JPH09148424A - Carriage tray, and semiconductor integrated circuit device carried by it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent bump electrode trouble from occurring by providing a salient electrode for supporting a package by a point, in the specified position of a package storage region. SOLUTION: On the main face of a carriage tray, the package storage regions 1a1 quadrangular in plan view stand in line regularly in matrix form, and these are made by the indents formed on the main face of the carriage tray 1a1 . That is, semiconductor integrated circuit devices can be carried in condition that they are accommodated in individual storage regions 1a1 . What is more, this is arranged so that they can be carried in condition that plural sheets of carry trays lie on top of on another at the time of carriage. Projections 1a2 quadrangular in plan view are made in the vicinities of the four corners of the bottom in this package storage region 1a1 . This projection 1a2 is a member for supporting it in floating condition so that the bump electrode 2a may not contact with the bottom of the package storage region 1a1 , in the case of storing it so that the face where the bump electrode 2a is made may oppose the bottom of the package storage region 1a1 . Therefore, this prevents the bump electrode from contacting with the carriage tray during carriage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tray and a semiconductor integrated circuit device technology carried by the carrier tray, and more particularly to a surface mount type semiconductor integrated circuit having a bump electrode structure such as BGA (Ball Grid Array). The present invention relates to a technique effectively applied to a carrying tray for carrying a device.

[0002]

2. Description of the Related Art As semiconductor integrated circuit devices have advanced functions and higher performance, and the degree of integration of devices has been improved, the number of external terminals for drawing out device electrodes in a package is also increasing. .

However, in the surface mount type package structure in which the external terminals are pulled out from the side surface of the package, when the number of external terminals is increased, the side length of the side surface of the package must be increased, and the package is larger than necessary. However, there is a limit to the number of external terminals that can be installed.

As a structure for avoiding such a problem, there is a surface mount type package structure in which external terminals called bump electrodes are drawn out from the back surface of the package such as BGA. In this case, it is possible to increase the number of external terminals without making the package large.

By the way, a carrier tray is usually used to move the semiconductor integrated circuit device having such a bump electrode structure to a predetermined place. The transport tray is formed with a recess (package accommodating region) to accommodate the package, and the package is conveyed to a predetermined place while being accommodated in the package accommodating region.

In this case, the package is in a state where the bump electrode forming surface is directed to the package accommodating region, that is,
When the bump electrode is transported in contact with the bottom surface of the package housing area, and when the bump electrode formation surface of the package faces upward, that is, the package upper surface (the surface where the bump electrode is not formed) is housed in the package. It may be transported in a state of being directed toward the area.

The carrying tray of the semiconductor integrated circuit device is described in, for example, Japanese Patent Application Laid-Open No. 6-40482.

[0008]

However, the present inventor has found that the semiconductor integrated circuit device having the bump electrode structure has the following problems with respect to its carrying technique.

That is, when the package is transported with the bump electrode in contact with the transport tray, the bump electrode is impacted by the contact portion of the transport tray to be deformed or peeled off due to shaking during transport, etc. There is a problem that the solderability at the time of mounting deteriorates.

According to the technique studied by the present inventor about the technique for avoiding such a problem, a step is provided at an intermediate position on the side surface of the package accommodating area of the transfer tray, and the step has an outer periphery, two sides, or two sides of the bump electrode forming surface. There is a technique in which the package is supported so that the four sides are caught so that the bump electrode does not come into contact with the bottom surface of the package accommodating region.

However, in this case, since the package is supported by two sides or four sides, that is, the surfaces are supported, bump electrodes cannot be provided on the supported surface on the package side, and an increase in the number of bump electrodes is required. There is a problem that it is not possible to meet the demand for miniaturization of packages and packages. Such a problem becomes a particular problem as the number of bump electrodes increases and the size of the semiconductor integrated circuit device becomes smaller.

Further, even when the bump electrodes of the package are carried upward, another carrying tray may be carried over the carrying tray, and in that case, the packages contained in the lower carrying tray may be carried. As a result of the bump electrodes coming into contact with the lower surface of the upper carrying tray, the above-mentioned problems of deformation / peeling of the bump electrodes and deterioration of solderability during package mounting occur.

An object of the present invention is to provide a technique capable of preventing a bump electrode defect from occurring during transportation of a semiconductor integrated circuit device having a bump electrode.

Another object of the present invention is to provide a technique capable of preventing deterioration of solderability of a semiconductor integrated circuit device having bump electrodes.

Another object of the present invention is to provide a technique capable of meeting the increasing demand for bump electrodes in a semiconductor integrated circuit device having bump electrodes.

Another object of the present invention is to provide a technique capable of meeting the demand for miniaturization of a semiconductor integrated circuit device having bump electrodes.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0018]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

The carrying tray of the present invention comprises a package housing area for housing a package having bump electrodes,
A carrier tray used to move the package to a predetermined place, and when the package is carried in a state where the bump electrode is opposed to the package accommodating region, the bump electrode causes the package to be accommodated. A protrusion for supporting the package by a point is provided at a predetermined position of the package accommodating region so as not to contact the surface of the region.

Further, the carrying tray of the present invention is a carrying tray which is provided with a package accommodating region for accommodating a package having bump electrodes and which is used to move the package to a predetermined place. Put it in the package storage area so that it faces outward,
And, when carrying in a state where other carrying trays are stacked,
A protrusion is provided at a predetermined position on the back surface of the transport tray so that the bump electrode does not come into contact with the back surface of another transport tray stacked on the bump electrode.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings (note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments. , The repeated explanation is omitted).

(Embodiment 1) FIG. 1 is a plan view of an essential part of a carrying tray according to an embodiment of the present invention, FIG. 2 is an enlarged plan view of an essential part of the carrying tray of FIG. 1, and FIG. A cross-sectional view taken along line III-III, FIG. 4 is an explanatory view when a package having a bump electrode structure is accommodated in the carrier tray of FIG. 1, FIG. 5 is a top view of the package having a bump electrode structure, and FIG. 6 is a bump electrode structure. FIG. 7 is a plan view showing a bump electrode formation surface of a package having a structure shown in FIG.

First, the carrying tray of the first embodiment is shown in FIG.
~ It demonstrates by FIG.

The carrying tray 1a is a tray used for carrying the BGA package type semiconductor integrated circuit device 2 (see FIG. 4), for example. The carrier tray 1a is made of an insulating material such as polypropylene or polyester, and is formed into a flat rectangular shape, for example.

On the main surface of the carrying tray 1a, for example, plane-rectangular package accommodating areas 1a1 are formed in a regular array in a matrix. This package storage area 1
a1 is a region for accommodating the semiconductor integrated circuit device 2 described above, and is formed by a recess formed in the main surface of the carrying tray 1a1.

That is, the semiconductor integrated circuit device 2 is
The package is conveyed while being housed in each package housing area 1a1. When the semiconductor integrated circuit device 2 is carried, a plurality of carrying trays 1a are carried in a stacked state.

By the way, the package accommodating area 1a1
In the vicinity of the four corners of the bottom surface of, the projections 1a2 having, for example, a quadrangular plane are formed. As shown in FIG. 4, when the bump electrode 2a of the semiconductor integrated circuit device 2 is housed so that the surface where the bump electrode 2a is formed faces the bottom surface of the package housing area 1a1, as shown in FIG. The member 2a is a member for supporting the package storage area 1a1 in a floating state so as not to come into contact with the bottom surface of the package housing area 1a1.

By providing such a protrusion 1a2, it is possible to prevent the bump electrode 2a from coming into contact with the carrying tray during the carrying of the semiconductor integrated circuit device 2. Therefore, it is possible to prevent the bump electrode 2a from being deformed or peeled off due to the contact. Also,
It is possible to prevent deterioration of the solderability of the bump electrode 2a due to the contact.

Further, the semiconductor integrated circuit device 2 is provided with the protrusion 1a.
By supporting the semiconductor integrated circuit device 2 on the bump electrode forming surface of the semiconductor integrated circuit device 2, the area where the bump electrode 2a cannot be formed due to the contact of the supporting portion can be made extremely small. Therefore, it is possible to meet the demand for increasing the bump electrodes 2a of the semiconductor integrated circuit device 2. Further, it is possible to meet the demand for miniaturization of the semiconductor integrated circuit device 2 having the bump electrodes 2a.

Further, the protrusion 1a2 of the carrying tray 1a is
Since the carrier tray 1a is integrally molded at the time of molding,
The number of parts does not increase, and the cost of the transport tray 1a does not increase.

Next, an example of the BGA type semiconductor integrated circuit device 2 carried by the carrying tray 1a will be described with reference to FIGS.

As shown in FIGS. 5 and 6, the upper surface and the back surface of the BGA package type semiconductor integrated circuit device 2 are as follows.
For example, it is formed in an octagonal shape.

On the back surface of the semiconductor integrated circuit device 2, a plurality of bump electrodes 2a are regularly arranged in a matrix. However, on the back surface, in the vicinity of the corner where the protrusion 1a2 (see FIG. 1) abuts, the above-mentioned protrusion 1a
The bump electrode placement prohibited area A is formed in anticipation of the contact of 2 and the bump electrode 2a is not formed.

The bump electrode 2a is used for the semiconductor integrated circuit device 2
Is an external terminal for pulling out the element electrode of the semiconductor chip 2b constituting the semiconductor device, for example, lead (Pb) -tin (S
n) Made of alloy.

The semiconductor chip 2b is made of, for example, silicon (S
i) It is made of a single crystal, and is mounted on the chip mounting region 2d at the center of the main surface of the package substrate 2c in the semiconductor integrated circuit device 2 in a state of being bonded with an epoxy resin containing silver (Ag) or the like. The package substrate 2c is made of, for example, an epoxy resin. In addition, the chip mounting area 2
d is made of a highly conductive metal such as copper (Cu).

A predetermined semiconductor integrated circuit is formed on the main surface of the semiconductor chip 2b, and its element electrode is provided with a lead 2f provided on the outer periphery of a chip mounting area 2d on the package substrate 2c through a bonding wire 2e. Is electrically connected to.

The lead 2f is made of a highly conductive metal such as Cu, and the surface thereof is plated with Ag, for example. The leads 2f are electrically connected to the bump base electrodes 2g on the back surface of the package substrate 2c through the internal wiring formed inside the package substrate 2c. Then, it is electrically connected to the bump electrode 2a provided on the bump base electrode 2g.

The semiconductor chip 2b, the bonding wires 2e, the leads 2f, etc. are sealed with a package resin 2h.

As described above, according to the first embodiment, the following effects can be obtained.

(1). By supporting the BGA package type semiconductor integrated circuit device 2 by the protrusions 1a2, it is possible to prevent the bump electrodes 2a from coming into contact with the carrying tray 1a during the carrying of the semiconductor integrated circuit device 2. It becomes possible.

(2) Due to the above (1), it is possible to prevent the bump electrode 2a from being defective during the transportation of the semiconductor integrated circuit device 2.

(3) Due to the above (1), it becomes possible to prevent deterioration of the solderability of the bump electrode 2a in the semiconductor integrated circuit device 2.

(4). The semiconductor integrated circuit device 2 is attached to the protrusion 1
By supporting with a2, it becomes possible to extremely reduce the area where the bump electrode 2a cannot be formed on the bump electrode forming surface of the semiconductor integrated circuit device 2.

(5). By the above (4), it becomes possible to meet the demand for increasing the bump electrodes 2a of the semiconductor integrated circuit device 2.

(6). Due to the above (4), it becomes possible to meet the demand for miniaturization of the semiconductor integrated circuit device 2. (Embodiment 2) FIG. 8 is a cross-sectional view of a main part of a carrying tray according to another embodiment of the present invention, and FIG. 9 is a description of carrying a package having a bump electrode structure using the carrying tray of FIG. It is a figure.

The carrying tray of the second embodiment will be described with reference to FIGS. 8 and 9. Transport tray 1 according to the second embodiment
Reference numeral b is also a tray used for carrying the BGA package type semiconductor integrated circuit device 2. Note that FIG. 9 shows, for example, a CSP (Chip Size Package) type semiconductor integrated circuit device 2 as an example of the BGA package type semiconductor integrated circuit device 2.

A package accommodating area 1b1 similar to that of the first embodiment is formed on the main surface of the carrier tray 1b.

However, in the second embodiment, the semiconductor integrated circuit device 2 is transported as follows. That is, as shown in FIG. 9, the semiconductor integrated circuit device 2 is accommodated in the package accommodating region 1b1 with its bump electrode forming surface facing upward, and a plurality of such transport trays 1b are stacked and transported.

Therefore, in the second embodiment, since it is not necessary to support the semiconductor integrated circuit device 2 in a floating manner, the projecting portion as in the first embodiment is not provided in the package accommodating region 1b1. .

However, the back surface of the upper carrying tray 1b is
In order to prevent the bump electrodes 2a in the semiconductor integrated circuit device 2 of the lower carrying tray 1b from coming into contact with each other, a protrusion 1b2 is provided on the back surface of the carrying tray 1b. In the second embodiment, the projecting portion 1b2 is located in the package housing area 1
It is provided on the back side of b1. In addition, this protrusion 1b2
Is also integrally formed with the transport tray 1b.

Thus, when a plurality of transport trays 1b are stacked and transported, the transport electrodes 1 with the bump electrodes 2a on the upper stage are transported.
It is possible to prevent contact with the back surface of b. Therefore, it is possible to prevent the bump electrode 2a from being defective due to the contact. Further, it is possible to prevent deterioration of the solderability of the bump electrode 2a due to the contact.

Further, when a plurality of transport trays 1b are stacked and transported, it is possible to prevent the back surface of the transport tray 1b from contacting the bump electrodes 2a by the protrusions 1b2 provided on the back surface of the transport tray 1b. , Semiconductor integrated circuit device 2
It is possible to extremely reduce the area where the bump electrode 2a cannot be formed on the bump electrode forming surface.

Therefore, it is possible to meet the increasing demand for the bump electrodes 2a of the semiconductor integrated circuit device 2. Further, it is possible to meet the demand for miniaturization of the semiconductor integrated circuit device 2.

As described above, according to the second embodiment, the following effects can be obtained.

(1). Protrusions 1b2 on the back surface of the carrying tray 1b.
By providing the plurality of transport trays 1b, the bump electrodes 2a of the semiconductor integrated circuit device 2 in the package accommodating area 1b1 are located above the transport tray 1b.
It is possible to prevent contact with the back surface of the.

(2). By the above (1), it is possible to prevent the bump electrode 2a from being defective due to its contact.

(3) Due to the above (1), it becomes possible to prevent deterioration of the solderability of the bump electrode 2a due to the contact.

(4) Preventing the back surface of the transport tray 1b from coming into contact with the bump electrodes 2a when the plurality of transport trays 1b are stacked and transported by the protrusion 1b2 provided on the back surface of the transport tray 1b. As a result, it is possible to extremely reduce the area where the bump electrode 2a cannot be formed on the bump electrode formation surface of the semiconductor integrated circuit device 2.

(5). Due to the above (4), it becomes possible to meet the demand for increasing the bump electrodes 2a of the semiconductor integrated circuit device 2.

(6). Due to the above (4), it becomes possible to meet the demand for miniaturization of the semiconductor integrated circuit device 2.

(Embodiment 3) FIG. 10 is a sectional view of a main part of a carrying tray according to another embodiment of the present invention, and FIG. 11 is FIG.
It is explanatory drawing at the time of carrying out the package which has a bump electrode structure using the carrying tray of 0.

The carrying tray according to the third embodiment will be described with reference to FIGS. The carrier tray 1c of the third embodiment is also the semiconductor integrated circuit device 2 of the BGA package type.
This is a tray used for transporting the. In addition, in FIG.
As an example of the A package type semiconductor integrated circuit device 2,
For example, a CSP type semiconductor integrated circuit device 2 is shown.

On the main surface of the carrier tray 1c, a package accommodating area 1c1 similar to that of the first and second embodiments is formed. The transportation mode is the same as that in the second embodiment. That is, as shown in FIG. 11, the semiconductor integrated circuit device 2 is accommodated in the package accommodating region 1c1 with its bump electrode formation surface facing upward.
A plurality of transport trays 1c are stacked and transported.

Therefore, also in the third embodiment, since it is not necessary to support the semiconductor integrated circuit device 2 in a floating manner, the projecting portion as in the first embodiment is not provided in the package accommodating region 1c1. .

However, the back surface of the upper carrying tray 1c is
In order to prevent the bumps 2a in the semiconductor integrated circuit device 2 of the lower carrying tray 1c from coming into contact with each other, a projection 1c2 is provided on the back surface of the carrying tray 1c.

In the third embodiment, the protrusions 1c2 are provided on the back surface of the carrying tray 1c near the four corners of the outer periphery of each package accommodating area 1c1. In addition,
The protrusion 1c2 is also integrally formed with the carrying tray 1c.

As a result, when a plurality of transport trays 1c are stacked and transported, the bump electrodes 2a of the semiconductor integrated circuit device 2 housed in the lower transport tray 1c contact the back surface of the upper transport tray 1c. It is possible to prevent it.

Therefore, it is possible to prevent the bump electrode 2a from being defective due to the contact. Also,
It is possible to prevent deterioration of the solderability of the bump electrode 2a due to the contact.

Further, when a plurality of transport trays 1c are stacked and transported, the protrusions 1c2 do not contact the semiconductor integrated circuit device 2, so that bump electrode disposition is prohibited on the bump electrode formation surface of the semiconductor integrated circuit device 2. There is no need to provide a region.

Therefore, it is possible to meet the demand for increasing the bump electrodes 2a of the semiconductor integrated circuit device 2. Further, it is possible to meet the demand for miniaturization of the semiconductor integrated circuit device 2.

In addition, in the third embodiment, when a plurality of transport trays 1c are stacked, the protrusions 1c on the back surface of the upper transport tray 1c in the lower transport tray 1c are stacked.
A recess 1c3 is formed at a portion where the 2 comes into contact with which the projection 1c can be fitted.

The recess 1c3 functions as a plane alignment portion of the carrying tray 1c, and prevents lateral displacement of the carrying tray 1c, so that the back surface of the carrying tray 1c becomes the bump electrode 2a due to the lateral misalignment. It is possible to prevent contact. The size of the recess 1c3 may be such that the protrusion 1c2 is just fitted.
It may be slightly larger.

As described above, according to the third embodiment, the following effects can be obtained in addition to the effects (1) to (3) obtained in the second embodiment.

(1). When a plurality of transport trays 1c are stacked and transported, the protrusions 1c2 do not contact the semiconductor integrated circuit device 2. Therefore, the bump electrode formation surface of the semiconductor integrated circuit device 2 has bump electrodes. There is no need to provide a prohibited area.

(2). By the above (1), it becomes possible to meet the demand for increasing the bump electrodes 2a of the semiconductor integrated circuit device 2.

(3) By the above (1), it becomes possible to meet the demand for miniaturization of the semiconductor integrated circuit device 2.

(4). In the lower carrying tray 1c, a recess 1c3 is formed on the rear surface of the upper carrying tray 1c at the portion contacting the protruding portion 1c2 so that the protruding portion 1c can be fitted therein. It is possible to stack the upper and lower transport trays 1c with good alignment.

(5). In the lower carrying tray 1c, a recess 1c3 is formed on the back surface of the upper carrying tray 1c at the portion where the protruding portion 1c2 comes into contact with the protruding portion 1c. Since the lateral displacement of the transport tray 1c can be prevented, it is possible to prevent the back surface of the transport tray 1c from contacting the bump electrodes 2a due to the lateral displacement.

The invention made by the present inventor has been specifically described above based on the embodiments, but the present invention is not limited to the above-mentioned first to third embodiments, and does not depart from the scope of the invention. It goes without saying that various changes can be made.

For example, in the first embodiment, the case where the protrusions are provided in the vicinity of the four corners of the package accommodating area has been described. However, the present invention is not limited to this, and various modifications can be made. For example, FIGS. As shown, steps (projections) 1d2 for supporting the semiconductor integrated circuit device may be provided at the four corners of the package housing area 1d1.

In the third embodiment, the case where the protrusions are provided on the back surface of the carrying tray in the vicinity of the four corners of the outer periphery of each package accommodating area has been described. However, the present invention is not limited to this and various modifications can be made. It is possible, for example, near the four corners and the center of the back surface of the carrier tray,
You may make it provide a protrusion part.

In the first to third embodiments, the case where the present invention is applied to the plastic package type BGA carrying tray has been described. However, the present invention is not limited to this and various applications are possible. It is also possible to apply it to a ceramic package type BGA carrier tray.

In the above description, the case where the invention made by the present inventor is mainly applied to the carrier tray for the semiconductor integrated circuit device, which is the field of application of the background, has been described, but the invention is not limited thereto. For example, it can be applied to a carrier tray for other electronic components having bump electrodes. INDUSTRIAL APPLICABILITY The present invention can be applied to a carrying tray for electronic components having at least bump electrodes.

[0084]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1). According to the carrier tray of the present invention, the bump electrode can be prevented from coming into contact with the carrier tray while the package is being carried by supporting the package by the projecting portion. Therefore, it becomes possible to prevent the bump electrode defect from occurring during the transportation of the package having the bump electrode. Further, it becomes possible to prevent deterioration of the solderability of the package having the bump electrodes.

(2) According to the carrier tray of the present invention, by supporting the package by the projecting portion, the area where the bump electrode cannot be formed can be made extremely small on the bump forming surface of the package. Therefore, it becomes possible to meet the demand for increasing the bump electrodes of the package having the bump electrodes. Further, it becomes possible to meet the demand for miniaturization of a package having bump electrodes.

(3) According to the carrying tray of the present invention, the bump electrode comes into contact with the back surface of the carrying tray when a plurality of carrying trays are stacked and carried, because the protrusions on the back surface of the carrying tray are provided. Can be prevented. Therefore, it is possible to prevent a bump electrode defect due to the contact. Further, it becomes possible to prevent deterioration of solderability of the bump electrode due to the contact.

(4) According to the transport tray of the present invention, when a plurality of transport trays are stacked and transported, the back surface of the transport tray contacts the bump electrode by the protrusion provided on the back surface of the transport tray. By preventing it, the area where the bump electrode cannot be formed can be made extremely small on the bump electrode forming surface of the package. Therefore, it becomes possible to meet the demand for increasing the bump electrodes of the package having the bump electrodes. Further, it becomes possible to meet the demand for miniaturization of a package having bump electrodes.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a carrying tray according to an embodiment of the present invention.

FIG. 2 is an enlarged plan view of an essential part of the carrying tray of FIG.

FIG. 3 is a sectional view taken along line III-III in FIG. 2;

FIG. 4 is an explanatory diagram of a case where a package having a bump electrode structure is housed in the transport tray of FIG.

FIG. 5 is a top view of a package having a bump electrode structure.

FIG. 6 is a plan view showing a bump electrode formation surface of a package having a bump electrode structure.

7 is a sectional view taken along line VII-VII of FIG.

FIG. 8 is a cross-sectional view of essential parts of a carrying tray according to another embodiment of the present invention.

9 is an explanatory diagram of a case where a package having a bump electrode structure is transported using the transport tray of FIG.

FIG. 10 is a cross-sectional view of essential parts of a carrying tray according to another embodiment of the present invention.

11 is an explanatory diagram of a case where a package having a bump electrode structure is transported using the transport tray of FIG.

FIG. 12 is a cross-sectional view of essential parts of a carrying tray according to another embodiment of the present invention.

FIG. 13 is a cross-sectional view of main parts taken along line XIII-XIII in FIG.

[Explanation of symbols]

 1a to 1d Transport tray 1a1 to 1d1 Package accommodating area 1a2 to 1d2 Projection portion 1c3 Recess 2 Semiconductor integrated circuit device 2a Bump electrode 2b Semiconductor chip 2c Package substrate 2d Chip mounting area 2e Bonding wire 2f Lead 2g Bump base electrode 2h Package resin A bump Electrode placement prohibited area

Front page continuation (72) Inventor Masato Numazaki 5-201-1, Josuihonmachi, Kodaira-shi, Tokyo Inside Hitate Cho-LS Engineering Co., Ltd. (72) Inventor Enomoto Yusuke, Kodaira-shi, Tokyo 5-20-1, Mizumotocho Incorporated company Hitachi Ltd. Semiconductor Division

Claims (5)

[Claims] 1. A carrier tray provided with a package accommodating area for accommodating a package having bump electrodes, the tray being used for moving the package to a predetermined location, the bump electrodes of the package facing the package accommodating area. A protrusion for supporting the package by a point is provided at a predetermined position in the package accommodating region so that the bump electrode does not come into contact with the surface of the package accommodating region when being transported in the packaged state. Transport tray characterized by. 2. A carrier tray provided with a package accommodating region for accommodating a package having bump electrodes, wherein the carrier tray is used to move the package to a predetermined place, and the bump electrodes of the package face outward. In order to prevent the bump electrodes from coming into contact with the back surface of the other transport tray stacked thereon, when the transport electrode is accommodated in the package accommodating area and is transported in a state where the other transport trays are stacked.
A carrying tray characterized in that a protrusion is provided at a predetermined position on the back surface of the carrying tray. 3. The transport tray according to claim 1, wherein the protrusions are provided at four or more places. 4. The transport tray according to claim 1, 2 or 3, wherein the package is BGA. 5. A semiconductor integrated circuit device transported by the transport tray according to claim 1, wherein the bump electrode is provided on a portion of the back surface of the package where the protrusion contacts. A semiconductor integrated circuit device having a prohibition region for prohibiting the disposition of the semiconductor integrated circuit device.