JPH10291162A - Diamond rotary dresser and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the desired cutting quality and accuracy by increasing a number of effective abrasive grain to the grain size and concentration degree of the used abrasive grain, by dividing the surface of the diamond particles on a connected part in a peripheral direction, of a part or plural parts in an axial direction of an outer peripheral face of a diamond layer, by grooves. SOLUTION: A figure (i) is a schematic drawing for grinding a work 10, for example, by a WA grinder 9 of 300 mm, and dressing the grinder 9, for example, by a diamond rotary dresser 6 of 120 mm. A figure (ii) is a sectional drawing which shows the shape of a shoulder part 5 of the dresser 6, and shows the diamond particles 1 having a groove 2, and the bond part 3 having a groove 4 connected with the groove 2. The groove 2 is cut by the irradiation of a laser beam under a specific condition after truing, for example, 3 μm of radius, of the diamond layer surface by a diamond grinder. The diamond rotary dresser 6 comprising the groove, has low resistance at the dressing, and the dressing can be smoothly performed without the vibration.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond rotary dresser used for dressing a conventional grindstone such as WA or GC or a vitrified bonded CBN grindstone with high precision attached to a grinder or the like. is there.

[0002]

2. Description of the Related Art As a conventional diamond rotary dresser, a diamond rotary dresser disclosed in, for example, Japanese Patent Application Laid-Open No. 59-47162, in which diamond grains are further fixed to the outer periphery, is well known.

[0003] As another example, Japanese Patent Laid-Open Publication No. 1-21111 is disclosed.
No. 5 is known. In such a diamond rotary dresser used for dressing a conventional grindstone such as WA and GC or a vitrified CBN grindstone with high accuracy and a wide working width, the diamond grains are firmly fixed and the diamond Means for improving the accuracy by truing the tip to a flat surface has been used.

[0004]

However, since the flatness of the diamond grains is reduced, the sharpness of the diamond rotary dresser is reduced.
There is a problem that the dressing resistance when dressing a conventional grindstone such as GC or a vitrified CBN grindstone is large, which causes vibrations, and the vibrations adversely affect the shaping accuracy.

The present applicant has solved the above-mentioned problems, and has formed a groove in diamond grains fixed to the diamond rotary dresser as a diamond rotary dresser having a low dressing resistance and capable of performing dressing with high accuracy and high efficiency. Japanese Patent Application 9-29538
No. proposed by.

That is, in this proposal, a groove is formed by a laser beam or the like on the surface of a diamond grain fixed to the diamond layer of a diamond rotary dresser on the same plane as the surface of the bonding material or on the surface of the bonding material so as to divide the grinding surface of the diamond grain. It is characterized by having done.

[0007] The applicant of the present invention has conducted further trial production research on the diamond rotary dresser proposed above.
It has been discovered that it is not always necessary to provide a groove in the diamond grain and divide the protruding end of the diamond grain over the entire surface of the dresser. For example, in dressing of a grindstone having a shoulder portion, a groove is provided only in a portion of the diamond layer where the shoulder portion that is likely to burn is dressed. Alternatively, especially for parts requiring high precision, the truing amount of the diamond layer is large, and the sharpness decreases due to the increase in the flat part area of the diamond grains. Therefore, it is better to provide grooves only in this part. In addition, attention has been paid to the fact that it is most effective in use, and it has been confirmed that this has led to the present application.

[0008]

That is, the feature of the present invention resides in that a diamond grain is formed on a part of an outer peripheral surface of a diamond layer of a diamond rotary dresser which is continuous in a part or a plurality of parts in an axial direction. The groove is provided on the surface of the diamond grain to divide the exposed end of the diamond grain. Other features and their operations will be described in the section of the embodiment.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described in the following Examples.

[0010]

【Example】

(Embodiment 1) FIG. 1 (a) shows a work 10 having an outer diameter of 300 m.
while grinding with a WA grinding stone 9 of m
FIG. 3 is a schematic view showing a case where dressing is performed with a diamond rotary dresser 6 of mm. FIG. 1B is a schematic cross-sectional view showing the shape of the shoulder portion 5 of the dresser 6, where 1 is a diamond grain having a groove 2 and 3 is a bond portion having a groove 4 connected to the groove 2.

(Embodiment 2) FIG. 3 shows an example of a diamond rotary dresser having an outer diameter of 150 mm. In the present diamond rotary dresser 6, the grindstone 9 is a conventional grindstone such as WA or GC having an outer diameter of 355 mm. There are two end surfaces 5 ', 5 "in the portion to be dressed. Therefore, the grooves 2 provided on the surface of the abrasive grains are a plurality of portions on the abrasive surface.

The dressers 6 of the first and second embodiments were manufactured as follows. Using 50/60 (260 to 320 μm) diamond grains 1, the bonding material 3 was formed into a single layer by nickel inversion plating, and this diamond layer was bonded to a steel base.

The groove 2 was formed by truing the surface of the diamond layer with a diamond grindstone at a radius of 3 μm and then irradiating a laser beam under the following conditions. Machine used YAG laser Irradiation direction Tangential direction of diamond layer Output 40W The shape of the groove processed by irradiation is as follows. Groove pitch 0.3 mm screw-shaped groove Groove opening width 0.03-0.08 mm Groove depth 0.03 mm

FIG. 2 is a photomicrograph showing a case where a groove is formed in a base shape by laser beam irradiation. The flat surface of the diamond grain 1 is seen in a pale black color, and regular grooves 2 are formed by irradiation on the surface of the white bonding material 3.

In order to confirm the performance of the above dresser, a conventional grindstone was dressed with the dressers of Examples 1 and 2 under the following conditions. Each arrow in the drawing indicates the rotation direction of the work, the grindstone, and the diamond rotary dresser. Conventional whetstone to be dressed WA80K Dressing condition Peripheral speed ratio 0.3 (down dress) Cutting speed 1.0 mm / min Cutting amount 4 mm

The resistance value at the time of dressing in the embodiment was compared with that of a conventional diamond rotary dresser without groove processing. The dressing resistance of the conventional diamond rotary dresser without grooves is 6.0 N / 10 mm in the normal direction and 0.8 N / 10 m in the tangential direction.
m. On the other hand, as shown in Table 1, the dressing resistance of the diamond rotary dresser of the example was 4.0 N / 10 mm in the normal direction and 0.4 N / 1 in the tangential direction.
It was 0 mm.

[0017]

[Table 1]

As described above, the diamond rotary dresser grooved by the laser of the present invention has a resistance at the time of dressing of at least 30% to 50% as compared with the conventional product.
The dressing was reduced and smooth dressing was possible without generating vibration. The precision of the dressed whetstone was also very good.

(Embodiment 3) FIG. 4 is a schematic view of a part of a cross section showing a shape of an embodiment in which the configuration of a diamond layer is changed.
Is a diamond grain, 2 is a groove, 7 is a base of a diamond rotary dresser, and 3 is a bonding material made of an Ag-Cu-Ti-based brazing material. The grain size of the diamond grains 1 and the shape and material of the grooves 2 in this embodiment are the same as those of the other embodiments. The difference is that the diamond grains 1 are directly fixed to the base 13 with a brazing material.

The fixing is performed by using a paste-like brazing material on the base 1.
3, the diamond grains 1 are hand-set, placed in a furnace, heated to melt the brazing material, and then cooled. Therefore, in Example 1, the exposed surface of the diamond grains is almost the same as the surface of the bond material, but in the present case, the exposed surface protrudes from the surface of the bond material. The protruding tip is flattened by truing, and the flat surface is irradiated with the same laser beam as in the first embodiment to form a groove. In some cases, truing can be omitted.

This brazed diamond rotary dresser has a large projection of diamond grains and an extremely large abrasive grain space as compared with the other embodiments as described above, so that cutting chips can be eliminated during dressing. It has excellent features that it is performed smoothly and has low dressing resistance and no clogging. In addition, the formation of the groove 2 increases the number of blade tips of each diamond grain 1 to a plurality, and increases the number of effective abrasive grains, so that both sharpness and accuracy are improved.

Ag used as a brazing material in Example 3
-Cu-Ti-based activated brazing material is excellent in that it can easily and strongly adhere diamond and a steel base metal as a base material, but since its hardness is as low as about Hv100, grinding and dressing are performed. Occasionally, even if the diamond grains do not wear out, there is a concern that this brazing material will be eroded from the surface one after another due to the contact of the cuttings, eventually dropping the diamond grains and rapidly shortening the life of the diamond rotary dresser. .

Therefore, in order to prevent the brazing material from being eroded from the cutting powder, it is very effective to include hard particles in the brazing material to increase the wear resistance of the brazing material. The hard particles include diamond, CBN, SiC, and Al ₂ O 3 having a particle size equal to or less than half of the diamond particles used for forming the abrasive surface.
_{3. By} including one or more kinds of hard particles such as WC, a great effect can be expected in preventing erosion. The content ratio of these hard particles is 10 to 5 with respect to the brazing material volume.
It is used in a range of 0%, and a range of 30 to 50% is more preferable.

That is, according to the present invention, as in the first and second embodiments, a nickel plating layer is formed by a reverse plating method, and a groove is formed in the nickel plating layer. It can also be carried out by providing a groove in the material that is tied to form a bond material, but the brazed material fixed with the brazing material has the highest accuracy and the lowest dressing resistance. In addition, since only the required portions of the grinding surface are selectively flattened and grooved, the manufacturing time can be shortened. By changing the degree of concentration and the like, it is possible to expect to form a more advanced composite abrasive surface.

As described above, since the present invention has a specific configuration of the abrasive surface, it is necessary that the abrasive layer of the abrasive layer has a single layer of superabrasives. In addition, when the surface of the superabrasive layer is not a flat surface, since the laser beam is applied after forming a flat surface by truing, the particle size of the superabrasive particles is not necessarily uniform. Is also good.

However, if the particle diameters are not substantially uniform, the number of abrasive grains that cannot form grooves on the flat surface increases, and the desired effect cannot be obtained sufficiently. Truing can be easily performed, and there is an effect that a required groove can be formed even if the amount of removal by truing is small or even in some cases without truing. Further, in some cases, a groove can be formed by irradiating a laser beam to a required portion of the diamond layer of the dresser whose sharpness is reduced by use.

[0027]

As described above, in the present invention,
Since relatively large super-abrasive grains are used for a required abrasive surface such as a shoulder portion, the absolute value of the burial depth in the bonding material is deeper than that using fine super-abrasive grains. Therefore, the degree of bonding by the bonding material is strong, and the loss and dropout of superabrasive grains due to grinding are small.

In addition, a groove is provided on the required abrasive surface of the superabrasive layer, and the superabrasive layer is divided into a large number of uniform abrasive grains as if fine abrasive grains were used. Since the number of effective abrasive grains with respect to the particle diameter and concentration of the grains is increased, required sharpness and precision can be exhibited. The grooves can be formed into a regular or irregular shape such as a grid by irradiating a laser beam to the grinding surface. By selecting the number of grooves, intervals, and angles, sharpness and precision can be improved. An even better dresser can be provided. Of course, since the shoulder portion is configured as described above, the end face is not burned, and the resistance value and the occurrence of vibration during dressing are reduced.

[Brief description of the drawings]

FIG. 1A is a schematic side view showing a configuration of a first embodiment, and FIG. 1B is a schematic diagram illustrating a cross section of a diamond layer in a shoulder portion of FIG.

FIG. 2 is a micrograph showing a state in which a groove is formed by irradiating a laser beam to the surface of a diamond layer.

FIG. 3 is a schematic side view illustrating a configuration of a second embodiment.

FIG. 4 is a schematic diagram of a cross section of a diamond layer in a third embodiment in which the configuration of the diamond layer is changed.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Diamond grain 10 Work 2 Diamond grain groove 11 Work end face 3 Bond material 12 Work shaft part 4 Bond material groove 5 Shoulder part 6 Diamond rotary dresser 7 Diamond rotary dresser base 9 Grinding stone

Claims (5)

[Claims] 1. A diamond rotary dresser having a diamond layer formed by bonding diamond particles with a bonding material on the outer periphery, wherein diamond is disposed on a portion of the outer peripheral surface of the diamond layer in the axial direction or on a portion continuous in the circumferential direction of a plurality of portions. A diamond rotary dresser characterized in that the surfaces of the grains are divided by grooves. 2. The diamond rotary dresser according to claim 1, wherein the surface of the diamond layer has any one of the following shapes A, B and C. A. The surface of the diamond particles and the surface of the bonding material form substantially the same plane (having substantially the same height). B. The diamond grain surface protrudes from the bond material surface. C. In A or B, the bonding material surface also has a groove connected to the groove on the diamond grain surface. 3. The diamond rotary dresser according to claim 1, wherein the bonding material is formed of one of the following A, B, and C. A plating. B brazing material. C A brazing material containing hard particles. 4. The diamond rotary dresser according to claim 1, wherein a surface of the diamond layer or a protruding end of the diamond grain is formed flat by truing. 5. The method for producing a diamond rotary dresser according to claim 1, wherein a groove is formed by irradiating a laser beam only to a specified portion on the surface of the diamond layer.