JPH09181121A - Terminal structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance mechanical strength, narrow an electrode interval and enhance mount density by a method wherein a sub-substrate is interposed between two connectors from both sides. SOLUTION: A connector 14 comprises: a terminal 14a formed in a plurality of rectangular sections; and a resin part 14b molded with heat-resistant resin held by insulating the plurality of terminals 14a at specific intervals. A groove- like substrate engagement part 14c is provided in this resin part 14b. Both ends of a sub-substrate 11 to which parts are mounted on its both faces are inserted into the substrate engagement parts 14c, 14c of the connectors 14, 14. Thereafter, a space between a bonding pad 11b of the substrate 11 and the terminal 14a of the connector 14 is bonded at bonding points 15a, 15b by a wire 15. The substrate assembly that this terminal mounting is completed is mounted on a solder pattern 16a of a printed board 16 on which solder paste is applied, and by melting solder 17, a lower end of the connector 14 and a solder pattern 16a of the printed board 16 are melted and adhered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal structure for connecting a mounting substrate such as a hybrid integrated circuit to a common substrate such as a mother board, and more particularly to a terminal structure having high packaging density and high mechanical strength.

[0002]

2. Description of the Related Art FIG. 8 is a sectional view for explaining a conventional terminal structure. Hereinafter, description will be made with reference to the drawings. Reference numeral 91 is a substrate such as a ceramic on which the semiconductor chip 12 and the chip component 18 are mounted, and a bonding pad 92a for wire bonding with the semiconductor chip 12, a wiring pattern (not shown), and an electrode for soldering with the chip component 18. 9
1d is provided. Reference numeral 12 denotes a semiconductor chip mounted on the substrate 91, which is connected to the substrate 91 by the wire 13 and then coated with a resin 12b for protecting the semiconductor chip 12. Reference numeral 13 denotes a thin wire such as gold connecting the semiconductor chip 12 and the substrate 91, which are ultrasonically bonded to the semiconductor chip 12 and the substrate 91 at bonding points 13a and 13b.

Reference numeral 18 denotes a chip component mounted on the back surface of the substrate 91. The terminal portion 18a of the chip component 18 and the electrode 91d of the substrate 91 are fixed by the solder 18b. Reference numeral 94 is a terminal having a U-shaped clip portion 94a that fits into the electrode pattern 91 provided on the peripheral portion of the substrate 91.
The printed circuit board 9 is provided at the end opposite to the clip portion 94a
Leads 94b to be inserted into the through holes 96a of No. 6 are provided.

Reference numeral 96 denotes a printed circuit board made of glass epoxy or the like on which a plurality of circuit parts are mounted and provided with through holes 96a for mounting the parts and soldering. 97
Is the lead 94b of the terminal 94 and the through hole 9 of the substrate 96.
6a for connecting the solder. Next, the assembly process will be described. The semiconductor chip 12 is mounted on the substrate 91, and the bonding pads 12 a of the semiconductor chip 12 and the substrate 9 are mounted.
The one bonding pad 91a is ultrasonically bonded by the wire 13 at the bonding points 13a and 13b at both ends. Then, in order to protect the semiconductor chip 12, the surface is coated with a resin 12b such as silicon. The substrate 91 is inverted, the chip component 18 is also mounted on the back surface of the substrate 91, and the electrodes 91 of the substrate 91 are soldered with the solder 18b or the like.
fixed to d. In this way, the substrate assembly is completed.

Then, the clip portions 94a of the terminals 94 are fitted to the electrodes 91b at both ends of the board 91 on which the components are mounted, and fixed by soldering or the like. Then, the lead portion 94d of the terminal 94 is inserted into the through hole 96a of the printed board 96 and fixed by the solder 97 to complete the terminal structure.

[0006]

In the terminal structure having the above structure, when another component is mounted between the substrate 91 and the printed circuit board 96 in order to improve the mounting density of the component, the lead portion 94b of the terminal 94 is removed. It must be long, and its strength is reduced against vibration. Further, since the lead portion 94d at the tip of the terminal 94 is inserted into the through hole 96a of the printed circuit board 96, it is difficult to narrow the electrode pitch, and there is a problem that high-density mounting cannot be performed.

It is an object of the present invention to provide a terminal structure capable of improving mechanical strength when inserting a board on a printed board and narrowing an electrode interval to improve packaging density.

[0008]

In order to achieve the above object, the present invention provides a terminal structure of a sub-board on which electronic parts are mounted, which are connected in correspondence with a plurality of electrodes provided on a printed board. A plurality of electrodes provided on the periphery of the sub-board, and a groove for fitting with the sub-board,
An insulator holder for holding a plurality of U-shaped electrode terminals having a schematic cross section at a predetermined interval, and a connecting member for connecting the electrode of the sub-board and the electrode terminal, the peripheral portion of the sub-board is the It is characterized in that the plurality of electrodes of the sub-board and the plurality of electrode terminals are fitted in the groove portions of the holder and are correspondingly connected by the connecting members.

Further, in a terminal structure of a plurality of sub-boards on which electronic components are connected corresponding to a plurality of electrodes provided on a printed circuit board, a plurality of sub-boards provided on the periphery of the plurality of sub-boards are provided. An insulation that has electrodes and a plurality of groove portions for fitting with the respective sub-boards, and that holds a plurality of U-shaped electrode terminals having a schematic cross-section at predetermined intervals corresponding to the plurality of groove portions. A holder of the body, a connecting member for connecting the electrode of the sub-board and the electrode terminal, the peripheral portion of the plurality of sub-boards are fitted into the groove of the holder, the plurality of electrodes of each sub-board And the plurality of electrode terminals are correspondingly connected by the connecting member.

Further, the connection member is a lead wire, and the plurality of electrodes of the sub-board and the plurality of electrode terminals are correspondingly connected by the lead wire. Further, the conductive wire is characterized in that it is connected by bonding so as to correspond to the plurality of electrodes of the sub-board and the plurality of electrode terminals, respectively.

Further, the connection member is solder, and the plurality of electrodes of the sub-board and the plurality of electrode terminals are correspondingly connected to each other by the solder. Further, the connection member is a conductive adhesive, and the plurality of electrodes of the sub-board and the plurality of electrode terminals are correspondingly connected by the conductive adhesive. is there.

Further, the connecting member is a conductive particle contained in the holder, and the plurality of electrodes of the sub-board and the plurality of electrode terminals are correspondingly pressed against the conductive particle. It is characterized by
Further, the connection member is a protrusion provided on each of the plurality of electrode terminals, and the plurality of electrodes of the sub-board and the protrusions of the plurality of electrode terminals are correspondingly pressed against each other. To do.

[0013]

1A and 1B are views for explaining a connector having a terminal structure according to a first embodiment of the present invention. FIG. 1A is a front view and FIG. 1B is a sectional view taken along line AA. 2A and 2B are views for explaining the terminal structure of the first embodiment of the present invention. FIG. 2A is a top view (only a board assembly portion), and FIG. After soldering). Hereinafter, description will be made with reference to the drawings.

Reference numeral 14 denotes a terminal 14a formed of a plurality of phosphor bronze or the like and having a generally U-shaped cross section, and a heat-resistant PBT resin (polybutylene terephthalate) for insulating and holding the plurality of terminals 14a at a predetermined interval. It is a connector composed of a resin portion 14b molded by the above. The upper end 14aa of the U-shaped terminal 14a is connected to the bonding pad 11b of the board 11, and the lower end 14ab is connected to the solder pattern 16a of the printed board 16. The resin portion 14b is provided with a groove-shaped board fitting portion 14c into which the board 11 is inserted.

Reference numeral 11 denotes a semiconductor chip 12 and a chip component 18.
The semiconductor chip 12 is a substrate such as a ceramic on which the semiconductor chip 12 is mounted.
Bonding pad 1 for wire bonding with
1a, a wiring pattern (not shown), a bonding pad 11b for wire bonding with the terminal 14a (upper end 14aa) of the connector 14, and an electrode pattern 11d for soldering with the chip component 18. 1
Reference numeral 2 is a semiconductor chip mounted on the substrate 11, and a wire 13
After being connected to the substrate 11 by means of, the resin is coated with a resin 12b for protecting the semiconductor chip 12. Reference numeral 13 is a thin wire such as gold connecting the semiconductor chip 12 and the substrate 11. The bonding pad 12a of the semiconductor chip 12 and the bonding pad 11a of the substrate 11 are ultrasonically bonded at bonding points 13a and 13b. Reference numeral 15 is a thin wire such as gold connecting the substrate 11 and the connector 14, and the bonding pad 11b of the substrate 11 and the terminal 14a (upper end 14aa) of the connector 14 are ultrasonically bonded at the bonding points 15a and 15b. Reference numeral 18 denotes a chip component mounted on the back surface of the substrate 11. The terminal portion 18a of the chip component 18 and the electrode pattern 11d of the substrate 11 are fused by the solder 18b.

Reference numeral 16 is a printed circuit board made of glass epoxy or the like on which a plurality of circuit components are mounted. Through holes (not shown) for mounting the components and soldering the solder patterns 1
6a is provided. 17 is a terminal 14 of the connector 14
It is solder that connects a (lower end 14ab) and the solder pattern 16a of the printed board 16. Next, the assembly process will be described. The semiconductor chip 12 is mounted on the substrate 11, and the bonding pad 12a of the semiconductor chip 12 and the bonding pad 11a of the substrate 11 are bonded by the wire 13 at the bonding points 13a and 13b at both ends by ultrasonic waves or the like. Then, in order to protect the semiconductor chip 12, the surface is coated with a resin 12b such as silicon. The substrate 11 is inverted and solder paste is printed on the electrode pattern 11d, the chip component 18 is mounted thereon, and the solder 18b is melted and fixed to the electrode pattern 11d of the substrate 11. The electrodes, wiring patterns, etc. of the chip component 18 on the lower surface are gathered in advance on the bonding pads 11b on the upper surface via through holes (not shown) provided in the substrate 11 or the end portions of the substrate 11.

Subsequently, the substrate 11 having components mounted on both sides thereof
After both ends of the connector are inserted (press-fitted) into the groove-shaped substrate fitting portion 14c of the connector 14, the bonding pad 11b of the substrate 11 and the terminal 14a (upper end 14aa) of the connector 14 are correspondingly bonded by the wire 15. 15a, 15
In step b, ultrasonic waves are bonded. In this way, the terminal attachment of the substrate 11 is completed. When electrically connecting the bonding pad 11b of the substrate 11 and the terminal 14a of the connector 14, a ribbon-shaped tab tape (connection tape provided with a conductive pattern for connection) is used instead of the wire 15. Good.

The board assembly having the terminals attached is mounted on the solder pattern 16a of the printed board 16 to which the solder paste is applied by the same method as that of a normal electronic component, and the solder 17 is melted to melt the solder 17 to form the terminals of the connector 14. 14a (lower end 14ab) and the solder pattern 16a of the printed board 16 are fused. As described above, in this embodiment,
Since the board 11 can be mounted and connected without forming holes in the printed board 16 and the terminal spacing of the connector can be narrowed, the mounting density is improved and the mounting strength is improved because the board is sandwiched by two connectors from both sides. .

3A and 3B are views for explaining the terminal structure of the second embodiment of the present invention. FIG. 3A is a front view of the connector, FIG. 3B is a sectional view of the connector AA, and FIG. It is a sectional view after. Hereinafter, description will be made with reference to the drawings. Reference numeral 24 is a terminal 2 formed of a plurality of phosphor bronze and having a generally U-shaped cross section.
4a and a plurality of terminals 24a are insulated from each other at a predetermined interval and held by a heat-resistant resin portion 24 made of, for example, PBT resin or the like.
It is a connector composed of b. U-shaped terminal 24a
The upper end 24aa is connected to the electrode pattern 21b of the board 21, and the lower end 24ab is connected to the solder pattern of the printed board. A groove-shaped board fitting portion 24c into which the board 21 is inserted is provided in the resin portion 24b in contact with the terminal 24a (upper end 24aa).

Reference numeral 21 denotes a semiconductor chip 12 and a chip component 18.
The semiconductor chip 12 is a substrate such as a ceramic on which the semiconductor chip 12 is mounted.
Bonding pad 2 for wire bonding with
1a, a wiring pattern (not shown), an electrode pattern 21b for solder connection with the terminal 24a (upper end 24aa) of the connector 24, and an electrode pattern 21d for soldering with the chip component 18. Reference numeral 25 is a solder that connects the substrate 21 and the connector 24, and the electrode pattern 21b of the substrate 21 and the terminal 24a (upper end 24aa) of the connector 24 are soldered. Since the semiconductor chip 12, the wires 13 and the chip parts 18 have the same names, functions and actions as those of the first embodiment, they are given the same reference numerals and their explanations are omitted.

Next, the assembly process will be described. Board 21
Since the method of mounting the semiconductor chip 12 and the chip component 18 on the same is the same as that of the first embodiment, the description thereof will be omitted. The ends of the substrate 21 having components mounted on both sides are immersed in a molten solder bath to coat the electrode pattern 21b with solder 25. After both ends of the solder-coated substrate 21 are inserted (press-fitted) into the groove-shaped substrate fitting portion 24c of the connector 24, the solder 25 is remelted in a heating furnace to re-melt the substrate 21 and the terminals 24a (upper end 24aa) of the connector 24. ) Are connected. In this way, the terminal attachment of the substrate 21 is completed. The remelting of the solder 25 for attaching the terminals may be performed at the same time when the solder 25 is mounted on the printed board. Also,
The electrode pattern 21b of the substrate 21 and the terminal 2 of the connector 24
When electrically connecting 4a (upper end 24aa), solder 25
You may connect by applying a conductive adhesive instead of.

The board assembly having the terminals attached thereto is mounted on the solder pattern of the printed board to which the solder paste is applied by the same method as that of a normal electronic component, and the terminal 24a (lower end of the connector 24) of the connector 24 is melted by melting the solder. Two
4ab) and the solder pattern of the printed circuit board are fused.
As described above, in this embodiment, the board 21 can be mounted and connected without providing holes in the printed board, and the terminal spacing of the connector can be narrowed, so that the mounting density is improved and the board is sandwiched by two connectors from both sides. Mounting strength is improved. In addition, the board can be easily connected only by inserting it into the board fitting portion of the connector.

4A and 4B are views for explaining a terminal structure of the third embodiment of the present invention. FIG. 4A is a front view of a connector, FIG. 4B is a sectional view of the connector AA, and FIG. It is a sectional view after. Hereinafter, description will be made with reference to the drawings. Reference numeral 34 is a terminal 3 formed of a plurality of phosphor bronze or the like and having an approximately U-shaped cross section.
4a and a plurality of terminals 34a are insulated from each other at a predetermined interval and held by a heat-resistant resin portion 34 made of, for example, PBT resin or the like.
It is a connector composed of b. U-shaped terminal 34a
Has an upper end 34aa connected to the electrode pattern 31b of the substrate 31, and a lower end 34ab connected to a solder pattern (not shown) of the printed circuit board. The resin portion 34b is provided with a groove-shaped board fitting portion 34c into which the board 31 is inserted.
The resin portion 34b has elasticity and the resin portion 3b
Conductive balls 34d are dispersed in 4b, and conductivity is generated in the compression direction.

31 is a semiconductor chip 12 and a chip component 18
The semiconductor chip 12 is a substrate such as a ceramic on which the semiconductor chip 12 is mounted.
Bonding pad 3 for wire bonding with
1a, a wiring pattern (not shown), an electrode pattern 31b for connecting to the terminal 34a of the connector 34 via a conductive ball 34d, and an electrode pattern 31d for soldering to the chip component 18. Since the semiconductor chip 12, the wires 13 and the chip parts 18 have the same names, functions and actions as those of the first embodiment, they are given the same reference numerals and their explanations are omitted.

Next, the assembly process will be described. Substrate 31
The method of mounting the semiconductor chip 12 and the chip component 18 on the top is the same as that in the first embodiment, and thus the description thereof is omitted. By inserting (press-fitting) both ends of the board 31 into the groove-shaped board fitting portion 34c of the connector 34, the resin portion 34b is formed.
The conductive balls 34d dispersed in the substrate are compressed, and conductivity is generated in the compression direction, so that the electrode pattern 31b of the substrate 31 is formed.
And the terminal 34a (upper end 34aa) of the connector 34 are electrically connected. In this way, the terminal mounting of the substrate 31 is completed.

The board assembly having the terminals attached is mounted on the solder pattern of the printed board to which the solder paste is applied by a method similar to that of an ordinary electronic component, and the terminal 34a (lower end of the connector 34) of the connector 34 is melted by melting the solder. Three
4ab) and the solder pattern of the printed circuit board are fused.
As described above, in this embodiment, the board 31 can be mounted and connected without providing holes in the printed board, and the terminal spacing of the connector can be narrowed, so that the mounting density is improved and the board is sandwiched by two connectors from both sides. Mounting strength is improved. In addition, the board can be easily connected only by inserting it into the board fitting portion of the connector.

5A and 5B are views for explaining the terminal structure of the fourth embodiment of the present invention. FIG. 5A is a front view of the connector, FIG. 5B is a sectional view of the connector AA, and FIG. It is a sectional view after. Hereinafter, description will be made with reference to the drawings. Reference numeral 44 designates a terminal 4 formed of a plurality of phosphor bronze and having a generally U-shaped cross section.
4a and a plurality of terminals 44a are insulated from each other at a predetermined interval and held by a heat-resistant resin portion 44 made of, for example, PBT resin or the like.
It is a connector composed of b. U-shaped terminal 44a
Has an upper end 44aa connected to the electrode pattern 41b of the substrate 41 and a lower end 44ab connected to a solder pattern (not shown) of the printed circuit board. The resin portion 44b is provided with a groove-shaped board fitting portion 44c into which the board 41 is inserted.
A protrusion 44d is provided on the upper end 44aa. In this example, as a method of manufacturing the protrusion 44d, the terminal 44aa is used.
Although the tip is bent by pressing to form a protrusion,
Separate protrusions (eg, conductive balls, thin wires, etc.) may be provided.

Reference numeral 41 is a semiconductor chip 12 and a chip component 18.
The semiconductor chip 12 is a substrate such as a ceramic on which the semiconductor chip 12 is mounted.
Bonding pad 4 for wire bonding with
1a, a wiring pattern (not shown), an electrode pattern 41b for connecting to the terminal 44a of the connector 44 via a conductive ball 44d, and an electrode pattern 41d for soldering with the chip component 18. Since the semiconductor chip 12, the wires 13 and the chip parts 18 have the same names, functions and actions as those of the first embodiment, they are given the same reference numerals and their explanations are omitted.

Next, the assembly process will be described. Board 41
The method of mounting the semiconductor chip 12 and the chip component 18 on the top is the same as that in the first embodiment, and thus the description thereof is omitted. By inserting (press-fitting) both ends of the board 41 into the groove-like board fitting portion 44c of the connector 44, the terminal 44a is formed.
The protrusion 44d at the (upper end 44aa) is pressure-bonded to the electrode pattern 41b of the substrate 41, and the electrode pattern 41b of the substrate 41 and the terminal 44a of the connector 44 are electrically connected. In this way, the terminal mounting of the substrate 41 is completed.

The board assembly having the terminals attached is mounted on the solder pattern of the printed board on which the solder paste has been applied by the same method as that for a normal electronic component, and the terminals 44a (lower end of the connector 44) of the connector 44 are melted by melting the solder. Four
4ab) and the solder pattern of the printed circuit board are fused.
As described above, in this embodiment, the board 41 can be mounted and connected without providing holes in the printed board, and the terminal spacing of the connector can be narrowed, so that the mounting density is improved and the board is sandwiched by two connectors from both sides. Mounting strength is improved. In addition, the board can be easily connected only by inserting it into the board fitting portion of the connector.

6A and 6B are views for explaining the terminal structure of the fifth embodiment of the present invention. FIG. 6A is a front view of the connector, FIG. 6B is a sectional view of the connector AA, and FIG. It is a sectional view after. Hereinafter, description will be made with reference to the drawings. In this example, a plurality of substrates are inserted into one connector to improve the degree of integration. Reference numeral 54 designates a plurality of terminals 54a made of phosphor bronze or the like, and resin portions 541b, 542b formed of heat-resistant PBT resin or the like for insulating and holding the terminals 54a at predetermined intervals.
Each terminal 54a has a first claw (upper end) 541a, a second claw 542a, and a third claw (lower end) 543.
a, each of the two claws is formed in a generally U-shape. Groove-shaped board fitting portions 541c and 542c into which the board 21 is inserted are provided in the resin portions 541b and 542b in contact with the first claws (upper ends) 541a and the second claws 542a.

Reference numeral 21 is a semiconductor chip 12 and a chip component 18.
The semiconductor chip 12 is a substrate such as a ceramic on which the semiconductor chip 12 is mounted.
Bonding pad 2 for wire bonding with
1a, wiring pattern (not shown), first connector 54
A claw (upper end) 541a, an electrode pattern 21b for solder connection with the second claw 542a, and an electrode pattern 21d for soldering with the chip component 18 are provided. Reference numeral 25 is solder that connects the substrate 21 and the connector 54, and the electrode pattern 21b of the substrate 21 and the connector 54 are soldered. Since the semiconductor chip 12, the wires 13 and the chip parts 18 have the same names, functions and actions as those of the first embodiment, they are given the same reference numerals and their explanations are omitted. The lower substrate 21 is mounted component (semiconductor chip 12, chip component 1
8) is omitted.

Next, the assembly process will be described. Board 21
The method of mounting the semiconductor chip 12 and the chip component 18 on the top is the same as that in the first embodiment, and thus the description thereof is omitted. The ends of the substrate 21 having components mounted on both sides are immersed in a molten solder bath to coat the electrode pattern 21b with solder 25. Both ends of the solder-coated substrate 21 are groove-shaped substrate fitting portions 541c and 542 of the connector 54.
After being inserted (press-fitted) into c and c, respectively, the solder 25 is re-melted in the heating furnace and the board 21 and the claw 54 of the connector 54 are
1a and 542a are connected. In this way, the terminal attachment of the substrate 21 is completed. The remelting of the solder 25 for attaching the terminals may be performed at the same time when the solder 25 is mounted on the printed board. Further, when electrically connecting the electrode pattern 21b of the substrate 21 and the connector 54, a conductive adhesive may be applied instead of the solder 25 for connection.

The board assembly with the terminals attached is mounted on the solder pattern of the printed board to which the solder paste has been applied by the same method as that for a normal electronic component, and the third nail ( Bottom edge 543
The solder pattern of a) and the printed circuit board are fused. still,
As a method of connecting the board 21 and the connector 54, a method similar to the method of connecting with the connectors 34 and 44 (connectors provided with conductive balls, protrusions, etc.) as in the third to fourth embodiments is also possible.

As described above, in this embodiment, a plurality of substrates can be connected to one connector, so that the mounting density is further improved. Further, since the board is sandwiched by the two connectors from both sides, the mounting strength is improved. FIG. 7 shows a sixth embodiment of the present invention.
7A is a front view of the connector, FIG. 8B is a sectional view of the connector AA, and FIG. 8C is a sectional view after the connector is inserted. Hereinafter, description will be made with reference to the drawings. In this example, a plurality of substrates are inserted into one connector to improve the degree of integration.

Reference numeral 64 is a terminal 64 made of a plurality of phosphor bronze or the like.
resin portions 641b, 6 made of heat-resistant material such as PBT resin that insulates and holds a and the terminal 64a at a predetermined interval.
42b, 643b connector, each terminal 64
a is a first claw 641a, a second claw 642a, a third claw 643
a and a fourth claw 644a. Resin part 641
Groove-shaped board fitting portions 641c, 642c, 643c, 644 into which the board 21 is inserted in b, 642b, 643b.
c, one side is provided in contact with the first to fourth claws 641a to 644a.

Reference numeral 21 is a substrate made of ceramic or the like on which semiconductor chips, chip parts and the like are mounted, and a terminal 64a of the connector 64.
There is provided an electrode pattern 21b for solder connection with and an electrode pattern 21d for soldering with the chip component 18. Reference numeral 25 is solder for connecting the board 21 and the connector 64, and the electrode pattern 21b of the board 21 and the terminal 64a of the connector 64 are soldered. Note that the four substrates 2
In No. 1, the mounted parts are omitted.

Next, the assembly process will be described. The ends of the substrate 21 having components mounted on both sides are immersed in a molten solder bath to coat the electrode pattern 21b with solder 25. After both ends of the solder-coated board 21 are inserted (press-fitted) into the groove-shaped board fitting portions 641c to 644c of the connector 64, the solder 25 is remelted in a heating furnace to remove each of the board 21 and the connector 64. Claws 641a to 64
4a are connected. In this way, the terminal attachment of the substrate 21 is completed. The remelting of the solder 25 for attaching the terminals may be performed at the same time when the solder 25 is mounted on the printed board.
In addition, when the electrode pattern 21b of the substrate 21 and the claws 641a to 644a of the connector 64 are electrically connected, the solder 2
The connection may be made by applying a conductive adhesive instead of 5.

The board assembly having the terminals attached thereto is mounted on the solder pattern of the printed board to which the solder paste has been applied by the same method as that for a normal electronic component, and the solder is melted to melt the solder and the lower surface of the connector 64 and the printed board. The 16 solder patterns 16 a are fixed by the solder 17.
As a method of connecting the substrate 21 and the claws 641a to 644a, a method similar to the method of connecting with the connectors 34 and 44 (connectors provided with conductive balls, protrusions, etc.) as in the third to fourth embodiments is also possible. Is.

As described above, in this embodiment, a plurality of substrates can be connected to one connector, so that the mounting density is further improved. Further, the distance between the printed boards can be kept constant regardless of the number of boards.

[0041]

As described above, according to the present invention, when the board is inserted into the printed board, the mechanical strength can be improved and the terminal space can be narrowed to improve the mounting density.

[Brief description of the drawings]

FIG. 1 is a view for explaining a connector having a terminal structure according to a first embodiment of the present invention, (a) is a front view and (b) is an AA cross-sectional view.

FIG. 2 is a diagram for explaining the terminal structure of the first embodiment of the present invention, FIG. 2A is a top view (only a substrate assembly portion),
(B) is a cross-sectional view taken along the line AA (after inserting the connector and soldering the printed circuit board).

3A and 3B are diagrams for explaining a terminal structure of a second embodiment of the present invention, FIG. 3A is a front view of a connector, and FIG.
-A sectional drawing, (c) is sectional drawing after a connector insertion.

4A and 4B are views for explaining a terminal structure according to a third embodiment of the present invention, in which FIG. 4A is a front view of a connector and FIG.
-A sectional drawing, (c) is sectional drawing after a connector insertion.

5A and 5B are views for explaining a terminal structure of a fourth embodiment of the present invention, where FIG. 5A is a front view of a connector and FIG.
-A sectional drawing, (c) is sectional drawing after a connector insertion.

6A and 6B are views for explaining a terminal structure according to a fifth embodiment of the present invention, where FIG. 6A is a front view of a connector and FIG.
-A sectional drawing, (c) is sectional drawing after a connector insertion.

7A and 7B are views for explaining a terminal structure of a sixth embodiment of the present invention, in which FIG. 7A is a front view of a connector and FIG.
-A sectional drawing, (c) is sectional drawing after a connector insertion.

FIG. 8 is a cross-sectional view for explaining a conventional terminal structure.

[Explanation of symbols]

11, 21, 31, 41 ... Substrate, 12
.... Semiconductor chips 14, 24, 34, 44 ... Connector, 1
3, 15 ... Wires 14a, 24a, 34a, 44a ... Terminals, 16
.... Printed circuit boards 14b, 24b, 34b, 44b ... Resin portion, 34
d ... Conductive balls 14c, 24c, 34c, 44c ... Board fitting portion,
44d ... Protrusion

Claims (8)

[Claims] 1. A terminal structure of a sub-board on which an electronic component is mounted, which is connected to a plurality of electrodes provided on a printed circuit board, wherein the plurality of electrodes are provided in a peripheral portion of the sub-board, An insulator holder, which has a groove for fitting with the sub-board and holds a plurality of U-shaped electrode terminals having a substantially U-shaped cross section at predetermined intervals, connects the electrode of the sub-board and the electrode terminal. A connecting member, the peripheral portion of the sub-board is fitted into the groove of the holder,
A terminal structure in which a plurality of electrodes of the sub-board and the plurality of electrode terminals are correspondingly connected by the connecting member. 2. In a terminal structure of a plurality of sub-boards on which electronic components are connected corresponding to a plurality of electrodes provided on a printed circuit board, a plurality of sub-boards provided on the periphery of the plurality of sub-boards are provided. An insulation that has electrodes and a plurality of groove portions for fitting with the respective sub-boards, and that holds a plurality of U-shaped electrode terminals having a substantially U-shaped cross section at predetermined intervals corresponding to the plurality of groove portions. A holder of the body, and a connecting member that connects the electrode of the sub-board and the electrode terminal, the peripheral portion of the plurality of sub-boards are fitted into the groove of the holder, the plurality of electrodes of each sub-board And a plurality of electrode terminals correspondingly connected by the connecting member, respectively. 3. The connection member is a lead wire, and the plurality of electrodes of the sub-board and the plurality of electrode terminals are correspondingly connected to each other by the lead wire. Item 2. The terminal structure according to item 2. 4. The terminal structure according to claim 3, wherein the conductive wire is connected by bonding corresponding to the plurality of electrodes of the sub-board and the plurality of electrode terminals, respectively. 5. The connection member is solder, and the plurality of electrodes of the sub-board and the plurality of electrode terminals are correspondingly connected to each other by the solder. Item 2. The terminal structure according to item 2. 6. The connecting member is a conductive adhesive, and the plurality of electrodes of the sub-board and the plurality of electrode terminals are correspondingly connected to each other by the conductive adhesive. The terminal structure according to claim 1 or 2. 7. The connection member is a conductive particle contained in the holder, and the plurality of electrodes of the sub-substrate and the plurality of electrode terminals are correspondingly pressed against the conductive particle. The terminal structure according to claim 1 or 2, wherein 8. The connection member is a protrusion provided on each of the plurality of electrode terminals, and the plurality of electrodes of the sub-board and the protrusions of the plurality of electrode terminals are correspondingly pressed against each other. The terminal structure according to claim 1 or 2, characterized in that.