JPH09223710A - Bump forming method and bump forming equipment - Google Patents

Bump forming method and bump forming equipment

Info

Publication number
JPH09223710A
JPH09223710A JP2898596A JP2898596A JPH09223710A JP H09223710 A JPH09223710 A JP H09223710A JP 2898596 A JP2898596 A JP 2898596A JP 2898596 A JP2898596 A JP 2898596A JP H09223710 A JPH09223710 A JP H09223710A
Authority
JP
Japan
Prior art keywords
ball
wire
bump
circuit pattern
bump forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2898596A
Other languages
Japanese (ja)
Inventor
Seiji Sakami
省二 酒見
Eisuke Waki
英輔 脇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2898596A priority Critical patent/JPH09223710A/en
Publication of JPH09223710A publication Critical patent/JPH09223710A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To stably form a bump of high quality, by sparking to a tip part of a wire, forming a ball, transferring the ball cut out from the wire on a board, and bonding the ball to a circuit pattern of the board with pressure. SOLUTION: By sparking to a tip part of a wire 31 constituted of a metal thin wire, a ball 31a is formed on the tip part of the wire 31. The ball 31a is cut out from the wire 31, and the cut ball 31a is transferred on a circuit pattern of a board. The transferred ball 31a is bonded to the circuit pattern of the board with pressure, and a bump is formed. For example, the upper end part of the wire 31 is protruded in a short distance from a box 15, and a ball 31a is formed by sparking from a torch electrode 38. The ball 31a is set on a pedestal 15a, a tool 22 is brought into contact with the ball 31a, and the ball 31a is cut out from the wire 31 with cutters 36, 37. The upper part of the ball 31a is sucked with the tool 22, and the ball 31a is transferred to the board side.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、ワイヤの先端部に
形成されるボールを用いたバンプ形成方法及びバンプ形
成装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump forming method and a bump forming apparatus using a ball formed at the tip of a wire.

【０００２】[0002]

【従来の技術】基板の回路パターンにバンプ（突出電
極）を比較的に安価に形成できる工法として、ワイヤバ
ンプ法が知られている。この工法は、金属細線からなる
ワイヤの先端部にスパークを飛ばしてボールを形成し、
このボールを回路パターンに押し付けて接合させ、その
後回路パターンに接合したボールからワイヤを引きちぎ
ってボールのみを回路パターンに残し、残ったボールを
バンプとして使用するというものである。2. Description of the Related Art A wire bump method is known as a method of forming bumps (protruding electrodes) on a circuit pattern of a substrate at a relatively low cost. This method creates a ball by flying a spark at the tip of a wire made of thin metal wire.
This ball is pressed against the circuit pattern to be bonded, and then the wire is torn off from the ball bonded to the circuit pattern, leaving only the ball in the circuit pattern and using the remaining ball as a bump.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、この工
法では、次に述べられるように、バンプのばらつきを生
じたり、バンプ形成自体が不首尾に終わったりすること
があった。However, in this method, as described below, there are cases in which bumps vary and the bump formation itself ends unsuccessfully.

【０００４】図５において、２，３は基板１の表面に形
成された回路パターン、４，５は回路パターン２，３上
にワイヤバンプ法によって形成されたバンプである。In FIG. 5, 2 and 3 are circuit patterns formed on the surface of the substrate 1, and 4 and 5 are bumps formed on the circuit patterns 2 and 3 by the wire bump method.

【０００５】上述したように、ワイヤバンプ法では、ボ
ールを回路パターンに接合した後、ワイヤをボールから
引きちぎるものであるが、ワイヤが引きちぎられる位置
が一定しないことがある。その結果、図５（ａ）に示す
ように、バンプ４の高さＨ１が大きすぎたり、又バンプ
５の高さＨ２が小さすぎたりするなど、バンプの高さに
バラツキを発生しやすかった。As described above, in the wire bump method, after the ball is joined to the circuit pattern, the wire is torn off from the ball, but the position where the wire is torn off may not be constant. As a result, as shown in FIG. 5A, the height H1 of the bump 4 was too large, and the height H2 of the bump 5 was too small.

【０００６】また図５（ｂ）に示すように、基板６の回
路パターン７とボール８の接合力が弱い場合、ワイヤ９
を引きちぎるべく、矢印Ｎ１で示すように上昇させる
と、ボール８が回路パターン７から外れてしまうことが
あった。Further, as shown in FIG. 5B, when the bonding force between the circuit pattern 7 on the substrate 6 and the ball 8 is weak, the wire 9 is used.
When the ball 8 is lifted as shown by the arrow N1 to break off the ball, the ball 8 sometimes comes off the circuit pattern 7.

【０００７】このように従来のワイヤバンプ法では、バ
ンプのばらつきやバンプ形成の失敗を発生しやすいとい
う問題点があった。As described above, the conventional wire bump method has a problem that variations in bumps and failures in bump formation are likely to occur.

【０００８】そこで本発明は、安定して高品質のバンプ
を形成できるバンプ形成方法を提供することを目的とす
る。Therefore, an object of the present invention is to provide a bump forming method capable of stably forming high quality bumps.

【０００９】[0009]

【課題を解決するための手段】本発明のバンプ形成方法
は、金属細線から構成されるワイヤの先端部にスパーク
を飛ばして、ワイヤの先端部にボールを形成するステッ
プと、ワイヤからボールを切断し切断されたボールを基
板の回路パターン上へ移載するステップと、移載された
ボールを基板の回路パターンへ圧着してバンプを形成す
るステップとを含む。According to the bump forming method of the present invention, a step of forming a ball on the tip of a wire by blowing a spark on the tip of the wire made of a fine metal wire, and cutting the ball from the wire. Then, the step of mounting the cut ball on the circuit pattern of the substrate and the step of pressing the transferred ball to the circuit pattern of the substrate to form bumps.

【００１０】[0010]

【発明の実施の形態】請求項１記載のバンプ形成方法
は、金属細線から構成されるワイヤの先端部にスパーク
を飛ばして、ワイヤの先端部にボールを形成するステッ
プと、ワイヤからボールを切断し切断されたボールを基
板の回路パターン上へ移載するステップと、移載された
ボールを基板の回路パターンへ圧着してバンプを形成す
るステップとを含むので、ボールとワイヤはボールが回
路パターンへ圧着される前に、カッタによって切断され
る。これにより、一定の位置で切断を行うことができ、
ボールの高さがばらつかないようにすることができる。
また、ワイヤの切断によって一旦回路パターンに接合さ
れバンプとなったボールが、回路パターンから外れてし
まうようなことはない。A bump forming method according to a first aspect of the present invention comprises a step of forming a ball on the tip of a wire by blowing a spark on the tip of the wire made of a fine metal wire, and cutting the ball from the wire. Since the cut ball is transferred onto the circuit pattern of the substrate and the transferred ball is pressure-bonded to the circuit pattern of the substrate to form bumps, the ball and the wire are the same as the circuit pattern. It is cut by a cutter before it is crimped. This allows you to cut at a certain position,
The height of the ball can be prevented from varying.
In addition, the balls that are once joined to the circuit pattern and become bumps by cutting the wire do not come off from the circuit pattern.

【００１１】次に図面を参照しながら、本発明の実施の
形態について説明する。図１は、本発明の一実施の形態
におけるバンプ形成装置の斜視図である。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a bump forming apparatus according to an embodiment of the present invention.

【００１２】図１において、１０はその表面に複数の回
路パターン１１が形成された基板、１２は回路パターン
１１上に形成されたバンプ、１３は基板１２を位置決め
する位置決めテーブルである。In FIG. 1, 10 is a substrate having a plurality of circuit patterns 11 formed on its surface, 12 is a bump formed on the circuit pattern 11, and 13 is a positioning table for positioning the substrate 12.

【００１３】１４は位置決めテーブル１３に隣接して配
置されたボール形成部であり、１５はそのボックスであ
る。なおボール形成部１４の構成については後に詳述す
る。Reference numeral 14 is a ball forming portion disposed adjacent to the positioning table 13, and reference numeral 15 is its box. The structure of the ball forming portion 14 will be described in detail later.

【００１４】１６はＸモータＭＸ、ＹモータＭＹによっ
てＸＹ方向に移動できる移動テーブル、１７は移動テー
ブル１６上に設けられ略Ｕ字状をなすフレーム、１８は
フレーム１７の上部に揺動自在に軸支されたブロックで
あり、１９はブロック１８を揺動させるモータである。Reference numeral 16 is a moving table which can be moved in the XY directions by the X motor MX and Y motor MY, 17 is a frame which is provided on the moving table 16 and which is substantially U-shaped, and 18 is a shaft swingably mounted on the upper portion of the frame 17. The block is supported, and 19 is a motor for rocking the block 18.

【００１５】そして、ブロック１８にはアーム２０の後
部が装着されており、２１はアーム２０の後端部に装着
された起音波振動子、２２はアーム２０の先端部に保持
されたツールである。ツール２２の内部には縦に貫通す
る吸着管が形成されており、この吸着管には配管２３を
介して吸引装置２４が発生する負圧を作用させ得るよう
になっている。A rear portion of the arm 20 is mounted on the block 18, 21 is an ultrasonic transducer mounted on the rear end portion of the arm 20, and 22 is a tool held on the front end portion of the arm 20. . A suction pipe that penetrates vertically is formed inside the tool 22, and a negative pressure generated by a suction device 24 can be applied to this suction pipe via a pipe 23.

【００１６】図２（ａ）に示すように、ボックス１４の
内部には、上向きにワイヤ３１を繰り出すスプール３０
が収納されている。３２は送りモータ３３に駆動されて
スプール３０から繰り出されたワイヤ３１を上方へ送る
ピンチローラ、３４はピンチローラ３２と共にワイヤ３
１を挟持するガイドローラである。ピンチローラ３２に
より上方へ送られるワイヤ３１の上部は、ワイヤガイド
３５の内部を通過することにより、垂直に案内され、ワ
イヤ３１の上端部はボックス１５の上面から小距離突出
するようになっている。As shown in FIG. 2A, inside the box 14, a spool 30 for paying out a wire 31 upwards.
Is stored. 32 is a pinch roller that is driven by a feed motor 33 to feed the wire 31 fed from the spool 30 upward, and 34 is a wire 3 together with the pinch roller 32.
It is a guide roller that holds 1 in between. The upper portion of the wire 31 fed upward by the pinch roller 32 is vertically guided by passing through the inside of the wire guide 35, and the upper end portion of the wire 31 projects a short distance from the upper surface of the box 15. .

【００１７】またボックス１５の上部には、ボックス１
５から突出するワイヤ３１の先端部に臨むトーチ電極３
８が配置されており、ガイドローラ３４がワイヤ３１に
電気的に導通すると共に、トーチ電極３８とガイドロー
ラ３４との間に、トーチ電極３８からスパークを飛ばす
ため電源部３９が接続されている。On the upper part of the box 15, the box 1
Torch electrode 3 facing the tip of wire 31 protruding from 5.
8 is arranged, the guide roller 34 is electrically connected to the wire 31, and a power supply unit 39 is connected between the torch electrode 38 and the guide roller 34 to blow a spark from the torch electrode 38.

【００１８】したがって、トーチ電極３８からスパーク
を飛ばして、ワイヤ３１の上端部にボール３１ａを形成
できる。そして、図２（ａ）のＡ部を拡大した図２
（ｂ）に示すように、ボックス１５の上部には、形成さ
れたボール３１ａを収納できるように、テーパ状をなす
座１５ａが形成されている。また、座１５ａの直下にお
いて、一対のカッタ３６，３７の刃先がボール３１ａと
ワイヤ３１との境目付近に臨んでおり、カッタ３６，３
７を閉じることによって、ボール３１ａをワイヤ３１か
ら分断できるようになっている。Therefore, the spark can be blown from the torch electrode 38 to form the ball 31a on the upper end portion of the wire 31. 2 is an enlarged view of part A of FIG.
As shown in (b), a tapered seat 15a is formed in the upper part of the box 15 so that the formed ball 31a can be stored therein. Further, immediately below the seat 15a, the cutting edges of the pair of cutters 36, 37 face the vicinity of the boundary between the ball 31a and the wire 31, and the cutters 36, 3
The ball 31 a can be separated from the wire 31 by closing 7.

【００１９】次に、このバンプ形成装置の動作を図３〜
図４を参照しながら説明する。まず上述したように、ワ
イヤ３１の上端部をボックス１５から小距離突出させ、
トーチ電極３８からスパークを飛ばしてボール３１ａを
形成する。Next, the operation of this bump forming apparatus will be described with reference to FIGS.
This will be described with reference to FIG. First, as described above, the upper end of the wire 31 is projected a small distance from the box 15,
The spark is blown from the torch electrode 38 to form the ball 31a.

【００２０】次に図３（ａ）に示すように、ボール３１
ａを座１５ａにセットし、ツール２２をボール３１ａに
接触させる。そして、図３（ｂ）のように、カッタ３
６，３７でボール３１ａとワイヤ３１とを切断する。Next, as shown in FIG. 3A, the ball 31
a is set on the seat 15a, and the tool 22 is brought into contact with the ball 31a. Then, as shown in FIG.
The balls 31a and the wires 31 are cut at 6,37.

【００２１】そして図３（ｃ）に示すように、ツール２
２でボール３１ａの上部を吸着してボール３１ａを基板
１０側へ移載する。なお、図ではこのとき、ボール３１
ａの下部に、ワイヤ３１の一部であった突片３１ｂが存
在しているが、カッタ３６，３７が切断する位置を調整
することにより、突片３１ｂの長さをほとんどゼロにす
ることもできる。Then, as shown in FIG. 3C, the tool 2
At 2, the upper part of the ball 31a is sucked and the ball 31a is transferred to the substrate 10 side. In the figure, at this time, the ball 31
Although the protruding piece 31b, which was a part of the wire 31, is present in the lower part of a, the length of the protruding piece 31b can be made almost zero by adjusting the position where the cutters 36 and 37 cut. it can.

【００２２】ここで、ワイヤ３１とボール３１ａは、引
きちぎられるのではなく、カッタ３６，３７により切断
されるので、ボール３１ａ及び突片３１ｂの高さを容易
に一定にすることができる。Here, since the wire 31 and the ball 31a are not cut off but cut by the cutters 36 and 37, the heights of the ball 31a and the protruding piece 31b can be easily made constant.

【００２３】ボール３１ａの切断が済んだら、図４
（ａ）に示すように、ツール２２を基板１０の回路パタ
ーン１１上へ移動し、図４（ｂ）に示すように、ツール
２２でボール３１ａの下部を回路パターンＮに圧着す
る。そして図４（ｃ）に示すように、ツール２２を上昇
させると、ボール３１ａは回路パターン１１と接合した
バンプ１２となる。ここで、ボール３１ａを回路パター
ン１１に接合させた後、ボール３１ａに上向きの力を作
用させる必要はなく、一旦回路パターン１１に接合した
バンプ１２が回路パターン１１から外れてしまうことは
ない。After cutting the ball 31a, as shown in FIG.
As shown in (a), the tool 22 is moved onto the circuit pattern 11 of the substrate 10, and as shown in FIG. 4 (b), the lower part of the ball 31a is pressed onto the circuit pattern N by the tool 22. Then, as shown in FIG. 4C, when the tool 22 is raised, the balls 31 a become the bumps 12 bonded to the circuit pattern 11. Here, after the ball 31a is bonded to the circuit pattern 11, it is not necessary to apply an upward force to the ball 31a, and the bump 12 once bonded to the circuit pattern 11 does not come off from the circuit pattern 11.

【００２４】なお、図４（ａ）に示すように、ボール３
１ａの下部に突片３１ｂが突出していても、図４（ｂ）
に示した接合時に突片ｂがつぶれてしまうし、バンプ１
２の上部は、ボール３１ａの上部の形状のままとなるか
ら、バンプ１２の高さＨを均一にすることができる。As shown in FIG. 4 (a), the ball 3
Even if the projecting piece 31b is projected to the lower part of 1a, as shown in FIG.
The protrusion b is crushed at the time of joining shown in FIG.
Since the upper portion of 2 has the shape of the upper portion of the ball 31a, the height H of the bump 12 can be made uniform.

【００２５】[0025]

【発明の効果】本発明のバンプ形成方法は、金属細線か
ら構成されるワイヤの先端部にスパークを飛ばして、ワ
イヤの先端部にボールを形成するステップと、ワイヤか
らボールを切断し切断されたボールを基板の回路パター
ン上へ移載するステップと、移載されたボールを基板の
回路パターンへ圧着してバンプを形成するステップとを
含むので、バンプの形成失敗を抑制し、バンプの高さを
均一にして、安定的に高品質のバンプを形成できる。According to the bump forming method of the present invention, a step of forming a ball on the tip of the wire by blowing a spark on the tip of the wire made of a fine metal wire, and cutting the ball from the wire Since it includes a step of transferring the ball onto the circuit pattern of the substrate and a step of forming the bump by pressing the transferred ball onto the circuit pattern of the substrate, bump formation failure is suppressed and the bump height is reduced. Can be made uniform, and high-quality bumps can be stably formed.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施の形態におけるバンプ形成装置
の斜視図FIG. 1 is a perspective view of a bump forming apparatus according to an embodiment of the present invention.

【図２】（ａ）本発明の一実施の形態におけるバンプ形
成装置の部分断面図 （ｂ）本発明の一実施の形態におけるバンプ形成装置の
一部拡大図2A is a partial cross-sectional view of a bump forming apparatus according to an embodiment of the present invention. FIG. 2B is a partially enlarged view of a bump forming apparatus according to an embodiment of the present invention.

【図３】（ａ）本発明の一実施の形態におけるバンプ形
成装置の動作説明図 （ｂ）本発明の一実施の形態におけるバンプ形成装置の
動作説明図 （ｃ）本発明の一実施の形態におけるバンプ形成装置の
動作説明図FIG. 3A is an operation explanatory diagram of the bump forming apparatus according to the embodiment of the present invention. FIG. 3B is an operation explanatory diagram of the bump forming apparatus according to the embodiment of the present invention. Of the operation of the bump forming device

【図４】（ａ）本発明の一実施の形態におけるバンプ形
成装置の動作説明図 （ｂ）本発明の一実施の形態におけるバンプ形成装置の
動作説明図 （ｃ）本発明の一実施の形態におけるバンプ形成装置の
動作説明図FIG. 4A is an operation explanatory view of the bump forming apparatus according to the embodiment of the present invention. FIG. 4B is an operation explanatory view of the bump forming apparatus according to the embodiment of the present invention. Of the operation of the bump forming device

【図５】従来のバンプ形成方法の説明図FIG. 5 is an explanatory diagram of a conventional bump forming method.

【符号の説明】[Explanation of symbols]

３１ ワイヤ ３１ａ ボール 31 wire 31a ball

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】金属細線から構成されるワイヤの先端部に
スパークを飛ばして、ワイヤの先端部にボールを形成す
るステップと、 ワイヤからボールを切断し切断されたボールを基板の回
路パターン上へ移載するステップと、 移載されたボールを基板の回路パターンへ圧着してバン
プを形成するステップとを含むことを特徴とするバンプ
形成方法。1. A step of forming a ball on the tip of the wire by blowing a spark on the tip of the wire composed of a fine metal wire, and cutting the ball from the wire and placing the cut ball on a circuit pattern of a substrate. A bump forming method comprising: a step of transferring and a step of press-bonding the transferred balls to a circuit pattern of a substrate to form bumps. 【請求項２】基板を位置決めする位置決めテーブルと、
ボールを供給するボール形成部と、前記ボール形成部か
らボールをピックアップして前記位置決めテーブルに位
置決めされた基板の回路パターンへボールを圧着してバ
ンプとなすツールとを備え、 前記ボール形成部は、ワイヤを繰り出すスプールと、ワ
イヤの先端部にスパークを飛ばしてボールを形成するト
ーチ電極と、形成されたボールとワイヤとを分断するカ
ッタとを有することを特徴とするバンプ形成装置。2. A positioning table for positioning a substrate,
A ball forming unit that supplies a ball; and a tool that picks up the ball from the ball forming unit and presses the ball onto the circuit pattern of the substrate positioned on the positioning table to form a bump, the ball forming unit, A bump forming apparatus comprising: a spool for feeding out a wire; a torch electrode for forming a ball by flying a spark at the tip of the wire; and a cutter for separating the formed ball and the wire.
JP2898596A 1996-02-16 1996-02-16 Bump forming method and bump forming equipment Pending JPH09223710A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2898596A JPH09223710A (en) 1996-02-16 1996-02-16 Bump forming method and bump forming equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2898596A JPH09223710A (en) 1996-02-16 1996-02-16 Bump forming method and bump forming equipment

Publications (1)

Publication Number Publication Date
JPH09223710A true JPH09223710A (en) 1997-08-26

Family

ID=12263721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2898596A Pending JPH09223710A (en) 1996-02-16 1996-02-16 Bump forming method and bump forming equipment

Country Status (1)

Country Link
JP (1) JPH09223710A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106289535A (en) * 2016-11-04 2017-01-04 中国计量大学 A kind of symmetric distributed array of cavities

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106289535A (en) * 2016-11-04 2017-01-04 中国计量大学 A kind of symmetric distributed array of cavities

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