JPH09153513A - Manufacturing device of semiconductor device, method of manufacture the same, and device for mounting semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an excellent flatness between electrodes by absorbing the variation of the diameters of solder ball electrodes and the variation between the electrodes caused by the warping of a board. SOLUTION: The flatness of solder ball electrodes 3 is equalized by heating the solder ball electrodes 3, that are formed to be a ball grid array(BGA) product 21, at an adequate temperature lower than the melting temperature of them by a heater 6 and pressing the solder ball electrodes 3 to the base 5 with adequate pressure by a pressing jig 4. Therefore, the flatness of the electrodes of the BGA product 21 that is required at the assembling of it into a set is improved and simple and reliable mounting is realized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a ball grid array type package, which uses a solder ball or a solder paste as an electrode, and more particularly, a semiconductor device manufacturing apparatus and method in which the electrode is improved, and a semiconductor device. Mounting device.

[0002]

2. Description of the Related Art FIG. 2 shows a conventional ball grid array type package (hereinafter referred to as BGA product). In making such a BGA product, a substrate 2 based on flat ceramic or epoxy or other material is used. For example, a mold or a metal cap is provided on one surface of the substrate 2, and a spherical electrode 7 is provided on the other surface with a carefully selected solder ball or a solder paste whose supply amount is controlled.

[0003]

DISCLOSURE OF THE INVENTION In BGA products,
It is required that the heights of the tip portions of the electrodes be uniform within a predetermined narrow condition and that the electrodes have flatness. That is, it is not preferable that the electrodes have different sizes as shown in FIG. For this reason, each part / material was carefully selected. However, maintaining the flatness of the electrodes of the BGA product has been accompanied by the following difficulties.

First, substrates based on ceramics or epoxies or other materials must be severely screened to ensure their flatness. Moreover, even if such sorting is performed, warping, twisting, etc. occur during processing,
The flatness of the substrate was sometimes impaired.

Furthermore, when solder balls are used, those having high sphericity and high dimensional accuracy are required, and they must be strictly selected. However, doing so causes a decrease in yield and a rise in prices.

Further, the flux or the solder paste used as a base for mounting the solder balls on the substrate is supplied by printing or the like, but it is difficult to control the uniform and accurate amount. Furthermore, the solder ball electrodes may be deformed due to handling and heat stress in the BGA product assembly process,
The flatness may be deteriorated. Further, in the test or burn-in, the solder ball electrode may be stressed due to the use of the socket or thermal stress, which may cause deformation or damage, which may deteriorate the flatness of the electrodes.

Since this type of BGA product is usually face-down mounted, it is difficult to visually inspect the soldered state of the electrodes after mounting, and the deterioration of the flatness of the electrodes causes defects during mounting, which is a major problem. It was a problem.

The present invention is intended to solve the above problems, and an object thereof is to correct the electrodes to improve the flatness of the electrodes of a BGA product and enable easy and reliable mounting.

[0009]

SOLUTION TO THE PROBLEM A solder ball electrode having poor flatness by heating a solder ball electrode formed on a BGA product to an appropriate temperature which does not melt by a heating means and applying an appropriate pressure by a pressurizing means. Homogenize. This corrects the initial variations in the substrate made of ceramic or epoxy or other material that constitutes the BGA product, and the solder balls that form the electrodes, and the deterioration of the flatness due to warpage or twisting that occurs in the assembly process. The heights of the respective tip surfaces are made uniform.

According to the present invention, not only the product having excellent flatness is carried out in a process close to the final process of the BGA product, but also the BGA product is mounted by performing this correction when incorporating the product into a set. It is possible.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, BGA product 2
In FIG. 1, the substrate 2 is provided with, for example, a mold or a metal cap 1 on one surface, and a plurality of electrodes 3 made of, for example, solder balls is provided on the other surface. This BGA
In the product 21, the metal cap 1 is held by the pressing jig 4. The surface of the base 5, which is made of a material such as aluminum, having excellent flatness faces the pressure jig 4. A heater 6 for heating the base 5 is provided inside the base 5. An electrode 9 and a switch 10 are connected to the heater 6. The pressure jig 4 is provided with a driving device 11, and the pressure jig 4 is driven by the driving device 1.
1 allows movement in a direction toward the base 5 and a direction away from the base 5.

The operation of the above configuration will be described.
The base 5 has a high temperature within a range that does not adversely affect the parts and materials constituting the BGA product and does not melt the solder ball electrode 3 (eg, 183 ° C. or lower in the case of eutectic solder, Pb: Sn = In the case of 9: 1 high-temperature solder, the temperature is raised to 299 ° C. or lower by the heater 6 for heating. In this state, the pressing jig 4 is moved in a direction approaching the base 5, and the electrode 3 is pressed against the base 5. For example, a pressure sensor (not shown) or the like may be provided on the base 5, and the pressure of all solder balls may be monitored by this pressure sensor to control the pressure.
Further, a method of controlling the above-mentioned pressing force in cooperation with the coplanarity data of each BGA product is also included. That is, for example, the unevenness amount of each electrode may be detected in advance, and the pressure may be controlled according to the unevenness amount.

The simplest straightening method is as follows. The tip of the ball is brought into contact with the flat base 5 and then pushed in arbitrarily (for example, when the accuracy of the ball diameter is 700 μm ± 20 μm, 20).
There is a method to correct the coplanarity by pressing (μm).

According to the above embodiment, the flatness of the electrodes can be improved and the BGA product can be reliably soldered to the set. Moreover, there is an advantage that the warp of the substrate due to the above heating and pressing can be corrected especially when the substrate is epoxy.

In the BGA product assembly, the present invention may be carried out as close to shipping as possible after being tested, burned in, and the like. Alternatively, it is also possible to employ this device as a mounting machine or the like on the side of mounting on a set without performing it on the manufacturing side of BGA products. In this case, BG
Deterioration of flatness that occurs when the product A is conveyed is corrected, and good mounting becomes possible.

[0016]

As described above in detail, according to the present invention, it is possible to absorb variations in electrodes caused by nonuniform diameter of solder ball electrodes, warpage of the substrate, etc. Can be obtained. Therefore, BG
When the product A is incorporated into the set, it can be reliably soldered, so that the reliability can be improved and the difficult visual inspection in the face-down mounting can be omitted. Furthermore, BGA
It is no longer necessary to make the standards for parts and materials that make up a product stricter than necessary, and easing the standards will improve yields and reduce prices.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a flatness correction method of the present invention.

FIG. 2 is a configuration diagram showing a conventional BGA product having poor flatness.

[Explanation of symbols]

1 ... Upper part of BGA product (mold, metal cap, etc.), 2 ... Lower part of BGA product (ceramic, epoxy, etc.), 3 ... Solder electrode corrected by heat and pressure, 4 ... Jig for flatness correction (addition) Pressing jig), 5 ... Flatness correcting jig (jig with lower heating mechanism), 6 ... Heating heater, 7 ... Solder electrode (solder ball, formation by reflow of solder paste, etc.), 8 ... Horizontal Reference line, 9 ... Heating heater power source, 10 ... Heating heater switch, 11 ... Pressurizing jig drive device, 21 ... BGA product.

Claims (5)

[Claims] 1. A substrate made of ceramic or epoxy,
A semiconductor device for processing a ball-shaped electrode of a semiconductor product in which a plurality of ball-shaped electrodes are provided on this substrate, wherein the electrode is heated below the melting temperature of the electrode and the electrode is pressed against a flat base surface. By so doing, the heights of the tip surfaces of the electrodes are made uniform. 2. The method of manufacturing a semiconductor device according to claim 1, wherein heating and pressurizing the electrodes are performed when the semiconductor product is incorporated into a set. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the warp of the substrate on which the electrodes are arranged is also corrected by the heating and pressing. 4. A substrate made of ceramic or epoxy,
A base having a flat surface on which the electrodes of a semiconductor device, in which a plurality of ball-shaped electrodes are provided on the substrate, are abutted; and a heating device for heating the base at a temperature below the melting temperature of the electrodes A semiconductor device manufacturing apparatus, comprising: a pressing device that presses the electrode against a base via the substrate. 5. A mounting device for a semiconductor device in which a BGA semiconductor is incorporated into a set, wherein a ceramic or epoxy substrate is used, and a plurality of ball-shaped electrodes are provided on the substrate. A base having a transparent surface, a heating device that heats the base to a temperature below the melting temperature of the electrode, and a pressure device that presses the electrode against the base via the substrate. A mounting device for a characteristic semiconductor device.