JPH09204250A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively radiate heat inside a device to an outside while realizing the minituarization of the device by constituting a part of or whole outer wall of the device by means of hollow structure having a route which opens to the outside of the device. SOLUTION: In an electronic device 1, a part of or whole outer wall of the device is constituted by hollow structure having the route which opens to the outside of the device. Or plural projecting objects 3 which are projectingly formed from the external surface of the device are provided. Or the plural projecting objects 4 which are projectingly formed from the base surface of the device so as to have a shape to be a plane and whose projecting tip has an area larger than that of the projecting part are provided. That is, the outer wall of the device base surface is constituted of hollow structure 2 so that the surface area of the device base surface is increased, the plural projecting objects 3 which are projectingly formed from the device side surface are provided so that the surface area of the device side surface is increased and, moreover, the plural projecting objects 4 which are projectingly formed from the base surface of the device so as to have a shape to be a plane and whose projecting tip has an area larger than that of the projecting part are provided so that the surface area of the device base surface is increased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device in which a circuit function that consumes power is mounted in a housing, and in particular, the heat inside the device can be efficiently radiated to the outside while realizing the downsizing of the device. To an electronic device for doing so.

[0002]

2. Description of the Related Art In recent years, in electronic devices, such as notebook computers, which are required to be miniaturized, the capacity of CPU and PC are increased.
Due to the dramatic increase in heat generated in the device due to the spread of cards, the space inside the device is reduced to meet the demand for miniaturization, and sufficient convection and heat dissipation are not performed, This leads to an increase in the temperature inside the entire device or locally.

As a result, semiconductor devices such as CPU and HD
There is a problem that the temperature inside the device exceeds the guaranteed operating temperature range of the unit such as D. In order to solve this problem, conventional electronic devices use heat radiation fins, heat sinks, and heat pipes to move heat internally.
The method of dispersion is adopted, and if this cannot be dealt with, the method of using a fan to radiate heat to the outside has been adopted even for electronic devices that are required to be downsized.

[0004]

However, when the method of radiating heat to the outside by using a fan is used as in the prior art, the rise in the temperature inside the device can be surely suppressed, but the demand for downsizing cannot be met. In addition, there is a problem that the device becomes large.

Also, when dealing with a method of moving / dispersing heat internally by using a heat radiation fin, a heat sink, or a heat pipe without using a fan, the heat radiation to the outside is natural. Therefore, there is a problem that the device must be enlarged in order to prevent the temperature inside the device from rising.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a new electronic device capable of efficiently radiating the heat inside the device to the outside while realizing the downsizing of the device. And

[0007]

FIG. 1 shows the principle configuration of the present invention. In the figure, reference numeral 1 denotes an electronic device equipped with the present invention, which mounts a circuit function that consumes power in a housing.

In the electronic device 1 of the present invention whose principle structure is shown in FIG. 1 (a), a part or all of the outer wall of the device is formed of a hollow structure 2 having a route opening to the outside of the device.
In addition, the electronic device 1 of the present invention whose principle configuration is shown in FIG. 1B includes a plurality of protrusions 3 formed to project from the outer surface of the device.

Further, in the electronic device 1 of the present invention whose principle configuration is shown in FIG. 1C, the electronic device 1 is formed so as to project from the bottom surface of the device.
A plurality of protrusions 4 each having a flat surface whose protruding tip has a larger area than the protruding portion are provided.

In the electronic device 1 of the present invention, the principle configuration of which is shown in FIG. 1 (a), which is constructed in this way, for example, the outer wall of the bottom surface of the device has a hollow structure 2 having a route opening to the outside. As a result, the surface area of the bottom surface of the device is increased, so that the heat inside the device can be efficiently radiated to the outside, and the rise in the temperature inside the device can be reliably suppressed.

In addition, in the electronic device 1 of the present invention whose principle configuration is shown in FIG.
By providing a plurality of protrusions 3 protruding from the side surface of the apparatus, the surface area of the side surface of the apparatus is increased, whereby the heat inside the apparatus can be efficiently dissipated to the outside, and the temperature inside the apparatus rises. Can be surely suppressed.

In addition, in the electronic device 1 of the present invention, the principle structure of which is shown in FIG. 1 (c), which is constructed in this manner, is formed to project from the bottom surface of the device, and the projecting tip has a larger area than the projecting portion. A plurality of protrusions 4 having a flat shape are provided, and the device is mounted by bringing the protruding tip of the protrusion 4 into contact with the mounting surface of the device. As a result, the heat inside the device can be efficiently radiated to the outside, and the rise in the temperature inside the device can be reliably suppressed.

As described above, according to the electronic device 1 of the present invention, by providing the outer surface of the device with the function of the heat radiation fins, the structure for positively radiating heat to the outside without using a fan is adopted. Thus, it becomes possible to reliably suppress the rise in the temperature inside the device while realizing the downsizing of the device.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail according to embodiments. FIG. 2 illustrates a device configuration of a pen input type data processing device 10 to which the present invention is applied.

As shown in this figure, in order to meet the demand for downsizing, the pen-input type data processing device 10 is provided with a screen input section 11 in which a touch panel is mounted on a liquid crystal display screen without a keyboard. The data input is executed by detecting the movement of the pen 12 input to the screen input unit 11.

In the data processing device having the keyboard,
Since there is a metal plate on the bottom of the keyboard and many key tops are arranged on the keyboard, the heat inside the device is radiated to the outside via the keyboard,
The pen input type data processing device 10 does not have such a heat radiation part. Moreover, the fan cannot be used because it is required to be further downsized than the data processing device including the keyboard. From now on, the rise of the temperature in the device has become a big problem.

FIG. 3 shows the pen input type data processing apparatus 1 of the present invention.
0 illustrates an embodiment of the invention applied to 0. The pen input type data processing device 10 of this embodiment is characterized in that the outer wall of the bottom surface of the device is constituted by a hollow structure 20. The hollow structure 20 has, for example, a checkerboard pattern shape and opens to the outside of the device.

The hollow structure 20 increases the surface area of the lower surface of the device, whereby the heat inside the device can be efficiently dissipated to the outside, and the rise in the temperature inside the device can be reliably suppressed. Like

FIG. 4 shows another embodiment of the present invention applied to the pen input type data processing device 10. The pen input type data processing device 10 of this embodiment is characterized in that a projection 30 formed to project from the bottom surface of the device is provided at, for example, a crossing position of a checkerboard pattern. The protrusion 30 is formed of a flat surface having a larger projecting tip than the projecting portion, and the projecting tip comes into contact with the device mounting surface to mount the device.

The protrusion 30 increases the surface area of the bottom surface of the device, so that the heat inside the device can be efficiently radiated to the outside, and the rise in the temperature inside the device can be surely suppressed. become.

The protrusion 30 may be provided on the bottom surface of the device by being integrally formed with the device main body by molding or the like. However, as shown in FIG. Along with manufacturing, the fitting hole 31 may be formed in the bottom surface of the device, and the fitting hole 31 may be fitted into the fitting hole 31 so as to be provided on the bottom surface of the device. Alternatively, as shown in FIG. The device may be manufactured separately from the device main body, and the screw hole 32 may be formed on the bottom face of the device, and the screw hole 32 may be screwed to be provided on the bottom face of the device. When the latter method is adopted, it is preferable that the projection tip of the protrusion 30 has a circular planar shape in order to arrange the protrusions 30 in an orderly manner.

Further, as shown in FIG.
In the case of adopting a method of manufacturing the device separately from the device main body, it is not necessary to make the material of the protrusion 30 the same as that of the device bottom surface. Is preferably a metal. At this time, since the protruding tip surface of the protrusion 30 may be touched by the user, it is preferable to cover it with a heat insulating material such as rubber to prevent burns.

When it is necessary to further enhance the heat dissipation effect of the protrusion 30, the protrusion 30 is not attached to the bottom surface of the device but is attached to a metal plate mounted inside the device.

That is, for example, as shown in FIG. 6, a metal plate 33 for fixing the printed board and the connector to each other is prepared inside the device, and therefore, as shown in FIG. The hole 34 is formed and the through hole 3 is formed.
The projection 30 made of metal is screwed to the metal plate 33 through the screw 4. By adopting this configuration, the heat inside the device can be more efficiently radiated to the outside, and the rise in the temperature inside the device can be reliably suppressed. In addition, 35 shown in FIG.
Is a coating film of the above-mentioned rubber or the like.

While the invention has been disclosed in accordance with the illustrated embodiment,
The present invention is not limited to this. For example, the arrangement position and shape of the protrusion 30 disclosed in the embodiment are merely examples, and in the embodiment, the configuration in which the protrusion 30 is arranged on the bottom surface of the device is disclosed, but other than that. It may be arranged on the device surface, and in the embodiment, the shape of the protrusion 30 is disclosed in which the projecting tip is composed of a plane having a larger area than the projecting portion. It may have a shape.

In the embodiment, the present invention is disclosed according to the application example to the pen input type data processing device 10 having no keyboard, but the present invention is not limited to this, and the data processing having a keyboard is not limited thereto. It can be applied as it is to a device or an electronic device having no CPU function. When the present invention is applied to a data processing device equipped with a keyboard, in addition to being able to reliably suppress an increase in the temperature inside the device, the effect of heat dissipation by the keyboard can be suppressed to a low level, so that the keyboard becomes hot. It also becomes possible to prevent the occurrence of the inconvenient problem that

[0027]

As described above, according to the electronic device of the present invention, by providing the outer surface of the device with the function of the heat radiation fin, a structure for positively radiating heat to the outside without using a fan is provided. By adopting this, it becomes possible to surely suppress the rise in the temperature inside the device while realizing the downsizing of the device.

[Brief description of drawings]

FIG. 1 is a principle configuration diagram of the present invention.

FIG. 2 is an explanatory diagram of an apparatus to which the present invention is applied.

FIG. 3 is an embodiment of the present invention.

FIG. 4 is another embodiment of the present invention.

FIG. 5 is an explanatory diagram of a method of attaching a protrusion.

FIG. 6 is an explanatory diagram of a metal plate included in the device.

FIG. 7 is an explanatory diagram of a method of attaching a protrusion.

[Explanation of symbols]

 1 Electronic Device 2 Hollow Structure 3 Projection 4 Projection

Claims (7)

[Claims] 1. An electronic device having a circuit function that consumes power in a housing, wherein a part or all of an outer wall of the device has a hollow structure having a route opening to the outside of the device. And electronic device. 2. An electronic device in which a circuit function that consumes power is mounted in a housing, the electronic device comprising a plurality of protrusions formed to project from an outer surface of the device,
An electronic device characterized in that the protrusion is configured to radiate heat. 3. An electronic device having a circuit function that consumes power in a housing, wherein a plurality of protrusions are formed so as to project from a bottom surface of the device, and the projecting tip has a plane having a larger area than the projecting portion. An electronic device, characterized in that the electronic device is provided with a single piece, and the projection tip of the projection is brought into contact with a mounting surface of the apparatus to mount the apparatus, and heat is radiated by the projection. 4. An electronic device in which a circuit function that consumes power is mounted in a housing, and a plurality of metal protrusions made of metal are attached to an outer surface of the device to be attached to the device, and the metal protrusions radiate heat. An electronic device characterized by being configured to perform. 5. An electronic device having a circuit function that consumes power in a housing, wherein a metal protrusion having a flat surface portion and a protrusion protruding from the flat surface is attached to the bottom surface of the device. Is mounted on the bottom surface of the device, and the device is mounted by bringing the flat surface portion of the metal protrusion into contact with the mounting surface of the device, and the metal protrusion is configured to radiate heat. And electronic device. 6. The electronic device according to claim 4, wherein the metal protrusion is not attached to the device surface but is attached to a metal plate inside the device through a through hole provided in the device surface. , Characterized electronic device. 7. The electronic device according to claim 4, 5 or 6, wherein a surface of the metal projection, which is easily contacted from the outside, is covered with a heat insulating material. apparatus.