CN115986452B

CN115986452B - Input/output interface bracket and electronic equipment

Info

Publication number: CN115986452B
Application number: CN202310244728.8A
Authority: CN
Inventors: 孟宪春; 杨淑锟; 郭林; 张志雄; 李文昌
Original assignee: Hefei Lianbao Information Technology Co Ltd
Current assignee: Hefei Lianbao Information Technology Co Ltd
Priority date: 2023-03-09
Filing date: 2023-03-09
Publication date: 2023-07-07
Anticipated expiration: 2043-03-09
Also published as: CN115986452A

Abstract

The invention provides an input/output interface bracket and electronic equipment, which comprises a body part, a plurality of protruding parts and a heat dissipation part, wherein the body part is connected with a main board, the protruding parts are arranged in a protruding way relative to the body part, each protruding part comprises a first protruding rib, a second protruding rib and a limiting blocking rib, the first protruding rib and the second protruding rib are arranged oppositely, the limiting blocking rib is connected between the first protruding rib and the second protruding rib to form a containing groove for containing a physical interface, and the heat dissipation part extends out from the limiting blocking rib of at least one protruding part and is used for being connected with a chip which is arranged on the main board and is close to the edge area of the main board. The invention can fix the physical interface and realize the heat dissipation of the chip, compared with the conventional heat dissipation mode of the chip through the rear cover of the electronic equipment, the invention can effectively reduce the hot spot temperature of the rear cover of the electronic equipment.

Description

Input/output interface bracket and electronic equipment

Technical Field

The present invention relates to the field of electronic devices, and in particular, to an input/output interface bracket and an electronic device.

Background

The IC chip (Integrated Circuit Chip) is formed by placing an integrated circuit formed by a large number of microelectronic components on a plastic substrate to form a chip, and the chips are quite large on a notebook computer, and the heat productivity of the chips is generally not high, so that a heat dissipation structure is not specially designed for the conventional product in the design process. However, with the development of the chip manufacturing process and the packaging structure and the improvement of the communication transmission protocol, the performance of the IC chip on the notebook computer is higher and higher, and the surface temperature and the core temperature of the IC chip are also higher and higher, but because the arrangement positions of the IC chip are limited by the functions, the transmission protocol and the wiring limitation during the board layout, the positions of some IC chips are too close to the edge of the motherboard, and are far away from the heat dissipation module of the motherboard, so that the heat cannot be dissipated through the heat dissipation module of the notebook computer.

From the standpoint of cost and operability in the production process, when the heat dissipation module on the motherboard cannot provide effective heat dissipation conditions for the IC chip, the conventional solution is to attach a layer of heat-conducting pad to the surface of the IC chip and connect the heat-conducting pad with the rear cover of the notebook computer, so that the heat of the IC chip is conducted to the rear cover of the notebook computer for heat dissipation, however, the heat dissipation method has the following problems: when the IC chip is used, the local hot spot temperature of the rear cover of the notebook computer is obviously increased, the user experience is poor, especially the temperature of the USB4.0 IC chip can be very high when the IC chip runs at a high speed, if the user places the notebook computer on the leg and uses the USB disk to copy data, the USB4.0 chip works, the surface temperature of the USB4.0 chip is rapidly increased, and when the heat is transferred to the rear cover of the notebook computer through the heat conducting gasket, the user can obviously sense that the local hot spot at the position of the rear cover of the computer corresponding to the leg is obviously increased, and even the risk of scalding the leg of the user can occur.

Disclosure of Invention

In view of the above, according to an aspect of the present invention, an input/output interface bracket is provided to at least partially solve the above-mentioned technical problems.

The input-output interface bracket according to the present invention comprises:

the body part is used for being connected with the main board;

the plurality of protruding parts are arranged in a protruding mode relative to the body part, each protruding part comprises a first protruding rib, a second protruding rib and a limiting blocking rib, the first protruding rib and the second protruding rib are arranged oppositely, and the limiting blocking rib is connected between the first protruding rib and the second protruding rib to form a containing groove for containing a physical interface; and

and the heat dissipation part extends out from the limit stop rib of at least one protruding part and is used for being connected with a chip arranged on the main board and close to the edge area of the main board.

According to another aspect of the present invention, there is also provided an electronic device including a housing, a motherboard, a plurality of physical interfaces, and a chip disposed on the motherboard and near an edge region of the motherboard, the housing having a receiving space, the motherboard being disposed in the receiving space, the plurality of physical interfaces being connected with the motherboard and being fixed by an input-output interface bracket, the input-output interface bracket including:

the main body part is used for being connected with the main board;

the plurality of protruding parts are arranged in a protruding mode relative to the body part, each protruding part comprises a first protruding rib, a second protruding rib and a limiting blocking rib, the first protruding rib and the second protruding rib are arranged oppositely, and the limiting blocking rib is connected between the first protruding rib and the second protruding rib to form a containing groove for containing the physical interface; and

and the heat dissipation part extends out from the limit stop rib of at least one protruding part and is used for being connected with the chip.

Optionally, the surface area of the heat dissipation part is M, M is less than or equal to M and less than or equal to 4M, and M is the surface area of the chip.

Optionally, the housing includes a bottom shell, and a space is provided between the bottom shell and the heat dissipation part, and the space forms an air layer.

Optionally, the heat dissipation part has a first surface and a second surface disposed opposite to each other, the first surface is farther from the bottom case than the second surface, the chip has a top surface remote from the main board, and a heat-conducting pad is disposed between the first surface and the top surface.

Optionally, the thickness of the thermally conductive pad is no greater than the thickness of the heat sink.

Optionally, the body portion is detachably connected to the main board by a fastener.

Optionally, the first protruding rib of one of the protruding portions is located at an edge of the input/output interface support to form an edge protruding rib, and an edge connecting portion extends out of the edge protruding rib and is connected with the shell.

In the invention, the input/output interface bracket is provided with the accommodating groove for accommodating the physical interface and the heat dissipation part connected with the chip, so that the physical interface can be fixed on one hand, and the heat dissipation of the chip can be realized on the other hand.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:

in the drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

Fig. 1 is a block diagram of an input-output interface bracket provided on a motherboard according to an exemplary embodiment of the present invention;

fig. 2 is an enlarged view of a portion a in fig. 1;

FIG. 3 is an exploded view of the corresponding structure shown in FIG. 1;

FIG. 4 is a block diagram of the I/O interface bracket of FIG. 1;

fig. 5 is a schematic diagram of heat dissipation from a chip of an electronic device according to an exemplary embodiment of the invention.

The reference numerals in the figures illustrate:

10. an input/output interface bracket; 11. a body portion; 111. a connection hole; 12. a protruding portion; 121. a first protruding rib; 122. a second protruding rib; 123. limiting stop ribs; 124. a receiving groove; 13. a heat dissipation part; 131. a first surface; 132. a second surface; 14. an edge connection portion; 20. a fastener; 30. a housing; 40. a main board; 401. a corresponding hole; 50. a chip; 51. a top surface; 60. an air layer; 70. a thermally conductive pad.

Detailed Description

In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions according to the embodiments of the present invention will be clearly described in the following with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

The i/o interface bracket 10 of the present invention is mainly used in electronic devices, which may be notebook computers, or other terminal devices having a chip 50 and a physical interface.

As shown in fig. 1 to 4, the input-output interface bracket 10 according to the present invention includes a body portion 11, a plurality of protruding portions 12, and a heat dissipation portion 13.

The body 11 is used for connection with the main board 40, where the main board 40 is provided with the chip 50 near the edge area of the main board 40, the body 11 can be detachably connected with the main board 40 by means of fasteners 20 such as screws, bolts, and specifically, the body 11 is provided with the connection hole 111, the main board 40 is provided with the corresponding hole 401 at a position corresponding to the connection hole 111, and the fasteners 20 pass through the connection hole 111 and the corresponding hole 401 to connect the body 11 with the main board 40.

The plurality of protruding portions 12 are arranged in a protruding manner relative to the body portion 11, each protruding portion 12 comprises a first protruding rib 121, a second protruding rib 122 and a limiting blocking rib 123, the first protruding rib 121 and the second protruding rib 122 are arranged oppositely, and the limiting blocking rib 123 is connected between the first protruding rib 121 and the second protruding rib 122 to form a containing groove 124 for containing a physical interface. Here, the number of the protruding portions 12 is equal to the number of the physical interfaces, and the physical interfaces respectively correspond to one another, and may include any one or more of a USB interface, a serial interface, a parallel interface, a VGA interface, a network cable interface, and the like, one input/output end of the physical interface is connected to the motherboard 40, and the other input/output end of the physical interface is connected to an external device.

The heat dissipation portion 13 extends from the limit rib 123 of the at least one protruding portion 12, and is used for being connected with the chip 50 disposed on the main board 40 and close to the edge area of the main board 40.

The input/output interface bracket 10 has the receiving groove 124 for receiving the physical interface, and the heat dissipation portion 13 connected to the chip 50, so that the physical interface can be fixed on the one hand, and the heat dissipation of the chip 50 can be realized on the other hand.

According to another aspect of the present invention, referring to fig. 1, fig. 4, and fig. 5, the electronic device includes a housing 30, a motherboard 40, a plurality of physical interfaces (not shown in the physical interface diagrams) and a chip 50 disposed on the motherboard 40 and near an edge region of the motherboard 40, where the chip 50 cannot dissipate heat through the heat dissipation module due to a distance from the heat dissipation module of the motherboard 40, the housing 30 has a receiving space, the motherboard 40 is disposed in the receiving space, the plurality of physical interfaces are connected with the motherboard 40 and fixed through the input/output interface bracket 10, during fixing, the fastener 20 passes through the connection hole 111 on the body 11 and the corresponding hole 401 on the motherboard 40 and then can be locked on the housing 30, the plurality of physical interfaces are respectively disposed in the receiving slots 124 of the plurality of protruding portions 12 in a one-to-one correspondence manner, and the heat dissipation portion 13 extends from the limit rib 123 of the at least one protruding portion 12 and is connected with the chip 50, so that the heat dissipation can be performed on the chip 50 through the input/output interface bracket 10. For the electronic device as the notebook computer, even if a user places the notebook computer on the leg and uses the USB flash disk to copy data, the heat generated by the USB4.0 chip can be dissipated through the input/output interface bracket 10, so that the risk that local hot spots at the position of the rear cover of the computer obviously rise to the legs of the user is avoided.

In one embodiment of the present invention, the surface area of the heat dissipation portion 13 is M, M is less than or equal to 4M, and M is the surface area of the chip 50, so that the problem of poor heat dissipation effect due to too small surface area of the heat dissipation portion 13 can be avoided; but also can avoid the problem of waste of material cost caused by overlarge surface area of the heat dissipation part 13.

In one embodiment of the present invention, the case 30 includes a bottom case, which is a housing part for placing the electronic device on a supporting plane to facilitate the use of the electronic device, and the heat dissipation part 13 with a space therebetween, which forms an air layer 60, and the bottom case may be a D-case of a notebook computer. Based on the air layer 60, the heat dissipation part 13 is not contacted with the bottom shell, so that heat of the chip 50 is prevented from being conducted to the bottom shell through the heat dissipation part 13, and heat of the chip 50 can be dissipated through the input/output interface bracket 10.

Further, the heat dissipation portion 13 has a first surface 131 and a second surface 132 disposed opposite to each other, the first surface 131 is farther from the bottom case than the second surface 132, the chip 50 has a top surface 51 far from the motherboard 40, and a heat conductive pad 70 is disposed between the first surface 131 and the top surface 51. In this way, the heat of the chip 50 is conducted to the i/o interface bracket 10 through the heat conducting pad 70 for heat dissipation.

Here, the heat conducting pad 70 may be made of silicone grease, silica gel, phase change material, phase change metal sheet, heat conducting glue, etc., and the thickness of the heat conducting pad 70 is not greater than the thickness of the heat dissipating part 13, so that the heat of the chip 50 is conducted to the whole output interface bracket through a thinner layer of the heat conducting pad 70 to dissipate the heat, and the larger the thickness of the heat conducting pad 70, the larger the thermal resistance is, and the heat transfer amount is inversely proportional to the thermal resistance, and the thinner the heat conducting pad 70, the smaller the thermal resistance is, thereby being more beneficial to heat transfer.

In one embodiment of the present invention, the first protruding rib 121 of one of the protruding portions 12 is located at an edge of the input/output interface bracket 10 to form an edge protruding rib, and the edge protruding rib extends with an edge connection portion 14, and the edge connection portion 14 is connected to the housing 30, so that the input/output interface bracket 10 can be stably fixed to the housing 30. Here, the edge connection portion 14 may be provided with a through hole, and the housing 30 may be provided with a screw hole at a position corresponding to the through hole, and a screw may be connected to the screw hole through the through hole to lock the edge connection portion 14 to the housing 30.

In the description of the present invention, it should be understood that the azimuth or positional relationship indicated by the azimuth word is generally based on the azimuth or positional relationship shown in the drawings, and is merely for convenience of describing the present invention and simplifying the description, and the azimuth word does not indicate or imply that the device or element to be referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present invention; the orientation terms "inner" and "outer" refer to the inner and outer relative to the outline of the components themselves.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one or more components or features' spatial positional relationships to other components or features as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass not only the orientation of the elements in the figures but also different orientations in use or operation. For example, if the element in the figures is turned over entirely, elements "over" or "on" other elements or features would then be included in cases where the element is "under" or "beneath" the other elements or features. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". Moreover, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and all such cases are intended to be encompassed herein.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present invention. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, components, assemblies, and/or combinations thereof.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein.

The present invention has been illustrated by the above-described embodiments, but it should be understood that the above-described embodiments are for purposes of illustration and description only and are not intended to limit the invention to the embodiments described. In addition, it will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that many variations and modifications are possible in light of the teachings of the invention, which variations and modifications are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. An input-output interface bracket, comprising:

a main body (11) for connecting with a main board (40);

the plurality of protruding parts (12) are arranged in a protruding mode relative to the body part (11), each protruding part (12) comprises a first protruding rib (121), a second protruding rib (122) and a limiting blocking rib (123), the first protruding rib (121) and the second protruding rib (122) are arranged in a mode of being opposite to each other, and the limiting blocking rib (123) is connected between the first protruding rib (121) and the second protruding rib (122) to form a containing groove (124) for containing a physical interface; and

and the heat dissipation part (13) extends from the limit stop rib (123) of at least one protruding part (12) and is used for being connected with a chip (50) which is arranged on the main board (40) and is close to the edge area of the main board (40).

2. The input/output interface bracket according to claim 1, wherein the surface area of the heat dissipation portion (13) is M, M is less than or equal to 4M, and M is the surface area of a chip (50) connected with the heat dissipation portion (13).

3. The input-output interface bracket according to claim 1, characterized in that the body portion (11) is detachably connected to the main board (40) by means of a fastener (20).

4. An electronic device, including casing (30), mainboard (40), a plurality of physical interfaces and set up mainboard (40) are last and be close to mainboard (40) marginal area chip (50), casing (30) have accommodation space, mainboard (40) set up in the accommodation space, its characterized in that, a plurality of physical interfaces with mainboard (40) are connected and are fixed through input output interface support, input output interface support includes:

a main body (11) for connecting to the main board (40);

the plurality of protruding parts (12) are arranged in a protruding mode relative to the body part (11), each protruding part (12) comprises a first protruding rib (121), a second protruding rib (122) and a limiting blocking rib (123), the first protruding rib (121) and the second protruding rib (122) are arranged in a relative mode, and the limiting blocking rib (123) is connected between the first protruding rib (121) and the second protruding rib (122) to form a containing groove (124) for containing the physical interface; and

and the heat dissipation part (13) extends from the limit stop rib (123) of at least one protruding part (12) and is used for being connected with the chip (50).

5. The electronic device according to claim 4, wherein the heat dissipation portion (13) has a surface area of m.ltoreq.m.ltoreq.4m, M being a surface area of the chip (50).

6. The electronic device according to claim 4, wherein the housing (30) includes a bottom case having a space between the bottom case and the heat dissipation portion (13), the space forming an air layer (60).

7. The electronic device according to claim 6, wherein the heat sink (13) has a first surface (131) and a second surface (132) arranged opposite to each other, the first surface (131) being further away from the bottom case than the second surface (132), the chip (50) having a top surface (51) remote from the main board (40), a heat conductive pad (70) being provided between the first surface (131) and the top surface (51).

8. The electronic device according to claim 7, characterized in that the thickness of the heat conductive pad (70) is not greater than the thickness of the heat dissipation portion (13).

9. The electronic device according to claim 4, characterized in that the body portion (11) is detachably connected to the main board (40) by means of a fastener (20).

10. The electronic device according to claim 4, wherein the first protruding rib (121) of one of the protruding portions (12) is located at an edge of the input/output interface bracket to form an edge protruding rib, and an edge connecting portion (14) extends from the edge protruding rib, and the edge connecting portion (14) is connected to the housing (30).