JPH09191015A - Heat treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent movement of a workpiece due to an air cushion in mount ing the workpiece on a heat treatment plate and an impact on the workpiece by an operation of a mounting piece. SOLUTION: In a heat treatment device with a heat treatment plate 4 to mount a workpiece 1 in an adjacent state or in a state of contact and a means of mounting the workpiece on the heat treatment plate 4, the heat treatment plate 4 has a large number of thin grooves. Further, a mounting means performs mounting on and drawing from the heat treatment plate by performing vertical movements of the workpiece 1 in a horizontal state besides performing curved acceleration and deceleration of vertical movement speeds at the start-and end-points of the vertical movements. A mounting means has supporting members 2, 5 with supporting pins supporting the workpiece 1 and allowing the vertical movements through a through hole of the heat treatment plate 4 and an S-shaped cam 6 vertically moving these supporting members 2, 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for placing a work piece horizontally and heat-treating the work piece with a heating plate or a cooling plate located below the work piece.

[0002]

2. Description of the Related Art Conventionally, a heat treatment apparatus of this type is disclosed in Japanese Patent Publication No.
As disclosed in Japanese Patent No. 127820 and Japanese Patent Publication No. 3-135011, it is configured such that a workpiece is placed on a heat treatment plate in a close state and heat treatment is performed. The workpiece is placed on the placing mechanism before the treatment and is placed on the heat treatment plate by the operation of the placing mechanism. The placed workpiece is placed on the heat treatment plate.
Contacted or held in close proximity by three or more support points. Then, after the heat treatment for a predetermined time is completed, the work piece is separated from the heat treatment plate by the mounting mechanism and waits for delivery to the next process.

[0003]

However, in the above-mentioned conventional example, if the operating speed of the mounting mechanism before and after the actual heat treatment time is increased in order to improve the processing efficiency, the following problems occur.

(1) When the work piece is on a thin plate, it is moved on the heat treatment plate by an air cushion, and the position becomes unsuitable for taking out after processing.

(2) When the work piece is a thin plate and has a high rigidity, the work piece moves due to an impact at the operation start point and the end point of the mounting mechanism, and the position becomes unsuitable for taking out after processing.

(3) When the processed product requires a high degree of cleanliness in the process of processing, it is assumed that particles are rolled up by the air cushion and generated by impact.

Therefore, the present invention prevents movement of the work piece due to the air cushion when the work piece is placed on the heat treatment plate,
Another object is to reduce the impact on the workpiece due to the operation of the mounting mechanism.

[0008]

In order to achieve this object, a first invention is to place a heat treatment plate on which a workpiece is placed in the state of being close to or in contact with it, and placing the workpiece on the heat treating plate. In the heat treatment apparatus having the means, the heat treatment plate has a large number of fine grooves on its upper surface.

According to this, when the work piece is placed on the heat treatment plate, even if the work piece approaches the heat treatment plate at a high speed, the air between the heat treatment plate and the work piece is guided along the narrow groove. Therefore, the work is prevented from moving due to the air cushion effect.

A second aspect of the present invention is a heat treatment apparatus having a heat treatment plate on which a workpiece is placed in a state of being close to or in contact with the workpiece, and a means for placing the workpiece on the heat treatment plate. The means is for placing and picking up the workpiece on a heat treatment plate by moving it vertically in a horizontal state, and for accelerating and decelerating the vertical movement speed at the start and end points of the vertical movement. Is characterized in that.

According to this, it is possible to prevent the impact on the workpiece at the start and end points of the vertical movement when the workpiece is placed and picked up.

The placing means has a supporting member for supporting the workpiece and having a supporting pin capable of moving up and down through the through hole of the heat treatment plate, and an S-shaped cam for moving the supporting member up and down. Can be configured.

Further, according to the first invention and the second invention, as compared with the conventional example, the mounting operation is quicker, the wasted time other than the heat treatment time is shortened, and the number of processed products per unit time is improved. To do.

[0014]

1 shows a heat treatment apparatus according to an embodiment of the present invention. In the figure, 1 is a work piece, 4 is a hot plate for heat-treating the work piece 1, 2 is a mounting mechanism pin that supports the work piece 1 and moves up and down through a through hole of the hot plate 4, and 3 is A proximity distance determining pin that supports the workpiece 1 placed on the hot plate 4 at a close distance on the hot plate 4, 6 is an S-shaped cam, 5 is a mounting mechanism pin 2, and the S-shaped cam 6 A driven unit that moves up and down, and 7 is a cam operation source that drives the S-shaped cam 6. FIG. 2 is a perspective view of the hot plate 4, and 8 in the figure is a large number of fine grooves machined parallel to the surface of the hot plate 4.

In this structure, the workpiece 1 moves the S-shaped cam 6 by the cam operation source 7 to move the driven portion 5 and thus the mounting mechanism pin 2 up and down to move the hot plate 4
It is held on or picked up from the proximity pin 3 above. When the workpiece 1 moves up and down, the workpiece 1
The mounting mechanism pin 2 for supporting the workpiece comes into contact with the workpiece 1 at a very low speed by the action of the S-shaped cam 6, and after smoothly accelerating and decelerating, stops. Further, when the workpiece 1 approaches the hot plate 4, the workpiece 1 and the hot plate 4 are passed through the narrow groove 8 formed on the hot plate 4.
The air between them flows out.

FIG. 3 shows another example of processing the hot plate 4. In this case, the narrow grooves 8 are provided radially around the heating plate 4.

[0017]

As described above, according to the present invention,
The movement of the work piece due to the air cushion when the work piece is placed on the heat treatment plate is prevented, and the impact on the work piece due to the operation of the placing means is mitigated.

As a result, especially in the heat treatment process of silicon wafers used for semiconductor manufacturing, the preparatory operation time for delivering the wafers, which is outside the processing time, can be shortened as compared with the conventional case, and the processing efficiency is improved. improves. Further, it is possible to reduce the floating of particles due to the rewinding of air. Further, the impact mitigation at the time of placing the wafer also suppresses the generation of particles and improves the characteristics of the processing step.

[Brief description of the drawings]

FIG. 1 is a diagram showing a heat treatment apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a processed state of a hot plate of the apparatus shown in FIG.

FIG. 3 is a diagram showing another example of processing the hot plate of the apparatus of FIG.

[Explanation of symbols]

1: Work piece, 2: Mounting mechanism pin, 3: Proximity distance determining pin, 4: Hot plate, 5: Mounting operation mechanism, 6: S-shaped cam, 7:
Cam operating source, 8: narrow groove.

Claims (3)

[Claims] 1. A heat treatment apparatus comprising: a heat treatment plate on which workpieces are placed in a state of being close to or in contact with each other; and a means for placing the workpiece on the heat treatment plate. A heat treatment apparatus having a narrow groove. 2. A heat treatment apparatus, comprising: a heat treatment plate to be placed in a state where workpieces are in close proximity to or in contact with each other; and a means for placing the workpiece on the heat treatment plate, wherein the placing means places the workpiece in place. It is designed to be placed and picked up on a heat treatment plate by moving it up and down in a horizontal state, and to vertically accelerate and decelerate the vertical motion speed at the start and end points of the vertical motion. Heat treatment equipment. 3. The mounting means includes a support member having a support pin that supports a workpiece and can be moved up and down through a through hole of a heat treatment plate, and an S-shaped cam that moves the support member up and down. The heat treatment apparatus according to claim 2, wherein: