CN201182049Y - Single plate and electronic equipment with the same - Google Patents
Single plate and electronic equipment with the same Download PDFInfo
- Publication number
- CN201182049Y CN201182049Y CNU2008201111942U CN200820111194U CN201182049Y CN 201182049 Y CN201182049 Y CN 201182049Y CN U2008201111942 U CNU2008201111942 U CN U2008201111942U CN 200820111194 U CN200820111194 U CN 200820111194U CN 201182049 Y CN201182049 Y CN 201182049Y
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- CN
- China
- Prior art keywords
- radiator
- veneer
- cooling stand
- pcb
- flanging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
A single plate comprises a PCB tray and a PCB plate, wherein, the PCB plate penetrates and is arranged on a supporting stud arranged on the PCB tray; the PCB plate is provided with a chip; a grid-type heat radiation support is connected above the supporting stud which penetrates the PCB plate; the grids of the heat radiation support are provided with a heat radiator; a heat conducting medium is arranged between the heat radiator and the chip. The utility model also discloses electronic equipment provided with the single plate, and the heat radiation support of the single plate can save the installation room of the heat radiator of the sing plate.
Description
Technical field
The utility model relates to a kind of parts of data communication products, especially with a kind of veneer and to have an electronic equipment of this veneer relevant.
Background technology
In data communication, the PCB of high-end product design becomes increasingly complex, and the veneer number of plies increases year by year, and device count increases year by year, veneer cabling very dense.And chip power-consumption, board power consumption are increasing, cause on the veneer radiator volume increasing, more and more heavier; The radiator number is more and more.Heatsink weight is heavy more, and is high more to installation requirement, generally fixes by mechanical screw, and this requires wide-bore on PCB; If number of chips is many, then cause to open a lot of macropores; Opposite, need to install the chip of radiator, all is a lot of acp chip of pin generally, punching to intensive PCB cabling, is a very big puzzlement around chip, or even impossible task.This contradiction is along with the rising of veneer complexity, more and more outstanding.
In a kind of application of prior art, because BGA Package (ball grid array, being called for short BGA) soldered ball of chip has certain height, therefore is welded on PCB when going up when bga chip, and certain clearance (height of soldered ball after promptly melting) is arranged between the PCB of bga chip housing and bottom.Can make a fastener, this fastener utilizes this intersegmental crack, and fastener self is fixed on the bga chip housing, and radiator assists to be installed on the bga chip by fastener then.
Though this mode has avoided beating the mounting screw hole of radiator on PCB; And radiator installs and fixes guaranteed.But the application of this mode has tangible limitation: the weight of radiator can not be too big, otherwise fastener can't guarantee the radiator under the vibration situation stability is installed.The encapsulation of chip must be supported the installation of fastener, and the chip of other packing forms can not use this kind mode that radiator is installed, and therefore, a lot of chips are than inapplicable this mode.These two limitation limit it to a great extent and apply.
In the another kind of prior art is used, as shown in Figure 1, radiator 2 and hold-down screw 25 are one, chip 31 is arranged on pcb board 3 upper surfaces, pallet 5 corresponding design self-clinching standoffs below the pcb board 3 correspondence positions design through hole, pcb board 3, radiator passes pcb board 3, be fixed on the self-clinching standoff on the PCB pallet 5, be added with heat-conducting medium 9 between radiator 2 and the chip 31.The weak point of this scheme is that the position of through hole and quantity must be corresponding one by one with the radiator screw on the pcb board 3; Generally speaking, a radiator needs 4 screw holes, that is to say that PCB upward needs punching in 4 angles of chip near zone.Technical difficulty is big, complex process, cost height.
The utility model content
At problems of the prior art, the quantity that the purpose of this utility model is to provide a kind of screw position, screw hole that can not be subject to radiator by screw hole mode mechanical fixation radiator with the position that guarantees to install stability, screw hole according to the situation decision of PCB cabling is not because of increase increase and the mounting means and the irrelevant veneer of Chip Packaging of veneer radiator quantity.
Another purpose of the present utility model is to provide a kind of electronic equipment with the utility model veneer.
For achieving the above object, veneer of the present utility model, comprise PCB pallet and pcb board, pcb board is located on the supporting studs that is provided with on the PCB pallet, described pcb board is provided with chip, be connected with the cooling stand of frame grid type above the described supporting studs of passing described pcb board, on the sash of described cooling stand radiator be installed, the chip chamber that described radiator is corresponding with it is provided with heat-conducting medium.
Electronic equipment of the present utility model has veneer of the present utility model.
Advantage of the present utility model is, in the veneer of the present utility model, because the application of cooling stand makes that radiator no longer needs to be fixed on the pcb board, but is fixed on the cooling stand; Cooling stand is fixed together by fixed bolt and PCB pallet; And then cooling stand adopts the design of L type flanging, guarantees radiator bottom and chip upper surface substantially on same plane, makes things convenient for the heat-conducting medium between chip upper surface and radiator bottom to arrange.
The beneficial effects of the utility model mainly contain following 4 points:
1, often to go out line density very high for high power consumption chip, need draw from 4 bights of chip especially, adopt traditional machinery that the radiator mode is installed, must on pcb board, 4 corner positions of chip design screw holes, screw hole will have influence on the cabling of all line layers, and will be very big to the highly dense layout influence of pcb board, and pass through the utility model, cleverly radiator is fixed on the radiator mounting bracket, can design through hole around the chip.
2, radiator and chip need very steadily, combination closely, can reduce thermal resistance as far as possible, and the Heat Conduction Material adhesive strength that thermal conductivity is good more usually is very low, need by screw, therefore, the necessary symmetry of the design of radiator hold-down screw generally is good, and preferably want 4, and in the veneer of the present utility model, obviously, " bending edges " of heat radiation mounting bracket is that the screwed hole on the flanging of L type can at will be set.
3, San Re extensibility is good, and Heat Conduction Material can flexible Application, can improve radiating effect by revising cooling stand and heat sink size, and pcb board can not need the correcting design
4, mounting means is not subject to type of package for chips, can be not limited to bga chip.
Description of drawings
Fig. 1 is the radiator scheme of installation of prior art veneer;
Fig. 2 has been installed on the schematic diagram of PCB pallet for pcb board in the veneer of the present utility model;
Fig. 3 has installed the schematic diagram of cooling stand for pcb board in the veneer of the present utility model;
Fig. 4 is the stereogram of cooling stand of the veneer of the utility model embodiment;
Fig. 5 is the vertical view of cooling stand of the veneer of the utility model embodiment;
Fig. 6 is the end view of cooling stand of the veneer of the utility model embodiment;
Fig. 7 is the stereogram of radiator of the veneer of the utility model embodiment;
Fig. 8 is the end view of radiator of the veneer of the utility model embodiment;
Fig. 9 is the assembling schematic diagram of the veneer of the utility model embodiment.
Embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings and the specific embodiments.
As shown in Figure 2, the same with common single plate structure, veneer of the present utility model, pcb board 3 is confined on PCB pallet 5 by several screws.Look the size dimension difference of veneer, the screw hole difference that needs, these are primary conditions that single board design must satisfy.Veneer of the present utility model will utilize this mounting screw hole exactly, makes a large-scale cooling stand, and cooling stand and pcb board 3 shared screw holes are fixed on the PCB pallet 5
At first, situation according to the PCB cabling, at the not intensive area design screw hole of cabling, the supporting studs 4 that the design of PCB pallet correspondence position presses, the cooling stand 1 that is used to install radiator like this can be by being connected in supporting studs 4 and being connected in the pcb board 3 of supporting studs 4 equally and the integral body that PCB pallet 5 is combined into a mechanically stable, and the screw positions according to radiator 2 above the cooling stand 4 have designed the installing hole that is used to install radiator.
Therefore, the veneer of the utility model embodiment, as Fig. 3 and shown in Figure 9, comprise Handle Bar 6, PCB pallet 5 and pcb board 3, pcb board 3 is located on the supporting studs 4 that is provided with on the PCB pallet 5, pcb board 3 is provided with the chip 31 that has installed radiator 2 additional, the top of passing the supporting studs 4 of pcb board 3 is connected with the cooling stand 4 of frame grid type, radiator 2 is installed on the sash of offering on the cooling stand 1, preferably, cooling stand 1 is connected in supporting studs 4 tops, and the chip chamber that radiator 2 is corresponding with it is provided with heat-conducting medium 9.Heat-conducting medium 9 can be heat-conducting glue or heat conductive pad.
As shown in Figure 4 and Figure 5, offer the rectangle sash that adapts with radiator 2 specifications on the cooling stand 1 of the veneer of the utility model embodiment, two relative edges of rectangle go up to being arranged with the cross section and are the flanging 12 of L type, and the horizontal sides of flanging 12 is provided with the screwed hole 120 that is used to install radiator 2.Radiator can be installed on the flanging 12 like this, screw 22 on the radiator 2 can be fixed in the radiator installation screwed hole 120 then, so, radiator is to be fixed on the mounting bracket of radiator, rather than is fixed on the PCB pallet 5 by the installing hole of pcb board 3.Offer the lightening hole 13 that is used to alleviate described cooling stand own wt on the bulkhead of the adjacent sash of cooling stand 1, the quantity of lightening hole 13 and position can be selected under the situation that guarantees cooling stand intensity according to actual feelings.Sash also can be the shape that other and radiator 2 specifications adapt.
As shown in Figure 4 and Figure 5, the veneer of the utility model embodiment, the flanging 12 of cooling stand 1 both can be the elongated structure that extends described rectangular edges, promptly extended to the described rectangular edges other end from rectangular edges one end; L type flanging on described rectangle two relative edges is arranged in parallel, and the bottom surface is concordant, promptly on same horizontal plane.As shown in Figure 6, in its end view, L type flanging 12 laterally takes up space seldom at it, therefore effectively reduced the interference of other devices on itself and the veneer, both be convenient to cooling stand is installed on supporting studs, also be convenient to the radiator cooling stand of packing into, and be convenient to make, simplified manufacture craft.Screwed hole 120 is arranged at elongated structure L type flanging 12 two ends respectively.
As shown in Figure 4 and Figure 5, the veneer of the utility model embodiment, the flanging 121,122 of cooling stand 1 also can be arranged at four bights of described rectangle respectively, is provided with screwed hole 120 on each flanging 121 and the flanging 122.Such L type flanging 121,122, it has also saved the space in the vertical, has also alleviated the weight of L type flanging self simultaneously, does not also influence the installation of radiator 2.
As shown in Figure 7 and Figure 8, radiator 2 comprises the connecting portion 23 that is used for described radiator is connected in described cooling stand that radiator body 20, vertical centre position, four bights of radiator body are provided with, be equipped with radiator mounting screw 22 on the connecting portion 23, the periphery of described radiator mounting screw 22 is arranged with spring 24, by spring 24, can regulate the setting height(from bottom) of radiator 2, make radiator lower limb and chip upper surface gap very little, can look the chip cooling demand, adopt heat-conducting glue or heat conductive pad to be connected.
Veneer of the present utility model, its cooling stand body both can be whole piece be installed on the supporting studs top, also can be a plurality of bursts, actual arrangement according to veneer, be installed on the supporting studs top of zones of different respectively, even can an independently cooling stand be set separately for a radiator.
Veneer of the present utility model can be applied to electronic equipment of the present utility model.
Above-described only is preferable possible embodiments of the present utility model; described embodiment is not in order to limit scope of patent protection of the present utility model; therefore the equivalent structure done of every utilization specification of the present utility model and accompanying drawing content changes, and in like manner all should be included in the protection range of the present utility model.
Claims (10)
1. veneer, comprise PCB pallet and pcb board, pcb board is located on the supporting studs that is provided with on the PCB pallet, described pcb board is provided with chip, it is characterized in that, be connected with the cooling stand of frame grid type above the described supporting studs of passing described pcb board, on the sash of described cooling stand radiator be installed, the chip chamber that described radiator is corresponding with it is provided with heat-conducting medium.
2. veneer as claimed in claim 1 is characterized in that: described sash is a rectangle, and described rectangle two relative edges go up to being arranged with the cross section and are the flanging of L type, and the horizontal sides of described flanging is provided with the screwed hole that is used to install described radiator.
3. veneer as claimed in claim 2 is characterized in that: offer the lightening hole that is used to alleviate described cooling stand own wt on the bulkhead of the adjacent sash of described cooling stand.
4. veneer as claimed in claim 1 is characterized in that: described heat-conducting medium is heat-conducting glue or heat conductive pad.
5. veneer as claimed in claim 2, it is characterized in that: described flanging extends to the other end of described rectangular edges from rectangular edges one end, flanging on described rectangle two relative edges is parallel to each other and is symmetrical arranged, and described screwed hole is arranged at described L type flanging two ends respectively.
6. veneer as claimed in claim 2 is characterized in that: described flanging is arranged at four bights of described rectangle respectively.
7. veneer as claimed in claim 1 is characterized in that: described radiator comprises the connecting portion that is used for described radiator is connected in described cooling stand that radiator body, vertical centre position, four bights of radiator body are provided with.
8. veneer as claimed in claim 7 is characterized in that: be equipped with the radiator mounting screw on the described connecting portion, the periphery of described radiator mounting screw is arranged with spring.
9. veneer as claimed in claim 1 is characterized in that: described cooling stand is whole piece or a plurality of burst.
10. electronic equipment, it is characterized in that: described electronic equipment has the arbitrary described veneer of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201111942U CN201182049Y (en) | 2008-04-23 | 2008-04-23 | Single plate and electronic equipment with the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201111942U CN201182049Y (en) | 2008-04-23 | 2008-04-23 | Single plate and electronic equipment with the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201182049Y true CN201182049Y (en) | 2009-01-14 |
Family
ID=40251538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201111942U Expired - Lifetime CN201182049Y (en) | 2008-04-23 | 2008-04-23 | Single plate and electronic equipment with the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201182049Y (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307450A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Radiating fin |
| CN102625625A (en) * | 2012-04-01 | 2012-08-01 | 北京市万格数码通讯科技有限公司 | Novel fixing device and assembling method for high-power radio frequency power amplifiers |
| CN102638958A (en) * | 2012-04-01 | 2012-08-15 | 北京市万格数码通讯科技有限公司 | Installation device and method of radio frequency power amplifier with radiating and grounding performances |
| CN102023239B (en) * | 2009-09-22 | 2013-01-09 | 上海华虹Nec电子有限公司 | Device for protecting probe in process of carrying probe card |
| CN104105378A (en) * | 2013-04-03 | 2014-10-15 | 华为技术有限公司 | Single board heat-radiating device |
| CN105491810A (en) * | 2014-09-18 | 2016-04-13 | 甘宁 | Chip mounter X-axis movable mechanism |
| CN107666820A (en) * | 2017-09-18 | 2018-02-06 | 通鼎互联信息股份有限公司 | Line card and communication machine box |
| WO2020192577A1 (en) * | 2019-03-28 | 2020-10-01 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof, and display device |
| CN112297474A (en) * | 2020-10-15 | 2021-02-02 | 江西视晶光电有限公司 | Transfer film casting equipment for chip packaging |
| CN112788911A (en) * | 2019-11-08 | 2021-05-11 | 中兴通讯股份有限公司 | Radiator and circuit board heat radiation structure |
| CN115379700A (en) * | 2021-05-20 | 2022-11-22 | 华为技术有限公司 | Single board, electronic device and manufacturing method |
| CN115986452A (en) * | 2023-03-09 | 2023-04-18 | 合肥联宝信息技术有限公司 | Input/output interface support and electronic equipment |
-
2008
- 2008-04-23 CN CNU2008201111942U patent/CN201182049Y/en not_active Expired - Lifetime
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102023239B (en) * | 2009-09-22 | 2013-01-09 | 上海华虹Nec电子有限公司 | Device for protecting probe in process of carrying probe card |
| CN102307450A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Radiating fin |
| CN102625625B (en) * | 2012-04-01 | 2015-03-11 | 北京市万格数码通讯科技有限公司 | Novel fixing device and assembling method for high-power radio frequency power amplifiers |
| CN102625625A (en) * | 2012-04-01 | 2012-08-01 | 北京市万格数码通讯科技有限公司 | Novel fixing device and assembling method for high-power radio frequency power amplifiers |
| CN102638958A (en) * | 2012-04-01 | 2012-08-15 | 北京市万格数码通讯科技有限公司 | Installation device and method of radio frequency power amplifier with radiating and grounding performances |
| CN102638958B (en) * | 2012-04-01 | 2015-03-11 | 北京市万格数码通讯科技有限公司 | Installation device and method of radio frequency power amplifier with radiating and grounding performances |
| CN104105378B (en) * | 2013-04-03 | 2018-01-09 | 华为技术有限公司 | Single plate cooling device |
| CN104105378A (en) * | 2013-04-03 | 2014-10-15 | 华为技术有限公司 | Single board heat-radiating device |
| CN105491810A (en) * | 2014-09-18 | 2016-04-13 | 甘宁 | Chip mounter X-axis movable mechanism |
| CN107666820A (en) * | 2017-09-18 | 2018-02-06 | 通鼎互联信息股份有限公司 | Line card and communication machine box |
| CN107666820B (en) * | 2017-09-18 | 2019-09-10 | 通鼎互联信息股份有限公司 | Line card and communication machine box |
| WO2020192577A1 (en) * | 2019-03-28 | 2020-10-01 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof, and display device |
| US11605797B2 (en) | 2019-03-28 | 2023-03-14 | Boe Technology Group Co., Ltd. | Display panel and method for manufacturing the same, and display device |
| CN112788911A (en) * | 2019-11-08 | 2021-05-11 | 中兴通讯股份有限公司 | Radiator and circuit board heat radiation structure |
| CN112297474A (en) * | 2020-10-15 | 2021-02-02 | 江西视晶光电有限公司 | Transfer film casting equipment for chip packaging |
| CN115379700A (en) * | 2021-05-20 | 2022-11-22 | 华为技术有限公司 | Single board, electronic device and manufacturing method |
| CN115986452A (en) * | 2023-03-09 | 2023-04-18 | 合肥联宝信息技术有限公司 | Input/output interface support and electronic equipment |
| CN115986452B (en) * | 2023-03-09 | 2023-07-07 | 合肥联宝信息技术有限公司 | Input/output interface bracket and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Patentee after: Xinhua three Technology Co., Ltd. Address before: 310053 Hangzhou hi tech Industrial Development Zone, Zhejiang province science and Technology Industrial Park, No. 310 and No. six road, HUAWEI, Hangzhou production base Patentee before: Huasan Communication Technology Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090114 |
|
| CX01 | Expiry of patent term |