JPH09187816A - Tip for disk cutter and its working method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise productivity by raising precision in brazing of a tip to a substrate to reduce a grinding amount of the tip after brazing by a method wherein an engaging groove to which an edge part of a tip holding hole formed on a teeth stand of the substrate fits is formed on a specific side. SOLUTION: A disk like blank plate 20 consisting of a double layers structure having a diamond sintered body layer 12 is firstly integrally provided on an upper face of a super alloy layer 11. The blank plate 20 is fitted by being inclined at an angle of about 40 deg. to a table 24 of a wire cut electric spark machine 21 with a clamper 25. For the spark machine, the table 24 is moved by control in X axis-Y axis directions with an NC controller. Further, a wire 22 is drawn out at a specific rate from an upper nozzle part 23a toward a lower nozzle part 23b, and the wire is swung by control at a specific angle F to the blank plate 20 with the upper and lower nozzle parts. Then, the blank plate 20 is cut by controlling the table 24 and the wire 22 to form a tip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip made of ultra-hard abrasive grains fixed to the outer peripheral portion of a disk-shaped substrate and a method for processing the chip.

[0002]

2. Description of the Related Art As a conventional technique, ultra-hard abrasive grains are compression-molded in a mold and heated at a high temperature to sinter them, so that the edges of a tooth base of a substrate are fitted to predetermined sides. In some cases, a chip having an engaging groove is formed.

[0003]

In the above-mentioned conventional device, the dimensions of each part including the engaging groove cannot be formed with high precision, and the soldering precision of the chip on the substrate varies, and There is a drawback that the amount of chips to be polished after attachment is increased and the productivity is reduced. Especially, diamond sintered body (PC
In the case of the chip made of D), the above-mentioned drawbacks become remarkable, and the grindstone is consumed more. Further, when the chip is fitted to the edge portion of the tooth base of the substrate and brazed, the thickness of the solder becomes large, and the chip is easily separated from the substrate due to the impact from the work material during cutting. There was a flaw.
It is an object of the present invention to obtain a novel disk cutter tip that solves the above drawbacks and a method for processing the same.

[0004]

Means for Solving the Problems The present invention is configured as follows to achieve the above object. That is, a plate-shaped blank plate is provided by sintering ultra-hard abrasive grains, and the blank plate is cut into parallelogram shapes by a wire-cut electric discharge machine, and a chip formed on a tooth base of a substrate on a predetermined side. It is configured to form an engagement groove into which the edge portion of the holding hole fits. Further, a plate-shaped blank plate is provided by sintering ultra-hard abrasive grains, the blank plate is inclined at a predetermined angle with respect to a horizontal plane, and the blank plate is cut into parallelogram shapes by a wire cut electric discharge machine. At this time, the first side forming the flank side of the chip moves the upper surface contact portion of the wire contacting the upper surface of the blank plate linearly relative to the blank plate in the X-axis direction and contacts the lower surface of the blank plate. The second contact forming part of the inner peripheral surface opposite to the flank of the tip by moving the lower surface contact portion of the wire relative to the blank plate in a crank shape bending inward in the Y axis in the X axis direction and in the middle.
The side moves both the upper contact portion and the lower contact portion of the wire relative to the blank plate in the X-axis direction and in the middle in the Y-axis direction in the form of a crank that bends inward to form both side surfaces of the chip. The third side and the fourth side are configured such that both the upper surface contact portion and the lower surface contact portion of the wire are linearly moved relative to the blank plate in the Y-axis direction. in this case,
The third and fourth sides forming the both side surfaces of the chip have their upper and lower contact portions formed linearly with respect to the blank plate in a state where the lower portion of the wire is inclined inward with respect to the upper portion. It is advisable to make relative movement in the Y-axis direction.

[0005]

Embodiments of the present invention will be described below with reference to the drawings. In the drawings, FIG. 1 is a partial side view of a disk cutter to which a tip according to the present invention is applied, FIG. 2 is an enlarged side view of a main part thereof, FIG. 3 is a sectional view taken along line III-III of FIG. 2, and FIG. FIG. 6 shows an enlarged side view of the formed chip.
FIG. In FIG. 1, reference numeral 1 is a disk cutter, and a chip 1 made of ultra-hard abrasive grains is provided on the outer peripheral portion of a disk-shaped substrate 2.
Zeros are fixed at a predetermined pitch in the circumferential direction.

The substrate 2 is formed of, for example, a 1.2 mm thick alloy tool steel (JIS standard SKS51 in the form of a disc, and a toothed tooth base 3 and scraping teeth 4 in the circumferential direction on the outer peripheral portion thereof. 6 are alternately formed at equal pitches so that the difference L between the scraping teeth 4 and the height of the tooth holder 3 is about 0.6 mm. A pocket-shaped chip holding hole 5 is formed at the end on the substrate rotation side (the right end in FIG. 1), and the chip 10 is fitted into this holding hole 5 and fixed by brazing.

As shown in FIG. 2, the chip holding hole 5 is formed so that the angle (α ') in the inner circumferential direction with respect to the tangent line of the substrate 2 is about 45 degrees. Further, the chip 10 is
A diamond sintered body (PCD) is formed on the upper surface of the cemented carbide layer 11.
As shown in FIGS. 2 to 6, the diamond sintered body layer 12 has a rake face 10 and has a two-layer structure in which the layer 12 is integrally formed.
The blade thickness T is 1.7 mm, the angle β ′ on the cutting edge side is about 50 degrees, the side face centripetal angle ε on both side surfaces 10e and 10f is about 1 degree, and the side clearance angle θ is about 1 degree. It is formed in a rhombus shape as viewed from the side, and the engaging grooves 13 and 14 are formed in the entire rear surface of the outer peripheral surface 10b and the inner peripheral surface 10c on the opposite side.

The width W of each of the engaging grooves 13 and 14 is determined by the substrate 2
1.23 mm, which is slightly larger than the plate thickness of 1.2 mm,
The maximum depth S is about 0.3 mm. Then, the chip 10 is fixed by brazing by fitting the engaging grooves 13 and 14 to the outer peripheral edge portion and the inner peripheral edge portion of the chip holding hole 5.
The rake angle γ of the tip 10 is set to about -5 degrees.
Then, only the tip portion of the tip 10 is polished, and as shown in FIG. 2, the clearance angle α is about 10 degrees and the protrusion amount H of the tip cutting edge 10d is H.
Is about 0.1 mm. Note that each of these angles and the amount of protrusion H are appropriately determined depending on the type of the work piece.

7 and 8 show a method of processing the chip 10. First, as shown in FIG. 7, a disc-shaped blank plate 20 having a two-layer structure integrally having a diamond sintered body (PCD) layer 12 is provided on the upper surface of the cemented carbide layer 11, and the blank plate 20 is clamped. The apparatus 25 is attached to the table 24 of the wire cut electric discharge machine (hereinafter referred to as a processing machine) 21 while inclining it at an angle of about 40 degrees. The processing machine 21
Is controlled by the NC controller to move the table 24 in the X-axis and Y-axis directions, and the wire 22 for electric discharge machining is fed from the upper nozzle portion 23a toward the lower nozzle 23b at a predetermined speed. Upper and lower nozzle portions 23a, 2
By 3b, swing control is performed at a predetermined angle F with respect to the blank plate 20 (vertical axis). Further, at the time of electric discharge machining, a machining liquid (water) is ejected from each nozzle portion 23a, 23b toward the blank plate 20.

Then, the table 24 and the wire 22 are provided.
The blank plate 20 is cut by controlling as shown in FIG. 8 to form the chip 10 described above. Here, as shown in FIG. 7, the portion where the wire 22 contacts the upper surface of the blank plate 20 is the upper surface contact portion 22 a, and the wire 22 is the blank plate 2.
A portion of the zero contacting the lower surface is referred to as a lower surface contact portion 22b. In FIG. 8, the first side 10 forming the outer peripheral surface 10b side of the chip
In b ', the upper surface contact portion 22a has (a), (a),
The blank plate 20 is moved relative to the blank plate 20 so as to linearly move in the X-axis direction toward (e) and (f). on the other hand,
The lower surface contact portion 22b includes (a), (a), (c), (d),
It is moved relative to the blank plate 20 so that it is bent in a crank shape toward (e) and (f) and advances in the X-axis direction. As a result, the outer peripheral surface 10b of the chip 10 having a predetermined angle and the engagement groove 13 on the outer peripheral side are formed.

On the third side 10e 'forming the left side surface 10e of the chip, the lower surface contact portion 22b is connected to the upper surface contact portion 2b.
The upper surface contact portion 22 is tilted inward with respect to 2a.
a is (f), (ki), the lower surface contact portion 22b is (s),
The blank plate 20 is moved relative to the blank plate 20 so as to linearly move in the X-axis direction toward (c). As a result, the chip 10 having the predetermined side face centripetal angle ε and side face clearance angle θ
A left side surface 10e is formed.

Further, on the second side 10c 'forming the inner peripheral surface 10c side opposite to the outer peripheral surface 10b of the chip, both the upper surface contact portion 22a and the lower surface contact portion 22b are (ki),
The blank plate 20 is moved relative to the blank plate 20 so as to bend in a crank shape toward (X), (X), (X), (X), and (X) and to advance in the X-axis direction. Thereby, the inner peripheral surface 10c of the chip 10 having the inner peripheral side engaging groove 14 is formed.

On the third side 10f 'forming the right side surface 10f of the chip, the lower surface contact portion 22b is connected to the upper surface contact portion 2b.
The upper surface contact portion 22 is tilted inward with respect to 2a.
a is (shi), (a), the lower surface contact portion 22b is (so),
The blank plate 20 is moved relative to the blank plate 20 so as to linearly move in the X-axis direction toward (a). As a result, the chip 10 having the predetermined side face centripetal angle ε and side face clearance angle θ
Is formed on the right side face 10f.

[0014]

As is apparent from the above description, according to the present invention, a plate-shaped blank plate obtained by sintering ultra-hard abrasive grains such as a diamond sintered body (PCD) is used to form a tooth base of a substrate. It is possible to highly accurately form the chip having the engaging groove with which the edge fits. Therefore, the accuracy of brazing the chip on the substrate is increased, the amount of polishing the chip after brazing is reduced, and the productivity is increased. Furthermore, when the chip is fitted to the edge of the base plate of the board and brazed, the thickness of the braze becomes thinner and the fixing force increases, and the chip is separated from the board due to the impact from the work material during cutting. It is difficult to do so, and it is possible to obtain a durable rotary cutter.

[Brief description of the drawings]

FIG. 1 is a partial side view of a disc cutter to which a tip according to the present invention is applied.

FIG. 2 is an enlarged side view of a main part of FIG.

FIG. 3 is a sectional view taken along line III-III of FIG. 2;

FIG. 4 is an enlarged side view of a chip formed according to the present invention.

FIG. 5 is a plan view of FIG.

FIG. 6 is a right side view of FIG.

FIG. 7 is a side view of essential parts showing a state where a blank plate is being cut by a wire cut electric discharge machine.

FIG. 8 is an explanatory view showing a wire advancing state of the wire cut electric discharge machine on the blank plate portion.

[Explanation of symbols]

 1 disk cutter 2 substrate 3 tooth base 4 scraping tooth 5 chip holding hole 10 chip 10a rake face 10b outer peripheral surface 10c inner peripheral surface 10d tip cutting edge 10e left side surface 10f right side surface 11 cemented carbide layer 12 diamond sintered body layer 13 , 14 Engagement groove 20 Blank plate 21 Wire cut electric discharge machine 22 Wire 23a, 23b Nozzle part 24 Table 25 Crank device

Claims (3)

[Claims] 1. A plate-shaped blank plate (20) is provided by sintering ultra-hard abrasive grains, and the blank plate (20) is cut into parallelogram shapes by a wire-cut electric discharge machine (21) and at a predetermined time. Of the chip holding hole (5) formed in the tooth base (3) of the substrate (2) is engaged with the engaging groove (13, 1).
4) A disk cutter tip characterized by being formed. 2. A wire-cut electric discharge machine (2) in which a plate-shaped blank plate (20) is provided by sintering ultra-hard abrasive grains, and the blank plate (20) is inclined at a predetermined angle with respect to a horizontal plane.
When the blank plate (20) is cut into parallelograms according to 1), the first side (10b ') forming the flank (10b) side of the chip (10) contacts the upper surface of the blank plate (20). The lower surface contact portion of the wire (22), which moves the upper surface contact portion (22a) of the wire (22) linearly relative to the blank plate (20) in the X-axis direction and contacts the lower surface of the blank plate (20). (22b) is moved relative to the blank plate (20) in the X-axis direction and in the middle of the Y-axis direction in the middle so as to be bent in a crank shape, and the inner periphery of the tip (10) opposite to the flank (10b). The second side (10c ') forming the surface (10c) has both the upper surface contact portion (22a) and the lower surface contact portion (22b) of the wire (22) in the X-axis direction with respect to the blank plate (20). Crank shape that bends inward in the Y-axis on the way Are relatively moved, the chip (10)
Side (10e, 10f) side of the third side (10
e ′) and the fourth side (10f ′) are the wires (22)
A method for processing a tip for a disc cutter, characterized in that both the upper surface contact portion (22a) and the lower surface contact portion (22b) are linearly moved relative to the blank plate (20) in the Y-axis direction. 3. The third side (10e ′) and the fourth side (10f ′) forming both side surfaces of the chip (10) are formed by inclining the lower part of the wire (22) inward with respect to the upper part. 3. The disk cutter according to claim 2, wherein both the upper surface contact portion (22a) and the lower surface contact portion (22b) are linearly moved relative to the blank plate (20) in the Y-axis direction in this state. Method of processing chips.