JPH09162525A - Process for applying sealing resin to bare chip in flip chip mounting - Google Patents
Process for applying sealing resin to bare chip in flip chip mountingInfo
- Publication number
- JPH09162525A JPH09162525A JP31805395A JP31805395A JPH09162525A JP H09162525 A JPH09162525 A JP H09162525A JP 31805395 A JP31805395 A JP 31805395A JP 31805395 A JP31805395 A JP 31805395A JP H09162525 A JPH09162525 A JP H09162525A
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- bare chip
- wiring board
- printed wiring
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、フリップチップ
実装(以下F・C実装という)方法における耐湿性、耐
久性、耐衝撃性に優れた封止樹脂塗布工程に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing resin coating process which is excellent in moisture resistance, durability and impact resistance in a flip chip mounting (hereinafter referred to as FC mounting) method.
【0002】[0002]
【従来の技術】従来のF・C実装方法は以下に示す工程
順序で行われていた。すなわち、 (1)ベアーチップ1を半田付け及び熱圧着等によりプ
リント配線板2に搭載した後、ベアーチップ1が搭載さ
れたプリント配線板2をホットプレート(又は電気炉)
3により60〜100℃に加熱する。 (2)プリント配線板2を加熱中は、ベアーチップ1を
搭載したプリント配線板2は傾けておく(図8参照、θ
は傾斜角度を示す)。 (3)加熱された状態にある、ベアーチップ1を搭載し
たプリント配線板2のベアーチップ1上辺側に、封止樹
脂4をディスペンサー等5により、必要量滴下する(図
9参照)。 (4)プリント配線板2に滴下された封止樹脂4は重力
によりベアーチップ1下面を伝わるという、いわゆる、
封止樹脂4の流動性のみによりベアーチップ1の下面に
樹脂を回らせて充填し封止していた(図10参照)。2. Description of the Related Art A conventional F / C mounting method has been performed in the following process sequence. (1) After the bare chip 1 is mounted on the printed wiring board 2 by soldering, thermocompression bonding, etc., the printed wiring board 2 on which the bare chip 1 is mounted is hot plate (or electric furnace).
3. Heat to 60-100 ° C. (2) While the printed wiring board 2 is being heated, the printed wiring board 2 on which the bare chip 1 is mounted is tilted (see θ in FIG. 8).
Indicates the tilt angle). (3) A required amount of the sealing resin 4 is dropped by a dispenser 5 on the upper side of the bare chip 1 of the printed wiring board 2 on which the bare chip 1 is mounted in the heated state (see FIG. 9). (4) The sealing resin 4 dropped on the printed wiring board 2 is transmitted to the bottom surface of the bare chip 1 by gravity, that is,
The bottom surface of the bare chip 1 was rotated and filled with resin only by the fluidity of the sealing resin 4 (see FIG. 10).
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上述の
F・C実装方法における封止樹脂の塗布工程では、封止
樹脂は傾斜面を重力により流動してベアーチップ下部に
回り込むため、塗布作業に長時間を要するという問題が
ある。However, in the step of applying the sealing resin in the above-mentioned F / C mounting method, the sealing resin flows by gravity on the inclined surface and wraps around to the lower part of the bare chip, so that the coating operation is long. There is a problem that it takes time.
【0004】また、ベアーチップとプリント配線板との
ギャップが小さい場合や、流動性の悪い封止樹脂を使用
した場合には、ベアーチップとプリント配線板との間
に、封止樹脂が完全に回り込まない場合があり、耐湿
性、耐久性及び耐衝撃性の点で問題点があった。Further, when the gap between the bare chip and the printed wiring board is small, or when a sealing resin having poor fluidity is used, the sealing resin is completely sealed between the bare chip and the printed wiring board. There was a case where it did not go around, and there were problems in terms of moisture resistance, durability and impact resistance.
【0005】さらに、封止樹脂がベアーチップ1下面ま
で回り込んで充填されているか否かは、ベアーチップを
剥がさないと確認が不可能であり、また、封止樹脂4を
滴下するとき、プリント配線板2を傾ける必要があり、
大きなプリント配線板へのF・C実装における封止樹脂
の塗布は困難であるといった問題点があった。Further, it is impossible to confirm whether or not the sealing resin has wrapped around to the lower surface of the bare chip 1 and is filled with it, unless the bare chip is peeled off. It is necessary to tilt the wiring board 2,
There is a problem that it is difficult to apply the encapsulating resin in the F / C mounting on a large printed wiring board.
【0006】本発明は、上記問題点を解決するためにな
されたものであり、その目的とするところは、封止樹脂
の塗布作業を行うのにプリント配線板を傾斜する必要が
なく、空気排出手段によりベアーチップの下部空間が迅
速に樹脂封止され、かつ、耐湿性、耐久性、耐衝撃性に
優れた高信頼性のF・C実装方法におけるベアーチップ
の封止樹脂塗布工程を提供することにある。The present invention has been made to solve the above problems, and an object thereof is to eliminate the need for inclining a printed wiring board to perform a sealing resin coating operation and to exhaust air. Provided is a bare chip sealing resin applying step in a highly reliable F / C mounting method in which the lower space of the bare chip is quickly resin-sealed by means, and which is excellent in moisture resistance, durability, and impact resistance. Especially.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、F・C実装方法におけるベアーチップへ
の封止樹脂塗布工程において、ベアーチップとこれを実
装するプリント配線板間の空気を真空装置等の空気排出
手段で排出すると同時に、封止樹脂を充填して、ベアー
チップの封止樹脂塗布作業を完工する工程を設けたもの
である。In order to achieve the above object, the present invention provides a method for applying a sealing resin to a bare chip in an FC mounting method, in which a bare chip and a printed wiring board on which the bare chip is mounted are mounted. At the same time as the air is discharged by an air discharge means such as a vacuum device, a step of filling the sealing resin and completing the sealing resin application work of the bare chip is provided.
【0008】これによれば、プリント配線板のベアーチ
ップとの対向域の中心部に小径スルーホールを設けてい
るので、このスルーホールから封止樹脂が迅速に充填さ
れ、プリント配線板を傾斜する必要がなくなる。また、
封止樹脂が充填されたことを小径スルーホール部におい
て確認することができ、充填された封止樹脂に混入して
いる空気も充填時に同時に除去される。According to this, since the small-diameter through hole is provided at the center of the area of the printed wiring board facing the bare chip, the sealing resin is quickly filled from this through hole and the printed wiring board is inclined. There is no need. Also,
It can be confirmed in the small-diameter through-hole that the sealing resin is filled, and the air mixed in the filled sealing resin is also removed at the same time as the filling.
【0009】[0009]
【発明の実施の形態】以下、本発明の実施形態について
図面を参照して説明する。図1〜5は本発明の第1の実
施形態としての工程図である。図1はベアーチップ11
を示す外観斜視図であり、その下面周辺には多数の球状
電極のバンプ11aが配列されている。図2はベアーチ
ップ11を搭載することを目的としたプリント配線板1
2の外観斜視図であり、F・C実装パッド13が配設さ
れており、その中心部には小径スルーホール12aが配
設されている。Embodiments of the present invention will be described below with reference to the drawings. 1 to 5 are process diagrams as a first embodiment of the present invention. Figure 1 shows bare chip 11
FIG. 4 is an external perspective view showing a plurality of bumps 11a of spherical electrodes arranged around the lower surface thereof. FIG. 2 shows a printed wiring board 1 for mounting the bare chip 11.
2 is an external perspective view of FIG. 2, in which an FC mounting pad 13 is provided, and a small diameter through hole 12a is provided in the center thereof.
【0010】次に、この発明に係るF・C実装方法の作
業工程について説明する。まず、ベアーチップ11の下
面周辺に多数の微小な球状電極バンプ11aを配列する
(図1)。このバンプ11aをプリント配線板2のF・
C実装パッド13に位置合わせした後(図2)、半田付
け、熱圧着等により接続搭載する(図3)。Next, work steps of the F / C mounting method according to the present invention will be described. First, a large number of minute spherical electrode bumps 11a are arranged around the lower surface of the bare chip 11 (FIG. 1). These bumps 11a are connected to the F.
After aligning with the C mounting pad 13 (FIG. 2), they are connected and mounted by soldering, thermocompression bonding or the like (FIG. 3).
【0011】プリント配線板12にベアーチップ11が
F・C実装された後、プリント配線板12のベアーチッ
プ11の周囲に封止樹脂14をディスペンサー15等に
て滴下供給する(図4)。ディスペンサー15等による
封止樹脂の滴下供給は樹脂封止域を真空状態にすること
を可能とした容器(図示せず)空間内で作業を行い、ベ
アーチップ11周囲への封止樹脂を供給しつつ、上記容
器内を真空状態にして行く。容器内が真空状態に近づく
につれ、ベアーチップ11周囲の封止樹脂は減少するた
め、その減少分を補完するため真空状態の進行と共に、
ベアーチップ11の周囲には封止樹脂の供給を行う。After the bare chips 11 are mounted on the printed wiring board 12 by F / C, the sealing resin 14 is dropped and supplied around the bare chips 11 of the printed wiring board 12 by a dispenser 15 or the like (FIG. 4). The dropping supply of the sealing resin by the dispenser 15 or the like is performed in a container (not shown) space capable of making the resin sealing region a vacuum state, and the sealing resin is supplied to the periphery of the bare chip 11. Meanwhile, the inside of the container is evacuated. As the inside of the container approaches the vacuum state, the sealing resin around the bare chip 11 decreases, and in order to complement the decrease, the vacuum state progresses,
A sealing resin is supplied around the bear chip 11.
【0012】このようにすることで、ベアーチップ11
の周囲に封止樹脂が十分供給できる。そして、ベアーチ
ップ11下部のプリント配線板12の小径スルーホール
12aより封止樹脂が確認できるようになった時に真空
状態を停止し、F・C実装を行ったベアーチップ11周
囲への封止樹脂14の供給を終了する。図5はこの状態
を示す要部外観斜視図である。By doing so, the bare chip 11
A sufficient amount of sealing resin can be supplied around the area. Then, when the sealing resin can be confirmed from the small-diameter through hole 12a of the printed wiring board 12 below the bare chip 11, the vacuum state is stopped, and the F / C mounted sealing resin around the bare chip 11 is mounted. The supply of 14 is terminated. FIG. 5 is an external perspective view of the main part showing this state.
【0013】また、図6は本発明に係るF・C実装方法
における封止樹脂塗布工程の第2の実施形態を示すもの
で、ベアーチップ21とプリント配線板22間の空気を
吸引する装置を示した要部側断面図である。この実施形
態では、小径スルーホール22aに空気吸引装置26の
吸引部ゴムノズル26aを連結して矢印方向に空気を吸
引することによってベアーチップ21の外周にディスペ
ンサー等(図示せず)によって滴下供給された封止樹脂
24を、プリント配線板22との間に吸引し充填するF
・C実装への封止樹脂の供給方法を示している。そし
て、この実施形態によれば、空気吸引装置26の吸引部
ゴムノゾル26aにて封止樹脂を確認したとき、空気吸
引装置26の駆動を停止すればよく、これにより、封止
樹脂が高効率でベアーチップ22下部空間が充填され、
目的通りの効果が得られるのである。FIG. 6 shows a second embodiment of the encapsulation resin coating step in the F / C mounting method according to the present invention, which shows an apparatus for sucking air between the bare chip 21 and the printed wiring board 22. It is the principal part side sectional view shown. In this embodiment, the rubber nozzle 26a of the air suction device 26 is connected to the small-diameter through hole 22a to suck air in the direction of the arrow so that the bare chip 21 is dropped and supplied to the outer periphery of the bare chip 21 by a dispenser or the like (not shown). The sealing resin 24 is sucked into and filled between the printed wiring board 22 and F.
-The method of supplying the sealing resin to C mounting is shown. Then, according to this embodiment, when the sealing resin is confirmed by the suction part rubber aerosol 26a of the air suction device 26, the driving of the air suction device 26 may be stopped, which allows the sealing resin to be highly efficient. The lower space of the bear tip 22 is filled,
The desired effect can be obtained.
【0014】さらに、図7は本発明の第3の実施形態を
示す要部側断面図で、ディスペンサー等37により直接
F・C実装部へ封止樹脂34を供給する構成が示されて
いる。この場合は、まず、プリント配線板32にベアー
チップ31をF・C実装する。F・C実装したベアーチ
ップ31下部のプリント配線板32に設けられた小径ス
ルーホール32aへディスペンサー37を挿着して圧縮
空気で封止樹脂を供給し、ベアーチップ31周囲に封止
樹脂が満たされたことを確認して封止樹脂の供給を停止
する。この工程によれば、第1の実施形態のような真空
発生装置を要せず、簡易かつ低価格にて高信頼性のベア
ーチップへの封止樹脂塗布工程が得られるのである。Further, FIG. 7 is a side sectional view showing the third embodiment of the present invention, showing a construction in which the sealing resin 34 is directly supplied to the FC mounting portion by a dispenser 37 or the like. In this case, first, the bare chip 31 is FC mounted on the printed wiring board 32. The dispenser 37 is inserted into the small-sized through hole 32a provided in the printed wiring board 32 below the bare chip 31 mounted by F / C, and the sealing resin is supplied by compressed air to fill the area around the bare chip 31 with the sealing resin. After confirming this, the supply of the sealing resin is stopped. According to this process, the vacuum resin generator as in the first embodiment is not required, and the process of applying the sealing resin to the bare chip with high reliability can be obtained easily at low cost.
【0015】上述の第1〜3実施形態においては、すべ
て、プリント配線板の保持角度を指定していないが、空
気排出手段によって強制的に排気しているためであり、
一般的な許容角度に保持されていれば、耐湿性その他の
特徴を有した高信頼性の封止樹脂塗布工程を確保でき
た。しかし、図示しないが、第1〜3実施形態において
プリント配線板等を水平に保持すれば、更に、高信頼性
のF・C実装方法におけるベアーチップの封止樹脂塗布
工程を提供できる効果が期待できることはいうまでもな
い。In all of the above-mentioned first to third embodiments, the holding angle of the printed wiring board is not specified, but the air is exhausted by the air exhausting means.
If it was kept at a general allowable angle, it was possible to secure a highly reliable encapsulation resin coating step having moisture resistance and other characteristics. However, although not shown, if the printed wiring board or the like is held horizontally in the first to third embodiments, it is expected that the bare chip sealing resin application step in the highly reliable F / C mounting method can be provided. It goes without saying that you can do it.
【0016】[0016]
【発明の効果】以上説明したように、本発明によれば、
以下に記載されるような効果を奏する。封止樹脂をプリ
ント配線板に設けた小径スルーホールにより、あるい
は、小径スルーホールに連結された空気排出手段(真空
装置、空気吸引装置及び圧縮空気装置)によって、強制
的に流入充填させる構成にしたので、封止樹脂塗布時間
の短縮化が図れ、従来のように、封止樹脂塗布時にプリ
ント配線板を傾けなくともよくなり、ベアーチップとプ
リント配線板間のギャップが狭くても、この間に封止樹
脂を密に充填できるほか、封止樹脂に混入している空気
も充填時に除去することができる。As described above, according to the present invention,
The following effects are obtained. The sealing resin is forced to flow in and out by a small diameter through hole provided in the printed wiring board or by an air discharging means (vacuum device, air suction device and compressed air device) connected to the small diameter through hole. Therefore, the coating time of the sealing resin can be shortened, and it is not necessary to tilt the printed wiring board at the time of coating the sealing resin as in the conventional case. Not only can the sealing resin be densely filled, but also the air mixed in the sealing resin can be removed at the time of filling.
【0017】また、プリント配線板に設けた小径スルー
ホールと空気排出装置との連結点において、プリント配
線板とベアーチップ間に封止樹脂が充填されたことを確
認できる。Further, it can be confirmed that the sealing resin is filled between the printed wiring board and the bare chip at the connection point between the small diameter through hole provided on the printed wiring board and the air discharge device.
【0018】従って、プリント配線板を傾ける必要がな
くなり、迅速な封止樹脂の塗布作業が可能になり、耐湿
性、耐久性、耐衝撃性に優れた高信頼性のフリップチッ
プ実装方法におけるベアーチップへの封止樹脂塗布工程
を提供することができる。Therefore, it is not necessary to incline the printed wiring board, the coating work of the sealing resin can be carried out quickly, and the bare chip in the highly reliable flip chip mounting method which is excellent in moisture resistance, durability and impact resistance. It is possible to provide a sealing resin applying step.
【図1】本発明の第1の実施形態におけるベアーチップ
を示す外観斜視図である。FIG. 1 is an external perspective view showing a bare chip according to a first embodiment of the present invention.
【図2】本発明の第1の実施形態におけるプリント配線
板を示す外観斜視図である。FIG. 2 is an external perspective view showing the printed wiring board according to the first embodiment of the present invention.
【図3】本発明の第1の実施形態におけるプリント配線
板にベアーチップを搭載した状態図である。FIG. 3 is a diagram showing a state in which a bare chip is mounted on the printed wiring board according to the first embodiment of the present invention.
【図4】本発明の第1の実施形態におけるベアーチップ
への封止樹脂塗布工程図である。FIG. 4 is a process diagram of applying a sealing resin to a bare chip according to the first embodiment of the present invention.
【図5】本発明の第1の実施形態のF・C実装ベアーチ
ップへの封止樹脂塗布工程終了時を示す斜視図である。FIG. 5 is a perspective view showing the end of the step of applying the sealing resin to the F / C-mounted bare chip of the first embodiment of the present invention.
【図6】本発明の第2の実施形態を示す要部側断面図で
ある。FIG. 6 is a side sectional view of an essential part showing a second embodiment of the present invention.
【図7】本発明の第3の実施形態を示す要部側断面図で
ある。FIG. 7 is a side sectional view of a main part showing a third embodiment of the present invention.
【図8】従来のベアーチップ搭載工程を示す要部外観斜
視図である。FIG. 8 is an external perspective view of a main part showing a conventional bare chip mounting step.
【図9】従来のベアーチップ封止樹脂塗布工程を示す要
部外観斜視図である。FIG. 9 is a perspective view of a main part appearance showing a conventional bare chip sealing resin application step.
【図10】従来のベアーチップ封止樹脂塗布完了図であ
る。FIG. 10 is a diagram showing the completion of application of a conventional bare chip sealing resin.
11,21,31 ベアーチップ 12,22,32 プリント配線板 12a,22a,32a 小径スルーホール 13,23 F・C実装パッド 14,24,34 封止樹脂 15,17,37 ディスペンサー 26 空気吸引装置 11,21,31 Bear chip 12,22,32 Printed wiring board 12a, 22a, 32a Small diameter through hole 13,23 FC mounting pad 14,24,34 Sealing resin 15,17,37 Dispenser 26 Air suction device
Claims (5)
脂の塗布工程において、前記フリップチップ実装ベアー
チップとプリント配線板間の空間を空気排出手段によっ
て排気し、樹脂封止を行うことを特徴とするフリップチ
ップ実装ベアーチップへの封止樹脂塗布工程。1. A flip which is characterized in that, in a step of applying a sealing resin in a flip chip mounting method, a space between the flip chip mounting bare chip and a printed wiring board is evacuated by an air discharging means to perform resin sealing. Chip mounting bare resin chip coating process.
装ベアーチップへの封止樹脂塗布作業域に設けられた真
空装置である請求項1記載のフリップチップ実装ベアー
チップへの封止樹脂塗布工程。2. The step of applying a sealing resin to a flip chip mounting bare chip according to claim 1, wherein the air discharging means is a vacuum device provided in a working area for applying a sealing resin to the flip chip mounting bare chip.
ベアーチップ下面との対向位置中心部に設けられた小径
スルーホールに連結された空気吸引装置である請求項1
記載のフリップチップ実装への封止樹脂塗布工程。3. The air suction device is an air suction device connected to a small-diameter through hole provided at a central portion of the printed wiring board facing the bottom surface of the bare chip of the printed wiring board.
Encapsulation resin application step for the flip chip mounting described.
ベアーチップ下面との対向位置中心部に設けられた小径
スルーホールに連結され、圧縮空気により駆動されるデ
ィスペンサーである請求項1記載のフリップチップ実装
ベアーチップへの封止樹脂塗布工程。4. The flip according to claim 1, wherein the air discharge means is a dispenser which is connected to a small-diameter through hole provided in a central portion of the printed wiring board facing the bottom surface of the bare chip and is driven by compressed air. Chip mounting bare resin chip coating process.
求項1,2,3又は4記載のフリップチップ実装ベアー
チップへの封止樹脂塗布工程。5. The step of applying a sealing resin to a flip chip mounting bare chip according to claim 1, wherein the printed wiring board is held horizontally.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31805395A JPH09162525A (en) | 1995-12-06 | 1995-12-06 | Process for applying sealing resin to bare chip in flip chip mounting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31805395A JPH09162525A (en) | 1995-12-06 | 1995-12-06 | Process for applying sealing resin to bare chip in flip chip mounting |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09162525A true JPH09162525A (en) | 1997-06-20 |
Family
ID=18094964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31805395A Withdrawn JPH09162525A (en) | 1995-12-06 | 1995-12-06 | Process for applying sealing resin to bare chip in flip chip mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09162525A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6396128B1 (en) * | 2000-04-17 | 2002-05-28 | Mitsubishi Denki Kabushiki Kaisha | Fixing structure and fixing method for semiconductor integrated circuit apparatus |
EP1345263A1 (en) * | 2000-12-18 | 2003-09-17 | TDK Corporation | Electronic device and method of manufacturing the electronic device |
-
1995
- 1995-12-06 JP JP31805395A patent/JPH09162525A/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6396128B1 (en) * | 2000-04-17 | 2002-05-28 | Mitsubishi Denki Kabushiki Kaisha | Fixing structure and fixing method for semiconductor integrated circuit apparatus |
EP1345263A1 (en) * | 2000-12-18 | 2003-09-17 | TDK Corporation | Electronic device and method of manufacturing the electronic device |
EP1345263A4 (en) * | 2000-12-18 | 2004-12-15 | Tdk Corp | Electronic device and method of manufacturing the electronic device |
US7134196B2 (en) | 2000-12-18 | 2006-11-14 | Tdk Corporation | Electronic device and manufacturing same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20030304 |