JPH09166724A - Manufacture of optical waveguide module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To exactly form positioning grooves for positioning with connecting end members at a waveguide chip. SOLUTION: The waveguide chip 13 is first formed by forming core parts 2 embedded into the clad layer 3 on the front surface 9 side of a substrate 1. Next, the fixed width grooves 10 are formed by using an etching liquid which does not react with the substrate 1 in the guide groove forming parts of the clad layers 3b on both sides across the region where the core parts 2 are formed. The substrate front surface 9 side exposed in these fixed width grooves 10 are anisotropically etched by using the etching liquid which does not react with the clad layers 3b with the clad layers 3b as a mask and, thereafter, the positioning grooves 16 having a V shape are formed. The positioning parts formed on the connecting end member side are positioned into these grooves 16, by which the waveguide chip 13 and the connecting end member are fitted and fixed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical waveguide module used for optical communication, for example, connected to a multi-fiber optical fiber connector or the like.

[0002]

2. Description of the Related Art In order to use a waveguide chip having an optical waveguide formed on a substrate for optical communication, an optical waveguide module in which the waveguide chip is modularized is widely known. When connecting the optical waveguide of this optical waveguide module and the optical fiber of the optical array formed by aligning and fixing a single-core optical fiber or a multi-core optical fiber, it is generally used to align and connect each other by adhesion or welding. However, this work is very time-consuming and poor in workability. Recently, a connection method for connecting the optical waveguide and the optical fiber in an unaligned state has been studied.

FIG. 4 shows one end of an optical waveguide module (not yet published) proposed by the applicant of the present invention. As shown in the figure, the proposed device is embedded in the clad layer 3 and the clad layer 3 formed by, for example, the flame deposition method on the substrate 1 formed of silicon (Si) or quartz glass. It has a waveguide chip 13 on which a plurality of core portions 2 (which function as optical waveguides) are formed, and the end face of the core portion 2 of this waveguide chip 13 is exposed at the connection end face 25a of the waveguide chip 13, They are arranged at a predetermined pitch.

Although only one end side of the optical waveguide module is shown in the figure, the other end side of this optical waveguide module is also formed in the same manner as in the figure, and the waveguide chip
The connection end surface 25b (not shown) on the other end side of 13 is also exposed, and the end surface of the core portion 2 is connected to the connection end surface 25b as shown in FIG. 6 (b).
It is exposed to b.

A connection end member (fitting member) 14 is provided on each of the connection end surfaces 25a and 25b of the waveguide chip 1. The connecting end member 14 is a through hole having a substantially rectangular cross section that is fitted around the outer peripheral side of the waveguide chip 13 with the connecting end surfaces 25a and 25b of the waveguide chip 13 exposed. 17 is formed, and the waveguide chip is
13 is fitted and attached, and is adhesively fixed with a thermosetting adhesive or the like. Each of the connection end members 14 is an integrally molded product manufactured by transfer molding using, for example, a filler-containing epoxy resin or the like, and guide pins for connection are inserted and fitted on both sides sandwiching the fitting hole portion 17. Penetrating fitting pin insertion holes 4a and 4b are formed as connecting pin fitting holes. The fitting pin insertion holes 4a and 4b are
For example, 4.6 mm at the position where the axis matches the pin hole of the multi-fiber optical fiber connector connected to this optical waveguide module.
It is formed with a pitch.

On both sides of the upper surface 18 of the waveguide chip 1,
A V-shaped positioning groove 16 is provided at a position avoiding the core portion 2.
The waveguide chip 13 is formed to extend over the entire length in the longitudinal direction, and the fitting hole 17 of the connection end member 14 facing the upper surface 18 of the waveguide chip 13 is provided with a positioning groove 16 on the facing surface 19 side. At the position, a mountain-shaped protrusion 20 for positioning is formed respectively. The positioning groove 16 is formed by machining, for example. Then, by fitting the protrusion 20 into the positioning groove 16, the waveguide chip 13 and the connection end member 14 are positioned, and in this state, the waveguide chip 13 and the connection end member 14 are adhesively fixed. An optical waveguide module is formed.

The waveguide chip 13 of this optical waveguide module
Is produced as follows. First, FIG. 5 (a)
On the silicon substrate 1 (surface 9 of the substrate 1 as shown in FIG.
On the side), the lower clad layer 3a and the core layer 2a are sequentially formed by using, for example, a flame deposition method or the like. Next, in FIG.
As shown in FIG. 3, the mask pattern is transferred to the surface of the core layer 2 a to pattern the optical waveguide, and the core portion 2 is formed in the longitudinal direction of the substrate 1. Then, by forming the clad layer 3b on the upper surface side of the core part 2, the core part 2 is embedded by the upper clad layer 3b. In this way, the optical waveguide film 30 formed by the clad layer 3 (the lower clad layer 3a, the upper clad layer 3b) and the core portion 2 is formed on the substrate 1.

Next, as shown in (d) of the figure, the core portion 2 is ground by a grinding process using a grindstone or a precision grinder with reference to a guide groove processing marker produced at the same time as patterning of the optical waveguide. The V-shaped positioning groove 16 is formed on both sides of the formation region of. The positioning groove 16 is formed with a predetermined depth in the longitudinal direction of the optical waveguide formed by the waveguide chip 13 and the core portion 2.

[0009]

In the above proposed optical waveguide module, the positioning of the waveguide chip 13 and the connecting end member 14 is performed by positioning the positioning groove 16 on the waveguide chip 13 side and the connecting end member 14 side. Since it is performed by fitting with the protrusion 20, the positional deviation of the positioning groove 16 and the protrusion 20 causes the fitting position of the waveguide chip 13 and the connection end member 14 to be displaced. Then, the waveguide chip 13 and the connection end member 14
When the fitting position shifts from the core 2 of the waveguide chip 13,
And the guide pin insertion holes 4a and 4b of the connection end member 14 are displaced relative to each other, so that the core portion 2 of this optical waveguide module and the fitting guide pins inserted into the guide pin insertion holes 4a and 4b are inserted. The optical axis of the multi-fiber optical fiber connector connected to the optical waveguide module via the optical axis shifts, resulting in an increase in connection loss between the core portion 2 and the optical fiber.

Therefore, the positioning groove 16 of the waveguide chip 13
Must be formed with good positional accuracy, for example, on the order of sub-μm. However, in the proposed optical waveguide module, in order to form the positioning groove 16 by grinding in the state in which the optical waveguide film 30 having a different thermal expansion coefficient from the substrate 1 is formed on the substrate 1, (see FIG. As shown in a), since the waveguide chip 13 is ground by the grindstone 22 or the like while being warped in the longitudinal direction of the waveguide chip 13 due to the difference in thermal expansion coefficient between the substrate 1 and the optical waveguide film 30. The positioning groove 16 has a problem that a large processing error occurs in the depth direction. It is to be noted that FIG. 11B shows a method of forming the positioning groove 16 on the surface side of the waveguide chip 13 by the grindstone 22 as viewed from the surface side of the waveguide chip 13.

Therefore, the waveguide chip 13 and the connection end member 14
It becomes impossible to accurately position them in the height direction of the waveguide chip 13 (the direction perpendicular to the substrate surface, that is, the vertical direction in the figure), and as a result, as described above, This leads to an increase in the connection loss between the module and the optical component such as the multi-fiber optical fiber connector on the other end of the connection.

The present invention has been made to solve the above problems, and an object thereof is to be able to accurately form a positioning groove on the side of a waveguide chip, thereby allowing the waveguide chip and the connecting end member to be formed. An object of the present invention is to provide a method of manufacturing an optical waveguide module capable of forming and aligning and with high accuracy.

[0013]

Means for Solving the Problems To achieve the above object, the present invention provides means for solving the problems by the following constitution. That is, according to the present invention, a core portion is formed by embedding a clad layer on the front surface side of a substrate, and the clad layer that embeds the core portion overhangs the substrate surface on both sides of the core portion to cover the substrate surface, Etching is performed using an etchant that does not react with the substrate on the guide groove forming portions of the clad layers on both sides of the core formation region to form a constant width groove on the upper clad layer of the substrate. A guide groove having a sloped side wall on the substrate surface side is formed by anisotropically etching the surface side of the substrate exposed in the constant width groove as a mask using an etching solution that does not react with the cladding layer, and the guide groove is It forms a chip side positioning groove of a waveguide chip consisting of a substrate, a clad layer and a core part, and contacts the both sides of the connection end face of the waveguide chip with the connection end face of the waveguide chip exposed. An end member is fitted and mounted, and a positioning portion provided on the connection end member side is aligned with a chip side positioning groove of the waveguide chip to fix the waveguide chip and the connection end member. Has been done.

In the present invention having the above-mentioned structure, the core portion and the clad layer for embedding the core portion are formed on the front surface side of the substrate. The clad layer is formed so as to project to the substrate surface side on both sides of the core portion. The guide groove formation part of the clad layer that bulges out to the substrate surface side on both sides of the core part formation region sandwiching the part formation region is etched with an etching liquid that does not react with the substrate, and is formed on the clad layer above the substrate. A width groove is formed. Then, the surface side of the substrate exposed in the constant width groove using the clad layer as a mask is anisotropically etched using an etching solution that does not react with the clad layer to form a guide groove on the surface side of the substrate. And a chip side positioning groove of the waveguide chip consisting of the cladding layer and the core portion.

As described above, in the present invention, since the chip-side positioning groove of the waveguide chip is formed by etching, the accuracy of the etching portion, etching width, and etching depth, which are the features of the etching technique, are utilized. Thus, the guide groove as the chip side positioning groove is formed at the position as designed, at the correct pitch, and at the correct depth.

Then, the connection end members are fitted and mounted on both sides of the connection end face of the waveguide chip, and the positioning portion provided on the connection end member side is aligned with the chip side positioning groove accurately formed as described above. Since the waveguide chip and the connecting end member are fixed to each other, the waveguide chip and the connecting end member are accurately aligned and fitted and fixed in the present invention, and the above problem is solved.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. In the description of the present embodiment, the same reference numerals are given to the same components as those in the above description, and the overlapping description will be omitted. FIG. 1 shows a main configuration of an embodiment of a method for manufacturing an optical waveguide module according to the present invention. Further, in FIG. 2A, an example of an optical waveguide module manufactured by using the method of manufacturing an optical waveguide module of the present embodiment is shown in a perspective view by a guide pin.
It is shown with 33, and the front view is shown by (b) of the same figure.

As shown in FIG. 2, an optical waveguide module manufactured by using the method for manufacturing an optical waveguide according to the present embodiment also has a waveguide chip 13 and this waveguide, as in the proposed optical waveguide module. A structure is provided with connection end members 14 that are fitted to the connection end faces 25a and 25b (not shown in FIG. 2) of the chip 13 in a state where the connection end faces 25a and 25b of the waveguide chip 13 are exposed. The most characteristic feature of this optical waveguide module different from the above-mentioned proposed optical waveguide module is that the positioning groove 16 formed at the position avoiding the core portion 2 on the upper surface 18 side of the waveguide chip 13 is etched. Is formed by.

In this optical waveguide module, the core portion 2 is formed in a rectangular shape having a cross section of 8 μm on each side.
A plurality (eight in the figure) are arranged and embedded in the clad layer 3. As shown in FIG. 2B, this clad layer 3 is composed of a lower clad layer 3a and an upper clad layer 3b, and the surface 8 of the lower clad layer 3a is flush with the surface 9 of the substrate 1. In addition, this surface and the bottom surface of the core portion 2 are formed on the same surface. The upper clad layer 3b is formed so as to overhang the substrate surface 9 on both sides of the core portion 2 and cover the surface 9 of the substrate 1. The upper clad layer 3b overhanging on the surface 9 side of the substrate 1 is formed in the upper clad layer 3b. The constant width groove 10 (see (e) and (f) in FIG. 1) having a predetermined width is formed in the position where the positioning groove (guide groove) 16 is formed.
It is extended and formed in 13 longitudinal directions.

In this optical waveguide module, the connection end member 14 is fitted and attached from the upper side of the waveguide chip 13, and the upper surface 18 side and the side surface side of the waveguide chip 13 are U-shaped. It is covered by the shaped fitting recess 5. This connecting end member 14 is an integrally molded product manufactured by transfer molding a filler-containing epoxy resin or the like, similarly to the above-mentioned proposed optical waveguide module, and an opposing surface facing the upper surface 18 of the waveguide chip 13. A protrusion 20 as a positioning portion is formed at 19.

Fitting pin insertion holes 4a, 4b similar to those of the above-mentioned proposed device are provided on both sides of the waveguide chip 13 with the core portion 2 interposed therebetween.
Are formed, and these fitting pin insertion holes 4a and 4b are formed.
The line connecting the centers B is formed to be 4 μm above the surface 9 of the substrate 1 and the surface 8 of the lower clad layer 3a. As a result, in the optical waveguide module shown in FIG. The center of the core portion 2 of the waveguide chip 13 is located on the line connecting the centers B of the mating pin insertion holes 4a and 4b.

Next, a method of manufacturing the optical waveguide module of this embodiment will be described with reference to FIG. First, as shown in FIG. 1A, a waveguide film forming recess 21 is formed in the central portion on the surface 9 side of a flat substrate 1 made of, for example, silicon or quartz glass. The waveguide film forming recess 21 is formed by grinding or etching to a predetermined depth, for example, by machining or etching. Next, as shown in (b) of FIG.
The lower clad layer 3a is formed by depositing a quartz film or the like on the surface 9 side of the substrate 1 containing the and making it transparent.

Then, as shown in FIG. 3C, the lower clad layer 3a is surface-ground to expose the surface 9 of the substrate 1. By doing so, the lower cladding layer 3a
The surface 8 of the substrate 1 and the surface 9 of the substrate 1 are flush with each other.

Next, as shown in FIG. 5D, an optical waveguide film forming process (photolithography) as shown in FIGS. 5B to 5C is formed on the surface 8 side of the lower cladding layer 3a. ) And the like, for example, eight rectangular core portions 2 having a cross section of 8 μm square are formed by a process using
Further, the core portion 2 is embedded with an upper clad layer 3b made of a quartz film. As shown in the figure, the upper clad layer 3b is formed on both sides of the core portion 2 so as to project toward the substrate surface 9 and cover the substrate surface 9.

Next, a mask 24 for clad layer etching is formed in a region of the clad layer 3 (upper clad layer 3b) on both sides of the region where the core portion 2 is formed, excluding the guide groove formation region. Etching is performed using an etchant such as an etchant that does not react with the substrate 1, and as shown in FIG.
A constant width groove 10 having a predetermined width is formed in (3b). When etching is performed using a fluorine-based etchant or the like that does not react with the substrate 1, due to the etching rate, the upper clad layer 3b is not formed until the surface 9 of the substrate 1 is reached.
Can be vertically etched with a predetermined opening width W. Therefore, as shown in FIG.
A constant width groove 10 having the above-mentioned predetermined opening width W is formed in the inner surface of the waveguide chip 13 so as to extend in the longitudinal direction.

Next, using the upper clad layer 3b as a mask, the surface 9 side of the substrate 1 exposed in the constant width groove 10 is anisotropically etched using an etching solution that does not react with the clad layer 3 (3b). As a result, as shown in (f) of the same drawing, a V-shaped guide groove having the slope 23 as a side wall is formed on the surface 9 side of the substrate 1, and this guide groove is used as the positioning groove 16. Since the etching depth H of the V-shaped positioning groove 16 is formed depending on the opening width W of the constant width groove 10, the positioning groove 16 having a desired etching depth H is formed. The opening width W is obtained in advance, and the obtained opening width W
The positioning groove 16 having a desired depth is formed by forming the constant width groove 10 having the above as described above.

Then, the connecting end member 14 is fitted and mounted from the upper side of the waveguide chip 13 manufactured as described above, and the projection 20 provided on the connecting end member 14 side is provided with the positioning groove 16 of the waveguide chip 13. 2 and by fitting the protrusion 20 into the positioning groove 16 and adhering and fixing the waveguide chip 13 and the connecting end member 14 in this state, the optical waveguide module as shown in FIG. It is formed.

According to the present embodiment, since the positioning groove 16 is formed by etching as described above, it is needless to say that the positioning groove 16 can be formed accurately, not to mention the formation site and pitch interval. Yes, and as mentioned above
A constant width groove 10 having an opening width W corresponding to a desired etching depth H
Is formed in the upper clad layer 3b, and the surface 9 side of the substrate 1 exposed in the constant width groove 10 is anisotropically etched to accurately form the positioning groove 16 having a desired depth.

Therefore, by fitting the protrusion 20 on the connection end member 14 side into the positioning groove 16, the waveguide chip
It becomes possible to accurately align 13 and the connection end member 14, and by fixing the waveguide chip 13 and the connection end member 14 in that state, it is possible to align the optical waveguide very accurately as designed. Modules can be made.

Moreover, according to this embodiment, the surface 9 of the substrate 1 and the bottom surface of the core portion 2 are formed on the same surface, and
As described above, since the depth of the positioning groove 16 can be accurately formed, the center of the core portion 2 and the center B of each of the fitting pin insertion holes 4a and 4b can be easily and surely aligned on the same line. You can Therefore, for example, the optical waveguide module manufactured by the method of manufacturing the optical waveguide module of the present embodiment is, for example, a multi-fiber optical fiber connector via the fitting guide pin 33 inserted into the fitting pin insertion holes 4a and 4b. It is possible to accurately perform optical connection between the core portion 2 of the optical waveguide module and the optical fiber of the multi-fiber optical fiber connector without connecting the optical parts such as the above.

The present invention is not limited to the above-described embodiment, but can adopt various embodiments. For example,
In the above embodiment, the waveguide chip 13 has a cross section of 8 μm.
Eight rectangular corner-shaped core portions 2 were formed, but the shape, the number, and the disposition state of the core portions 2 are not particularly limited.
It is set appropriately. For example, the number of core parts 2 may be one, or a plurality of core parts other than eight may be used, and the core parts 2 are appropriately set by corresponding to the optical component of the connection partner.

In the above embodiment, the surface 9 of the substrate 1 exposed in the constant width groove 10 is anisotropically etched to form a symmetrical V-shaped positioning groove having the slope 23 as a side wall.
Although 16 is formed, the positioning groove 16 may be a groove having a slope formed by anisotropic etching as a side wall, and may be, for example, a U-shaped groove or an asymmetric V-shaped groove (for example, the substrate surface 9). It may be a V-shaped groove formed on the surface perpendicular to the plane and on the slope.

Further, in the above embodiment, the constant width groove 10 formed in the cladding layer 3 of the waveguide chip 13 is a groove perpendicular to the surface 9 of the substrate 1, but the constant width groove 10 is, for example, As shown by the chain line in (e) of FIG. 1, the side wall 31 may be a groove formed obliquely with respect to the substrate surface 9.

As described above, in the method for producing an optical waveguide module of the present invention, the constant width formed in the cladding layer has a predetermined width at the bottom of the groove, that is, the substrate surface exposed by the constant width groove. If it is a groove, by anisotropically etching the substrate surface exposed in this constant width groove,
A guide groove (chip-side positioning groove) having a desired depth can be accurately formed.

Further, in the above-described embodiment, the protrusion 20 is formed on the side of the connection end member 14 as the positioning portion for the positioning groove 16. However, for example, as shown in FIG. The positioning groove 16 is provided on the facing surface 19 side facing the upper surface 18 of the
Even if the inverted V-shaped groove 12 is formed at a position corresponding to the position and an optical fiber or the like is provided between the positioning groove 16 and the inverted V-shaped groove 12, the waveguide chip 13 and the connection end member 14 are fixed. Good. in this way,
The method of forming the positioning portion on the side of the connection end member 14 is not particularly limited and may be set appropriately, and in the method for manufacturing the optical waveguide module of the present invention, as in the above-described embodiment, etching is performed. An accurate positioning groove 16 is formed on the waveguide chip 13 side by this, and the positioning groove 16 and the positioning portion provided on the connection end member 14 side are aligned to fix the waveguide chip 13 and the connection end member 14. You can do it like this.

Further, in the above embodiment, the connecting end member 14 having the U-shaped fitting concave portion 5 for fitting the waveguide chip 13 is formed and fitted to the waveguide chip 13. The shape and the like of the connecting end member 14 are not particularly limited and may be set appropriately. Further, the connection end member 14 is not necessarily an integrally molded product obtained by transfer molding of a filler-containing epoxy resin, and the waveguide chip
A connection end member that fits on the upper side of 13 and a connection end member 14 that fits on the side surface side of the waveguide chip 13 are individually formed, and fitted on the waveguide chip 13 to form an optical waveguide module. Good.

Further, in the above embodiment, the positioning groove
Although one 16 is formed on each side of the waveguide chip 13 on both sides of the core portion 2 forming region, a plurality of positioning grooves 16 may be formed on both sides of the core portion 2.

Further, in the above embodiment, the connecting end member
The fitting pin insertion holes 4a and 4b are provided in the waveguide 14, and the waveguide chip 13 is provided on the line connecting the centers B of the fitting pin insertion holes 4a and 4b.
Although the center of the optical axis of the core part 2 is located, the center of the core part 2 is not always formed on the line connecting the fitting pin insertion holes 4a and 4b. However, in the conventional multi-fiber optical fiber connector generally used, the optical axis of the optical fiber of the multi-fiber optical fiber connector is located on the line connecting the centers of the pin holes of the connector. When it is desired to connect the optical waveguide module to such a multi-core optical fiber connector, the center of the core portion is the fitting pin insertion hole 4 as in the above embodiment.
It may be formed on the line connecting a and 4b. The shape and the like of the pin insertion holes 4a and 4b are not particularly limited and may be set appropriately.

[0039]

According to the present invention, a cladding layer is formed on the substrate surface on both sides of the core portion of the waveguide chip, and an etching solution which does not react with the substrate is used for the guide groove forming portion of the protruding cladding layer. Etching is performed to form a constant width groove in the clad layer on the upper side of the substrate, and then using this clad layer as a mask, the surface side of the substrate exposed in the constant width groove is anisotropic using an etchant that does not react with the clad layer. Since the guide groove having the sloped side wall is formed on the surface side of the substrate by the selective etching, the guide groove can be formed at the accurate arrangement pitch in the guide groove forming portion.

In addition, since the guide groove can control the etching depth of the anisotropic etching by adjusting the opening width W of the constant width groove, the depth of the guide groove is desired. It becomes possible to form the guide groove accurately, and even if the substrate warps, the guide groove is not affected by the warp, and the guide groove can be formed extremely accurately with a uniform depth. Therefore, it is possible to solve the problem that the groove depth varies due to the warp of the substrate, which is a problem when the guide groove as the positioning groove is ground by using a grindstone or the like.

Further, according to the present invention, the guide grooves accurately formed at the guide groove forming portions with the extremely accurate and uniform depth and the accurate arrangement pitch are used as the chip side positioning grooves of the waveguide chip, In order to align the positioning portion provided on the connection end member side with the chip side positioning groove of the waveguide chip to fix the waveguide chip and the connection end member, the alignment between the waveguide chip and the connection end member is performed. It is possible to carry out very accurately, and it is possible to manufacture an optical waveguide module that is accurately aligned as designed, with a high yield.

Therefore, for example, a fitting pin insertion hole is provided on the side of the connecting end member so as to sandwich the core portion of the waveguide chip to manufacture an optical waveguide module, and the fitting pin insertion hole is fitted. When connecting the optical waveguide module and the optical component on the other side of the connection through a guide pin, etc., the optical axis of the optical component and the optical axis of the core can be accurately aligned. An optical waveguide module manufactured by using the method for manufacturing an optical waveguide module of the present invention can be used as a device that can be optically connected to an optical component on a connection partner side with low connection loss.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an optical waveguide chip manufacturing process in an embodiment of an optical waveguide module manufacturing method according to the present invention.

FIG. 2 is a configuration diagram showing an example of an optical waveguide module manufactured by using the manufacturing method according to the embodiment.

FIG. 3 is an explanatory view showing an example of an optical waveguide module manufactured by using another embodiment of the method for manufacturing an optical waveguide module of the present invention.

FIG. 4 is an explanatory diagram showing an example of an optical waveguide module previously proposed by the applicant.

FIG. 5 is an explanatory diagram showing a method of manufacturing a waveguide chip of the optical waveguide module of the above proposed example.

FIG. 6 is an explanatory diagram showing a problem in the method of manufacturing the optical waveguide module of the above-mentioned proposed example.

[Explanation of symbols]

 2 core part 3 clad layer 4a, 4b mating pin insertion hole 9 substrate surface 10 constant width groove 13 waveguide chip 14 connection end member 16 positioning groove

(72) Inventor Manki Watanabe 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. (72) Inventor Takeo Shimizu 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Industry Co., Ltd. (72) Inventor Shinji Nagasawa 3-19-2 Nishishinjuku, Shinjuku-ku, Tokyo Nippon Telegraph and Telephone Corporation (72) Inventor Mitsuru Kihara 3-19-3 Nishishinjuku, Shinjuku-ku, Tokyo Nippon Telegraph and Telephone Corporation

Claims (1)

[Claims] 1. A core portion is formed by embedding a clad layer on the front surface side of a substrate, and the clad layer that embeds the core portion overhangs the substrate surface on both sides of the core portion to cover the substrate surface. Part of the clad layer on both sides of the formation region is etched using an etching solution that does not react with the substrate to form a constant width groove on the upper clad layer of the substrate, and then this clad layer is masked. As a guide groove having a sloped side wall on the substrate surface side is formed by anisotropically etching the surface side of the substrate exposed in the constant width groove with an etchant that does not react with the cladding layer, and the guide groove is formed on the substrate. And a clad layer and a core part to form a chip side positioning groove of the waveguide chip, and the connection end member is exposed in both sides of the connection end face of the waveguide chip. Is fitted and mounted, and the positioning portion provided on the side of the connection end member is aligned with the chip side positioning groove of the waveguide chip to fix the waveguide chip and the connection end member. How to make a module.