JPH0918179A - Electronic apparatus - Google Patents

Abstract

PURPOSE: To obtain a radiation or cooling structure for a specified electronic component to be replaced or extended in a housing in which the size and weight of the electronic component can be reduced at low cost while preventing intrusion of foreign matter, e.g. dust, from the outside. CONSTITUTION: A rod-like radiation connector 1 made of a material having high thermal conductivity is disposed in a housing. Heat plates 2 are formed at the outer end of heat rod 3 while being exposed from the housing so that an external radiator can be coupled detachably therewith. A replaceable or extension circuit unit 10 is fixed detachably in the housing. A heat rod 4 made of a material having high thermal conductivity is fixed onto an IC chip 6 in the circuit unit 10 such that it can be coupled with the inner end of heat rod 3. When the heat rod 4 is coupled with the heat rod 3, heat can be dissipated from the IC chip 6 to the outside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, and more particularly to a predetermined or replaceable electric component which can be mounted in a casing, and which has a large power consumption as the electric component. The present invention relates to an electronic device whose temperature rises.

[0002]

2. Description of the Related Art Conventionally, in various electronic devices, a heat radiating member (heat sink) is provided in close contact with a heat generating portion such as an electric circuit provided in a housing, or a housing is provided for releasing heated air to the outside. It had vent holes for heat dissipation and had a built-in cooling fan.

[0003]

However, the above conventional example has the following disadvantages.

1. In an electronic device in which a predetermined or replaceable electric component, for example, a circuit unit having a substrate mounted with an IC chip or the like can be removably mounted in the housing, the electric component is not mounted or is mounted. However, if a component that consumes less power and generates less heat is attached, it is not necessary to provide a cooling fan or the like, and providing this from the beginning is an excessive specification, which is disadvantageous in terms of cost.

[0005] 2. In portable electronic devices, there is not enough space to install a fan or the like inside the housing. If you try to install it forcibly, the entire electronic device will be large, and the weight will be heavy, and the portability will be poor.

[0006] 3. Safety measures must be taken into account by forming ventilation holes in the housing for heat dissipation. That is,
There is a risk of foreign matter such as dust entering from the ventilation hole and causing a short circuit.

Therefore, an object of the present invention is, in an electronic device of this type, to radiate or cool a predetermined or replaceable electric component that is mounted in a housing, so that there is no waste in terms of cost and the electronic device It is an object of the present invention to provide a structure that can be reduced in size and weight and can prevent foreign matter such as dust from entering from the outside.

[0008]

In order to solve the above problems, according to the present invention, as a first configuration of an electronic device, the electronic device is made of a substance having a high thermal conductivity and is provided in a housing of the electronic device. The heat radiating connector has a heat radiating portion whose outer end is exposed from the housing and radiates heat to the outside air, and which has a heat radiating connector configured as a connecting portion to which an external heat radiating means can be detachably coupled. A predetermined electric component for replacement or expansion, which is provided with a heat dissipation member made of a material having a high thermal conductivity and is connectable to the inner end of the device, can be installed in the housing.

As a second structure, two hollow cooling pipes made of a material having a high thermal conductivity are provided in the housing of the electronic device, and the outer ends of the two cooling pipes are provided. Is exposed from the housing, and an external cooling liquid circulator can be detachably connected to each of the outer ends, and heat conduction that can be connected to each inner end of the cooling pipe. A configuration was adopted in which a predetermined electric component for substitution or expansion, which is provided with a cooling member configured by bending a single hollow pipe made of a highly efficient substance, can be mounted in the housing. .

[0010]

According to the above-described first structure, the heat generated by the driving of the electric component is mounted in a state where the electric component is mounted in the housing of the electronic device and the heat radiating member of the electronic device is connected to the heat radiating connector. Can be transmitted to the heat dissipation connector via the heat dissipation member and dissipated to the outside air, thereby preventing overheating of the electric parts and temperature rise in the housing. Further, by connecting an external heat radiating means to the heat radiating connector, heat can be radiated more efficiently.

According to the second structure, the electric parts are mounted in the housing of the electronic device, and the pipes of the cooling member of the electronic device are connected to the respective inner ends of the cooling pipes for cooling. When the liquid circulator is connected to each of the outer ends of the pipes, the liquid circulator drives the cooling liquid to circulate from the liquid circulator through the cooling pipe to the pipe of the cooling member. It is possible to cool an electric component that generates heat, prevent the electric component from overheating, and prevent the temperature inside the housing from rising.

Further, in any of the configurations, a detecting means for detecting whether or not the heat radiating means is connected to the heat radiating connector, or whether or not the cooling liquid circulator is connected to the cooling pipe, and its detecting means. If it has a control means for controlling the power consumption of the electric component according to the detection result,
When the heat dissipation means or the liquid circulator is not connected, the power consumption of the electric parts can be limited, and the electric parts can be prevented from overheating and the temperature inside the housing can be prevented from rising.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

[First Embodiment] FIGS. 1 to 6 show a first embodiment of the present invention.
First Embodiment FIGS. 1A and 1B show the appearance of a notebook personal computer as an electronic device according to the first embodiment.

1A and 1B, a casing 103 of a display unit provided with a liquid crystal display 102 is rotatable (openable / closable) on a casing 100 of a personal computer main body provided with a keyboard 101. It is provided in. Then, as shown in (B), a hole 100 is provided on one side of the housing 100 of the personal computer body.
a is formed, and the outer end of the heat dissipation connector 1 according to the present invention is exposed in the hole 100a.

FIGS. 2A and 2B show the outer end of the heat dissipation connector 1. The heat dissipation connector comprises a heat dissipation rod 3 made of a material having a high thermal conductivity such as copper or aluminum, and a plurality of heat dissipation plates 2 continuously formed at the outer end of the heat dissipation rod 3. The plurality of heat radiating plates 2 extend radially from the outer circumference of the heat radiating rod 3 and are arranged side by side in a circle. The heat radiating plates 2 can radiate heat to the outside air, and serve as a connecting portion that detachably connects the radiator of FIG. 4 described later. It is configured.

At the center of the circular arrangement of the plurality of heat radiating plates 2, as shown in FIG. 2 (C), the tips of the pins 16 bent in a crank shape are arranged. This pin is for electrically detecting whether or not the radiator of FIG. 4 is connected to the radiator plate 2 portion of the radiator connector 1, and is connected to the CPU of FIG. 6 described later.

The heat radiating rod 3 of the heat radiating connector 1 has a leg portion 3a as shown in FIG. 3 (B) and is fixed on a main board 15 provided in the housing 100 of the personal computer body.

Further, as shown in FIGS. 3 (A) to 3 (C),
A circuit unit generally designated by 10 is detachably mounted on the main board 15. The circuit unit 10 is a unitized structure in which a predetermined electric circuit can be mounted in a replaceable manner. The circuit unit 10 has an IC (integrated circuit) chip 6 soldered on the substrate 7 and heat can be efficiently transferred onto the substrate 7. It is composed of a heat dissipation rod 4 attached through an adhesive substance 5 for good transmission, and a connector 8 fixed to the lower surface of the substrate 7. The heat radiating rod 4 is made of a material having a high thermal conductivity such as copper or aluminum, like the heat radiating rod 3.

On the upper surface of the main board 15, a connector 9 is provided.
The connector 9 is provided with a circuit unit 10
By connecting the connector 8 of the circuit unit 10
Is detachably mounted on the main board 15 and can be electrically operated through the electrical connection of the connectors 8 and 9.

Further, when the circuit unit 10 is mounted in this manner, the protrusion 3b formed on the inner end of the heat dissipation rod 3 of the heat dissipation connector 1 is lower than the end of the heat dissipation rod 4 of the circuit unit 10. The concave portion 4a formed on the side is fitted and the heat radiating rods 3 and 4 are connected.

When the electronic device is operated after the circuit unit 10 is thus mounted, the IC of the circuit unit 10 is operated.
The heat generated by electrically driving the chip 6 causes the adhesive substance 5 to generate heat.
The heat is transmitted to the heat radiating rod 3 via the heat radiating rod 4 and is transmitted to the heat radiating plate 2 which is in contact with the outside air, and escapes to the outside of the housing 100 by radiating heat to the outside air.

By the way, the circuit unit 10 can be replaced by another circuit unit, but the other circuit unit also has the same connector as the connector 8 and has a heat dissipation rod connectable to the heat dissipation rod 3. However, in the case of a circuit unit that has low power consumption and a small amount of heat generation depending on the type of the mounted IC chip and does not need to radiate heat positively, the one corresponding to the heat radiating rod 4 is not provided but the adhesive substance 5 What you do is unnecessary. It should be noted that the circuit unit 10 may be configured not as a replaceable component that is always provided but as an additional component that need not be attached.

On the other hand, the heat generated by the circuit unit 10 is large,
When it is necessary to perform heat dissipation more efficiently, the radiator 14 whose appearance is shown in FIG. 4 is connected to the heat dissipation plate 2 portion of the heat dissipation connector 1 outside the housing 100.

In FIG. 4, reference numeral 12 is a case of the radiator 14, and this case 12 is formed with a slit 12a for radiating heat to the outside. A connector portion 11 for detachably connecting the radiator 14 to the heat radiation connector 1 is projected on one outer surface of the case 12. As shown in FIG. 5, the connector portion 11 includes a fin 12 provided in a case 12 for heat dissipation (heat sink) 1.
3 is integrally formed. The heat radiating member 13 is made of a material having a high thermal conductivity like the heat radiating rods 3 and 4.

Then, the connector portion 11 is press-fitted inside the elastic radiator plates 2, so that the radiator plate 2 is pressed against the outer periphery of the connector portion 11 and the radiator 14 is detachably connected to the radiator connector 1. To be done. Due to this connection, the heat transferred from the circuit unit 10 to the heat dissipation plate 2 is applied to the connector portion 1
1 is transmitted to the heat dissipation member 13 to efficiently dissipate heat.

Further, when the radiator 14 is connected to the radiator connector 1, the pin 16 on the connector 1 side comes into contact with the pin 33 of the electrode arranged at the center of the connector portion 11 of the radiator 14, so that the radiator 14 The fact that they are connected is electrically detected. Then, the power consumption of the IC chip 6 of the circuit unit 10 is controlled according to the detection result, and thus the power consumption of the electronic device is controlled. The configuration of the control system of the personal computer that performs the control will be described below with reference to FIG.

As shown in FIG. 6, the control system of the personal computer 20 has an MPU 2 which is the main CPU of the personal computer.
2 via an internal bus 21, a ROM 23 for storing a program such as System Bios, which is software that controls the basic operation of a personal computer, and a CPU 24, which is a one-chip microcomputer that controls the power saving function of the system according to the present invention. , I / O control of PC
An I / O controller (for example, a video controller, a keyboard controller, a hard disk controller, etc.) 25 is connected to the I / O controller 25, and the I / O controller 25 is controlled by an input / output device (for example, CR).
(T, keyboard, hard disk drive, etc.) 26 is connected.

In this configuration, the MPU 22 is the IC chip 6 of the circuit unit 10 described above, and there are a plurality of types, and they can be replaced or added.

Further, the pin 16 of the heat dissipation connector 1 is CP
The presence / absence detection signal that is connected to the U24 and indicates whether the radiator 14 is connected to the connector 1 from the pin 16 is CP.
It is designed to be input to U24. As for this presence / absence detection signal, the pin 16 causes the radiator 14 to be connected due to the connection of the radiator 14.
It changes by contacting the pin 33 of the connector part 11. For example, this signal is normally pulled up to a high level (5V) via a pull-up resistor, and
When 4 is connected, the pins 16 and 33 come into contact with the electrodes to attain a low level (0 V).

The CPU 24 determines that the radiator 14 is not connected when the presence / absence detection signal is at high level, and determines that the radiator 14 is connected when at low level. And the CPU 24
The system BIOS is informed of whether the radiator 14 is connected.

When the radiator 14 is not connected, the system bios issues a command to the MPU 22 to keep the power consumption below a predetermined amount, and in response to this, the MPU 22 receives the command.
Enters power save mode to reduce power consumption. This suppresses heat generation of the MPU 22 itself, and there is no problem of overheating even if the radiator 14 is not connected.

When the radiator 14 is connected,
SystemBios MP to avoid limiting power consumption
After issuing a command to U22, MPU22 operates at full power in response to this, and consumes power close to the maximum rating. The heat generated at this time is transmitted from the MPU 22 (IC chip 6) to the heat radiating rod 3 via the heat radiating rod 4, further transmitted from the heat radiating plate 2 to the heat radiator 14, and is efficiently radiated by the heat radiator 14.
This can prevent overheating of the MPU 22 and the like.

According to the present embodiment as described above, the heat dissipation connector 1 can dissipate heat from the IC chip 6 of the circuit unit 10, and the heat dissipation connector 1 can be connected to the radiator 14 to dissipate heat more efficiently. . This makes IC chip 6
Can be prevented, and the temperature inside the housing 100 can be prevented from rising. When the radiator 14 is not connected, the power consumption can be limited to prevent the circuit unit 10 from overheating.

Further, since the radiator 14 may be prepared later as needed, it does not become a cost burden. The heat dissipation connector 1 can be constructed at a significantly lower cost than a cooling fan or the like, and even if the circuit unit 10 is of a type that does not require heat dissipation and the heat dissipation connector 1 is not used, the cost is not so heavy. In addition, the heat radiation connector 1 occupies less space and can be made lighter than a cooling fan or the like, and thus the entire electronic device can be made smaller and lighter.

Further, the hole 100a of the housing 100 for exposing the heat dissipation plate 2 of the heat dissipation connector 1 may be smaller than the ventilation hole for heat dissipation, and moreover, the outer end portion of the heat dissipation connector 1 is in the hole 100a. Since it is arranged and the gap is small, foreign matter such as dust from the outside can be removed from the housing 100 through the hole 100a.
The risk of ingress is significantly less than with vents.

[Second Embodiment] Next, a second embodiment of the present invention will be described with reference to FIGS. First in FIGS. 7 to 9
The parts common to or corresponding to those in FIGS. 1 to 5 of the embodiment are designated by the same reference numerals, and the description of the common parts will be omitted.

In this embodiment, instead of the heat dissipation connector 1 of the first embodiment, the heat conductivity of copper, aluminum or the like is provided in the housing 100 of the personal computer main body shown in FIGS. 7 (A) and 7 (B). Two hollow cooling pipes made of a good substance are provided in parallel, and the outer ends of the two pipes shown by reference numeral 27 in FIG. 7B are exposed on one side of the housing 100. .

As shown in FIGS. 8A and 8B, the circuit unit 10 is formed by bending one hollow pipe made of a material having a high thermal conductivity such as copper or aluminum. A cooling member 28 is attached. Cooling member 2
Both ends of the pipe 8 are parallel to each other, the middle part is bent in a zigzag shape, and the middle part is fixed on the IC chip 6.

When the circuit unit 10 is mounted on the main board 15 in the housing 100 as in the case of the first embodiment, the pipes of the cooling member 28 are provided at the respective inner ends of the cooling pipes 27. Both ends of are connected.

The cooling liquid circulator 29 shown in FIG. 9 is detachably connected to each of the outer ends of the cooling pipe 27 exposed from the housing 100. The liquid circulator 29 circulates a cooling liquid such as water, and two pipes 30 connected to both ends of a liquid flow path (not shown) in the housing project from the housing. The two pipes 30 are detachably connected to the respective outer ends of the cooling pipe 27.

By thus connecting the liquid circulator 29 to the cooling pipe 27 and driving the liquid circulator 29, the cooling member 28 is driven from the liquid circulator 29 through the cooling pipe 27.
The cooling liquid circulates in the pipe to cool the IC chip 6 of the circuit unit 10 that generates heat by driving, and it is possible to prevent the IC chip 6 from overheating and the temperature inside the housing 100 from rising.

In addition, a pin 31 as an electrode is provided between two cooling pipes 27 projecting from the casing 100 of the personal computer main body, and two pins protruding from the casing of the liquid circulator 29. A pin 32 as an electrode is also projected between the pipes 30 of the above. When the liquid circulator 29 is connected to the cooling pipe 27, the pins 31, 32 come into contact with each other,
Similar to the detection of the connection of the radiator 14 of the first embodiment, the connection of the liquid circulator 29 is detected. Further, it is assumed that power consumption is controlled and the power save function is activated in accordance with the detection result as in the first embodiment.

According to the present embodiment as described above, the same effect as that of the first embodiment is obtained, and more powerful cooling than the heat radiation of the first embodiment can be performed by circulating the cooling liquid.
It is possible to lower the temperature of a circuit unit that consumes a lot of power and generates a large amount of heat. Further, the inner diameter of a hole (not shown) of the casing 100 for exposing the pipe 27 is set to the pipe 27.
To make the gap almost the same as the outer diameter of, or
By sealing the gap between the hole and the pipe 27, the entry of foreign matter such as dust from the outside can be completely prevented.

Further, means for measuring the temperature around the IC chip 6 and a signal line between the cooling liquid circulator 29 and the CPU 24 are further provided, and when the temperature of the IC chip 6 rises, a command is issued from the CPU 24. Alternatively, the liquid may be circulated and the liquid may be circulated.

It is needless to say that the structure for heat dissipation or cooling as described above is not limited to the IC chip and can be similarly applied for heat dissipation or cooling of other heat-generating electric parts.

[0047]

As is apparent from the above description, according to the present invention, in the electronic equipment, the heat radiation connector to which the external heat radiation means is detachably connectable to the outer end portion is provided in the housing, and the heat radiation is performed. A first structure in which a predetermined or replaceable predetermined electric component having a heat radiating member connectable to the inner end portion of the connector for electric power can be mounted in the housing, and an external cooling liquid circulator Two cooling pipes that are detachably connectable to the outer ends are provided in the housing, and one cooling pipe that is connectable to the inner ends of the cooling pipes is bent to form a cooling pipe. By adopting the second configuration in which a predetermined or replaceable predetermined electric component attached with a member for use can be mounted in the housing, the electric component can be dissipated or cooled, and the electric component can be overheated. Can prevent temperature rise in the body Radiator connector through the cooling pipes significantly inexpensive to configure than like the cooling fan,
It is economical, does not occupy space and is lightweight, and the entire electronic device can be made compact and lightweight.

Further, the external heat radiating means or the liquid circulator for cooling may be prepared later as needed, so that it does not become a cost burden. Further, it is possible to obtain an excellent effect of preventing the intrusion of dust and the like from the outside when the conventional vent holes for heat dissipation are provided.

[Brief description of the drawings]

FIG. 1 is a perspective view and a side view showing an appearance of an electronic device according to a first embodiment of the invention.

2A and 2B are a front view and a perspective view showing a structure of an outer end portion of a heat dissipation connector provided in the electronic device, and a perspective view of a radiator detecting pin.

FIG. 3 is a side view showing the structure of a circuit unit equipped with the same heat dissipation connector and a heat dissipation rod connectable to the same and the attachment and detachment of the circuit unit.

FIG. 4 is a perspective view showing an external appearance of a radiator that can be connected to an outer end portion of the heat dissipation connector.

FIG. 5 is a front view, a top view, and a side view showing the inside of the radiator.

FIG. 6 is a block diagram showing a configuration of a control system of the electronic device of the embodiment.

7A and 7B are a perspective view and a side view showing an appearance of an electronic device according to a second embodiment.

8A and 8B are a side view and a top view showing a cooling pipe provided in the electronic device and a cooling member of a circuit unit connectable to an inner end portion thereof.

FIG. 9 is a perspective view showing the external appearance of a cooling liquid circulator that can be connected to the outer end of the cooling pipe.

[Explanation of symbols]

 1 heat dissipation connector 2 heat dissipation plate 3,4 heat dissipation rod 5 adhesive material 6 IC chip 7 substrate 8, 9 connector 10 circuit unit 14 heat sink 15 main board 16 heat sink detection pin 22 MPU 23 ROM 24 CPU 26 input / output Equipment 27 Cooling pipe 28 Cooling member 29 Cooling liquid circulator 100 Personal computer case

Claims (4)

[Claims] 1. A heat dissipating member, which is made of a material having a high thermal conductivity, is provided in a housing of an electronic device, and has an outer end portion exposed from the housing to dissipate heat to the outside air. It has a heat dissipation connector configured as a detachably connectable connection part, and is provided with a heat dissipation member made of a material having a high thermal conductivity and connectable to an inner end of the heat dissipation connector. An electronic device, wherein a predetermined electric component for expansion can be mounted in the housing. 2. A detection means for detecting whether or not the heat radiation means is connected to the heat radiation connector, and a control means for controlling power consumption of the electric component according to a detection result of the detection means. The electronic device according to claim 1, wherein: 3. An electronic device housing is provided with two hollow cooling pipes made of a substance having a high thermal conductivity, and the outer ends of the two cooling pipes are separated from the housing. A material having a high thermal conductivity that is exposed and is configured to be detachably connectable to each of the outer end portions of an external cooling liquid circulator, and is connectable to each inner end portion of the cooling pipe. An electronic device, wherein a predetermined replaceable or additional electric component provided with a cooling member configured by bending one hollow pipe is attached in the housing. 4. Detection means for detecting whether or not the liquid circulator is connected to the two cooling pipes, and control for controlling power consumption of the electric component according to a detection result of the detection means. The electronic device according to claim 3, further comprising means.