JPH09148425A - Carry tape and semiconductor circuit device carried by it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent bump electrode trouble from occurring during carriage, by providing a projection for supporting a package by point, in the specified position of a package storage region. SOLUTION: A carry tape 1 consists of a band-shaped tape body 1a used for carriage, and the tape body 1a consists of insulating material such as polypropylene, polyester, or the like, and a plurality of package storage regions 1a1 quadrangular in plan view are provided at specified intervals in longitudinal direction of the tape body 1a at the main face. Projections 1a2 quadrangular in plan view are made in the vicinities of the four corners of the package storage region 1a1 of the carry tape 1. The projection 1a2 is a member which support it in floating condition so that the bump electrode 2a may not contact with the bottom of the package storage region 1a1 , in the case of storing it so that the face where the bump electrode 2a is made may oppose the bottom of the package storage region 1a1 , and this is made in a body with the tape body 1a. Such a projection 1a2 is provided to prevent the bump electrode from contacting with the carry tray during carriage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape and a semiconductor integrated circuit device technology carried by the carrier tape, and more particularly to a surface mount type semiconductor integrated circuit having a bump electrode structure such as BGA (Ball Grid Array). The present invention relates to a technique effective when applied to a carrier tape for carrying an apparatus.

[0002]

2. Description of the Related Art As semiconductor integrated circuit devices have advanced functions and higher performance, and the degree of integration of devices has been improved, the number of external terminals for drawing out device electrodes in a package is also increasing. .

However, in the surface mount type package structure in which the external terminals are pulled out from the side surface of the package, when the number of external terminals is increased, the side length of the side surface of the package must be increased, and the package is larger than necessary. However, there is a limit to the number of external terminals that can be installed.

As a structure for avoiding such a problem, there is a surface mount type package structure in which external terminals called bump electrodes are drawn out from the back surface of the package such as BGA. In this case, it is possible to increase the number of external terminals without making the package large.

By the way, there is a carrying tape as a carrying means for moving the semiconductor integrated circuit device having such a bump electrode structure to a predetermined place. The carrier tape is a strip-shaped tape that can be wound, and has recesses (package accommodating regions) along the longitudinal direction that accommodate the packages at predetermined intervals.

For example, the package is transported as follows. That is, after the package is housed in the package accommodating area with the bump electrode formation surface facing the transport tape, the transport tape is wound on the transport reel and transported to a predetermined place while being wound on the transport reel. It is like this.

A means for carrying the semiconductor integrated circuit device is described in, for example, Japanese Patent Application Laid-Open No. 6-40482, and a carrying tray is disclosed therein.

[0008]

However, the present inventor has found that a carrier tape for carrying a semiconductor integrated circuit device having a bump electrode structure has the following problems.

That is, when the package is transported with the bump electrode in contact with the transport tray, the bump electrode is impacted by the contact portion of the transport tray to be deformed, peeled, or charged due to shaking during transport. There are problems that the inhibitor adheres and the solderability at the time of package mounting deteriorates.

According to the technique studied by the present inventor about a technique for avoiding such a problem, a step extending along two or four sides of the package accommodating region is provided at an intermediate position on the side face of the package accommodating region of the transport tape. There is a technique for supporting the package by catching the outer periphery of the bump electrode formation surface, two sides or four sides, and preventing the bump electrode from coming into contact with the bottom surface of the package accommodating region.

However, in this case, since the package is supported by two sides or four sides, that is, the surfaces are supported, bump electrodes cannot be provided on the supported surface on the package side, and an increase in the number of bump electrodes is required. There is a problem that it is not possible to meet the demand for miniaturization of packages and packages. Such a problem becomes a particular problem as the number of bump electrodes increases and the size of the semiconductor integrated circuit device becomes smaller.

An object of the present invention is to provide a technique capable of preventing a bump electrode defect from occurring during the transportation of a semiconductor integrated circuit device having a bump electrode.

Another object of the present invention is to provide a technique capable of preventing deterioration of solderability of a semiconductor integrated circuit device having bump electrodes.

Another object of the present invention is to provide a technique capable of meeting the increasing demand for bump electrodes in a semiconductor integrated circuit device having bump electrodes.

Another object of the present invention is to provide a technique capable of meeting the demand for miniaturization of a semiconductor integrated circuit device having bump electrodes.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0017]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

The carrier tape of the present invention is such that the package having the bump electrode structure is accommodated in each of a plurality of package accommodating regions provided at predetermined intervals along the longitudinal direction of the strip-shaped tape main body at a predetermined location. When the package having the bump electrode structure is housed so that its bump electrode forming surface faces the package housing area, the bump electrode contacts the surface of the package housing area. In order not to do so, a protrusion that supports the package at a point is provided at a predetermined position in the package accommodation area.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings (note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments. , The repeated explanation is omitted).

FIG. 1 is a perspective view of a carrier tape according to an embodiment of the present invention, FIG. 2 is an enlarged plan view of an essential part of the carrier tape of FIG. 1, FIG. 3 is a sectional view taken along line III-III of FIG. 4 is an explanatory view of a case where a package having a bump electrode structure is accommodated in the carrier tape of FIG. 1, FIG. 5 is a top view of a package having a bump electrode structure, and FIG. 6 is a plan view showing a bump electrode formation surface of the package of FIG. 7 is a sectional view taken along line VII-VII in FIG.

First, the transport tape of this embodiment is shown in FIGS.
This will be described with reference to FIG. This carrier tape 1 is, for example, B
GA package type semiconductor integrated circuit device 2 (see FIG. 4)
The tape-shaped tape main body 1a is used for transporting the tape, and can be wound by the transport reel 3.

The tape body 1a is made of an insulating material such as polypropylene or polyester,
On the main surface of the tape body 1a, a plurality of package accommodation areas 1a1 having, for example, a quadrangular plane shape are provided at predetermined intervals along the longitudinal direction of the tape body 1a.

The package accommodating area 1a1 is an area for accommodating the semiconductor integrated circuit device 2, and is formed by a recess having a size enough to accommodate the semiconductor integrated circuit device 2. When the semiconductor integrated circuit device 2 is transported, the transport tape 1 is wound around the transport reel 3 and transported to a predetermined place.

By the way, in the present embodiment, projections 1a2 having, for example, a quadrangular plane are formed in the vicinity of the four corners of the package accommodating area 1a1 of the carrier tape 1.

As shown in FIG. 4, the protrusion 1a2 is
When the BGA package type semiconductor integrated circuit device 2 is housed so that the surface on which the bump electrode 2a is formed faces the bottom surface of the package housing area 1a1, the bump electrode 2a
Is a member for supporting the package housing area 1a1 in a floating state so as not to come into contact with the bottom surface of the package housing area 1a1, and is integrally formed with the tape body 1a, for example.

By providing such a protrusion 1a2, it is possible to prevent the bump electrode 2a from coming into contact with the carrying tray during carrying of the semiconductor integrated circuit device 2.

Therefore, it is possible to prevent the bump electrode 2a from being deformed or peeled off due to the contact.
Further, it is possible to prevent the antistatic agent from adhering to the bump electrodes 2a. Further, it is possible to prevent deterioration of the solderability of the bump electrode 2a due to the contact.

Further, the semiconductor integrated circuit device 2 is provided with the protrusion 1a.
By supporting the semiconductor integrated circuit device 2 with the bump electrode 2, the area where the bump electrode 2a cannot be formed in the bump electrode formation surface of the semiconductor integrated circuit device 2 can be made extremely small in anticipation of the contact of the protrusion 1a2. Therefore, it is possible to meet the demand for increasing the bump electrodes 2a of the semiconductor integrated circuit device 2. Further, since the area where the bump electrode 2a cannot be formed can be reduced, it is possible to meet the demand for miniaturization of the semiconductor integrated circuit device 2 having the bump electrode 2a.

Further, since the protrusion 1a2 of the carrier tape 1 is integrally molded when the tape body 1a is molded, the number of parts does not increase and the cost of the carrier tape 1 does not increase.

In the vicinity of one long side of the tape body 1a of the transport tape 1, a plurality of feed holes 1a are provided along the long side.
3 is perforated. The feed hole 1a3 is a through hole provided for feeding the tape in good alignment.

Next, an example of a BGA type semiconductor integrated circuit device 2 conveyed by such a conveying tape 1 is shown in FIG.
~ It demonstrates by FIG.

As shown in FIGS. 5 and 6, the upper surface and the back surface of the BGA package type semiconductor integrated circuit device 2 are as follows.
For example, it is formed in an octagonal shape.

On the back surface of the semiconductor integrated circuit device 2, a plurality of bump electrodes 2a are regularly arranged in a matrix. However, on the back surface, in the vicinity of the corner where the protrusion 1a2 (see FIG. 2) abuts, the above-mentioned protrusion 1a
The bump electrode placement prohibited area A is formed in anticipation of the contact of 2 and the bump electrode 2a is not formed.

The bump electrode 2a is used for the semiconductor integrated circuit device 2
Is an external terminal for pulling out the element electrode of the semiconductor chip 2b constituting the semiconductor device, for example, lead (Pb) -tin (S
n) Made of alloy.

The semiconductor chip 2b is made of, for example, silicon (S
i) It is made of a single crystal, and is mounted on the chip mounting region 2d at the center of the main surface of the package substrate 2c in the semiconductor integrated circuit device 2 in a state of being bonded with an epoxy resin containing silver (Ag) or the like. The package substrate 2c is made of, for example, an epoxy resin. In addition, the chip mounting area 2
d is made of a highly conductive metal such as copper (Cu).

A predetermined semiconductor integrated circuit is formed on the main surface of the semiconductor chip 2b, and its element electrode is provided with a lead 2f provided on the outer periphery of a chip mounting area 2d on the package substrate 2c through a bonding wire 2e. Is electrically connected to.

The lead 2f is made of a highly conductive metal such as Cu, and the surface thereof is plated with Ag, for example. The leads 2f are electrically connected to the bump base electrodes 2g on the back surface of the package substrate 2c through the internal wiring formed inside the package substrate 2c. Then, it is electrically connected to the bump electrode 2a provided on the bump base electrode 2g.

The semiconductor chip 2b, the bonding wires 2e, the leads 2f, etc. are sealed with a package resin 2h.

As described above, according to this embodiment, the following effects can be obtained.

(1). By supporting the BGA package type semiconductor integrated circuit device 2 by the protrusions 1a2, it is possible to prevent the bump electrodes 2a from coming into contact with the carrier tape 1 while the semiconductor integrated circuit device 2 is being carried. It becomes possible.

(2) Due to the above (1), it is possible to prevent the bump electrode 2a from being defective during the transportation of the semiconductor integrated circuit device 2.

(3) By the above (1), it becomes possible to prevent the antistatic agent from adhering to the bump electrodes 2a during the transportation of the semiconductor integrated circuit device 2.

(4) Due to the above (1), it becomes possible to prevent deterioration of the solderability of the bump electrode 2a in the semiconductor integrated circuit device 2.

(5). By supporting the semiconductor integrated circuit device 2 having the bump electrode structure with the protrusions 1a2, the area on the bump electrode formation surface of the semiconductor integrated circuit device 2 where the bump electrodes 2a cannot be formed is made extremely small. It becomes possible.

(6). By the above (5), it becomes possible to meet the demand for increasing the bump electrodes 2a of the semiconductor integrated circuit device 2.

(7). Due to the above (5), it becomes possible to meet the demand for miniaturization of the semiconductor integrated circuit device 2.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in the above-described embodiment, the case where the present invention is applied to the plastic package type BGA carrier tape has been described, but the present invention is not limited to this and various applications are possible, for example, a ceramic package type. It can also be applied to a carrier tape for BGA.

Further, in the above-mentioned embodiment, the case where the present invention is applied to the carrier tape for the BGA package has been described, but the present invention is not limited to this and various applications are possible, for example, CSP (Chip Size Package). It is also possible to apply it to a carrier tape for use in.

Further, in the above-described embodiment, the case where the present invention is applied to the carrier tape for the semiconductor integrated circuit device having one semiconductor chip in the package has been described, but the present invention is not limited to this. It is applicable, for example, to a carrier tape for a semiconductor integrated circuit device having a plurality of semiconductor chips in a package.

In the above description, the case where the invention made by the present inventor is mainly applied to the carrier tape for the semiconductor integrated circuit device which is the field of application which is the background of the invention has been described, but the invention is not limited to this. It can be applied to, for example, a carrier tape for other electronic components having bump electrodes. INDUSTRIAL APPLICABILITY The present invention can be applied to a carrier tape for electronic components having at least bump electrodes.

[0052]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1). According to the carrier tape of the present invention, by supporting the package having the bump electrode structure by the protrusions,
It is possible to prevent the bump electrode from coming into contact with the surface of the package accommodating area of the transport tape during package transport.
Therefore, it becomes possible to prevent the bump electrode defect from occurring during the transportation of the package having the bump electrode structure. Further, it becomes possible to prevent the antistatic agent from adhering to the bump electrodes. In addition, it becomes possible to prevent deterioration of the solderability of the package having the bump electrode structure.

(2) According to the carrier tape of the present invention, by supporting the package by the projecting portion, it is possible to extremely reduce the area where the bump electrode cannot be formed on the bump forming surface of the package. Therefore, it becomes possible to meet the demand for an increase in the bump electrodes of the package having the bump electrode structure. Further, it becomes possible to meet the demand for miniaturization of the package having the bump electrode structure.

[Brief description of the drawings]

FIG. 1 is a perspective view of essential parts of a carrier tape according to an embodiment of the present invention.

FIG. 2 is an enlarged plan view of an essential part of the transport tape of FIG.

FIG. 3 is a sectional view taken along line III-III in FIG. 2;

FIG. 4 is an explanatory diagram of a case where a package having a bump electrode structure is housed in the carrier tape of FIG.

FIG. 5 is a top view of a package having a bump electrode structure.

6 is a plan view showing a bump electrode formation surface of the package of FIG.

7 is a sectional view taken along line VII-VII of FIG.

[Explanation of symbols]

 1 Transport Tape 1a Tape Body 1a1 Package Storage Area 1a2 Projection 1a3 Feed Hole 2 Semiconductor Integrated Circuit Device 2a Bump Electrode 2b Semiconductor Chip 2c Package Substrate 2d Chip Mounting Area 2e Bonding Wire 2f Lead 2g Bump Base Electrode 2h Package Resin A Bump Electrode Arrangement Prohibited area 3 Transport reel

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masakatsu Suzuki 5-20-1, Josuihoncho, Kodaira-shi, Tokyo Inside the Semiconductor Business Division, Hitachi, Ltd. (72) Inventor Enomoto Yusuke, Komizura-cho, Kodaira, Tokyo 5-20-1 Hitachi Ltd. Semiconductor Division

Claims (4)

[Claims] 1. A method of moving a package having a bump electrode structure to a predetermined place while being housed in each of a plurality of package accommodating regions provided at predetermined intervals along a longitudinal direction of a strip-shaped tape body. A carrier tape to be used, when the package having the bump electrode structure is housed so that the bump electrode forming surface faces the package housing area,
A carrier tape, wherein a protrusion for supporting the package at a point is provided at a predetermined position in the package containing area so that the bump electrode does not come into contact with the surface of the package containing area. 2. The transport tape according to claim 1, wherein the protrusions are provided at four or more places. 3. The carrier tape according to claim 1, wherein the package is BGA. 4. A semiconductor integrated circuit device carried by the carrying tape according to claim 1, 2 or 3, wherein the bump electrode is prohibited from being arranged on a portion of the back surface of the package where the protrusion contacts. A semiconductor integrated circuit device having a prohibited area for protection.