JPH09252024A - Semiconductor device and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure a reliable electric connection and mechanical fixing of a connection medium by making the electric connection and mechanical fixing by the mutually pressing forces of a bare chip element and printed interconnection board, utilizing the shrinking force of an adhesive for the mechanical fixing of the chip element to the board at the resin hardening. SOLUTION: A connection medium 6 and mechanically fixing adhesive 10 are disposed at specified position on a bare chip element 1 or printed interconnection board 3, the element 1 is mounted at specified position on the board 3 and the medium 6 between a pad 2 of the element 1 and foot print 4 of the board 3 is electrically connected and mechanically fixed by the mutually pressing forces of the element 1 and board 3, utilizing the shrinking force of the adhesive 10 at hardening.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a multi-terminal component of a semiconductor element is connected to a printed wiring board, and more particularly, a semiconductor device and a method of manufacturing the same for improving a face-down mount structure of a bare chip component. Regarding

[0002]

2. Description of the Related Art In recent years, face-down mounting has become necessary when mounting multi-terminal parts in a semiconductor device at high density. In order to realize a mount structure with high connection reliability, the conventional example cross section of FIG. 10 and FIG.
On the side of the bare chip component 30, the bump forming process P41 for forming the bump 32 on the pad 31 of the bare chip component 30, the bump leveling process P42 for correcting the flatness of the bump 32, and the leveling are performed. A conductive paste transfer step P43 is required to attach the conductive paste 34 for supplementing the non-planarity on the printed wiring board 33 side to the bumps as a bonding agent and for electrical connection. On the other hand, the printed wiring board 33 side requires the bare chip component 30 and the adhesive application step P44 of applying the adhesive 35 for adhesively fixing the printed wiring board 33. Then, the bare chip component 30 is positioned at a predetermined position on the printed wiring board 33, and mounting is completed by a mounting step P45 in which the conductive paste 34 and the adhesive 35 are heat-cured. Such manufacturing processes require expensive materials, complex structures and manufacturing processes. Since the bumps 32 are formed by applying ultrasonic waves or heating, stress is applied to the pads 31 of the bare chip component 30.
Also, the crack or peeling of the bare chip component 30 is a factor that impairs reliability.

[0003]

In such a conventional mounting structure using a conductive paste, stress is applied to the pad of the bare chip component and cracks or peeling may occur in the pad or the bare chip component, resulting in a loss of reliability. turn into. The process is long and complicated, for example, it takes several hours to heat-cure. In order to compensate for the non-planarity on the printed wiring board side, the increase / decrease in the transfer amount of the conductive paste for each position is poor in uniformity and it is difficult to control the transfer amount for each position. Although it plays an important role of ensuring electrical connection reliability, it cannot keep up with the force of peeling during heat curing due to the difference in thermal expansion coefficient between the bare chip component and the printed wiring board. There is a problem that disconnection or half-breakage may occur due to lack of adhesive strength capable of coping with external force or minute displacement of bonding position.

[0004]

According to the present invention, in order to solve the above problems, a connection medium 6 and a mechanical fixing adhesive 10 are arranged at predetermined positions of a bare chip component 1 or a printed wiring board 3. A method of manufacturing a semiconductor device comprises a step and a step of mounting the bare chip component 1 at a predetermined position on the printed wiring board 3. Bare chip component 1
The bumps to be formed on the substrate are no longer necessary, and a simple connection structure and a technical method that provides a manufacturing process are adopted.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, in FIG. 1, a connection medium 6 is mechanically fixed between a pad 2 of a bare chip component 1 and a footprint 4 of a printed wiring board 3 between the bare chip component 1 and the printed wiring board 3. The structure is such that the contraction force of the adhesive 10 for curing is used to electrically connect and mechanically fix the bare chip component 1 and the printed wiring board 3 by the mutual pressing force. By this means, since a complicated manufacturing process and bumps are not required, a simple structure and manufacturing process can be obtained.

Next, in FIG. 2, a connection medium 8 whose surface is coated with an adhesive 5 is arranged between the pad 2 of the bare chip component 1 and the footprint 4 of the printed wiring board 3, and the bare chip component 1 is faced. The structure is made by down-bonding. By this means, since a complicated manufacturing process and bumps are not required, a simple structure and manufacturing process can be obtained.

Further, in FIG. 3, the connection medium 6 or 8 is used.
Has a structure having spike-shaped or bump-shaped projections 9 on its surface. By this means, the oxide film generated on the surface of the pad 2 of the bare chip component 1 or the footprint 4 of the printed wiring board 3 is broken, so that an action of reliable connection can be obtained.

Further, in FIG. 4, the connection medium 6 is applied on the surface of the bare chip component 1 or the printed wiring board 3 in advance and press-fitted into a semi-cured or high-viscosity adhesive 10 to be arranged at a predetermined position. To do. By this means, the connection medium 6 is press-fitted into the adhesive 10 between the pad 2 of the bare chip component 1 and the footprint 4 of the printed wiring board 3, so that the connection and the fixing can be performed simultaneously and easily.

Next, referring to FIG. 5, the connection media 6 and 8 are connected.
Is applied to the surface of the bare chip component 1 or the printed wiring board 3 in advance, and the connection portion is exposed to the laser beam or printed to expose the pad 2 of the bare chip component 1 and the connection portion of the footprint 4 of the printed wiring board 3 with the adhesive 10 Recess 11
The structure is such that it is inserted into and placed at a predetermined position. By this means, the connection medium 6 or the connection medium 8 whose surface is coated with the adhesive 5 is inserted into the recess 11 of the adhesive 10 between the pad 2 of the bare chip component 1 and the footprint 4 of the printed wiring board 3. Therefore, it is possible to obtain the effect that the connection and the fixing can be performed at the same time with easy positioning. Also bad 2
Since there is no adhesive 10 on the or footprint 4, high connection reliability is obtained.

Further, in FIG. 6, after the connection medium 6 is inserted into the guide hole 12 of the guide plate 13 provided at a predetermined position, the bare chip component 1 or the printed wiring board 3 is pinned by the pin 14 in the guide hole 12. The semi-cured or high-viscosity adhesive 10 previously applied to the surface of the above is press-fitted and arranged at a predetermined position. By this means, the connection medium 6 is press-fitted into the adhesive 10 between the pad 2 of the bare chip component 1 and the footprint 4 of the printed wiring board 3, so that it is possible to obtain the effect that the connection and the fixing can be simultaneously performed with easy positioning.

Further, in FIG. 7, the suction head 15 having a fine opening capable of guiding the connection medium 6 to a predetermined position.
Adhesive 1 that has been absorbed by and is applied in advance to the surface of the bare chip component 1 or the printed wiring board 3 and is semi-cured or has a high viscosity.
It is press-fitted into 0 and arranged at a predetermined position. By this means, the pad 2 of the bare chip component 1 and the printed wiring board 3
Since the connection medium 6 is press-fitted into the adhesive 10 between the footprint 4 and the footprint 4, it is possible to obtain an effect that the connection and the fixing can be simultaneously performed with easy positioning.

Next, in FIG. 8, the connection medium 6 is adsorbed by an adsorption plate 16 having a plurality of fine openings at predetermined positions, pre-coated on the surface of the bare chip component 1 or the printed wiring board 3 and semi-cured. Alternatively, the structure is such that the high-viscosity adhesive 10 is press-fitted together and placed at a predetermined position. By this means, the surface of the connecting medium 6 is press-fitted into the adhesive 10 between the pad 2 of the bare chip component 1 and the footprint 4 of the printed wiring board 3 at a time, so that accurate positioning and simultaneous connection and fixing can be performed. To get

Further, in FIG. 9, the connection media 6 and 8 are connected.
Is placed at or after a predetermined position, a weak ultrasonic wave is applied to the connection media 6 and 8 to remove the oxide film on the surface of the pad 2 of the bare chip component 1 and the footprint 4 of the printed wiring board 3. The structure. By this means, the oxide film on the pad 2 of the bare chip component 1 and the footprint 4 of the printed wiring board 3 is removed to secure high connection reliability of the connection medium 6 or the connection medium 8 whose surface is coated with the adhesive 5. Get the action you can.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawings relating to the present invention shown in FIGS. 1 to 9 will now be described in the order of the drawing numbers. FIG. 1 is a sectional view showing the principle of the present invention. In the figure, between the pad 2 of the bare chip component 1 and the footprint 4 of the printed wiring board 3, a connection medium 6 using, for example, a gold sphere as a core material,
The bare chip component 1 and the printed wiring board 3 are electrically connected and mechanically fixed by the mutual pressing force between the bare chip component 1 and the printed wiring board 3 by utilizing the contracting force of the adhesive 10 for mechanically fixing the bare chip component 1 and the printed wiring board 3. It has a structure for performing. As a result, in addition to the elasticity of the material serving as the core of the connection medium 6, the contraction force of the adhesive 10 at the time of adhesive curing is used to electrically connect and machine the bare chip component 1 and the printed wiring board 3 by mutual pressing force. Since the static fixation is maintained, the simple structure without bumps and the connection reliability can be maintained. As the core material, there is a sphere made of resin having high heat resistance, which is plated with gold, and the shape is also a polyhedron. The adhesive 10 flows out and is removed from the contact point between the pad 2 or the footprint 4 and the connection medium 6 by the pressure applied when the bare chip component 1 is mounted.

FIG. 2 is a sectional view of the first embodiment of the present invention. In the figure, a structure in which a connection medium 8 whose surface is coated with an adhesive 5 is arranged between the pad 2 of the bare chip component 1 and the footprint 4 of the printed wiring board 3 and the bare chip component 1 is face down bonded And Thereby, due to the elasticity of the material serving as the core of the connection medium 8, it is possible to maintain the simple structure without the bump and the connection reliability.

FIG. 3 is a sectional view of the second embodiment of the present invention. In the figure, the connection media 6 and 8 are structured to have spike-like or bump-like projections 9 on their surfaces. As a result, in addition to the elasticity of the core material, the surface has the spike-shaped or bump-shaped projections 9, so that the oxide film generated on the surface of the pad 2 of the bare chip component 1 or the footprint 4 of the printed wiring board 3 is broken. The connection reliability can be further improved.

FIG. 4 is a sectional view of the third embodiment of the present invention, in which the left side (a) shows the printed wiring board 3 side and the right side (b) shows the bare chip component 1 side. In the figure, the connection medium 6 is applied to the surface of the bare chip component 1 or the printed wiring board 3 in advance and press-fitted into the semi-cured or high-viscosity adhesive 10 to be arranged at a predetermined position. As a result, the connection medium 6 is press-fitted into the adhesive 10, so that connection and fixing can be performed simultaneously and easily.

FIG. 5 is a cross-sectional view of a fourth embodiment of the present invention, in which (a) on the left side shows the printed wiring board 3 side and (b) on the right side shows the bare chip component 1 side. In the figure, the connection medium 6 or 8 is applied to the surface of the bare chip component 1 or the printed wiring board 3 in advance, and the electrode portion is irradiated with laser light or printed to print the pad 2 of the bare chip component 1 or the footprint 4 of the printed wiring board 3. The connection portion was inserted into the recessed portion 11 of the adhesive 10 having the exposed portion, and was placed at a predetermined position. As a result, the connection medium 6 or 8 is attached to the adhesive 10
Since it is inserted into the concave portion 11 of, the connection and the fixing can be performed at the same time with easy positioning. Further, since there is no adhesive 10 on the pad 2 or the footprint 4, high connection reliability can be obtained.

FIG. 6 is a sectional view of the fifth embodiment of the present invention, in which (a) on the left side shows the printed wiring board 3 side and (b) on the right side shows the bare chip component 1 side. In the figure, after the connection medium 6 is inserted into the guide hole 12 of the guide plate 13 provided at a predetermined position, the pin 14 in the guide hole 12 applies the connection medium 6 to the surface of the bare chip component 1 or the printed wiring board 3 in advance. Semi-cured or highly viscous adhesive 1
It was press-fitted into 0 and arranged at a predetermined position. Since the connection medium 6 is press-fitted into the adhesive 10 by this, connection and fixing can be performed simultaneously with easy positioning.

FIG. 7 is a sectional view of a sixth embodiment of the present invention, in which (a) on the left side shows the printed wiring board 3 side and (b) on the right side shows the bare chip component 1 side. In the figure, the connection medium 6 is adsorbed by an adsorption head 15 having a fine opening that can be guided to a predetermined position, pre-applied to the surface of the bare chip component 1 or the printed wiring board 3 and is semi-cured or has a high viscosity adhesive. The structure is such that it is press-fitted in 10 and arranged at a predetermined position. Since the connection medium 6 is press-fitted into the adhesive 10 by this, connection and fixing can be performed simultaneously with easy positioning.

FIG. 8 is a sectional view of a seventh embodiment of the present invention, in which (a) on the left side shows the printed wiring board 3 side and (b) on the right side shows the bare chip component 1 side. In the figure, the connection medium 6 is adsorbed by an adsorption plate 16 having a plurality of fine openings at predetermined positions and pre-applied to the surface of the bare chip component 1 or the printed wiring board 3 to be semi-cured or high-viscosity adhesive. A structure was adopted in which 10 was press-fitted together and placed at a predetermined position. As a result, the connection medium 6 is press-fitted into the adhesive 10 all at once, so that the connection and the fixing can be simultaneously performed with accurate positioning.

FIG. 9 is a sectional view of the eighth embodiment of the present invention, in which (a) on the left side shows the printed wiring board 3 side and (b) on the right side shows the bare chip component 1 side. In the figure, when the connection media 6 and 8 are arranged at predetermined positions or after the connection media 6 and 8 are arranged, weak ultrasonic waves are applied to the connection media 6 and 8 and the pads 2 of the bare chip component 1 and the foot of the printed wiring board 3 are placed. The structure is such that the oxide film on the print 4 is removed. This makes it possible to secure high connection reliability by removing the oxide film from the connection medium 6 or 8.

[0023]

The effects of the present invention described above will be described in the order of claims. According to another aspect of the semiconductor device having the configuration of the present invention, the connection medium is used to utilize the contraction force of the adhesive for mechanically fixing the bare chip component and the printed wiring board when the bare chip component and the printed wiring board are mutually cured. Since the structure is such that the electrical connection and the mechanical fixing are performed by the pressing force of, the reliable electrical connection of the connecting medium and the mechanical fixing can be secured.
Furthermore, even if the size of the connection medium is miniaturized, electrical connection can be achieved.
Mechanical fixing can be ensured, and the structure can be applied to fine pitch and multiple terminals. Further, since the bumps are not formed on the pads of the bare chip component, the stress applied to the bare chip component can be suppressed.

According to another aspect of the semiconductor device having the structure of the present invention, a connection medium having a surface coated with an adhesive is disposed between the pad of the bare chip component and the footprint of the printed wiring board to face down the bare chip component. Since they are joined, in addition to the effect described in claim 1, the connection medium can be temporarily fixed by the adhesive force of the adhesive during the manufacturing process, and the manufacturing workability can be improved.

According to another aspect of the semiconductor device having the structure of the present invention, each of the two types of connection media has a structure having spike-like or bump-like protrusions on the surface, and the pads of the bare chip component and the footprint of the printed wiring board are formed. Since the oxide film generated on the surface is broken and the connection is made, a high electrical connection reliability can be secured in addition to the effect of the first or second aspect.

According to another aspect of the semiconductor device having the structure of the present invention, a step of arranging a connection medium and an adhesive for mechanical fixation at a predetermined position on the bare chip component or the printed wiring board, and the bare chip component on the printed wiring board are prescribed. Since the method of manufacturing a semiconductor device includes a step of mounting at a position, in addition to the effect of the first aspect, a simple connection structure and a manufacturing process that do not require bump formation on a bare chip component can be obtained.

According to another aspect of the semiconductor device having the structure of the present invention, the connection medium is pre-applied to the surface of the bare chip component or the printed wiring board and press-fitted into a semi-cured or high-viscosity adhesive to be placed at a predetermined position. Therefore, in addition to the effect of the first aspect, the electrical connection and the fixing of the connection medium can be performed at the same time with easy positioning.

According to another aspect of the semiconductor device having the structure of the present invention, the two types of connection media are pre-applied to the surface of the bare chip component or the printed wiring board, and the electrode portions are bonded by laser light irradiation or printing to expose the connection portions. Since it is inserted into the concave portion of the agent and arranged at a predetermined position, in addition to the effect according to claim 1 or 2, the two types of connection media can be easily positioned,
Secure electrical connection and fixing can be done at the same time.

According to another aspect of the semiconductor device having the structure of the present invention, after the connection medium is inserted into the guide hole of the guide plate provided at a predetermined position, the surface of the bare chip component or the printed wiring board is pinned by the pin in the guide hole. In addition to the effect according to claim 1, since it is applied in advance and press-fitted into a semi-cured or high-viscosity adhesive and arranged at a predetermined position, the connection medium can be accurately positioned and securely connected and fixed. And can be done at the same time.

According to another aspect of the semiconductor device having the structure of the present invention, the connection medium is adsorbed by an adsorption head having a fine opening capable of guiding the connection medium to a predetermined position, and is pre-coated on the surface of a bare chip component or a printed wiring board to be semi-cured. Since it is press-fitted into a high-viscosity or high-viscosity adhesive and placed at a predetermined position, in addition to the effect of the first aspect, the electrical connection and the fixing can be performed at the same time by the accurate positioning of the connection medium.

According to another aspect of the semiconductor device having the structure of the present invention, the connection medium is adsorbed by an adsorption plate having a plurality of fine openings at predetermined positions, and is pre-coated on the surface of the bare chip component or the printed wiring board to be semi-cured. In addition to the effect according to claim 1, reliable positioning, fixing, and connection of the connection medium can be performed at once, and productivity can be improved since it is press-fitted into a predetermined or high-viscosity adhesive and placed at a predetermined position. You can

In the semiconductor device having the structure according to the tenth aspect of the present invention, bare ultrasonic waves are applied to the two types of connection medium when or after the two types of connection medium are placed at predetermined positions. Since the structure is such that the oxide film on the pad of the component or the footprint of the printed wiring board is removed, high electrical connection reliability can be secured in addition to the effect of the first aspect.

[Brief description of drawings]

FIG. 1 is a sectional view showing the principle of the present invention.

FIG. 2 is a sectional view of the first embodiment of the present invention.

FIG. 3 is a sectional view of a second embodiment of the present invention.

FIG. 4 is a sectional view of a third embodiment of the present invention.

FIG. 5 is a sectional view of a fourth embodiment of the present invention.

FIG. 6 is a sectional view of a fifth embodiment of the present invention.

FIG. 7 is a sectional view of a sixth embodiment of the present invention.

FIG. 8 is a sectional view of a seventh embodiment of the present invention.

FIG. 9 is a sectional view of an eighth embodiment of the present invention.

FIG. 10 is a sectional view of a conventional example.

FIG. 11 is a manufacturing process diagram of a conventional example.

[Explanation of symbols]

 1 Bare Chip Component 2 Pad 3 Printed Wiring Board 4 Footprint 5 Adhesive 6 Connection Medium 8 Connection Medium 9 Protrusion 10 Adhesive 11 Recess 12 Guide Hole 13 Guide Plate 14 Pin 15 Adsorption Head 16 Adsorption Plate

Claims (10)

[Claims] 1. A connection medium (6) is provided between the pad (2) of the bare chip component (1) and the footprint (4) of the printed wiring board (3), and the bare chip component (1) and the printed wiring board (3). ) The adhesive force (10) for mechanical fixation with the adhesive (10) is used to make electrical connection and mechanical fixation by the mutual pressing force between the bare chip part (1) and the printed wiring board (3) by utilizing the shrinkage force at the time of curing. A semiconductor device characterized by being performed. 2. A connection medium (8) whose surface is coated with an adhesive (5) between a pad (2) of a bare chip component (1) and a footprint (4) of a printed wiring board (3).
And a bare chip component (1) are face-down bonded to each other. 3. The semiconductor device according to claim 1, wherein the connection medium (6, 8) has spike-like or bump-like protrusions (9) on its surface. 4. A step of arranging a connection medium (6) and an adhesive (10) for mechanical fixing at a predetermined position of a bare chip component (1) or a printed wiring board (3), and printing the bare chip component (1). The method for manufacturing a semiconductor device according to claim 1, further comprising a step of mounting the wiring board (3) at a predetermined position. 5. The connection medium (6) is applied to the surface of a bare chip component (1) or a printed wiring board (3) and press-fitted into a semi-cured or high-viscosity adhesive (10) to be placed at a predetermined position. The method for manufacturing a semiconductor device according to claim 1, wherein 6. The pad (2) of the bare chip component (1) is formed by applying the connection medium (6, 8) to the surface of the bare chip component (1) or the printed wiring board (3) and irradiating or printing the electrode portion with laser light. 3.) and the footprint (4) of the printed wiring board (3) are inserted into the recesses (11) of the exposed adhesive (10) and are arranged at predetermined positions. Device manufacturing method. 7. The bare chip part is inserted by a pin (14) in the guide hole (12) after the connection medium (6) is inserted into a guide hole (12) of a guide plate (13) provided at a predetermined position. 2. The manufacturing of a semiconductor device according to claim 1, wherein the semiconductor device is arranged at a predetermined position by being pressed into a semi-cured or high-viscosity adhesive (10) applied to the surface of (1) or a printed wiring board (3). Method. 8. A bare chip component (1) or a printed wiring board (3), wherein the connection medium (6) is sucked by a suction head (15) having a fine opening that can be guided to a predetermined position.
Semi-cured or high-viscosity adhesive (1
2. The method for manufacturing a semiconductor device according to claim 1, wherein the semiconductor device is press-fitted into 0) and arranged at a predetermined position. 9. The connection medium (6) is adsorbed by an adsorption plate (16) having a plurality of fine openings at predetermined positions, and applied to the surface of a bare chip component (1) or a printed wiring board (3). 2. The method of manufacturing a semiconductor device according to claim 1, wherein the cured or high-viscosity adhesive (10) is press-fitted together and arranged at a predetermined position. 10. After placing the connection medium (6, 8) in place, weak ultrasonic waves are applied to the connection medium (6, 8).
2. The method for manufacturing a semiconductor device according to claim 1, wherein the oxide film on the surface of the pad (2) of the bare chip component (1) or the footprint (4) of the printed wiring board (3) is removed by applying to the substrate. .