JPH09189737A - Liquid crystal display element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly feed back the state of a deffectively connected IC to the repairing work of the IC by connecting a plurality of short-circuiting electrodes in a semiconductor chip to metallic thin film wiring having connecting sections corresponding to the electrodes with conductive connecting members. SOLUTION: In thin film wiring on a lower substrate 2 connected to a plurality of short-circuiting electrodes 15 in an IC 6, metallic thin film wiring 1 having individual connecting section corresponding to each of the electrodes 15 is formed. The IC 6 is mounted on and connected to the substrate 2 through a conductive connecting member 7. The resistance of a COG connecting section is measured and controlled by measuring the resistance by using a two-terminal method by bringing a resistance measuring probe into contact with the terminating sections of two wires 1 not coated with insulating protective films. Therefore, a deffectively connected IC 6 can be specified before a lighting test and the state of the IC 6 can be fed back quickly to the repairing work of the IC 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display element, in which a semiconductor chip for driving a liquid crystal panel is mounted on a circuit board on one side constituting a liquid crystal panel.

[0002]

2. Description of the Related Art Conventionally, in a liquid crystal display panel, a semiconductor chip for driving a liquid crystal panel (hereinafter referred to as an IC) is formed on a metal thin film wiring of one substrate on which a metal thin film wiring is formed in a pattern.
At least one of the inner electrodes has a structure in which an IC short-circuited inside the IC is directly connected by a plurality of electrodes. (FIGS. 1 and 2) In FIG. 1, transparent electrodes 9 and 10 are formed on the inner surfaces of a lower substrate 2 and an upper substrate 4 made of glass, and a liquid crystal 8 is sealed between the upper and lower substrates 2 and 4. Then, the periphery thereof is sealed with the sealant 3 to form a liquid crystal panel. Metal thin film wiring 11 is formed on the lower substrate 2. Further, in order to protect the metal thin film wiring 11 from the external environment, it is covered with the insulating protective film 12.

FIG. 2 is an explanatory view of the periphery of the IC connecting portion, and IC6
The independent electrodes 5 which are not short-circuited therein are fixedly connected to the metal thin film wirings 13 each having an individual connecting portion via the conductive connecting member 7. Further, the plurality of electrodes 15 short-circuited in the IC are connected via the conductive connecting member 7 to the metal thin film wiring 14 having a collective connection portion corresponding to the plurality of IC short-circuit electrodes 15 in order to secure a connection area. I was connected to.

[0004]

In the conventional example, the mounted I
The evaluation of the COG (chip on glass) connection state of C was not performed immediately after mounting, but the lighting test in the final step of the liquid crystal module assembly was used to determine whether the COG connection state of the IC was good or bad. For this reason, it is not known exactly what kind of electrical connection between each electrode in the IC and the lower substrate, and it takes time to give feedback to the IC repair. There was a problem.

An object of the present invention is to speed up the individual evaluation of the COG connection state of the mounted IC and the feedback to the IC repair.

[0006]

First, as shown in FIG. 3, a lower substrate 2 connected to a plurality of short-circuit electrodes 15 in an IC 6 in order to electrically measure the COG connection state of the IC. In the upper metal thin film wiring, the short-circuit electrode 1 in the IC6
The metal thin film wiring 1 having all individual connection portions is formed corresponding to each of the electrodes 5. Next, the IC 6 is mounted on the lower substrate via the conductive connecting member 7. The resistance measurement can be performed by the two-terminal method by bringing a probe for resistance measurement into contact with the end portions of the two metal thin film wirings 1 not covered with the insulating protective film 12. This makes it possible to perform resistance measurement management of the COG connection part.

By providing metal thin-film wirings having individual facing connecting portions for each short-circuit electrode in the IC,
Since the resistance between the metal thin-film wiring and the connection portion of each short-circuit electrode in the IC can be measured by the two-terminal method, it is possible to identify the IC in a poor connection state before the lighting test.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described with reference to the drawings. A TFT liquid crystal cell using amorphous silicon was produced by a usual method.

FIG. 3 is an explanatory view of the periphery of the IC connecting portion of the liquid crystal display element according to the present invention. First, on the lower substrate 2 (AN-635 manufactured by Asahi Glass Co., Ltd.), metal thin film wirings 1 and 13 (for example, a first layer having a film thickness of 100 n are formed by sputtering and etching).
m, sheet resistance 1 ohm chrome layer on second layer thickness 1
Indium oxide layers having a thickness of 00 nm and a sheet resistance of 20 ohms) and an insulating protective film 12 (film thickness 1300 n)
m silicon nitride) to form a lower circuit board. Next, the conductive connecting member 7 (A Hitachi product)
C-8301X) was set. Then IC6 to C
It was mounted by a bonder device for OG connection. A resistance measuring probe was brought into contact with the end portions of the two metal thin film wirings 1 not covered with the insulating protective film 12, and the resistance value was measured by the two-terminal method to determine whether the COG connection state was good or bad. When the resistance value measured by the 2-terminal method is within the resistance value range in which the resistance value between the short-circuit electrodes in the IC and the connection portion is added to the resistance value of two metal thin film wirings, the COG connection is performed. The condition was judged to be good. Furthermore, it was confirmed that the results of the resistance measurement management according to this example were reflected in the subsequent lighting test.

[0010]

According to the present invention, the COG connection evaluation of an on-board IC, which has not been electrically grasped accurately until now, can be performed immediately after mounting by resistance measurement management of each short-circuit electrode connection part in an individual IC. Therefore, it is possible to speed up the feedback to the IC repair.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a liquid crystal display device according to the related art and the present invention.

FIG. 2 is an explanatory diagram around a mounting IC connection portion of a conventional liquid crystal display element.

FIG. 3 is an explanatory diagram around a mounting IC connection portion of a liquid crystal display element according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Metal thin film wiring, 2 ... Lower substrate, 5 ... Electrode, 6 ... Semiconductor chip, 7 ... Conductive connection member, 12 ... Insulating protective film, 13 ... Metal thin film wiring, 15 ... Short circuit electrode in IC.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naoya Isada, 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Stock, Ltd., Institute of Industrial Science, Hitachi, Ltd. Production Engineering Research Laboratory, Hitachi, Ltd.

Claims (1)

[Claims] 1. A liquid crystal display device having a semiconductor chip for driving a liquid crystal panel mounted on a circuit board on one side constituting a liquid crystal panel, wherein the liquid crystal panel is short-circuited inside the chip by a plurality of electrodes at at least one place. The liquid crystal display characterized in that the semiconductor chip and the liquid crystal panel having all the individual connection parts corresponding to the plurality of electrodes short-circuited in the semiconductor chip and the metal thin film wiring are connected by a conductive connection member. element.