JPH0923052A - Manufacture of bendable flexible printed wiring board - Google Patents
Manufacture of bendable flexible printed wiring boardInfo
- Publication number
- JPH0923052A JPH0923052A JP17214895A JP17214895A JPH0923052A JP H0923052 A JPH0923052 A JP H0923052A JP 17214895 A JP17214895 A JP 17214895A JP 17214895 A JP17214895 A JP 17214895A JP H0923052 A JPH0923052 A JP H0923052A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating
- cover
- wiring board
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器等に用い
られるフレキシブルプリント配線板（以下、ＦＰＣとも
云う）に折り曲げぐせを付ける折り曲げフレキシブルプ
リント配線板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a folded flexible printed wiring board in which a flexible printed wiring board (hereinafter also referred to as an FPC) used in electronic equipment or the like is bent.
【０００２】[0002]
【従来の技術】ＦＰＣは、ポリイミドフィルム等の可撓
性に富むベース絶縁層上に導体層パターンが設けられ、
その上にこの導体層パターンを絶縁保護するカバー絶縁
層が付与された積層構造を持ち、その基本特性として
は、基板が柔軟である点が挙げられる。ＦＰＣは、この
特性を活かしてプリンタ等にあるような繰り返し屈曲す
る部分の配線や、機器内にコンパクトに折り畳んで配線
するための用途等に使用されている。この折り畳み用途
の場合は、機器内への組み込みを容易にするために、Ｆ
ＰＣの出荷時に折り曲げぐせを付ける旨の要求のあるこ
とが少なくない。従来、この折り曲げぐせを付ける方法
としては、平面状ＦＰＣの所定部位を治具を用いて手作
業で折り曲げることが行われていた。2. Description of the Related Art In FPC, a conductor layer pattern is provided on a flexible insulating base layer such as a polyimide film.
It has a laminated structure in which a cover insulating layer that insulates and protects the conductor layer pattern is provided thereon, and its basic characteristic is that the substrate is flexible. The FPC is used for the wiring of a portion which is repeatedly bent as in a printer or the like by utilizing this characteristic, or for the purpose of compactly folding and wiring in a device. In the case of this folding application, the F
There are many cases where there is a demand for bending the PC when it is shipped. Conventionally, as a method of providing this bending habit, a predetermined portion of the flat FPC is manually bent using a jig.
【０００３】[0003]
【発明が解決しようとする課題】従来はＦＰＣに折り曲
げぐせを付ける方法として、平面状ＦＰＣの所定部位を
治具を用いて手作業で折り曲げていたため、時間と手間
がかかる上に多数の作業者が必要で量産性が悪く、また
折り曲げ角度が不統一になり易く品質のばらつきが大き
いという問題点があった。Conventionally, as a method of bending a FPC, a predetermined portion of a planar FPC is manually bent by using a jig, which takes time and labor and a large number of workers. However, there is a problem in that mass productivity is poor, and bending angles are likely to be ununiform, resulting in large variations in quality.
【０００４】本発明は、上記に鑑みてなされたもので、
量産性及び品質を向上させることのできる折り曲げフレ
キシブルプリント配線板の製造方法を提供することを目
的とする。The present invention has been made in view of the above,
An object of the present invention is to provide a method for manufacturing a bent flexible printed wiring board, which can improve mass productivity and quality.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、請求項１記載の発明は、少なくとも導体層パターン
が設けられたベース絶縁層上に前記導体層パターンを絶
縁保護するカバー絶縁層を付与した積層構造を持つフレ
キシブルプリント配線板に折り曲げぐせを付ける折り曲
げフレキシブルプリント配線板の製造方法において、前
記積層構造は熱収縮率の異なる前記ベース絶縁層とカバ
ー絶縁層とを組み合わせて構成し、前記折り曲げぐせを
付ける部分近傍を前記カバー絶縁層付与時の温度よりも
高い一定の温度で熱処理することを要旨とする。In order to solve the above-mentioned problems, the invention according to claim 1 provides a cover insulating layer for insulating and protecting the conductor layer pattern on at least a base insulating layer provided with the conductor layer pattern. In a method for manufacturing a bending flexible printed wiring board having a bending behavior in a flexible printed wiring board having a given laminated structure, the laminated structure is formed by combining the base insulating layer and the cover insulating layer having different heat shrinkage rates, It is a gist to heat-treat the vicinity of the portion to be bent at a constant temperature higher than the temperature at which the insulating cover layer is applied.
【０００６】すなわち、折り曲げぐせを付ける部分近傍
をカバー絶縁層付与時の温度よりも高い一定の温度で熱
処理することにより、熱収縮率の大きい絶縁層側を内側
として折れ曲がる。折り曲げ角度は、ベース絶縁層とカ
バー絶縁層の各熱収縮率、各絶縁層の厚さ等の組み合わ
せに依存して所定の角度が得られる。That is, the vicinity of the portion to be bent is heat-treated at a constant temperature higher than the temperature at which the insulating cover layer is applied, so that the insulating layer side having a large thermal shrinkage is bent inside. The bending angle can be a predetermined angle depending on the combination of the heat shrinkage ratio of the insulating base layer and the insulating cover layer, the thickness of each insulating layer, and the like.
【０００７】請求項２記載の発明は、ベース絶縁層の両
面に導体層パターンを設け、該両導体層パターンをそれ
ぞれ絶縁保護するカバー絶縁層を前記ベース絶縁層の両
面に付与した積層構造を持つフレキシブルプリント配線
板に折り曲げぐせを付ける折り曲げフレキシブルプリン
ト配線板の製造方法において、前記積層構造は熱収縮率
の異なる前記ベース絶縁層とカバー絶縁層とを組み合わ
せて構成し、前記折り曲げぐせを付ける部分における前
記両カバー絶縁層の一方を除去し、前記カバー絶縁層付
与時の温度よりも高い一定の温度で熱処理することを要
旨とする。According to a second aspect of the present invention, a conductive layer pattern is provided on both sides of the base insulating layer, and a cover insulating layer for insulating and protecting the both conductive layer patterns is provided on both sides of the base insulating layer. In a method of manufacturing a flexible printed wiring board, which is provided with a bending habit on a flexible printed wiring board, the laminated structure is configured by combining the base insulating layer and the cover insulating layer having different heat shrinkage ratios, and a portion in the portion to which the bending habit is applied is formed. It is a gist to remove one of the both cover insulating layers and perform heat treatment at a constant temperature higher than the temperature at which the cover insulating layers were applied.
【０００８】すなわち、フレキシブルプリント配線板
を、ベース絶縁層の両面に導体層パターンを設け、その
両導体層パターンをそれぞれ絶縁保護するカバー絶縁層
を前記ベース絶縁層の両面に付与した積層構造とした場
合において、折り曲げぐせを付ける部分における両カバ
ー絶縁層の一方を除去することで、熱処理の際、フレキ
シブルプリント配線板全体を加熱処理しても、その両カ
バー絶縁層の一方を除去した部分において、ベース絶縁
層と他方のカバー絶縁層との熱収縮率の差により折れ曲
がる。That is, the flexible printed wiring board has a laminated structure in which conductor layer patterns are provided on both sides of the base insulating layer, and cover insulating layers for insulating and protecting the both conductor layer patterns are provided on both sides of the base insulating layer. In this case, by removing one of both cover insulating layers in the portion to be bent, even if the entire flexible printed wiring board is heat-treated during heat treatment, in the portion where one of both cover insulating layers is removed, Bending due to the difference in heat shrinkage between the insulating base layer and the other insulating cover layer.
【０００９】また、このとき、カバー絶縁層及び導体層
パターンを、折り曲げぐせを付ける部分における一方の
側で除去して折り曲げぐせを付け易くする。また、この
除去され分断された導体層パターンは対向する面の導体
層パターンとスルーホールを介して接続される。Further, at this time, the insulating cover layer and the conductor layer pattern are removed on one side of the portion to be bent to facilitate bending. The removed and divided conductor layer pattern is connected to the conductor layer pattern on the opposite surface via a through hole.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施形態を図１な
いし図３を参照して説明する。まず、図１を用いて本実
施形態に適用される両面ＦＰＣ１の構造を説明する。両
面ＦＰＣ１は、ベース絶縁層２の両面に銅箔等からなる
第１の導体層パターン３と第２の導体層パターン４が形
成され、この第１、第２の導体層パターン３，４をそれ
ぞれ絶縁保護するための第１のカバー絶縁層５と第２の
カバー絶縁層６がベース絶縁層２の両面に付与された積
層構造となっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. First, the structure of the double-sided FPC 1 applied to this embodiment will be described with reference to FIG. In the double-sided FPC 1, a first conductor layer pattern 3 and a second conductor layer pattern 4 made of copper foil or the like are formed on both sides of an insulating base layer 2, and the first and second conductor layer patterns 3 and 4 are respectively formed. It has a laminated structure in which a first insulating cover layer 5 and a second insulating cover layer 6 for insulation protection are provided on both sides of the insulating base layer 2.
【００１１】ベース絶縁層２は厚みが２０〜１００μｍ
程度のポリイミドフィルムが用いられ、第１、第２のカ
バー絶縁層５，６はそれぞれ厚みが２０〜４０μｍ程度
のアクリル系感光性樹脂が用いられてベース絶縁層２と
カバー絶縁層５，６とは、熱収縮率の値が、（カバー絶
縁層５，６）＞（ベース絶縁層２）のように設定されて
いる。そして折り曲げ部Ｃの部分で第１のカバー絶縁層
５に開口部７が開けられてベース絶縁層２が露出してい
る。第１の導体層パターン３と第２の導体層パターン４
とは図示省略のスルーホールを介して適宜に層間接続さ
れている。折り曲げを行う関係上、Ｃ部の部分の第１の
導体層パターン３の形成本数はできるだけ少なくするこ
とが望ましく、Ａ部とＢ部の回路パターン同士を接続す
るための１〜２本程度の導体層のみの配設に止めるのが
よい。また、このＣ部の部分には第１の導体層パターン
３は全く形成せず、Ａ部とＢ部の第１の導体層パターン
３同士の接続は、スルーホールで第２の導体層パターン
４側を通して行ってもよい。なお、折り曲げ部Ｃの部分
に第１の導体層パターン３を形成した場合は、折り曲げ
後にその第１の導体層パターン３上に適宜の絶縁物塗布
等を行うようにしてもよい。The insulating base layer 2 has a thickness of 20 to 100 μm.
Polyimide film is used, and the first and second cover insulating layers 5 and 6 are made of acrylic photosensitive resin having a thickness of about 20 to 40 μm. Has a value of thermal shrinkage such that (cover insulating layers 5, 6)> (base insulating layer 2). The opening 7 is opened in the first insulating cover layer 5 at the bent portion C to expose the insulating base layer 2. First conductor layer pattern 3 and second conductor layer pattern 4
Are properly connected to each other through through holes (not shown). In terms of bending, it is desirable to reduce the number of the first conductor layer patterns 3 formed in the C portion as much as possible, and about 1 to 2 conductors for connecting the circuit patterns of the A portion and the B portion. It is better to dispose only layers. In addition, the first conductor layer pattern 3 is not formed at all in the C portion, and the first conductor layer patterns 3 in the A portion and the B portion are connected to each other by using the through holes to form the second conductor layer pattern 4. You may go through the side. When the first conductor layer pattern 3 is formed at the bent portion C, an appropriate insulating material may be applied to the first conductor layer pattern 3 after the bending.
【００１２】次に、図３に示す工程フローチャートを用
いて、図２に示すような折り曲げＦＰＣ１０の製造方法
を説明する。両面銅貼り積層板を準備し、層間接続用ス
ルーホール形成のための穴開けを行う（工程Ｓ１１）。
ドライフィルム等の密着力を高めるため表面粗化を行う
（工程Ｓ１２）。上記の穴開け部にスルーホールメッキ
を行う（工程Ｓ１３）。銅貼り上に感光レジストとして
ドライフィルムラミネートを貼り付け露光、現像を行っ
て所要のマスクパターンを形成する（工程Ｓ１４）。マ
スクパターンを通して銅貼りをエッチングし（工程Ｓ１
５）、感光レジストを剥離して導体層パターンを形成す
る（工程Ｓ１６）。工程Ｓ１４〜Ｓ１６は両面銅貼り積
層板の両面について行いベース絶縁層２の両面に第１の
導体層パターン３と第２の導体層パターン４を形成す
る。Next, a method of manufacturing the folded FPC 10 as shown in FIG. 2 will be described with reference to the process flow chart shown in FIG. A double-sided copper-clad laminate is prepared, and holes are formed to form through holes for interlayer connection (step S11).
Surface roughening is performed in order to improve the adhesion of a dry film or the like (step S12). Through-hole plating is performed on the above-mentioned perforated portion (step S13). A dry film laminate is attached as a photosensitive resist on the copper layer, exposed and developed to form a desired mask pattern (step S14). The copper paste is etched through the mask pattern (step S1
5) Then, the photosensitive resist is peeled off to form a conductor layer pattern (step S16). Steps S14 to S16 are performed on both sides of the double-sided copper-clad laminate to form the first conductor layer pattern 3 and the second conductor layer pattern 4 on both sides of the insulating base layer 2.
【００１３】第１、第２の導体層パターン３，４をそれ
ぞれ絶縁保護するための第１のカバー絶縁層５と第２の
カバー絶縁層６を、印刷処理又は熱接着によりベース絶
縁層２の両面に付与する。本実施形態では第１のカバー
絶縁層５と第２のカバー絶縁層６とは同じ厚さとする。
カバー絶縁層５，６としてアクリル系感光性樹脂を用い
たとき、印刷後の熱処理又は熱接着のための温度Ｔ
1 は、１３０〜１５０℃で行う。また、この工程におい
て折り曲げ部Ｃにおける第１のカバー絶縁層５に開口部
７を開ける（工程Ｓ１７）。メッキ、防錆処理等の所要
の表面処理（工程Ｓ１８）及び積層板の外形抜き（工程
Ｓ１９）を行い、図１に示したような両面ＦＰＣ１とす
る。A first cover insulating layer 5 and a second cover insulating layer 6 for insulating and protecting the first and second conductor layer patterns 3 and 4 are formed on the base insulating layer 2 by printing or heat bonding. Apply on both sides. In this embodiment, the first cover insulating layer 5 and the second cover insulating layer 6 have the same thickness.
When acrylic photosensitive resin is used for the cover insulating layers 5 and 6, the temperature T for heat treatment or thermal adhesion after printing is increased.
1 is performed at 130 to 150 ° C. Further, in this step, the opening 7 is opened in the first insulating cover layer 5 in the bent portion C (step S17). Required surface treatments such as plating and rustproofing (step S18) and outline cutting of the laminated plate (step S19) are performed to obtain the double-sided FPC 1 as shown in FIG.
【００１４】この両面ＦＰＣ１全体をカバー絶縁層５，
６付与時の温度よりも高い一定の温度Ｔ2 で熱処理して
折り曲げぐせを付けるための折り曲げ加工を行う。ベー
ス絶縁層２にポリイミドフィルムを用い、カバー絶縁層
５，６には上記のようにアクリル系感光性樹脂を用いた
とき、熱処理は温度Ｔ2 ＝２００〜２５０℃で５〜１０
秒程度行う。この熱処理により、開口部７を設けた折り
曲げ部Ｃの部分のみが折れ曲がる。折り曲げ角度は、ベ
ース絶縁層２とカバー絶縁層６の各熱収縮率、各絶縁層
２，６の厚さ等の組み合わせ、さらには折り曲げ部Ｃに
存在する導体層パターンの厚さや幅にも依存し、これら
が一定の組み合わせ等である限り、統一された所定の角
度が得られる（工程Ｓ２０）。最後に、折り曲げ角度を
含む全般的な検査を行い折り曲げＦＰＣ１０の製造を終
了する（工程Ｓ２１）。The entire double-sided FPC 1 is covered with the insulating layer 5,
6 Heat treatment is performed at a constant temperature T 2 higher than the temperature at the time of application to perform a bending process for giving a bending habit. When a polyimide film is used for the base insulating layer 2 and the acrylic photosensitive resin is used for the cover insulating layers 5 and 6 as described above, the heat treatment is performed at a temperature of T 2 = 200 to 250 ° C. for 5 to 10
Do about a second. By this heat treatment, only the bent portion C provided with the opening 7 is bent. The bending angle depends on the combination of the heat shrinkage rates of the insulating base layer 2 and the insulating cover layer 6, the thickness of the insulating layers 2 and 6, and the thickness and width of the conductor layer pattern existing in the bent portion C. However, as long as these are a fixed combination or the like, a uniform predetermined angle can be obtained (step S20). Finally, a general inspection including the bending angle is performed, and the manufacturing of the bending FPC 10 is completed (step S21).
【００１５】なお、上述の実施形態では両面ＦＰＣに適
用した場合について述べたが、本発明はベース絶縁層の
片面のみに導体層パターン及びカバー絶縁層が設けられ
た片面ＦＰＣにも適用することができる。片面ＦＰＣの
場合は、折り曲げ部Ｃに開口部を設ける必要はないが折
り曲げ時には折り曲げ部Ｃの近傍部分のみを加熱処理す
る。In the above embodiment, the case of applying to the double-sided FPC has been described, but the present invention can be applied to the single-sided FPC in which the conductor layer pattern and the insulating cover layer are provided on only one side of the insulating base layer. it can. In the case of a single-sided FPC, it is not necessary to provide an opening in the bent portion C, but only the portion in the vicinity of the bent portion C is heat-treated at the time of bending.
【００１６】[0016]
【発明の効果】以上説明したように、請求項１記載の発
明によれば、少なくとも導体層パターンが設けられたベ
ース絶縁層上に前記導体層パターンを絶縁保護するカバ
ー絶縁層を付与した積層構造を持つフレキシブルプリン
ト配線板に折り曲げぐせを付ける折り曲げフレキシブル
プリント配線板の製造方法において、前記積層構造は熱
収縮率の異なる前記ベース絶縁層とカバー絶縁層とを組
み合わせて構成し、前記折り曲げぐせを付ける部分近傍
を前記カバー絶縁層付与時の温度よりも高い一定の温度
で熱処理するようにしたため、熱収縮率の大きい絶縁層
側を内側として折れ曲がり、その折り曲げ角度は、ベー
ス絶縁層とカバー絶縁層の各熱収縮率、各絶縁層の厚さ
等の組み合わせに依存して所定の角度が得られる。した
がって量産性及び品質を向上させることができる。As described above, according to the first aspect of the invention, a laminated structure in which a cover insulating layer for insulating and protecting the conductor layer pattern is provided on at least the base insulating layer provided with the conductor layer pattern. In the method of manufacturing a flexible printed wiring board, the laminated structure is configured by combining the base insulating layer and the cover insulating layer having different heat shrinkage rates, and the bending is attached. Since the vicinity of the portion is heat-treated at a constant temperature higher than the temperature at the time of applying the cover insulating layer, it is bent with the insulating layer side having a large heat shrinkage ratio as the inner side, and the bending angle is the same as the base insulating layer A predetermined angle can be obtained depending on the combination of each heat shrinkage rate, the thickness of each insulating layer, and the like. Therefore, mass productivity and quality can be improved.
【００１７】請求項２記載の発明によれば、ベース絶縁
層の両面に導体層パターンを設け、該両導体層パターン
をそれぞれ絶縁保護するカバー絶縁層を前記ベース絶縁
層の両面に付与した積層構造を持つフレキシブルプリン
ト配線板に折り曲げぐせを付ける折り曲げフレキシブル
プリント配線板の製造方法において、前記積層構造は熱
収縮率の異なる前記ベース絶縁層とカバー絶縁層とを組
み合わせて構成し、前記折り曲げぐせを付ける部分にお
ける前記両カバー絶縁層の一方を除去し、前記カバー絶
縁層付与時の温度よりも高い一定の温度で熱処理するよ
うにしたため、熱処理の際、フレキシブルプリント配線
板全体を加熱処理しても、その両カバー絶縁層の一方を
除去した部分において、ベース絶縁層と他方のカバー絶
縁層との熱収縮率の差により、上記と同様に所定の角度
で折れ曲がる。したがって、量産性を一層高めることが
できると共に品質を向上させることができる。According to the second aspect of the present invention, a laminated structure is provided in which conductive layer patterns are provided on both sides of the base insulating layer, and cover insulating layers for insulating and protecting the both conductive layer patterns are provided on both sides of the base insulating layer. In the method of manufacturing a flexible printed wiring board, the laminated structure is configured by combining the base insulating layer and the cover insulating layer having different heat shrinkage rates, and the bending is attached. Since one of the both cover insulating layers in the part is removed and the heat treatment is performed at a constant temperature higher than the temperature at which the cover insulating layer is applied, at the time of heat treatment, even if the entire flexible printed wiring board is heat treated, The heat shrinkage ratio between the base insulating layer and the other cover insulating layer in the part where one of the two cover insulating layers is removed. Differences, like the bending at a predetermined angle. Therefore, mass productivity can be further improved and quality can be improved.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明に係る折り曲げフレキシブルプリント配
線板の製造方法の実施例に適用する両面ＦＰＣの構成例
を示す斜視図及び部分拡大断面図である。FIG. 1 is a perspective view and a partially enlarged cross-sectional view showing a configuration example of a double-sided FPC applied to an embodiment of a method for manufacturing a folded flexible printed wiring board according to the present invention.
【図２】上記両面ＦＰＣを折り曲げた折り曲げＦＰＣを
示す斜視図及び部分拡大断面図である。FIG. 2 is a perspective view and a partially enlarged sectional view showing a folded FPC in which the double-sided FPC is folded.
【図３】上記実施例を説明するための工程フローチャー
トである。FIG. 3 is a process flowchart for explaining the above embodiment.
１ 両面ＦＰＣ ２ ベース絶縁層 ３，４ 第１、第２の導体層パターン ５，６ 第１、第２のカバー絶縁層 ７ 開口部 １０ 折り曲げＦＰＣ 1 Double-sided FPC 2 Base insulating layer 3,4 First and second conductor layer patterns 5,6 First and second cover insulating layer 7 Opening 10 Bending FPC
Claims (3)
ベース絶縁層上に前記導体層パターンを絶縁保護するカ
バー絶縁層を付与した積層構造を持つフレキシブルプリ
ント配線板に折り曲げぐせを付ける折り曲げフレキシブ
ルプリント配線板の製造方法において、 前記積層構造は熱収縮率の異なる前記ベース絶縁層とカ
バー絶縁層とを組み合わせて構成し、前記折り曲げぐせ
を付ける部分近傍を前記カバー絶縁層付与時の温度より
も高い一定の温度で熱処理することを特徴とする折り曲
げフレキシブルプリント配線板の製造方法。1. A bendable flexible printed wiring board having a laminated structure in which a cover insulating layer for insulating and protecting the conductor layer pattern is provided on at least a base insulating layer provided with a conductor layer pattern. In the manufacturing method, the laminated structure is configured by combining the insulating base layer and the insulating cover layer having different heat shrinkage ratios, and the vicinity of the portion to which the fold is attached is higher than the temperature at the time of applying the insulating cover layer. A method for manufacturing a bent flexible printed wiring board, which comprises heat-treating at a temperature.
設け、該両導体層パターンをそれぞれ絶縁保護するカバ
ー絶縁層を前記ベース絶縁層の両面に付与した積層構造
を持つフレキシブルプリント配線板に折り曲げぐせを付
ける折り曲げフレキシブルプリント配線板の製造方法に
おいて、 前記積層構造は熱収縮率の異なる前記ベース絶縁層とカ
バー絶縁層とを組み合わせて構成し、前記折り曲げぐせ
を付ける部分における前記両カバー絶縁層の一方を除去
し、前記カバー絶縁層付与時の温度よりも高い一定の温
度で熱処理することを特徴とする折り曲げフレキシブル
プリント配線板の製造方法。2. A flexible printed wiring board having a laminated structure in which conductive layer patterns are provided on both sides of a base insulating layer, and cover insulating layers for insulating and protecting the both conductive layer patterns are provided on both sides of the base insulating layer. In the method for manufacturing a bending flexible printed wiring board having a gusset, the laminated structure is configured by combining the base insulating layer and the cover insulating layer having different heat shrinkage ratios, and the both cover insulating layers in the portion to which the fold is attached are formed. A method for producing a folded flexible printed wiring board, characterized in that one is removed and a heat treatment is performed at a constant temperature higher than the temperature at which the insulating cover layer is applied.
は、前記折り曲げぐせを付ける部分における一方の側で
除去され、かつ前記両面の導体層パターンは適宜スルー
ホールで接続されることを特徴とする請求項２記載の折
り曲げフレキシブルプリント配線板の製造方法。3. The insulating cover layer and the conductor layer pattern are removed on one side of the portion to be bent and the conductor layer patterns on both surfaces are appropriately connected by through holes. Item 3. A method for manufacturing a bent flexible printed wiring board according to Item 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17214895A JPH0923052A (en) | 1995-07-07 | 1995-07-07 | Manufacture of bendable flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17214895A JPH0923052A (en) | 1995-07-07 | 1995-07-07 | Manufacture of bendable flexible printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0923052A true JPH0923052A (en) | 1997-01-21 |
Family
ID=15936461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17214895A Pending JPH0923052A (en) | 1995-07-07 | 1995-07-07 | Manufacture of bendable flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0923052A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012875A (en) * | 2005-06-30 | 2007-01-18 | Fujikura Ltd | Printed circuit board |
| KR100878383B1 (en) * | 2006-01-27 | 2009-01-13 | 가부시키가이샤 히타치 디스프레이즈 | Display device |
| US7545649B2 (en) | 2005-04-12 | 2009-06-09 | Au Optronics Corp. | Double sided flexible printed circuit board |
| JP2010105317A (en) * | 2008-10-31 | 2010-05-13 | Brother Ind Ltd | Method for manufacturing flexible wiring member, flexible wiring member, method for manufacturing piezoelectric actuator unit, and piezoelectric actuator unit |
| WO2017043299A1 (en) * | 2015-09-10 | 2017-03-16 | 株式会社デンソー | Method for manufacturing printed circuit board |
| WO2018029920A1 (en) * | 2016-08-12 | 2018-02-15 | 株式会社フジクラ | Wiring substrate and method for manufacturing said wiring substrate |
| CN113299199A (en) * | 2021-05-19 | 2021-08-24 | 河源力友通讯科技有限公司 | Manufacturing method of flexible AMOLED display module of mobile phone |
| US11483923B2 (en) * | 2016-03-30 | 2022-10-25 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Laminated component carrier with a thermoplastic structure |
-
1995
- 1995-07-07 JP JP17214895A patent/JPH0923052A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7545649B2 (en) | 2005-04-12 | 2009-06-09 | Au Optronics Corp. | Double sided flexible printed circuit board |
| JP2007012875A (en) * | 2005-06-30 | 2007-01-18 | Fujikura Ltd | Printed circuit board |
| KR100878383B1 (en) * | 2006-01-27 | 2009-01-13 | 가부시키가이샤 히타치 디스프레이즈 | Display device |
| JP2010105317A (en) * | 2008-10-31 | 2010-05-13 | Brother Ind Ltd | Method for manufacturing flexible wiring member, flexible wiring member, method for manufacturing piezoelectric actuator unit, and piezoelectric actuator unit |
| CN107950081A (en) * | 2015-09-10 | 2018-04-20 | 株式会社电装 | The manufacture method of printed circuit board (PCB) |
| JP2017054964A (en) * | 2015-09-10 | 2017-03-16 | 株式会社デンソー | Manufacturing method for printed circuit board |
| KR20180032608A (en) | 2015-09-10 | 2018-03-30 | 가부시키가이샤 덴소 | Manufacturing method of printed board |
| WO2017043299A1 (en) * | 2015-09-10 | 2017-03-16 | 株式会社デンソー | Method for manufacturing printed circuit board |
| TWI633815B (en) * | 2015-09-10 | 2018-08-21 | 電裝股份有限公司 | Printed substrate manufacturing method |
| CN107950081B (en) * | 2015-09-10 | 2020-06-19 | 株式会社电装 | Method for manufacturing printed circuit board |
| US11212913B2 (en) | 2015-09-10 | 2021-12-28 | Murata Manufacturing Co., Ltd. | Manufacturing method of printed board |
| US11483923B2 (en) * | 2016-03-30 | 2022-10-25 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Laminated component carrier with a thermoplastic structure |
| US12048089B2 (en) | 2016-03-30 | 2024-07-23 | AT&SAustria Technologie & Systemtechnik | Laminated component carrier with a thermoplastic structure |
| WO2018029920A1 (en) * | 2016-08-12 | 2018-02-15 | 株式会社フジクラ | Wiring substrate and method for manufacturing said wiring substrate |
| US10405419B2 (en) | 2016-08-12 | 2019-09-03 | Fujikura Ltd. | Wiring substrate and method for manufacturing said wiring substrate |
| CN113299199A (en) * | 2021-05-19 | 2021-08-24 | 河源力友通讯科技有限公司 | Manufacturing method of flexible AMOLED display module of mobile phone |
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