JP3077033B2 - Chip for disk cutter and method of processing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip made of ultra-hard abrasive grains fixed to an outer peripheral portion of a disk-shaped substrate and a method of processing the chip.

[0002]

2. Description of the Related Art As a conventional technique, ultra-hard abrasive grains are compression-molded in a mold, heated at a high temperature and sintered, so that the edge of the base of the substrate is fitted to a predetermined side. In some cases, a chip having an engaging groove is formed.

[0003]

In the above-mentioned conventional device, the dimensions of each part including the engaging groove cannot be formed with high accuracy, and the accuracy of soldering the chip to the substrate varies, and There is a disadvantage that the polishing amount of the chip after the attachment is increased and the productivity is reduced. In particular, diamond sintered bodies (PC
In the case of a chip made by D), the above-mentioned defects become remarkable and the wear of the grinding wheel becomes severe. In addition, when the chip is fitted to the edge of the base of the board and brazed, the thickness of the brazing becomes large, and the chip is easily detached from the board due to the impact from the workpiece during cutting. There were drawbacks.
SUMMARY OF THE INVENTION An object of the present invention is to provide a novel disk cutter tip that solves the above-mentioned disadvantages and a method for processing the same.

[0004]

Means for Solving the Problems The present invention is configured as follows to achieve the above object. That is, super
The diamond sintered body layer (1) is formed on the upper surface of the hard alloy layer (11).
2) providing a plate-shaped blank plate (20) integrally having
The blank plate (20) is replaced with a diamond sintered body layer (12).
Is cut into a parallelogram by a wire-cut electric discharge machine (21) so that it is on the rake face (10a) side, and the inner peripheral face on the outer peripheral face (10b) side and the opposite side.
An engagement groove (13, 14) is formed with the (10c) side.
The mating grooves (13, 14) are formed on the base (3) of the base (2).
Outside the pocket- shaped chip holding hole (5) formed on the rotating side
If possible fitted on the peripheral side of the edge between this and the inner peripheral side of the opposite edge
This is the configuration. Also, a plate-shaped blank plate is provided by sintering ultra-hard abrasive grains, the blank plate is inclined at a predetermined angle with respect to a horizontal plane, and the blank plate is cut into a parallelogram by a wire cut electric discharge machine. At this time, the first side, which forms the flank side of the chip, moves the upper surface contact portion of the wire that contacts the upper surface of the blank plate linearly relative to the blank plate in the X-axis direction, and contacts the lower surface of the blank plate. The lower surface contact portion of the wire to be moved relative to the blank plate in the X-axis direction and in the middle in the form of a crank bent inward in the Y-axis direction on the way, forming a second inner surface opposite to the flank of the chip. The side relatively moves the upper surface contact portion and the lower surface contact portion of the wire relative to the blank plate in a crank shape bent inward in the X-axis direction and in the Y-axis direction on the way,
The third side and the fourth side, which are both side surfaces of the chip, are configured such that both the upper surface contact portion and the lower surface contact portion of the wire are relatively linearly moved in the Y-axis direction with respect to the blank plate. In this case, the third and fourth sides on both sides of the chip
The side may be configured such that both the upper surface contact portion and the lower surface contact portion are linearly moved relative to the blank plate in the Y-axis direction while the lower portion of the wire is inclined inward with respect to the upper portion.

[0005]

Embodiments of the present invention will be described below with reference to the drawings. In the drawings, FIG. 1 is a partial side view of a disk cutter to which a tip according to the present invention is applied, FIG. 2 is an enlarged side view of a main part thereof, FIG. 3 is a sectional view taken along the line III-III of FIG. FIG. 6 is an enlarged side view of the formed chip, and FIG.
FIG. In FIG. 1, reference numeral 1 denotes a disk cutter, and a chip 1 made of super-hard abrasive grains is provided on an outer peripheral portion of a disk-shaped substrate 2.
0 are fixed at a predetermined pitch in the circumferential direction.

The substrate 2 is formed, for example, in a disk shape according to a 1.2 mm-thick alloy tool steel (JIS SKS51), and is provided with a saw-toothed tooth base 3 and a scraping tooth 4 on its outer periphery in the circumferential direction. The height of the scraping teeth 4 is set so that the difference L is about 0.6 mm with respect to the height of the tooth base 3. A pocket-shaped chip holding hole 5 is formed at the end on the substrate rotation side (the right end in FIG. 1), and the chip 10 is fitted into the holding hole 5 and fixed by brazing.

As shown in FIG. 2, the chip holding hole 5 is formed such that the angle (α ′) in the inner circumferential direction with respect to the tangent line of the substrate 2 is about 45 degrees. In addition, the chip 10
Diamond sintered body (PCD) on top of cemented carbide layer 11
The diamond sintered body layer 12 has a rake face 10 as shown in FIGS.
a, the blade thickness T is 1.7 mm, the angle β ′ on the cutting edge side is about 50 degrees, the side center angle ε of the side faces 10 e and 10 f is about 1 degree, and the side clearance angle θ is about The engagement grooves 13 and 14 are formed in the entire area of the rear portion on the outer peripheral surface 10b side and the inner peripheral surface 10c on the opposite side to the outer peripheral surface 10b.

The width W of each of the engagement grooves 13 and 14 is
1.23mm, which is slightly larger than 1.2mm
The maximum depth S is about 0.3 mm. Then, the chip 10 is fixed by fitting the engagement grooves 13 and 14 to the outer peripheral edge and the inner peripheral edge of the chip holding hole 5 by brazing,
The rake angle γ of the tip 10 is set to about −5 degrees.
Next, only the tip of the tip 10 is polished, and as shown in FIG. 2, the clearance angle α is about 10 degrees, and the protrusion amount H of the tip cutting edge 10d.
Is about 0.1 mm. Note that these angles and the protrusion amount H are appropriately determined depending on the type of the workpiece.

FIG. 7 and FIG. 8 show a method of processing the chip 10. First, as shown in FIG. 7, a disc-shaped blank plate 20 having a two-layer structure integrally including a diamond sintered body (PCD) layer 12 is provided on the upper surface of a cemented carbide layer 11, and the blank plate 20 is clamped. The apparatus 25 is attached to a table 24 of a wire-cut electric discharge machine (hereinafter referred to as a machine) 21 at an angle of about 40 degrees. The above processing machine 21
The NC control device controls the movement of the table 24 in the X-axis and Y-axis directions, and feeds out the electric discharge machining wire 22 from the upper nozzle portion 23a toward the lower nozzle 23b at a predetermined speed. Upper and lower nozzle portions 23a, 2
By 3b, swing control is performed at a predetermined angle F with respect to the blank plate 20 (vertical axis). Further, at the time of electric discharge machining, a machining fluid (water) is jetted from each of the nozzle portions 23a and 23b toward the blank plate 20.

The table 24 and the wire 22
Is controlled as shown in FIG. 8 to cut the blank plate 20 to form the chip 10 described above. Here, as shown in FIG. 7, a portion where the wire 22 contacts the upper surface of the blank plate 20 is referred to as an upper surface contact portion 22a, and the wire 22 is
A portion that contacts the lower surface of the “0” is referred to as a lower surface contact portion 22b. In FIG. 8, the first side 10 forming the outer peripheral surface 10b side of the chip
In b ′, the upper surface contact portions 22a are (A), (A),
(E), relative to the blank plate 20 so as to proceed linearly in the X-axis direction toward (f). on the other hand,
The lower surface contact portion 22b includes (a), (b), (c), (d),
(E), relative to the blank plate 20 so as to bend in a crank shape toward (f) and advance in the X-axis direction. As a result, the outer peripheral surface 10b of the chip 10 having a predetermined angle and the engaging groove 13 on the outer peripheral side are formed.

On the third side 10e 'forming the left side surface 10e of the chip, the lower surface contact portion 22b is connected to the upper surface contact portion 2e.
2a, the upper surface contact portion 22
a is (f) and (g), the lower surface contact portion 22b is (s),
It is relatively moved with respect to the blank plate 20 so as to proceed linearly in the X-axis direction toward (S). As a result, the chip 10 having a predetermined lateral center angle ε and a lateral clearance angle θ
Is formed.

On the second side 10c 'on the side of the inner peripheral surface 10c opposite to the outer peripheral surface 10b of the chip, the upper surface contact portion 22a and the lower surface contact portion 22b are both (G).
It is moved relative to the blank plate 20 so that it bends in a crank shape toward (C), (K), (K), (S), and (S) and proceeds in the X-axis direction. As a result, the inner peripheral surface 10c of the chip 10 having the inner peripheral engagement groove 14 is formed.

On the third side 10f 'forming the right side surface 10f of the chip, the lower contact portion 22b is connected to the upper contact portion 2f.
2a, the upper surface contact portion 22
a is (S), (A), the lower surface contact portion 22b is (S),
It is relatively moved with respect to the blank plate 20 so as to proceed linearly in the X-axis direction toward (T). As a result, the chip 10 having a predetermined lateral center angle ε and a lateral clearance angle θ
Is formed on the right side surface 10f.

[0014]

As is apparent from the above description, according to the present invention, a plate-shaped blank plate obtained by sintering ultra-hard abrasive grains such as a diamond sintered compact (PCD) is used to form a tooth block of a substrate. A chip having an engagement groove with which the edge fits can be formed with high precision. For this reason, the accuracy of brazing the chip to the substrate is increased, and the amount of chip polishing after brazing is reduced, thereby increasing the productivity. Furthermore, when the chip is fitted and brazed to the edge of the pedestal of the board, the thickness of the brazing becomes thinner and the bonding force increases, and the chip separates from the board due to the impact from the workpiece during cutting. This makes it possible to obtain a durable rotary cutter.

[Brief description of the drawings]

FIG. 1 is a partial side view of a disk cutter to which a tip according to the present invention is applied.

FIG. 2 is an enlarged side view of a main part of FIG.

FIG. 3 is a sectional view taken along the line III-III of FIG. 2;

FIG. 4 is an enlarged side view of a chip formed according to the present invention.

FIG. 5 is a plan view of FIG. 4;

FIG. 6 is a right side view of FIG.

FIG. 7 is a main part side view showing a state where a blank plate is being cut by a wire cut electric discharge machine.

FIG. 8 is an explanatory view showing a progress state of a wire of a wire cut electric discharge machine in a blank plate portion.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 disk cutter 2 substrate 3 tooth base 4 raking teeth 5 chip holding hole 10 chip 10a rake face 10b outer peripheral face 10c inner peripheral face 10d tip cutting edge 10e left side face 10f right side face 11 cemented carbide layer 12 diamond sintered body layer 13 , 14 engagement groove 20 blank plate 21 wire cut electric discharge machine 22 wire 23a, 23b nozzle part 24 table 25 crank device

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) B28D 1/24 B24D 3/06 B24D 5/06 B24D 5/12 B23H 1/00

Claims (3)

(57) [Claims] A diamond is provided on an upper surface of a cemented carbide layer (11).
A plate-shaped blank plate (20) having a sintered body layer (12) integrally provided, and the blank plate (20) is made of diamond
The sintered body layer (12) should be on the rake face (10a) side.
Then, while being cut into a parallelogram by a wire cut electric discharge machine (21), the outer peripheral surface (10b) side and
Engagement grooves (13, 14) with the opposite inner peripheral surface (10c) side
And the engagement grooves (13, 14) are provided with teeth of the substrate (2).
A pocket-like chip holder formed on the substrate rotation side of the table (3).
Outer peripheral edge of holding hole (5) and inner peripheral edge opposite thereto
A tip for a disk cutter characterized in that it can be fitted to a part . 2. A wire-cut electric discharge machine (2) in which a plate-shaped blank plate (20) is provided by sintering super-hard abrasive grains, and the blank plate (20) is inclined at a predetermined angle with respect to a horizontal plane.
When the blank plate (20) is cut into a parallelogram according to 1), the first side (10b ') forming the flank (10b) side of the chip (10) is in contact with the upper surface of the blank plate (20). The upper surface contact portion (22a) of the wire (22) is moved linearly relative to the blank plate (20) in the X-axis direction, and the lower surface contact portion of the wire (22) is in contact with the lower surface of the blank plate (20). (22b) is moved relative to the blank plate (20) in the X-axis direction and in the middle in a crank shape bent inward in the Y-axis direction, and the inner periphery of the chip (10) on the side opposite to the flank surface (10b). The second side (10c ′) forming the side of the surface (10c) connects the upper surface contact portion (22a) and the lower surface contact portion (22b) of the wire (22) together in the X-axis direction with respect to the blank plate (20). Crank-shaped bent inward in the Y-axis direction on the way Are relatively moved, the chip (10)
(10e, 10f) side of the third side (10
e ′) and the fourth side (10f ′) are the wires (22)
Characterized in that both the upper surface contact portion (22a) and the lower surface contact portion (22b) are moved linearly relative to the blank plate (20) in the Y-axis direction. 3. A third side (10e ′) and a fourth side (10f ′) forming both sides of the chip (10) have the lower part of the wire (22) inclined inward with respect to the upper part. 3. The disk cutter according to claim 2, wherein both the upper surface contact portion and the lower surface contact portion are moved linearly relative to the blank plate in the Y-axis direction in the state. Processing method for chip.