤ１１とＴＣＰ１５とを実施例１と同じ条件で接続し、実施例２の電気装置５０を得た。
実施例２の電気装置５０を用いて実施例１と同じ条件で「剥離強度試験」を行い、その測定結果を上記表１に記載した。 These first and second adhesive materials are used for Example 1 in the steps of FIGS. 6A, 6B, 7A, 7B, 8A, and 8B. The LCD 11 and TCP 15 were connected under the same conditions as in Example 1 to obtain the electric device 50 of Example 2.
A “peel strength test” was performed using the electrical apparatus 50 of Example 2 under the same conditions as Example 1, and the measurement results are shown in Table 1 above.

＜比較例１、２＞
実施例１で作製したフィルム状に成形する前の、ペースト状の第一の接着材料１１５重量部に、実施例１で用いた第二の硬化剤２重量部を添加、混合し、第一、第二の硬化剤を両方有するペースト状の接着剤を作成し、該接着剤を実施例１で用いた剥離フィルムに塗布、乾燥し、膜厚２０μｍの接着フィルムを作製した。 <Comparative Examples 1 and 2>
2 parts by weight of the second curing agent used in Example 1 was added to and mixed with 115 parts by weight of the paste-like first adhesive material before being formed into a film produced in Example 1, A paste-like adhesive having both of the second curing agents was prepared, and the adhesive was applied to the release film used in Example 1 and dried to prepare an adhesive film having a thickness of 20 μm.

実施例１で用いたＬＣＤとＴＣＰとで上記接着フィルムを挟み込み、実施例１と同じ条件で加熱押圧を行って、比較例１の電気装置を得た。
これとは別に、実施例２で作製したペースト状の第一の接着材料１１５重量部に、実施例２で用いた第二の硬化剤２重量部を添加、混合し、ペースト状の接着剤を作製し、該接着剤を実施例１で用いたＬＣＤに塗布した後、ＴＣＰを接着剤に押しあて、実施例１と同じ条件で加熱押圧して比較例２の電気装置を得た。 The adhesive film was sandwiched between the LCD and TCP used in Example 1, and heated and pressed under the same conditions as in Example 1 to obtain an electric device of Comparative Example 1.
Separately, 2 parts by weight of the second curing agent used in Example 2 was added to and mixed with 115 parts by weight of the paste-like first adhesive material prepared in Example 2, and the paste-like adhesive was added. After producing and applying the adhesive to the LCD used in Example 1, TCP was pressed against the adhesive and heated and pressed under the same conditions as in Example 1 to obtain an electric device of Comparative Example 2.

これら比較例１、２の電気装置を用いて実施例１と同じ条件で「剥離強度試験」を行い、それらの試験結果を上記表１に記載した。
上記表１から明らかなように、第一の硬化剤を有する第一の接着材料と、第二の硬化剤を有する第二の接着材料とを別々に作製した実施例１、２では、従来よりも低温、短時間（１２０℃、１０秒間）の条件で接着剤を硬化させたのにもかかわらず、剥離強度が高く、本発明の二成分型接着剤の硬化性の高さが確認された。 Using these electrical devices of Comparative Examples 1 and 2, a “peel strength test” was performed under the same conditions as in Example 1, and the test results are shown in Table 1 above.
As is clear from Table 1 above, in Examples 1 and 2 in which the first adhesive material having the first curing agent and the second adhesive material having the second curing agent were separately produced, Although the adhesive was cured under conditions of low temperature and short time (120 ° C., 10 seconds), the peel strength was high and the high curability of the two-component adhesive of the present invention was confirmed. .

他方、第一、第二の硬化剤が分離されておらず、第一、第二の硬化剤が同じ接着剤に添加された比較例１、２では、剥離強度が実用に耐えられないほど低かった。これは、第一、第二の硬化剤の反応によって接着剤作製中から接着剤の粘度が除々上昇し、ＴＣＰとＬＣＤとを加熱押圧する前に、接着剤の接着性が失われたためと思われる。   On the other hand, in Comparative Examples 1 and 2 in which the first and second curing agents were not separated and the first and second curing agents were added to the same adhesive, the peel strength was so low that it could not withstand practical use. It was. This is because the adhesive viscosity gradually increased during the preparation of the adhesive due to the reaction of the first and second curing agents, and the adhesiveness of the adhesive was lost before the TCP and LCD were heated and pressed. It is.

これらの結果から、第一、第二の接着材料の形状（フィルム状、又はペースト状）に係わらず、シランカップリング剤と金属キレートとが使用の前に分離されていれば、接着剤の保存性に優れ、かつ、硬化した後の接着剤の剥離強度が高くなることがわかる。   From these results, it is possible to preserve the adhesive if the silane coupling agent and the metal chelate are separated before use regardless of the shape (film or paste) of the first and second adhesive materials. It can be seen that the peel strength of the adhesive after curing is high and the adhesive is cured.

以上は、導電性粒子２７を介して第一、第二の電極１３、１７を接続する場合について説明したが、本発明はこれに限定されるものではない。例えば、導電性粒子を添加せずに第一、第二の接着材料を作製し、加熱押圧の際に第二の電極を第一の電極に直接当接させることによって、第一、第二の電極を接続してもよい。また、導電性粒子２７を用いる場合は、第一、第二の接着材料のいずれか一方に導電性粒子２７が添加されていればよい。   The above describes the case where the first and second electrodes 13 and 17 are connected via the conductive particles 27, but the present invention is not limited to this. For example, the first and second adhesive materials are prepared without adding conductive particles, and the first and second electrodes are brought into direct contact with the first electrode during the heating and pressing. An electrode may be connected. Moreover, when using the electroconductive particle 27, the electroconductive particle 27 should just be added to any one of the 1st, 2nd adhesive material.

以上は第一の硬化剤としてシランカップリング剤を、第二の硬化剤として金属キレート（又は金属アルコラート）を用いる場合について説明したが、本発明はこれに限定されるものではなく、例えば、第一の硬化剤として金属キレート（又は金属アルコラート）を、第二の硬化剤としてシランカップリング剤を用いてもよい。   The above is a case where a silane coupling agent is used as the first curing agent and a metal chelate (or metal alcoholate) is used as the second curing agent, but the present invention is not limited to this. A metal chelate (or metal alcoholate) may be used as one curing agent, and a silane coupling agent may be used as the second curing agent.

金属キレートや金属アルコラートとしては、ジルコニウム、チタニウム、アルミニウム等種々の中心金属を有するものを用いることができるが、これらのなかでも特に反応性の高いアルミニウムを中心金属とするアルミニウムキレート（又はアルミニウムアルコラート）が好ましい。   As metal chelates and metal alcoholates, those having various central metals such as zirconium, titanium, and aluminum can be used. Among these, aluminum chelates (or aluminum alcoholates) having particularly reactive aluminum as the central metal. Is preferred.

アルミニウムキレートの配位子の種類や、アルミニウムアルコラートのアルコキシル基の種類も特に限定されるものではない。例えば、アルミニウムキレートとしては、上記実施例１〜４に用いたエチルアセトアセテートアルミニウムジイソプロピレート以外にもアルミニウムトリスエチルアセトアセテート、アルキルアセトアセテートアルミニウムジイソプロピレート、アルミニウムモノアセチルアセトネートビスエチルアセトアセテート、アルミニウムトリスアセチルアセトネート等を用いることができる。
また、シランカップリング剤としては、下記一般式（５）に示すものを用いることが好ましい。 The type of aluminum chelate ligand and the type of alkoxy group of aluminum alcoholate are not particularly limited. For example, as the aluminum chelate, in addition to the ethyl acetoacetate aluminum diisopropylate used in Examples 1-4 above, aluminum trisethyl acetoacetate, alkyl acetoacetate aluminum diisopropylate, aluminum monoacetylacetonate bisethylacetoacetate, Aluminum trisacetylacetonate or the like can be used.
Moreover, it is preferable to use what is shown to following General formula (5) as a silane coupling agent.

Figure 0004700082
Figure 0004700082

上記一般式（５）中置換基Ｘ1〜Ｘ4のうち、少なくとも一つの置換基がアルコキシ基である。また、アルコキシ基以外の置換基Ｘ1〜Ｘ4のうち、少なくとも一つの置換基がエポキシ環又はビニル基を有するものが好ましく、エポキシ環を有する置換基としてはグリシジル基が特に好ましい。 Of the substituents X 1 to X 4 in the general formula (5), at least one substituent is an alkoxy group. In addition, among the substituents X 1 to X 4 other than the alkoxy group, it is preferable that at least one substituent has an epoxy ring or a vinyl group, and the substituent having an epoxy ring is particularly preferably a glycidyl group.

以上は第一、第二の樹脂成分に同じ種類の樹脂を用いる場合について説明したが、本発明はこれに限定されるものではなく、それぞれ異なる種類の樹脂を用いることもできる。
第一、第二の樹脂成分に用いる樹脂はエポキシ樹脂に限定されるものではなく、硬化成分であるカチオンにより単独重合するものであれば、例えば、尿素樹脂、メラミン樹脂、フェノール樹脂、ビニルエーテル樹脂、オキセタン樹脂等種々のものを用いることができる。しかしながら、熱硬化後の接着剤の強度等を考慮するとエポキシ樹脂を用いることが好ましい。 Although the case where the same kind of resin is used for the first and second resin components has been described above, the present invention is not limited to this, and different kinds of resins can also be used.
The resin used for the first and second resin components is not limited to an epoxy resin, and may be any resin that is homopolymerized by a cation that is a curing component, for example, urea resin, melamine resin, phenol resin, vinyl ether resin, Various things, such as an oxetane resin, can be used. However, it is preferable to use an epoxy resin in view of the strength of the adhesive after thermosetting.

第一、第二の樹脂成分にはカチオン重合する樹脂と共に、熱可塑性樹脂を用いることが可能である。熱可塑性樹脂としては、例えば、フェノキシ樹脂、ポリエステル樹脂、ポリウレタン樹脂、ポリビニルアセタール、エチレンビニルアセテート、ポリブタジエンゴム等のゴム類等種々のものを用いることができる。また、第一、第二の接着材料に老化防止剤、充填剤、着色剤等の種々の添加剤を添加することもできる。   As the first and second resin components, a thermoplastic resin can be used together with a resin that undergoes cationic polymerization. As a thermoplastic resin, various things, such as rubbers, such as phenoxy resin, polyester resin, polyurethane resin, polyvinyl acetal, ethylene vinyl acetate, polybutadiene rubber, can be used, for example. Moreover, various additives, such as an anti-aging agent, a filler, and a coloring agent, can also be added to the first and second adhesive materials.

第一、第二の接着材料がペースト状の場合は、例えば、ディスペンサーを用いてＴＣＰやＬＣＤ等の貼付対象物に塗布することができる。以上は、ＬＣＤ１１とＴＣＰ１５を貼り合わせる場合について説明したが、本発明はこれに限定されるものではなく、例えば、半導体チップやフレキシブル配線板等種々の回路基板の接続に本発明の二成分型接着剤を用いることができる。   When the first and second adhesive materials are pasty, for example, they can be applied to a sticking object such as TCP or LCD using a dispenser. Although the above has described the case where the LCD 11 and the TCP 15 are bonded together, the present invention is not limited to this. For example, the two-component adhesive of the present invention is used to connect various circuit boards such as semiconductor chips and flexible wiring boards. An agent can be used.

以上は第一、第二の接着材料をそれぞれ別々に塗布する場合について説明したが、本発明はこれに限定されるものではない。第一、第二の接着材料を混合した場合、室温条件で数分間であれば硬化反応が起こらないので、第一、第二の接着材料を混合してから貼着対象物に塗布することも可能である。   The case where the first and second adhesive materials are applied separately has been described above, but the present invention is not limited to this. When the first and second adhesive materials are mixed, the curing reaction does not occur for several minutes at room temperature. Therefore, the first and second adhesive materials may be mixed and then applied to the object to be adhered. Is possible.

(ａ)、(ｂ)：本発明に用いる第一の接着フィルムを製造する工程の一例を説明するための図(a), (b): The figure for demonstrating an example of the process of manufacturing the 1st adhesive film used for this invention. 本発明に用いる第二の接着フィルムを説明するための図The figure for demonstrating the 2nd adhesive film used for this invention (ａ)〜(ｃ)：電気装置を製造する工程の一例の前半を説明する図(a)-(c): The figure explaining the first half of an example of the process of manufacturing an electric apparatus. (ａ)〜(ｃ)：電気装置を製造する工程の一例の中半を説明する図(a)-(c): The figure explaining the middle half of an example of the process of manufacturing an electric apparatus. (ａ)〜(ｃ)：電気装置を製造する工程の一例の後半を説明する図(a)-(c): The figure explaining the second half of an example of the process of manufacturing an electric apparatus. (ａ)、(ｂ)：電気装置を製造する工程の他の例の前半を説明する図(a), (b): The figure explaining the first half of the other example of the process of manufacturing an electric apparatus. (ａ)、(ｂ)：電気装置を製造する工程の他の例の中半を説明する図(a), (b): The figure explaining the middle half of the other example of the process of manufacturing an electric apparatus. (ａ)、(ｂ)：電気装置を製造する工程の他の例の後半を説明する図(a), (b): The figure explaining the second half of the other example of the process of manufacturing an electric apparatus.

符号の説明Explanation of symbols

２５……第一の接着フィルム（フィルム状にされた第一の接着材料）
２７……導電性粒子
３５……第二の接着フィルム（フィルム状にされた第二の接着材料）
４５、５５……第一、第二の接着材料の塗布層
25 …… First adhesive film (first adhesive material made into a film)
27 …… Conductive particles 35 …… Second adhesive film (second adhesive material formed into a film)
45, 55... Application layers of first and second adhesive materials

Claims (2)

第一のエポキシ樹脂と、前記第一のエポキシ樹脂にシランカップリング剤が添加されたペースト状の第一の接着材料と、
第二のエポキシ樹脂と、前記第二のエポキシ樹脂に金属キレート又は金属アルコラートが添加されたペースト状の第二の接着材料とを用意し、
前記第一、第二の接着材料のいずれかに導電性粒子を含有させ、
ガラス基板と、前記ガラス基板上に配置された第一の電極とを有する第一の貼付対象物に、前記第一の接着材料を塗布して第一の塗布層を形成し、
第二の電極を有する第二の貼付対象物に、前記第二の接着材料を塗布して第二の塗布層を形成し、
前記第二の電極が配置された側の面を、前記第一の電極が配置された面に向けさせ、
前記第一、第二の貼付対象物を相対的に移動させ、
前記第二の塗布層を前記第一の塗布層に押し当てて密着させ、
前記第二の貼付対象物を、前記第一、第二の電極間に導電性粒子が挟みこまれるまで加熱及び押圧し、
更に、加熱及び押圧することにより、前記第二のエポキシ樹脂に添加された前記金属キレート又は前記金属アルコラートと前記シランカップリング剤とを反応させて硬化成分を連鎖反応させ、前記第一と第二のエポキシ樹脂を重合させることにより、前記第一、第二の塗布層全体を硬化させた電気装置。 A first epoxy resin, and a paste-like first adhesive material in which a silane coupling agent is added to the first epoxy resin;
Preparing a second epoxy resin and a paste-like second adhesive material in which a metal chelate or a metal alcoholate is added to the second epoxy resin;
Conductive particles are contained in either of the first and second adhesive materials,
Applying the first adhesive material to a first pasting object having a glass substrate and a first electrode disposed on the glass substrate to form a first coating layer,
A second application layer is formed by applying the second adhesive material to a second sticking object having a second electrode,
The side on which the second electrode is arranged is directed to the surface on which the first electrode is arranged,
Relatively moving the first and second sticking objects;
The second coating layer is pressed against the first coating layer and closely adhered,
Heating and pressing the second pasting object until conductive particles are sandwiched between the first and second electrodes,
Further, by heating and pressing, the metal chelate or the metal alcoholate added to the second epoxy resin is reacted with the silane coupling agent to cause a chain reaction of the curing component, and the first and second An electric device in which the entire first and second coating layers are cured by polymerizing the epoxy resin. 前記シランカップリング剤がエポキシ環を有することを特徴とする請求項１記載の電気装置。   The electric device according to claim 1, wherein the silane coupling agent has an epoxy ring.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618643A (en) * 1979-07-25 1981-02-21 Toshiba Corp Preparation of epoxy resin composition
JPS63136639A (en) * 1986-11-28 1988-06-08 Fuji Xerox Co Ltd Anisotropic conductive bonding
JPH04326747A (en) * 1991-04-26 1992-11-16 Fujitsu Ltd Mounting method for component
JPH0726235A (en) * 1993-07-09 1995-01-27 Toshiba Chem Corp Conductive paste
JPH09255759A (en) * 1996-03-19 1997-09-30 Shoei Chem Ind Co Conductive composition
JP2001002893A (en) * 1999-06-17 2001-01-09 Sumitomo Metal Mining Co Ltd One-pack heat-curable type resin composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618643A (en) * 1979-07-25 1981-02-21 Toshiba Corp Preparation of epoxy resin composition
JPS63136639A (en) * 1986-11-28 1988-06-08 Fuji Xerox Co Ltd Anisotropic conductive bonding
JPH04326747A (en) * 1991-04-26 1992-11-16 Fujitsu Ltd Mounting method for component
JPH0726235A (en) * 1993-07-09 1995-01-27 Toshiba Chem Corp Conductive paste
JPH09255759A (en) * 1996-03-19 1997-09-30 Shoei Chem Ind Co Conductive composition
JP2001002893A (en) * 1999-06-17 2001-01-09 Sumitomo Metal Mining Co Ltd One-pack heat-curable type resin composition

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