JPH09232781A - Ic cooling structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC cooling structure, which absorbs an irregularity in the heights of ICs and the inclination of the ICs, is easily handled and cools the ICs efficiently and stably. SOLUTION: A plurality of ICs 2 are mounted on a wiring board 1 and a cooling plate 3 is held on the board 1 via holding plates 3B. A channel pipe 3A is closely fixed on the plate 3 and a cooling liquid is made to flow in the pipe 3A. Spiral bodies 6 are respectively inserted between the ICs 2 and the plate 3 and the spiral bodies 6 are pressed to the ICs 2 by the plate 3. The spiral bodies 6 are respectively constituted of a plurality of fine wires, which have a high heat conductivity and consist of a flexible metal. The bodies 6 are flexibly deformed and absorb an irregularity in the heights of the ICs 2 and the inclination of the ICs 2 and at the same time, come into contact with the ICs 2 and the plate 3 in multipoints, ensure a wide contact area with the ICs 2 and the plate 3 and transfer heat generated in the ICs 2 to the plate 3 stably and efficiently.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC cooling structure. In particular, it relates to an IC cooling structure for liquid-cooling a plurality of exothermic ICs mounted on a wiring board.

[0002]

2. Description of the Related Art Next, a conventional IC cooling structure will be described with reference to FIG. FIG. 4 is a sectional view showing an example of a conventional cooling structure. In FIG. 4, 1 is a wiring board, 2 is an exothermic IC, 3 is a cooling plate, and 4 is grease.

In FIG. 4, a plurality of ICs are provided on the wiring board 1.
2 is implemented. A cooling plate 3 having high thermal conductivity is arranged on the plurality of ICs 2. The cooling plate 3 is supported on the wiring board 1 by the holding plate 3B.

A cream-like grease 4 having high thermal conductivity is applied to the upper surface of the package portion of each IC 2, and the grease 4 contacts the lower surface of the cooling plate 3.

The flow path pipe 3A is closely fixed to the cooling plate 3.
A coolant such as ground water is supplied to the conduit of the flow conduit 3A from an external cooling system and flows into the flow conduit 3A. FIG.
Then, as described above, the plurality of ICs 2 are cooled by the endothermic action of the cooling liquid.

FIG. 5 is a sectional view showing a structure different from the conventional IC cooling structure. FIG. 5 shows the grease 4 of FIG.
It is replaced with a sheet 5 having high thermal conductivity.

[0007]

In many cases, the IC 2 mounted on the wiring board 1 has a variation in the mounting height from the mounting surface of the wiring board 1 to the upper surface of the package. The grease 4 of FIG. 4 and the sheet 5 of FIG. 5 are applied or inserted in order to absorb the variation in the mounting height and the inclination of the IC, and increase the degree of adhesion with the cooling plate 3.

The cooling structure shown in FIG. 4 is difficult to handle because the grease 4 is creamy, and it is difficult to control the coating thickness of the grease 4 in response to the variation in the mounting height. . Further, the grease 4 hardens with time in a high temperature environment, the degree of adhesion with the cooling plate 3 decreases, the thermal resistance increases, and the heat transfer efficiency decreases.

The cooling structure shown in FIG. 5 has a problem that the sheet 5 is thin, and if the mounting height has a large variation, the variation cannot be absorbed. Furthermore, if the elastic sheet 5 is made thicker, there is a problem that the thermal resistance increases.

According to the present invention, by providing a spiral body composed of a plurality of thin metal wires having a high thermal conductivity and a high flexibility between the IC and the cooling plate, it is possible to absorb variations in the mounting height of the IC and the inclination of the IC. The purpose is to provide a cooling structure for.

[0011]

To achieve this object, according to the present invention, a plurality of heat generating ICs 2 are mounted on a wiring board 1 and a high heat conductive plate 3 is arranged on the plurality of ICs 2.
A heat conducting means is interposed between C2 and the high thermal conductive plate 3, and the high thermal conductive plate 3 has a conduit 3A through which a cooling liquid flows from an external cooling system.
An IC cooling structure for cooling a plurality of ICs 2 by the endothermic action of a cooling liquid, in which a spiral body 6 in which a high thermal conductive soft wire is spirally wound is pressed against the outer ring of the spiral body 6,
It is provided with a heat conducting means interposed between the package portion of C2 and the high heat conductive plate 3.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing an embodiment of the present invention. Note that, hereinafter, since the reference numerals corresponding to those in FIGS. 4 and 5 are the same components, the description thereof will be omitted.

In FIG. 1, 6 is a spiral body. FIG.
Replaces the grease 4 of FIG. 4 and the sheet 5 of FIG. 5 with a spiral body 6. The spiral body 6 is formed by a plurality of fine wires made of a metal having a high thermal conductivity and being flexible, such as copper or aluminum.

A spiral body 6 is interposed between the IC 2 and the cooling plate 3, and the spiral body 6 is pressed by the cooling plate 3 so that the outer ring of the spiral body 6 is pressed against the IC 2. In FIG.
The spiral body 6 flexibly deforms, absorbs the height variation of the IC 2, and contacts the IC 2 and the cooling plate 3 at multiple points.

Next, the operation of the cooling structure shown in FIG. 1 will be described. The heat generated in the IC 2 is passed through the spiral body 6 to the cooling plate 3
Is transmitted to At this time, since the spiral body 6 is in contact with the IC 2 and the cooling plate 3 at multiple points, the contact area is wide and I
The thermal resistance between C2 and the cooling plate 3 becomes low, and heat can be efficiently transferred.

The heat transferred to the cooling plate 3 is transferred to the flow path pipe 3A and radiated to the cooling liquid flowing in the pipe path. Further, since the spiral body 6 is a metal such as copper or aluminum, its shape does not deform with time even in a high temperature environment, stable contact can be maintained, and heat can be stably transferred. it can.

FIG. 2 is a sectional view when the mounting height of the IC 2 in FIG. 1 is different. In FIG. 2, IC21 and IC
The height of 22 is different. Since the spiral body 6 is not creamy, the thickness can be easily controlled. Spiral 61 and spiral 62
By changing the outer ring shape thickness of IC21 and IC22
Can absorb the difference in height.

FIG. 3 is a block diagram showing another embodiment of the present invention. In FIG. 3, the cooling structure of FIG. 1 is arranged on both upper and lower surfaces of the wiring board 1.

[0019]

As described above, in the cooling structure according to the present invention, a spiral body in which a high thermal conductive soft wire is spirally wound is wound between the IC and the cooling plate so that the outer ring of the spiral body is pressed. Since it is interposed between the package part and the high heat conductive plate, the contact area between the IC and the cooling plate can be widely and stably ensured, the thermal resistance is low, and the heat can be efficiently transferred. Further, since the spiral body is flexibly deformed, it is possible to absorb variations in the IC height and inclination. Also,
Since the thickness of the spiral body can be easily controlled and the thickness can be increased, it is possible to absorb the height difference between ICs having different heights. Further, since the spiral body is a solid, it is easy to handle.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view when mounting heights of ICs 2 in FIG. 1 are different.

FIG. 3 is a configuration diagram showing another embodiment of the present invention.

FIG. 4 is a cross-sectional view showing an IC cooling structure according to a conventional technique.

FIG. 5 is a cross-sectional view showing another IC cooling structure according to the prior art.

[Explanation of symbols]

 1 Wiring Board 2 IC 3 Cooling Plate 3A Flow Tube 3B Holding Plate 6 Spiral Body

Claims (1)

[Claims] 1. A plurality of heat-generating ICs are mounted on a wiring board, and a high thermal conductive plate is arranged on the plurality of ICs.
A heat conducting means is interposed between C and the high thermal conductive plate, and the high thermal conductive plate has a pipe line through which a cooling liquid flows from an external cooling system, and an IC for cooling the plurality of ICs by the endothermic action of the cooling liquid. The cooling structure is provided with a heat conducting means for interposing a spiral body in which a high thermal conductive soft wire is spirally wound between the package part of the IC and the high thermal conductive plate in a form in which an outer ring of the spiral body is pressed. An IC cooling structure characterized in that