JPH09166723A - Optical waveguide module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical waveguide module capable of connecting optical parts to be connected in a non-centering state and a low connection loss state. SOLUTION: Connection end members 14 are fitted/engaged to/with the connection end faces 25a, 25b of an waveguide chip 13 to constitute an optical waveguide module. In the chip 13, an optical waveguide layer 30 consisting of a lower clad layer 3a, a core part 2 and an upper clad layer 3b is formed on a wavegude layer forming recessed part formed on the surface 9 side center part of a base 1 so as to be projected from the surface 9 of the base 1, the bottom of the core part 2 is set up to the same face as the surface 9 and the surface 9 parts on both the sides of the layer 30 are set up as chip side positioning parts 7a, 7b. Each connection end member 14 is constituted of an engaging recessed part 5 to be engaged with the layer 30 and positioning parts 6a, 6b formed on both the sides of the recessed part 5 and the positioning parts 6a, 6b are abutted upon the positining parts 7a, 7b to position and engage the member 14 with the chip 13. The center of the core part 2 is set to the same height as the center B of engaging pin inserting holes 4a, 4b formed on the member 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical waveguide module used, for example, for optical communication and connected to a multi-fiber optical fiber connector or the like.

[0002]

2. Description of the Related Art In order to use a waveguide chip having an optical waveguide formed on a substrate for optical communication, an optical waveguide module in which the waveguide chip is modularized is widely known. When connecting the optical waveguide of this optical waveguide module and the optical fiber of the optical array formed by aligning and fixing a single-core optical fiber or a multi-core optical fiber, it is generally used to align and connect each other by adhesion or welding. However, this work is very time-consuming and poor in workability. Recently, a connection method for connecting the optical waveguide and the optical fiber in an unaligned state has been studied.

FIG. 4 shows one end of an optical waveguide module (not yet published) proposed by the applicant of the present invention. As shown in the figure, the proposed device is embedded in a clad portion 3 formed by, for example, a flame deposition method and a clad portion 3 on a substrate 1 formed of silicon (Si) or quartz glass. It has a waveguide chip 13 in which a plurality of core portions 2 (functioning as optical waveguides) are formed, and the end face of the core portion 2 of this waveguide chip 13 is exposed at the connection end face 25a of the waveguide chip 13, They are arranged at a predetermined pitch.

Although only one end side of the optical waveguide module is shown in the figure, the other end side of this optical waveguide module is also formed in the same manner as in the figure, and the waveguide chip
The connection end surface 25b (not shown) on the other end side of 13 is also exposed, and the end surface of the core portion 2 is connected to the connection end surface 25b as shown in FIG. 6 (b).
It is exposed to b.

A connection end member (fitting member) 14 is provided on each of the connection end surfaces 25a and 25b of the waveguide chip 1. The connecting end member 14 is a through hole having a substantially rectangular cross section that is fitted around the outer peripheral side of the waveguide chip 13 with the connecting end surfaces 25a and 25b of the waveguide chip 13 exposed. 17 is formed, and the waveguide chip is
13 is fitted and attached, and is adhesively fixed with a thermosetting adhesive or the like. Each of the connection end members 14 is an integrally molded product manufactured by transfer molding using, for example, a filler-containing epoxy resin or the like, and guide pins for connection are inserted and fitted on both sides sandwiching the fitting hole portion 17. Penetrating fitting pin insertion holes 4a and 4b are formed as connecting pin fitting holes. The fitting pin insertion holes 4a and 4b are
For example, 4.6 mm at the position where the axis matches the pin hole of the multi-fiber optical fiber connector connected to this optical waveguide module.
It is formed with a pitch.

On both sides of the upper surface 18 of the waveguide chip 1,
A V-shaped positioning groove 16 is provided at a position avoiding the core portion 2.
The waveguide chip 13 is formed to extend over the entire length in the longitudinal direction, and the fitting hole 17 of the connection end member 14 facing the upper surface 18 of the waveguide chip 13 is provided with a positioning groove 16 on the facing surface 19 side. At the position, a mountain-shaped protrusion 20 for positioning is formed respectively. The positioning groove 16 is formed by machining, for example. Then, by fitting the protrusion 20 into the positioning groove 16, the waveguide chip 13 and the connection end member 14 are positioned, and in this state, the waveguide chip 13 and the connection end member 14 are adhesively fixed. An optical waveguide module is formed.

The waveguide chip 13 of this optical waveguide module
Is produced as follows. First, FIG. 5 (a)
On the silicon substrate 1 (surface 9 of the substrate 1 as shown in FIG.
On the side), the lower clad layer 3a and the core layer 2a are sequentially formed by using, for example, a flame deposition method or the like. Next, in FIG.
As shown in FIG. 3, the mask pattern is transferred to the surface of the core layer 2 a to pattern the optical waveguide, and the core portion 2 is formed in the longitudinal direction of the substrate 1. Then, by depositing and forming the clad layer 3b on the upper surface side of the core part 2, the core part 2 is embedded by the upper clad layer 3b. By doing so, the optical waveguide layer 30 formed by the lower clad layer 3a, the core portion 2, and the upper clad layer 3b is formed on the substrate 1.

Next, as shown in (d) of the figure, the core portion 2 is ground by a grinding process using a grindstone or a precision grinder with reference to a guide groove processing marker produced at the same time as patterning of the optical waveguide. The V-shaped positioning groove 16 is formed on both sides of the formation region of. The positioning groove 16 is formed with a predetermined depth in the longitudinal direction of the optical waveguide formed by the waveguide chip 13 and the core portion 2.

[0009]

In the above proposed optical waveguide module, the positioning of the waveguide chip 13 and the connecting end member 14 is performed by positioning the positioning groove 16 on the waveguide chip 13 side and the connecting end member 14 side. Since it is performed by fitting with the protrusion 20, the positional deviation of the positioning groove 16 and the protrusion 20 causes the fitting position of the waveguide chip 13 and the connection end member 14 to be displaced. Then, the waveguide chip 13 and the connection end member 14
When the fitting position shifts from the core 2 of the waveguide chip 13,
And the guide pin insertion holes 4a and 4b of the connection end member 14 are displaced relative to each other, so that the core portion 2 of this optical waveguide module and the fitting guide pins inserted into the guide pin insertion holes 4a and 4b are inserted. The connection loss with the optical fiber of the multi-fiber optical fiber connector connected to the optical waveguide module via the optical fiber module occurs.

Therefore, the positioning groove 16 of the waveguide chip 13
Must be formed with good positional accuracy, for example, on the order of sub-μm. However, in the proposed optical waveguide module, in order to form the positioning groove 16 in the state where the optical waveguide layer 30 having a different thermal expansion coefficient from the substrate 1 is formed on the substrate 1, as shown in FIG. So that the waveguide chip 13
However, since the substrate 1 and the optical waveguide layer 30 are ground by the grindstone 22 or the like in a state of being warped in the longitudinal direction of the waveguide chip 13 due to the difference in thermal expansion coefficient between the substrate 1 and the optical waveguide layer 30, the positioning groove 16 is formed in the depth direction thereof. There is a problem that a large processing error occurs. It is to be noted that FIG. 11B shows a method of forming the positioning groove 16 on the surface side of the waveguide chip 13 by the grindstone 22 as viewed from the surface side of the waveguide chip 13.

Therefore, the waveguide chip 13 and the connection end member 14
It becomes impossible to accurately position them in the height direction of the waveguide chip 13 (the direction perpendicular to the substrate surface, that is, the vertical direction in the figure), and as a result, as described above, This leads to an increase in the connection loss between the module and the optical component such as the multi-fiber optical fiber connector on the other end of the connection.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a multi-fiber optical fiber connector or the like with a mating side even if the waveguide chip is not centered in the height direction. An object of the present invention is to provide an optical waveguide module that can be connected to an optical component with high accuracy, for example, on the order of sub-μm, with low connection loss.

[0013]

Means for Solving the Problems To achieve the above object, the present invention provides means for solving the problems by the following constitution. That is, according to the present invention, a waveguide layer forming recess is formed in the central portion on the front surface side of a substrate, and a lower clad layer is formed in the waveguide layer forming recess so that its surface is flush with the substrate surface. A core portion and an upper clad layer for burying the core portion are provided on the surface side of the lower clad layer, and an optical waveguide layer is formed by the upper clad layer, the core portion and the lower clad layer, A waveguide chip is formed such that the surface side of the optical waveguide layer protrudes from the substrate surface to form a mesa shape, and the connection end surface of the waveguide chip is exposed on both sides of the connection end surface of the waveguide chip. At least each of the connecting end members having fitting recesses for fitting at least both sides and the upper surface of the mesa shape of the optical waveguide layer are provided, and each of these connecting end members is formed on both sides of the fitting recess. Connection end member The positioning chip is fitted and attached to the waveguide chip in a state where both sides of the substrate surface sandwiching the optical waveguide layer of the waveguide chip are in contact with the substrate surface which is the chip side positioning part. The connecting end member is characterized in that connecting pin fitting holes are formed on both sides sandwiching the waveguide chip.

Further, the core portion of the waveguide chip is formed such that its center is formed on a line connecting the centers of the connection pin fitting holes formed on both sides of the waveguide chip. It has a characteristic structure.

In the present invention having the above-mentioned structure, the surface side of the optical waveguide layer formed by the lower clad layer, the core portion and the upper clad layer protrudes from the substrate surface of the waveguide chip to form a mesa shape. Both side surfaces and the upper surface of the waveguide are fitted by being fitted in by the fitting recesses of the connecting end member, and the connecting end member has the connecting end member side positioning portions formed on both sides of the fitting recess, and the optical waveguide of the waveguide chip. The waveguide chip is mounted and fitted in contact with the surface of the substrate, which is the chip side positioning portion on both sides of the layer.

When a waveguide chip is formed by forming an optical waveguide layer having a coefficient of thermal expansion different from that of the substrate on the surface of the substrate to form a waveguide chip, the waveguide chip is warped due to the difference in the coefficient of thermal expansion. There is no processing error in the depth direction of the groove, that is, the height direction of the waveguide chip as in the case where the positioning groove is formed on the surface side of the waveguide chip. Since the substrate surface is well formed, when the substrate surface and the positioning portion of the connecting end member are brought into contact with each other by using the substrate surface as a positioning portion on the waveguide chip side, the connecting end member is fitted and mounted on the waveguide chip. The relative position in the height direction between the tip and the connecting end member is surely positioned and fitted with a very high accuracy.

Further, in the present invention, the surface of the substrate and the surface of the lower clad layer are flush with each other, and the core portion is formed on the surface side of the lower clad layer, so that the connection end member is positioned. Since the bottom surface of the core part is formed on the same surface as the substrate surface, it is possible to accurately position the relative position between the optical axis center position of the core part and the connection end member. Is very easy to position. For example, the core is formed so that the center of the core is on the line connecting the centers of the connection pin fitting holes on both sides of the connection end member, and the core is connected to the multi-fiber optical fiber connector or the like on the other end of the connection through the connection pin fitting holes. If the connection is made, the core portion and the optical fiber of the optical fiber connector are surely opposed to each other at the same height, and the optical fiber of the optical fiber connector and the core portion are connected in an unaligned and accurate manner, and the above problems are solved. .

[0018]

Embodiments of the present invention will be described below with reference to the drawings. In the description of the present embodiment, the same reference numerals are given to the same components as those in the above description, and the overlapping description will be omitted. FIG. 1A is a perspective view showing a main configuration of an optical waveguide module according to a first embodiment of the present invention, and FIG. 1B is a front view thereof. ing. As shown in these figures, also in the present embodiment example, the waveguide chip 13 and the waveguide chip 13 on the connection end faces 25a and 25b side of the waveguide chip 13 are respectively provided in the same manner as the proposed optical waveguide module. It is configured to have a connection end member 14 to be fitted with the connection end surfaces 25a and 25b being exposed.

In these figures, a waveguide film forming recess 21 is formed in the central portion of the waveguide chip 13 on the surface 9 side of the substrate 1, and this waveguide layer forming recess 21 has a lower cladding. The layer 3a is formed. Lower clad layer 3a
Is formed so that its surface 8 is substantially flush with the substrate surface 9 with high accuracy of, for example, 1 μm or less,
On the surface 8 side of the lower clad layer 3a, a cross section of one side 8
A rectangular core portion 2 of μm and an upper clad layer 3 a for burying the core portion 2 are formed.
b, the optical waveguide layer by the lower clad layer 3a and the core portion 2
30 are formed. The surface side of the optical waveguide layer 30 has a mesa shape protruding from the surface 9 of the substrate 1, and the waveguide chip 13 is formed by the optical waveguide layer 30 and the substrate 1. The substrate surfaces 9 on both sides sandwiching the optical waveguide layer 30 are respectively formed as chip side positioning portions 7a and 7b.

On the other hand, the connection end member 14 includes a waveguide chip 13
With the connecting end surfaces 25a and 25b of the optical waveguide layer exposed, at least both side surfaces of the mesa shape of the optical waveguide layer 30 and the upper surface 18 are formed with fitting recesses 5, which are fitted on both sides of the fitting recesses 5. Are formed with connection end member side positioning portions 6a and 6b, respectively. It is formed such that the centers of the fitting pin insertion holes 4a and 4b are located 4 μm above the line connecting the positioning portions 6a and 6b, and the connecting end member 14 is a chain line A in the figure.
It is symmetrical about the center. Mating pin insertion hole 4
Each of a and 4b has a circular shape and is formed at a pitch of 4.6 mm, for example, and has the same pitch and the same size as the pin hole of the multi-core optical fiber connector connected to this optical waveguide module.

In this embodiment, the connection end member 14 is mounted from the upper side of the waveguide chip 13,
The upper surface side and the side surface side thereof are covered with the connection end member 14. Then, both sides of the mesa shape of the optical waveguide layer 30 of the waveguide chip 13 and the upper surface 18 are surrounded by the fitting recess 5 of the connection end member 14, and are fitted without contacting with the fitting recess 5. ,And,
The positioning portions 6a and 6b of the connection end member 14 are positioned in contact with the substrate surface 9 formed with the chip side positioning portions 7a and 7b of the waveguide chip 13, respectively, and in that state, An optical waveguide module is formed by adhesively fixing the connection end member (14). As described above, in the present embodiment, since the connection end member side positioning portions 6a and 6b and the chip side positioning portions 7a and 7b are in contact with each other, the waveguide chip 13 and the connection end member 14 are fitted to each other. The core portion 2 of the waveguide chip 13 has its optical axis center formed on a line connecting the fitting pin insertion holes 4a and 4b of the connection end member 14.

Each connecting end member 14 is formed by transfer molding of a filler-containing epoxy resin or the like, like the above-mentioned proposed apparatus, and the depth C of each connecting end member 14 is The length is sufficiently short so that the warpage does not affect the waveguide chip 13.

Next, the manufacturing process of the waveguide chip 13 of the optical waveguide module of this embodiment will be described with reference to FIG. First, as shown in FIG. 2A, a waveguide layer forming recess 21 is formed in the central portion on the surface 9 side of a flat substrate 1 made of, for example, silicon or quartz glass. The waveguide film forming recess 21 is formed by grinding to a predetermined depth by, for example, machining or etching.
Next, as shown in (b) of FIG.
The lower clad layer 3a is deposited and formed by depositing a quartz film or the like on the surface 9 side of the substrate 1 including 21.

Then, as shown in FIG. 3C, the lower clad layer 3a is surface-ground to expose the surface 9 of the substrate 1 as a non-ground area. By doing this,
The surface 8 of the lower cladding layer 3a and the surface 9 of the substrate 1 are flush with each other.

Next, as shown in FIG. 5D, an optical waveguide layer forming process (photolithography) as shown in FIGS. 5B to 5C is formed on the surface 8 side of the lower cladding layer 3a. ) Etc., a rectangular core portion 2 of, for example, 8 μm square is formed, and the core portion 2 is further embedded with an upper cladding layer 3b made of a quartz film. Then, as shown in the figure, the optical waveguide layer 30 including the upper clad layer 3b and the lower clad layer 3a and the core portion 2 projects from the substrate surface 9, and the surface side of the optical waveguide layer 30 is formed in a mesa shape. It

In the present embodiment, the waveguide chip is formed by the above steps, the surface 8 of the lower cladding layer 3a and the surface 9 of the substrate 1 are flush with each other, and the surface of the lower cladding layer 3a is formed. Since the core portion 2 is formed on the surface 8, the bottom surface of the core portion 2 is surely at the same height as the surface 9 of the substrate 1.

Then, the substrate surface 9 on both sides of the optical waveguide layer forming region of the waveguide chip 13 is exposed, and the substrate surface 9 constitutes chip-side positioning portions 7a and 7b. The positioning portions 6a and 6b of the connection end member 14 are brought into contact with 7b so that the connection end member 14 and the waveguide chip 13
Since the and are positioned and fitted and attached, according to this embodiment, like the proposed optical waveguide module,
There is no such a case that the waveguide chip 13 and the connection end member 14 are not fitted with high accuracy due to the processing accuracy of the positioning groove 16 on the waveguide chip 13 side, and the waveguide chip 13 and the connection end member 14 are surely, It is positioned and fitted with extremely high accuracy on the order of sub-μm.

Moreover, according to the present embodiment, the surface 9 of the substrate 1 (the positioning portions 7a and 7b on the waveguide chip 13 side) and the bottom surface of the core portion 2 are on the same plane, and the positioning portion 7
Positioning portions 6a, 6 of the connection end member 14 that come into contact with a, 7b
Fitting pin insertion hole 4a, 4 μm above the line connecting b
4b has a center B, and the center of the core portion 2 (the core portion 2 is 8μ
Since it is an m-square, its center is 4 μm smaller than the bottom surface of the core part 2.
Since the height of the optical waveguide module and the multicore optical fiber connector are connected via the fitting guide pins inserted into the fitting pin insertion holes 4a and 4b, The optical fiber of the multi-fiber optical fiber connector and the core portion 2 of the optical waveguide module can be reliably and accurately aligned at least in the optical axis center position in the height direction (Y direction in the drawing).

The alignment in the X direction in the drawing is performed by, for example, a mark for positioning in the X direction on each of the positioning portions 6a, 6b, 7a and 7b when the waveguide chip 13 and the connecting end member 14 are manufactured, respectively. May be formed and aligned, or the positioning portions 6a and 6b of the connection end member 14 and the positioning portions 7a and 7b of the waveguide chip 13 are in contact with each other,
The relative position between the connection end member 14 and the waveguide chip 13 can be shifted in the X direction to finely adjust the center.

FIG. 3 (a) is a perspective view showing the structure of the essential parts of a second embodiment of the optical waveguide module according to the present invention, and FIG. 3 (b) is a front view thereof. It is shown. This example of the embodiment is also configured in substantially the same manner as the example of the first embodiment, and the characteristic of the example of the embodiment different from the example of the first embodiment is that the connecting end member 14 is formed by an integrally molded product. Rather than forming, connection end member forming member 14a
That is, it is formed by ~ 14c. These connection end member forming members 14a to 14c are, for example, machined silicon plates, Pyrex, quartz glass,
It may be formed of a glass plate such as Vycor or BK7 (trade name), or may be formed of a resin or the like as in the above embodiment.

In this embodiment, a fitting recess 5 similar to that of the first embodiment is formed in the connection end member forming member 14a provided on the upper side of the waveguide chip 13,
On both sides of the fitting recess 5, the connecting end member side positioning portions 6a,
6b are formed respectively. In addition, the positioning unit 6
V-grooves 10a and 10b are formed on both sides of a and 6b, respectively. The V-groove 11 is formed in each of the connection end member forming members 14b and 14c provided on the side surface side of the waveguide chip 13.
a and 11b are formed, the fitting groove 4a is formed by the V groove 11a and the V groove 10a of the connecting end member forming member 14a, and the V groove 11b and the connecting end member 14 of the connecting end member forming member 14c are formed.
A fitting pin insertion hole 4b is formed by the V groove 10b of a. Also in this embodiment, the center of the fitting pin insertion holes 4a, 4b, that is, the fitting pin insertion holes 4a, 4b.
The center of the core portion 2 of the waveguide chip 13 is located on the line connecting the centers of the fitting guide pins when the fitting guide pins are inserted in b.

The example of the present embodiment is configured as described above, and the manufacturing process of the waveguide chip 13 in the example of the present embodiment is the same as that of the first embodiment. And the first
The exposed surface 9 of the substrate 1 of the waveguide chip 13 manufactured by the same process as in the embodiment of FIG.
a, 7b, the chip side positioning portions 7a, 7b and the positioning portions 6a, 6b of the connecting end member 14 are positioned in contact with each other, and the connecting end member 14 is fitted to the waveguide chip 13. Since it is attached, the same effect as that of the first embodiment can be obtained.

It should be noted that the present invention is not limited to the above-mentioned embodiments, and various modes of implementation can be adopted. For example,
In the first embodiment, the fitting pin insertion holes 4a and 4b are provided.
Is a circular through hole, and in the second embodiment, the fitting pin insertion holes 4a and 4b are V-shaped grooves 10a and 11a, respectively.
Although the diamond-shaped penetrating holes formed by 10b and 11b are used, the shapes of the fitting pin insertion holes 4a and 4b are not particularly limited and may be appropriately set. For example, when the connecting end member 14 is formed of a plurality of connecting end member forming members as in the second embodiment,
It is also possible to form a U-shaped groove in each forming member and to form a circular or elliptical fitting pin insertion hole by combining the U-shaped grooves. Further, the fitting pin insertion holes 4a, 4b do not necessarily have to penetrate, and the fitting pin insertion holes 4a, 4b
It suffices to be able to connect to an optical component on the connection partner side such as a multi-fiber optical fiber connector via 4b.

In the above embodiment, the waveguide chip is used.
The center of the optical axis of the core portion 2 of 13 is the fitting pin insertion holes 4a, 4
Although it is located on the line connecting the centers of b, the center of the core portion 2 is not always formed on the line connecting the fitting pin insertion holes 4a and 4b. However, in the conventional multi-fiber optical fiber connector generally used, it is formed so that the optical axes of the optical fibers arranged in the multi-fiber optical fiber connector coincide with the line connecting the centers of the pin holes of the connector. Therefore, when it is desired to connect such a multi-core optical fiber connector to the optical waveguide module of the present invention, the center of the core portion 2 is formed with the fitting pin insertion holes 4a and 4b as in the above embodiment. It is formed on the connecting line.

Further, the arrangement pitch, the number of arrangements, etc. of the core portions of the waveguide chip in the optical waveguide module of the present invention are appropriately set, and for example, the connection partner side of a multi-fiber optical fiber connector, a laser diode, etc. It is appropriately set according to the optical component.

[0036]

According to the present invention, the surface side of the optical waveguide layer formed by the lower clad layer, the core part and the upper clad layer is protruded from the substrate surface in the central portion on the surface side of the substrate to form a mesa shape. The surface of the substrate on both sides sandwiching this optical waveguide layer serves as the chip side positioning portion, while the connecting end member that fits into the waveguide chip encloses both sides and the upper surface of the mesa shape of the optical waveguide layer. Are provided with fitting recesses, the connecting end member side positioning portions are formed on both sides of the fitting recesses, and the connecting end member side positioning portions are brought into contact with the substrate surface to fit the waveguide chip. Since they are mounted together, the positioning of the waveguide chip and the connection end member in the height direction can be performed by, for example, using the substrate surface of the waveguide chip formed at a predetermined height as the chip side positioning portion. Can be done reliably and accurately

Therefore, for example, when an optical waveguide layer is formed on the entire surface side of the substrate and a positioning groove or the like is formed on the surface side of the optical waveguide layer, a processing error of the groove caused by the warpage of the waveguide chip or the like. This makes it possible to solve the problem that the waveguide chip and the connecting end member cannot be accurately positioned in the height direction, and always, reliably,
For example, the waveguide chip and the connecting end member can be fitted and mounted in a state of extremely high positional accuracy on the order of sub-μm.

According to the present invention, the surface of the lower clad layer is flush with the substrate surface, and the core portion is formed on the surface side of the lower clad layer, so that the bottom surface of the core portion is formed on the substrate surface. Since the bottom surface of the core part and the positioning part (positioning surface) on the connection end member side can be on the same surface, the relative position between the core part and the connection pin fitting hole of the connection end member is easy And, it can be set exactly as designed. Therefore, when connecting the optical waveguide module and the optical component on the other side of the connection through the fitting guide pin or the like fitted in the connecting pin fitting hole, the optical axis of the optical component and the optical axis of the core part Can be easily aligned, and the optical connection with the optical component can be easily and accurately performed.

Further, in the conventional multi-fiber optical fiber connector generally used, the center of the optical axis of the optical fiber arranged in the multi-fiber optical fiber connector is the center of the fitting guide pin formed in the connector. Since it is formed on the line connecting the cores, the center of the waveguide chip is formed on the line connecting the centers of the connecting pin fitting holes formed on both sides of the waveguide chip. According to the present invention, the multi-core optical fiber connector and the optical waveguide module are connected by using the connection pin fitting hole and the fitting guide pin provided in the guide pin fitting hole of the multi-fiber optical fiber connector. At this time, the optical fiber of the multi-fiber optical fiber connector and the core portion of the optical waveguide module can be optically connected in a very accurately aligned state.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a first embodiment of an optical waveguide module according to the present invention.

FIG. 2 is an explanatory diagram showing a manufacturing process of the waveguide chip according to the embodiment.

FIG. 3 is a main part configuration diagram showing a second embodiment of an optical waveguide module according to the present invention.

FIG. 4 is an explanatory diagram showing an example of an optical waveguide module previously proposed by the applicant.

FIG. 5 is an explanatory diagram showing a manufacturing process of a waveguide chip in the optical waveguide module of the above-mentioned proposal example.

FIG. 6 is an explanatory diagram showing a method of forming a positioning groove and its problems in the proposed optical waveguide module.

[Explanation of symbols]

 2 core part 3a lower clad layer 3b upper clad layer 4a, 4b fitting pin insertion hole 5 fitting recess 6a, 6b, 7a, 7b positioning part 9 substrate surface 13 waveguide chip 14 connection end member

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Takashi Shigematsu 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. (72) Manki Watanabe 2-6-1, Marunouchi, Chiyoda-ku, Tokyo No. Furukawa Electric Co., Ltd. (72) Inventor Takeo Shimizu 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Within Furukawa Electric Co., Ltd. (72) Mitsuru Kihara 3--19, Nishishinjuku, Shinjuku-ku, Tokyo No. 2 inside Nippon Telegraph and Telephone Corporation (72) Inventor Shinji Nagasawa 3-19-2 Nishishinjuku, Shinjuku-ku, Tokyo Inside Nippon Telegraph and Telephone Corporation

Claims (2)

[Claims] 1. A concave portion for forming a waveguide layer is formed in a central portion on the front surface side of a substrate, and a lower clad layer is formed in the concave portion for forming a waveguide layer so that its surface is flush with the substrate surface. A core part and an upper clad layer for burying the core part are provided on the surface side of the lower clad layer, and an optical waveguide layer is formed by the upper clad layer, the core part and the lower clad layer. A waveguide chip is formed such that the surface side of the waveguide layer protrudes from the substrate surface to form a mesa shape, and the connection end face of the waveguide chip is exposed on both sides of the connection end face of the waveguide chip. At least connecting end members each having a fitting recess for fitting around both sides and the upper surface of the mesa shape of the optical waveguide layer are provided, and each of these connecting end members is formed on both sides of the fitting recess. Positioning of connection end member side Each of the waveguide chips is fitted and attached to the waveguide chip in a state where the female portion is in contact with both sides of the substrate surface sandwiching the optical waveguide layer of the waveguide chip and the substrate surface which is a chip side positioning portion. An optical waveguide module, characterized in that the connecting end member has connecting pin fitting holes formed on both sides sandwiching the waveguide chip. 2. The core portion of the waveguide chip is formed such that the center thereof is on a line connecting the centers of the connection pin fitting holes formed on both sides sandwiching the waveguide chip. Item 1. The optical waveguide module according to item 1.