JPH0922923A - Method and apparatus for mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly conduct CCB between connectors and between products by correcting the bump and pad height distribution difference. SOLUTION: Prior to CCB, the height distribution of bump 2 group is recognized for many pellets 1 by a bump height distribution recognition unit 15, and the height distribution of pad 5 group is recognized per many boards 3 by a pad height distribution recognition unit 35. The bump height distribution recognition data group and pad height distribution recognition data group are collated by an optimum combination selector 50, and the optimum combination of the pellet and the board to become the relation in which the difference between the bump height distribution and the pad height distribution is cancelled is sequentially selected. The optimum combination selector sequentially commands a handling unit 41 to selectively combine pellets and boards and to sequentially execute the CCB of the pellet to the board by the optimum combination. Accordingly, since the error of the height distribution can be corrected for all the optimum combination with the pellet and board, the bump group of the pellet can be uniformly conducted for the CCB to the pad group of the board, and the CCB can be conducted suitably without irregularity even among all the combinations.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to mounting technology,
In particular, it relates to a mounting technique in which a large number of pairs of articles are mounted and one main surface of each of them is sequentially mounted so as to face each other. For example, in a semiconductor device manufacturing plant, a pellet having a plurality of bumps on one main surface is mainly used. The present invention relates to a technique effectively used for aligning and mounting each bump and each pad on a substrate having a plurality of pads on its surface.

[0002]

2. Description of the Related Art Generally, as a connection technique capable of taking a large number of input / output terminals (number of I / O), a flip chip connection technique is known in which an active element surface of a chip (pellet) is connected to a substrate. CCB (Controlled Co) is a typical flip-chip connection technology.
Lappe Bonding) is widely known.
CCB is a bonding technique in which solder bumps are formed on a chip (hereinafter referred to as pellets), the pellets are turned upside down, aligned with the substrate for mounting, and then the solder is melted to collectively bond the bump groups. Is.

A conventional mounting device for carrying out this CCB has a pellet tray in which a large number of pellets with preformed solder bumps are arranged in a matrix, and a large number of substrates with preformed bonding pads in a matrix. Board trays that are arranged and stored in the shape of a sheet, a pellet reference position recognition device that recognizes the reference position specified for the pellet, a substrate reference position recognition device that recognizes the reference position specified for the substrate, and vacuum suction of the pellets A collet that holds and conveys to the substrate tray is provided, and the pellet is held by the collet and conveyed to the substrate in the substrate tray, and the reference position recognized by the pellet reference position recognition device and the substrate reference position recognition device are recognized. Mount the pellet on the substrate after correcting the alignment with the reference position Is constructed sea urchin.

As an example of describing CCB technology, Nikkei BP Co., Ltd., issued May 31, 1993, "Practice Course V"
LSI packaging technology (bottom) "P175-P176
But there is.

[0005]

In the CCB mounting device described above, since the pellet reference position recognizing device and the substrate reference position recognizing device are respectively provided, the pellet reference position recognizing device and the substrate reference position recognizing device are provided in the plane of the pellet bumps and the substrate pad. Although the alignment can be secured, the difference between the height distribution of the pellet bump group and the height distribution of the pad group of the substrate (vertical difference) cannot be corrected, so the bump and pad are connected. There may be a connection part that is not properly connected in the part group.

An object of the present invention is to provide a mounting technique capable of correcting the difference in height distribution of a pair of articles to be mounted and mounting the articles evenly and properly over the entire article.

[0007] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, in a mounting apparatus in which a plurality of pellets having a plurality of bumps and a substrate having a plurality of pads are set, and each bump and each pad are aligned and sequentially mounted, a bump group of each pellet is formed. The bump height distribution recognizing device that recognizes the height distribution and the pad height distribution recognizing device that recognizes the height distribution of the pad group for each substrate are compared with each other, and the difference between the height distributions is checked. It is characterized by comprising an optimum combination selection device for sequentially selecting an optimum combination of pellets and substrates which are in a mutually canceling relationship.

[0010]

In the above-mentioned means, the bump height distribution recognizing device recognizes the height distribution of the bump groups for a large number of pellets (a group of pellets) before the pellets are mounted on the substrate. The bump group height distribution data for the pellet is sent to the optimum combination selection device. In addition, the pad height distribution recognition device recognizes the height distribution of the pad group for a large number of substrates (reference group), and the height distribution data of the pad group for each substrate is sent to the optimum combination selection device. To be The optimum combination selection device sequentially collates the data group from the bump height distribution recognition device with the data group from the pad height distribution recognition device, and determines the difference between the bump group height distribution and the pad group height distribution. The optimum combination of the pair of pellets and the substrate, which have a relationship of canceling each other, is sequentially selected. Then, the optimum combination selection device sequentially commands the selected combination to the execution device that executes the mounting work, thereby causing the mounting work execution device to sequentially execute the mounting work for the pellet substrate by the optimum combination.

In this way, according to the above-mentioned means, the optimum combination of the pair of pellets and the substrate is such that the difference between the height distribution of the bump group and the height distribution of the pad group cancels each other out. Since the mounting work of the pellets on the substrate is sequentially executed, the height distribution error is corrected for all the combinations of the pellets and the substrates, and it is appropriate for all the combinations of the pellets and the substrates (a group of combinations). The mounting state will be secured.

[0012]

1 is a schematic partially cut front view showing a CCB mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic plan view thereof. FIG. 3 is a block diagram showing the control system. FIG. 4 shows a CC according to an embodiment of the present invention.
It is a flowchart showing a mounting method of B. 5 and 6 are explanatory diagrams for explaining the operation.

In this embodiment, a mounting apparatus according to the present invention is a CCB for sequentially mounting a pellet having a plurality of bumps and a substrate having a plurality of pads by aligning the bumps with the pads. It is configured as a mounting device.

The pellet 1 which is one of the mounting articles has a plurality of (9 in the illustrated example) bumps 2 protruding from one main surface (hereinafter referred to as the first main surface). The pellets and bumps are manufactured in the form of a wafer in a so-called pre-process in the manufacturing process of the semiconductor device. That is, a circuit (not shown) including a desired semiconductor element is provided on a wafer obtained by cutting a semiconductor such as silicon into a circular thin plate shape.
Is built to correspond to each pellet,
Electrical wiring is formed. Next, the bumps 2 are formed in a hemispherical shape by using solder on the pads connected to the electric wiring and formed on the one main surface. afterwards,
In the dicing process, the wafer is divided into square small flat plate-shaped pellets 1. The separated pellet 1 has its bump 2 side facing downward, and a pellet tray 12 to be described later.
One is stored in each storage hole 13 of.

Substrate 3, which is the other mounting article, has a main body 4 formed into a square plate shape by using an insulating thin plate such as ceramic or epoxy resin. Pad 5 is formed corresponding to each bump 2. Board body 4
An electric wiring (not shown) is formed inside the pad, and each pad 5 is formed by a screen printing method or a patterning method using a lithography process and an etching process using a copper foil to electrically connect to the electric wiring. It is connected. The substrates 3 are housed one by one in the housing holes 33 of the substrate tray 32, which will be described later, with the pad 5 side facing upward.

The CCB mounting apparatus 10 according to the present embodiment includes a pellet supply stage 1 for supplying pellets 1.
1, the XY table 14 on which the pellet tray 12 is placed is installed on the pellet supply stage 11. The pellet tray 12 has a plurality of storage holes 13 each storing one pellet 1, and the storage holes 13 are arranged in a matrix and are sunk into a square hole having a constant depth and slightly larger than the pellet 1. Is each storage hole 13
The bumps 2 are housed with the side facing downward. The XY table 14 is configured to move the pellet tray 12 in the horizontal and vertical directions (XY directions) within a horizontal plane.
Further, the XY table 14 is configured so that a pair of pellet trays 12 can be placed at a pair of front and rear positions, respectively.

The pellet supply stage 11 is equipped with a bump height distribution recognizing device 15 for recognizing the height distribution of the bump group for the pellet. The bump height distribution recognizing device 15 includes a handling device 16, and the handling device 16 holds the pellets 1 stored in the pellet tray 12 one by one by vacuum suction with a collet 17,
It is configured to be sequentially transported to the measurement station 18 set in the space above the XY table 14, and to return the pellet 1 to the original storage hole 13 after the measurement work described later is completed. A rotating mirror 19 is rotatably supported directly below the measuring station 18, and a laser range finder 20 is provided at a position optically opposed to the measuring station 18 with the mirror 19 interposed therebetween, and a collet 17 at the measuring station 18.
Are arranged so as to optically face the first main surface of the pellet 1 arranged by. This laser range finder 20
Has a linear light emitting unit and a linear photo sensor,
By optically scanning the entire first main surface of the pellet 1 in cooperation with the mirror 19, the distance to the respective positions (corresponding to XY coordinate points) on the first main surface of the pellet 1 (Z-axis direction). Corresponding to the interval of 1) is sequentially measured. A measurement data processing device 21 is electrically connected to the laser range finder 20, and the measurement data processing device 21 recognizes the height distribution of the bump 2 group of the pellet 1 based on the measurement data from the laser range finder 20. Is configured to. And this bump height distribution recognition device 1
The output end of the measurement data processing device 21 as the output end of 5 is electrically connected to the optimum combination selecting device 50 described later.

A pellet reference position recognition device 22 for recognizing the reference position designated for the pellet 1 is arranged on one side of the XY table 14 on the pellet supply stage 11 so as to face upward. Pellet reference position recognition device 22
Is configured to recognize the reference position of the pellet 1. That is, the pellet reference position recognition device 22 includes an industrial television camera 23 as an image pickup device and an illumination device 24.
And an image signal processing device (not shown) as a recognition device connected to the television camera 23 and recognizing the reference position of the object to be imaged based on the image pickup signal. The lighting device 24 includes a dark box 25. The dark box 25 is formed in a cylindrical shape having an open lower end, and is concentrically arranged and fitted into the upper end of the lens barrel of the television camera 23. A pellet insertion port 26 is concentrically opened in the closed wall at the upper end of the dark box 25, and the insertion port 26 is formed slightly larger than the pellet 1. A ring illuminator 27 is fitted on the outer periphery of the dark box 25 so as to illuminate a region directly above the pellet insertion port 26 in an obliquely upward inward direction. Ring illuminator 2
Reference numeral 7 denotes a large number of optical fibers (not shown) that are radially and obliquely upward along a normal line of the center of the ring and are bundled in a ring shape. It is fitted and fixed. The other end of the optical fiber group faces a light source (not shown) so that the light from the light source is emitted obliquely upward from the inner peripheral surface of the ring toward the center of the ring.

The ring illuminator 27 illuminates the lower surface of the pellet 1 held at the tip of the collet from the optical fiber group when the collet of the main handling device described later is inserted in the center of the ring illuminator 27. The light 28 is irradiated. The illumination light 28 applied to the lower surface of the pellet 1 is totally reflected by the pellet 1 downward in the axial direction of the collet. The image signal processing device as a recognition device connected to the television camera 23 in the pellet reference position recognition device 22 is connected to a controller (not shown) constructed from a computer or the like, and the controller is a pellet. The XY table, the handling device and the like are automatically controlled based on the recognition of a reference position described later by the reference position recognition device 22 and a substrate reference position recognition device described later by the operation described below.

The CCB mounting apparatus 10 according to the present embodiment includes a substrate supply stage 31 for supplying the substrate 3, and the substrate supply stage 31 is provided with an XY table 34 on which a substrate tray 32 is placed. The substrate tray 32 has a plurality of storage holes 33 in which the substrates 3 are accommodated one by one, and the storage holes 33 are arranged in a matrix and are respectively sunk into a square hole having a constant depth and slightly larger than the substrate 3.
The substrate 3 is housed in each housing hole 33 with the pad 5 side facing upward. The XY table 34 is configured to move the substrate tray 32 in the horizontal and vertical directions (XY directions). The XY table 34 is configured so that a pair of substrate trays 32 can be placed at a pair of front and rear positions, respectively.

The substrate supply stage 31 is equipped with a pad height distribution recognizing device 35 for recognizing the height distribution of the pads 5 on the substrate 3. Pad height distribution recognition device 35
Is provided with a laser range finder 36, and the laser range finder 36 is installed so as to face the upper surface of the substrate 3 of the substrate tray 32 optically. The laser range finder 36 includes a light emitting unit and a photo sensor, and the XY table 3
By optically scanning the entire upper surface of the substrate 3 in cooperation with 4, the distance to each position (corresponding to an XY coordinate point) on the upper surface of the substrate 3 (corresponding to an interval in the Z-axis direction).
Are sequentially measured. A measurement data processing device 37 is electrically connected to the laser range finder 36, and the measurement data processing device 37 is connected to the laser range finder 3
The height distribution of the pad 5 group of the substrate 3 is recognized based on the measurement data from 6 and the XY coordinate data from the XY table 34. Then, the measurement data processing device 3 as an output end of the pad height distribution recognition device 35
The output terminal of 7 is electrically connected to an optimum combination selecting device 50 described later.

On the substrate supply stage 31, the substrate reference position recognition device 3 for recognizing the reference position designated on the substrate 3.
8 is installed downward. Board reference position recognition device 3
Reference numeral 8 is configured to recognize the reference position of the substrate 3. That is, the board reference position recognizing device 38 is an industrial television camera 39 as an image pickup device, an illuminating device 40 attached to the tip of the camera 39, and the television camera 3.
9 and an image signal processing device (not shown) as a recognition device that recognizes the outer shape of the object to be imaged based on the image pickup signal, and recognizes the reference position of the substrate 3 of the substrate supply stage 31. Is configured to.

A handling device (hereinafter referred to as the main handling device) 41 for mounting the pellet 1 on the substrate 3 is provided between the pellet supply stage 11 and the substrate supply stage 31. The main handling device 41 includes a collet 42 that holds the pellet 1 by vacuum suction, a robot 43 that moves the collet 42 in the left-right direction and in the up-down direction, and a controller 44 that controls the robot 43. By doing so, the pellet 1 is mounted on the substrate 3.

Further, the pellet supply stage 11 is provided with a pellet recognizing device 45 for recognizing the position of each pellet 1 housed in the pellet tray 12 downward. The pellet recognition device 45 is an industrial television camera 46 as an image pickup device, an illumination device 47 attached to the tip of the camera 46, and a reference to an object to be imaged, which is connected to the television camera 46 and based on the image pickup signal. An image signal processing device (not shown) as a recognition device for recognizing the position is provided, and the position of each pellet 1 on the pellet tray 12 is recognized as a whole.

The optimum combination selecting device 50 in which the pad height distribution recognizing device 35 and the bump height distribution recognizing device 15 are electrically connected is constructed by a computer or the like. And the data group from the pad height distribution recognition device 35 are sequentially collated, and the difference between the height distribution of the bump 2 group and the height distribution of the pad 5 group is such that they cancel each other out. It is configured to sequentially select the optimum combination of the pair of pellets 1 and the substrate 3. The output end of the optimum combination selection device 50 is connected to the controller 44 of the robot 43 of the main handling device 41, and the selected combinations are sequentially instructed to the main handling device 41 as the execution device that executes the mounting work. As a result, the main handling device 41 is configured to sequentially execute the mounting work for the substrate 3 of the pellet 1 by the optimum combination.

Next, the operation of mounting the pellets on the substrate by the CCB mounting apparatus having the above-mentioned structure will be described to explain the CCB which is an embodiment of the present invention.
The mounting method of is explained.

In the pellet supply stage 11, the height distribution of the bump 2 group of the pellet 1 is recognized by the bump height distribution recognition device 15 before the mounting of the pellet 1 on the substrate 3. That is,
In the pellet supply stage 11, the pellet tray 1
The pellets 1 accommodated in the second accommodating holes 13 are vacuum suction-held by the collet 17 of the handling device 16 (hereinafter referred to as a sub-handling device) of the bump height distribution recognition device 15 and transported to the measurement station 18. In the measuring station 18, the laser rangefinder 20 directs the laser to the first main surface of the pellet 1 on the bump 2 group side.
The linear photo sensor receives the reflected light from the first main surface while irradiating the same while scanning in cooperation with 9, and the respective positions (XY) of the pellet 1 on the first main surface.
Corresponds to the coordinate point. ) (Corresponding to the distance in the Z-axis direction) is measured throughout.

The measurement data processing device 21 connected to the laser range finder 20 recognizes the height distribution of the bump 2 group of the pellet 1 based on the measurement data from the laser range finder 20. The measured data processor 20 recognizes the pellet 1
The height distribution of the second bump group is transmitted to the optimum combination selection device 50. After the measurement, the pellet 1 is stored in the original storage hole 13 of the pellet tray 12 by the sub-handling device 16.
Is returned to.

After that, by repeating the above operation, for example, the height distribution of the bump 2 group is recognized for all the pellets 1 accommodated in one pellet tray 12. At this time, the optimum combination selection device 50 identifies each pellet 1 by each position of the storage hole 13 in the pellet tray 12 and stores the bump height data of each identified pellet 1 in association with each other.

The pellet tray 12 for which the measurement of all the stored pellets 1 group has been completed is moved to the rear position of the XY table 14 of the pellet supply stage 11 and stands by for a mounting operation described later. The next pellet tray 12 is provided at the front position on the XY table 14.
Is supplied, and the bump height distribution recognition device 15 repeatedly performs the bump height distribution recognition work for each pellet 1.

On the other hand, in the substrate supply stage 31,
Prior to the mounting of the pellet 1 on the substrate 3, the height distribution of the pad group of the substrate 3 is recognized by the pad height distribution recognition device 35. That is, in the substrate supply stage 31, the pad height distribution recognition device 3
The laser range finder 36 of No. 5 irradiates the laser while scanning the laser beam on the upper surface, which is the main surface of the substrate 3 accommodated in the accommodation hole 33 of the substrate tray 32 on which the pad 5 is formed, in cooperation with the XY table 34. At the same time, the reflected light from the upper surface is received by the photosensor, so that the distance (corresponding to the Z-axis direction interval) to each position (corresponding to the XY coordinate points) on the upper surface of the substrate 3 is entirely covered. Measure.

The measurement data processing device 37 connected to the laser range finder 36 recognizes the height distribution of the pads 5 of the substrate 3 based on the measurement data from the laser range finder 36 and the XY coordinate data from the XY table 34. To do. The measurement data processing device 37 transmits the height distribution of the recognized pad 5 group to the optimum combination selection device 50. When the measurement is completed, the laser irradiation area of the laser range finder 36 is located next to the storage hole 33.
The XY table 34 is operated to move the pellets stored in the table.

After that, by repeating the above operation, for example, the height distribution of the group of pads 5 is recognized for all the substrates 3 accommodated in one substrate tray 32. At this time, the optimum combination selection device 50 identifies each substrate 3 by each position of the storage hole 33 in the substrate tray 32, and stores the pad height data of each identified substrate 3 in association with each other.

The substrate tray 32 for which the measurement has been completed for the predetermined group of substrates 3 is moved to the rear position of the XY table 34 of the substrate supply stage 31, and stands by for a mounting operation described later. The next substrate tray 32 is supplied to the front side position on the XY table 34, and the pad height distribution recognition device 35 repeatedly performs the pad height distribution recognition work for each substrate 3.

Further, in the substrate tray 32 moved to the rear position on the XY table 34, the reference position of the substrate 3 is recognized by the substrate reference position recognition device 38 for each substrate 3, and the reference position for each substrate 3 is determined. Temporarily stored in memory. That is, the board reference position recognition device 38 images each board 3 with the television camera 39, and recognizes the reference position of the board 3 by the image signal. When the reference position of the board 3 is recognized, the reference position is recognized and stored as the reference position of the board 3.

The optimum combination selecting device 50 is a bump height distribution data group for each pellet 1 transmitted from the bump height distribution recognizing device 15, and each substrate transmitted from the pad height distribution recognizing device 35. The pad height distribution data group for 3 is sequentially stored. And, for example,
When a data group for each of the pellet tray 12 and the substrate tray 32 is accumulated, the bump height distribution data for each pellet 1 and the pad height distribution data for each substrate 3 are sequentially collated, The optimum combination of the pair of pellets 1 and the substrate 3 in which the difference between the height distribution of the bump 2 group and the height distribution of the pad 5 group cancels each other is sequentially selected. And the optimum combination selection device 5
0 sequentially commands the selected combination to the robot controller 44 of the main handling device 41, thereby causing the main handling device 41 to sequentially execute the mounting work for the substrate 3 of the pellet 1 by the optimum combination.

Optimal combination selection device 5 by the above operation
When the controller 44 receives a command from 0, the robot 43 of the main handling device 41 moves the collet 42 onto the pellet supply stage 11 and holds the pellet 1 designated by the optimum combination selection device 50 by vacuum suction to pick it up. . At this time, the controller 44 of the robot 43 recognizes the storage place of the designated pellet 1 in the pellet tray 12 by the pellet recognition device 45.

The pellet 1 picked up by the collet 42 is transferred to the robot 4 of the main handling device 41.
3 is conveyed to the pellet reference position recognition device 22,
It is inserted into the pellet insertion port 26 of the pellet reference position recognition device 22, is imaged by the pellet reference position recognition device 22, and the reference position is recognized and temporarily stored in the memory.

That is, when the pellet 1 is illuminated from the front, the reference position pattern of the pellet 1 formed by metallization such as solder is white, and the rest is black. Since the boundary between the black area and the white area corresponds to the reference position pattern outline of the pellet 1, the reference position of the pellet 1 can be recognized by the boundary.

When the reference position of the pellet 1 is recognized, the relative positional relationship with respect to the reference position of the pellet 1 can be easily and accurately obtained by the image signal processing device or the controller. And the main handling device 4
The controller 44 of the robot 43 of 1 is the pellet 1
Of the substrate 3 of the pellet 1 by collating the reference position of the substrate 3 stored in the substrate tray 32 of the substrate supply stage 31 previously stored to obtain a correction value.
Correct the mounting position for.

The robot 43 while performing this correction operation
Shows the pellets 1 held by the collet 42 and the other substrate 3 designated by the optimum combination selection device 50.
Mount on top of. At this time, since solder cream (not shown) is previously applied to each pad 5 of the substrate 3 by a screen printing method or the like, each bump 2 of the aligned and mounted pellets 1 is attached to the substrate 3
In the state of being aligned with each pad 5 of FIG.

After that, the mounting work by the above operation is repeatedly performed for all the combinations of the pellets 1 and the substrates 3 selected by the optimum combination selection device 50. Then, when the mounting work is completed for all the combinations, the completed substrate trays 32 are supplied from the substrate supply stage 31 to the reflow soldering process and soldered. At this time, the pellet 1 and the substrate 3
Means that the difference between the height distribution of the bump 2 group and the height distribution of the pad 5 group on the substrate 3 cancels each other, so that the connection portions of the bumps 2 and the pads 5 are uniform over the whole. And both will be formed appropriately. Further, there is no variation in the state of the connecting portion between the respective combinations.

By the way, when the bump 2 group of the pellet 1 is projected by the plating process, a height distribution in which the heights are relatively different from each other may occur. In addition, since the wafer cut and ground or polished may have a thickness distribution, a thickness distribution also occurs in the pellet itself, and as a result, the height distribution of the bump 2 group also in these cases. May occur.

On the other hand, since the substrate 3 is formed of a thin plate of ceramic, epoxy resin or the like and is formed by firing processing or resin molding, waviness, warpage or thickness distribution is generated, resulting in a group of pads 5 Distribution may occur at the height of. Further, when the pads 5 of the substrate 3 are formed by plating, a height distribution may occur in which the heights of the pads are relatively different.

In the case where the height distribution is generated in each of the bump 2 group of the pellet 1 and the pad 5 group of the substrate 3 in this way, for example, as shown in FIG. When the pellets 1 having the bumps 2 having a high height and the central bumps 2 having a low height are combined with the warped substrate 3 of the main body 4 having a high peripheral portion and a low central portion, the pellets 1 are mounted as shown in FIG. As shown in (b), there may be a case where the connecting portion 6 is not formed between the central bump 2 and the central pad 5. In addition, the formation state of the connection portion 6 between the bump 2 and the pad 5 in the peripheral portion becomes improper, and the formation state of the connection portion 6 group becomes non-uniform throughout.

However, in the above-described embodiment, the pair of pellets 1 and the substrate 3 are optimally arranged so that the difference between the height distribution of the bump 2 group and the height distribution of the pad 5 group cancels each other. A combination is selected by the optimum combination selection device 50, and the mounting work for the substrate 3 of the pellet 1 is sequentially executed by the combination,
The height distribution error is corrected for all the combinations of the pellet 1 and the substrate 3, and an appropriate mounting state is secured for all the combinations of the pellet 1 and the substrate 3.

That is, for example, as shown in FIG. 6C, the bump 2 in the peripheral portion is high and the bump 2 in the central portion is high.
, Which has a low height distribution, and the main body 4 and the warped substrate 3 whose peripheral portion is low and whose central portion is high are combined and mounted, whereby the high bump 2 and the low pad 5 are mounted. 6 and the height of the low bump 2 is canceled by the height of the high pad 5, so that as shown in FIG.
The connecting portions 6 are properly formed between the peripheral bumps 2 and the peripheral pads 5 and between the central bumps 2 and the central pads 5. That is, according to the present embodiment, when CCB of the pellet 1 and the substrate 3 is performed, the formation state of the connecting portion 6 group is uniformly formed over the whole.

According to the above embodiment, the following effects can be obtained. (1) Before the pellets are mounted on the substrate,
The bump height distribution recognizing device recognizes the bump group height distribution for many pellets, and the pad height distribution recognizing device recognizes the pad group height distribution for many substrates. A relationship in which the difference between the height distribution of the bump group and the height distribution of the pad group is canceled out by sequentially comparing the data group from the bump height distribution recognition device and the data group from the pad height distribution recognition device The optimum combination of pellets and substrate is sequentially selected, and the optimum combination selection device sequentially commands the selected combination to the main handling device to sequentially perform the mounting work on the pellet substrate by the optimum combination. By doing so, it is possible to correct the height distribution error for all combinations of pellets and substrate. With the pump group can be uniformly mounting throughout the pads of the substrate,
It is possible to mount properly without variation among all combinations.

(2) Since all the combinations of pellets and substrates can be properly mounted without variation, the CCB connection state after mounting can be properly formed without variation, and the CCB quality and reliability can be improved. Can be increased.

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the bump height distribution recognizing device and the pad height distribution recognizing device are not limited to those configured by using an optical range finder such as a laser range finder, but a range finder using an air micrometer or an electrostatic capacitance. A non-contact type distance measuring device such as an instrument and a contact type distance measuring device such as a micrometer may be used.

The height distribution recognizing device is not limited to the structure for recognizing the height distribution of the bumps and pads, but may be the structure for recognizing the height distribution of the one main surface of the pellet and the opposing main surface of the substrate. Good.

The bump height distribution recognizing device is not limited to the structure in which the height of the bump group is measured from below in a state where the pellet is floated by the sub-handling device, and after the pellet is mechanically turned inside out, The height of the bump group may be measured from above.

The pellet reference position recognizing device and the substrate reference position recognizing device are not limited to the configuration as in the above embodiment,
It may be constituted by a mechanical positioning device, or
It may be omitted under the condition that the tray, robot, XY table, or the like has high mechanical accuracy.

Specific configurations of the pellet supply stage, the substrate supply stage, the main handling device, etc. are not limited to those in the above-mentioned embodiment, but can be appropriately changed according to the conditions of the mounting work and the bonding work.

In the above description, the invention made by the present inventor is the field of use which is the background of the CCB.
However, the present invention is not limited to this, and the second main surface opposite to the active element surface of the pellet is placed on the substrate such as the tab or the base with silver paste or solder. General pellet bonding technology for bonding with foil, eutectic layer, etc., as well as so-called chip type electrical parts mounting technology on substrates such as modules and printed wiring boards, mounting technology for mounting pellets on the board in general Can be applied.

[0057]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

In a mounting method in which a large number of pairs of articles are mounted so that one main surface faces each other and are sequentially mounted, the height distribution of the mounted main surfaces of both article groups is recognized prior to mounting. Then, by comparing the recognition results of both of them, the optimal combination of a pair of articles in which the difference in height distribution cancels each other out is sequentially selected, and one is sequentially selected to the other in accordance with the selected combination. By mounting, it is possible to correct the height distribution error for all combinations of both articles, so that it is possible to mount one article uniformly on the other and It is possible to mount properly without variation even between combinations.

[Brief description of drawings]

FIG. 1 is a schematic partially cut front view showing a CCB mounting device according to an embodiment of the present invention.

FIG. 2 is a schematic plan view thereof.

FIG. 3 is a block diagram showing its control system.

FIG. 4 is a process diagram showing a CCB mounting method according to an embodiment of the present invention.

FIG. 5A is an exploded perspective view showing a pellet and a substrate, and FIG. 5B is a front sectional view showing a portion after CCB.

6 (a), (b), (c) and (d) are explanatory views for explaining the action.

[Explanation of symbols]

1 ... Pellet (article), 2 ... Bump, 3 ... Substrate (article), 4 ... Main body, 5 ... Pad, 6 ... Connection part, 10 ... CC
B mounting device, 11 ... Pellet supply stage, 12 ... Pellet tray, 13 ... Storage hole, 14 ... XY
Table, 15 ... Bump height distribution recognition device, 16 ... Sub-handling device, 17 ... Collet, 18 ... Measuring station, 19 ... Mirror, 20 ... Laser rangefinder, 21 ...
Measurement data processing device, 22 ... Pellet reference position recognition device, 23 ... Television camera, 24 ... Illumination device, 25 ... Dark box, 26 ... Pellet insertion port, 27 ... Ring illuminator, 28
... illumination light, 31 ... substrate supply stage, 32 ... substrate tray, 33 ... storage hole, 34 ... XY table, 35 ... pad height distribution recognition device, 36 ... laser range finder, 37 ... measurement data processing device, 38 ... Substrate reference position recognition device, 39 ...
TV camera, 40 ... Lighting device, 41 ... Main handling device (mounting execution device), 42 ... Collet, 43 ... Robot, 44 ... Robot controller, 4
5 ... Pellet recognition device, 46 ... Television camera, 47 ... Lighting device, 50 ... Optimal combination selection device.

Claims (4)

[Claims] 1. A mounting method in which a large number of pairs of articles are mounted such that one main surface is opposed to each other and sequentially mounted, and one article group has a height of a main surface to be mounted before the mounting. Relationship between the height distributions of the other articles, the height distributions of the main surface on which the other article group is mounted, and the recognition results of both are collated to cancel the height distribution difference. The optimal combination of a pair of
A mounting method characterized in that mounting is sequentially performed according to the selected combination. 2. One of the articles is a pellet having a plurality of bumps on one main surface, and the other of the articles is a substrate having a plurality of pads on the one main surface, each pellet being the height of a bump group. As each distribution is recognized, the height distribution of the pad group is recognized for each board, and the recognition results of both are collated to cancel the difference between the height distribution of the bump group and the height distribution of the pad group. 2. The mounting method according to claim 1, wherein an optimal combination of a pair of pellets and a substrate having a relationship of being set is sequentially selected. 3. A recognition device for recognizing a height distribution of a main surface mounted on one of the article groups, in a mounting device in which a plurality of pairs of articles are mounted such that one main surface is opposed to each other and the main surfaces are sequentially mounted. A device, a recognition device for recognizing the height distribution of the main surface mounted on the other article group, and a pair of a pair of relationships in which the recognition results of both are compared to cancel the difference in height distribution from each other. A mounting device comprising: an optimum combination selection device for sequentially selecting an optimum combination of articles. 4. One of the articles is a pellet having a plurality of bumps on one main surface, and the other of the articles is a substrate having a plurality of pads on the one main surface. It is configured to recognize the height distribution of each bump group, and the other recognition device is configured to recognize the height distribution of each pad group of each board. By collating the recognition results of both, the optimum combination of a pair of pellets and a substrate is selected in order that the difference between the height distribution of the bump group and the height distribution of the pad group cancels each other out. The mounting device according to claim 3, wherein the mounting device is configured.