JPH09199524A - Mold for semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce defects such as voids and drawbacks by a method wherein a linking path which links a cavity corner part on a gate side with a cavity horizontal plane is provided. SOLUTION: A mold for a semiconductor package comprises an upper mold 11 and a lower mold 12 which are coupled with coupling surfaces. Trenches are formed as a gate 1 and an air vent 2 in the coupling surface of the lower mold 12. In the mold for a semiconductor package, a linking path 8 which links a cavity corner part on the gate 1 side with a cavity horizontal plane is provided in the cavity horizontal plane on the side which faces a semiconductor chip 5, i.e., in the upper mold 11. Even if the air staying in the mold for a semiconductor package is increased, a pressure at the cavity corner part is approximately equal to the pressure at the cavity horizontal plane. With this constitution, a semiconductor package which has few void defects in the gate side corner part can be molded without the precise control of molding conditions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed mold for a semiconductor package.

[0002]

2. Description of the Related Art In a semiconductor package formed by resin encapsulation, if the resin encapsulation conditions are not properly controlled, defective resin filling is likely to occur at the corners, resulting in voids and sink marks. Is causing Therefore, it is necessary to manage the resin sealing conditions with sufficient accuracy and perform molding.

In order to prevent such a defect from occurring, for example, in a semiconductor package mold disclosed in Japanese Patent Laid-Open No. 3-206629, a divided block 20 is provided on the air vent 2 side of the mold as shown in FIG. Have improved. In other words, when the semiconductor package is molded by injecting the sealing resin into such a semiconductor package mold, the air layer 21 tends to remain behind in the injection direction of the sealing resin injected into the upper mold cavity. However, the divided block 20 divides the air vent into two parts, the air layer that is about to remain at the corners is smoothly discharged, and defects such as voids are less likely to occur.

[0004]

However, in the above-mentioned conventional example, there is no effect on the air layer that tends to remain near the corner of the cavity on the gate side, and the generation of voids on the gate side is prevented. It's difficult. In addition, the effect of preventing the occurrence of voids on the air vent 2 side may not always be sufficient.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor package mold capable of easily molding a semiconductor package having few defects such as voids and sink marks. It is in.

[0006]

In order to solve the above-mentioned problems, the invention according to claim 1 is a mold for a semiconductor package in which a gate 1 and an air vent 2 are arranged facing each other on the left and right end surfaces of a cavity 7. It is characterized by forming a communication passage 8 that communicates with the cavity corner portion on the side and the horizontal surface of the cavity.

In such a semiconductor package mold,
Since the cavity corners on the side of the gate 1 where the air accumulates and the pressure tends to increase and the cavity horizontal surface communicate with each other,
Even if air is accumulated, the pressure at the corner of the cavity is almost the same as the horizontal surface of the cavity. That is, since the pressure at the corner portion of the cavity does not increase, resin is easily filled in this portion, and void defects are less likely to occur.

Further, since the cavity horizontal surface where the pressure tends to decrease and the cavity corner portion where the pressure tends to increase communicate with each other, the pressures on both sides are made uniform, and the filling property is particularly improved.

The invention according to claim 2 is characterized in that, in the invention according to claim 1, a communication passage 8 is provided on the side of the cavity horizontal surface facing the semiconductor chip 5.

In such a semiconductor package mold,
The resin filling property at the corner portion of the cavity on the semiconductor chip 5 side on the gate 1 side is improved.

The third aspect of the invention is characterized in that, in the first aspect of the invention, a communication passage 8 is provided on the side of the cavity horizontal surface facing the die pad 9.

In such a semiconductor package mold,
The resin filling property at the corner of the cavity on the die pad 9 side on the gate 1 side is improved.

According to a fourth aspect of the present invention, in the first aspect of the invention, the communication passages 8 are provided on both sides of the upper and lower cavity horizontal planes.
It is characterized in that each is provided.

In such a semiconductor package mold,
The filling property of the resin in the upper and lower cavity corners on the gate 1 side is improved.

According to a fifth aspect of the present invention, the air vent 2 is provided in the semiconductor package mold in which the gate 1 and the air vent 2 are arranged opposite to each other on the left and right end surfaces of the cavity 7.
It is characterized by forming a communication passage 8 connecting the upper and lower corners of the cavity.

In such a semiconductor package mold,
Even if air is likely to accumulate in one of the upper and lower cavity corners on the side of the air vent 2 and the pressure tends to increase, this cavity corner communicates with the other and the pressure drops, and the resin in this cavity corner The filling property of is improved. Therefore, void defects are less likely to occur.

The invention described in claim 6 is the first to fourth aspects of the present invention.
In any one of the inventions described above, it is characterized by forming a communication passage 8 connecting the upper and lower cavity corners on the air vent 2 side.

In such a semiconductor package mold,
The filling property of the resin in the corner portion on the side of the air vent 2 is improved.

[0019]

Embodiments of the present invention will be described below.

A first embodiment will be described below with reference to FIGS. 1 to 5. FIG. 1, FIG. 3 or FIG. 4 is a schematic cross-sectional view illustrating a semiconductor package mold according to this embodiment, and FIG. 2 or FIG. 5 is the same for the semiconductor package of FIG. 1 or FIG. It is an exploded perspective view showing a metal mold.

As shown in these figures, in this semiconductor package mold, a gate 1 and an air vent 2 are arranged opposite to the left and right end faces of a cavity 7, and the cavity 7 is generally a flat rectangular parallelepiped shape. Is formed in. Also, this semiconductor package mold consists of an upper mold 11 and a lower mold.
The lower mold 12 on the joint surface of the molds 11 and 12 is formed with the gate 1 and the air vent 2 as grooves.

In this semiconductor package mold, the communication passage 8 communicating with the corner of the cavity on the gate 1 side and the cavity horizontal surface is provided on the cavity horizontal surface side on which the semiconductor chip 5 faces, that is, the upper mold 11. ing.

As shown in FIG. 2, the upper mold 11 is composed of an upper mold body 11a and a communication passage cover 11b fitted in a recess 11c formed in the upper mold body 11a. And
In the recess 11c of the upper mold body 11a, two through holes 8a that are vertical portions of one communication passage 8 are bored toward the cavity 7, and two through holes that are horizontal portions of the communication passage 8 are formed. Hole
A groove 8b connecting 8a is formed. Further, the communication passages 8 are provided at two locations on both sides of the gate 1 in a plan view.

In such a semiconductor package mold,
Since the cavity corner portion on the side of the gate 1 and the cavity horizontal surface on the side of the semiconductor chip 5 are in communication with each other where air is likely to accumulate and the pressure is high, even if air is accumulated, the pressure in the cavity corner portion is almost the same as the cavity horizontal surface. become. That is, since the pressure at the corner portion of the cavity where the air is easily accumulated does not become high, the resin is easily filled in this portion and void defects are less likely to occur. Moreover, since the cavity horizontal surface where the pressure tends to be low and the cavity corner where the pressure tends to be high communicate with each other, the pressure on both sides is equalized, and the resin is easily filled from the low pressure side to the high pressure side. It is a mold for semiconductor packages that is more resistant to void defects.

It is also preferable to provide such a communication passage 8 on the horizontal surface side of the cavity facing the die pad 9, as shown in FIG. Such a communication passage 8
According to this, the filling property of the resin at the corner portion of the cavity on the die pad 9 side on the gate 1 side is improved, so that the generation of voids at this corner portion can be effectively suppressed.

Further, as shown in FIGS. 4 and 5, it is also preferable to provide communication passages 8 on both sides of the upper and lower cavity horizontal surfaces, respectively. According to the communication passages 8 on both the upper and lower sides, the resin filling property at the corner portions of the upper and lower cavities on the gate 1 side is improved, so that the generation of voids at the corner portions on the both sides is effectively suppressed.

As shown in FIG. 5, the lower mold 12 comprises a cavity frame 12d, a lower mold body 12a and a communication passage cover 12b, and the lower mold body 12a has a communication passage similar to the upper mold body 11a. 8 is formed.

The position where the above-mentioned communication passage 8 is provided is preferably selected in accordance with which part of the semiconductor package to be molded is most likely to have voids. That is, since the position where voids are likely to occur varies depending on the type of molding resin used, the shape of the semiconductor package, the molding conditions, etc., the position where the communication passage 8 is provided is selected to correspond to each case. Of.

A second embodiment will be described below with reference to FIGS. 6 to 7. FIG. 6 is a schematic sectional view showing a semiconductor package mold according to this embodiment, and FIG. 7 is an exploded perspective view showing the semiconductor package mold.

As shown in these figures, in this semiconductor package mold, the gate 1 and the air vent 2 are arranged opposite to the left and right end surfaces of the cavity 7 as in the case of the first embodiment. It is formed by doing so. In particular, the communication passage 8 is formed so as to connect the upper and lower cavity corners on the air vent 2 side.

In this communication passage 8, the shielding piece 13 is inserted into the cavity 7.
A small gap is provided between the inner wall of the cavity 7 and the inner wall of the cavity 7, and a through hole 8a serving as a communication passage 8 is formed in the shielding plate 13 toward the upper and lower cavity corners. Is formed. The slight gap is the upper mold 11 and the lower mold.
It is formed by providing pedestals 11e 1 and 12e 2 on the cavity surface of 12 and disposing a shielding plate 13. Further, as shown in FIG. 7, the communication passages 8 are provided at two locations on both sides of the air vent 2 in a plan view.

Even in such a semiconductor package mold, even if air is likely to be accumulated in one of the upper and lower cavity corners on the side of the air vent 2 and the pressure tends to increase, the cavity corner will be the other. The pressure is reduced by communicating with the air, and the accumulated air is discharged to the outside from the air vent 2. Therefore, the filling of the resin into the corners of the cavity on the side where the pressure is reduced is promoted, and void defects are less likely to occur.

Incidentally, the communication passage 8 shown in the first embodiment.
It is more preferable to use a semiconductor package mold in which the above and the communication passage 8 shown in this embodiment are combined together, because the resin filling property of the corner portion of each communication passage 8 is improved.

[0034]

According to the first aspect of the present invention, a semiconductor package having few void defects at the corners on the gate side can be easily formed without finely controlling the forming conditions. In particular, the low pressure on the horizontal surface of the cavity and the high pressure on the corners of the cavity are made uniform, so that the filling property is improved, and void defects are less likely to occur than in the air vent that simply communicates with the outside.

According to the second aspect of the present invention, it is possible to easily form a semiconductor package having few void defects at the corners of the semiconductor chip on the gate side.

According to the third aspect of the present invention, it is possible to easily form a semiconductor package having few void defects at the corners of the gate side die pad side.

According to the fourth aspect of the invention, it is possible to easily form a semiconductor package having few void defects at both corners on the die pad side on the gate side and the semiconductor chip side.

According to the fifth aspect of the present invention, a semiconductor package having few void defects in the corner portion on the air vent side can be easily molded without finely controlling molding conditions.

According to the sixth aspect of the invention, it is possible to easily form a semiconductor package having few void defects at the corners on the air vent side.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing a semiconductor package mold according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a semiconductor package mold of the same.

FIG. 3 is a schematic sectional view showing a different semiconductor package mold according to the embodiment.

FIG. 4 is a schematic sectional view showing still another semiconductor package mold according to the embodiment.

FIG. 5 is an exploded perspective view showing the above-mentioned semiconductor package mold.

FIG. 6 is a schematic cross-sectional view showing a semiconductor package mold according to a second embodiment of the present invention.

FIG. 7 is an exploded perspective view showing a semiconductor package mold of the same.

FIG. 8 is a sectional view showing a conventional example.

[Explanation of symbols]

 1 Gate 2 Air Vent 5 Semiconductor Chip 7 Cavity 8 Communication Path 9 Die Pad 11 Upper Die 12 Lower Die 13 Shielding Piece 20 Divided Block 21 Air Layer

Claims (6)

[Claims] 1. A semiconductor package mold comprising a gate and an air vent, which are arranged opposite to each other on the left and right end faces of a cavity, wherein a communication passage communicating with a corner of the gate and a horizontal surface of the cavity is formed. A characteristic semiconductor package mold. 2. The mold for a semiconductor package according to claim 1, wherein a communication path is provided on a horizontal surface of the cavity facing the semiconductor chip. 3. The mold for a semiconductor package according to claim 1, wherein a communication path is provided on a cavity horizontal surface side facing the die pad. 4. The mold for a semiconductor package according to claim 1, wherein communication paths are provided on both sides of the upper and lower horizontal surfaces of the cavity. 5. A semiconductor package mold, in which a gate and an air vent are disposed opposite to each other on the left and right end surfaces of a cavity, and a communication path is formed between the upper and lower corners on the air vent side and the air vent. A semiconductor package mold characterized by: 6. The mold for a semiconductor package according to claim 1, wherein a communication path is formed to connect the upper and lower corners on the side of the air vent and the air vent.