JPH09148276A - Wafer braking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device in which braking is performed along a half-cut line of a wafer and scattering or adhesion of dust on a braking face does not occur. SOLUTION: In a wafer braking device 20A in which wafers which have been half-cut, and which are adhered to a tape are performed braking to each chip, the half-cut line is provided in a checker pattern manner, and further pressurizing means 46 for pressurizing from the tape side and performing braking from the cut line is provided. The pressurizing means 46 has a pressurizing part 46a for pressurizing on the tape and simultaneously sliding. After the pressurizing part 46a moves to a vertical direction to one of the normal cut lines and performs braking from the one cut line, it moves to a vertical direction to the other cut line and performs braking from the other cut line.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for braking an uncut portion of a dicing wafer.

[0002]

2. Description of the Related Art Conventionally, as this kind, for example, FIG.
(Japanese Patent Laid-Open No. 6-140504).
This structure uses a dicing device (not shown) after half-cutting the tape-mounted wafer 1.
Both sides of the frame 3 held on the tape 2 are pressed and fixed to predetermined positions of the frame table 5 by the frame clamps 4, and the advancing / retreating means 6 is moved up the moving plate 8 via the servo motor 6a so that the pressing means 10 moves. The wafer 1 is set at an appropriate position and is pressed from the back side of the tape 2 by the pressing terminals 11 and 12.
Is squeezed by the rotational force obtained through the rotary shaft 14 connected to the drive motor 13, the horizontal mounting plate 14a, and the large and small circular plates 15 and 15a to brake each chip.

[0003]

However, in the conventional case, when the half-cut wafer 1 is braked, a force is applied so that the pressing terminals 11 and 12 rotate, so that the half-cut line is evenly distributed. It is difficult to break linearly from the half-cut line because the force is applied to draw a circle instead of the break force. Therefore, the breaking line becomes zigzag and the dust is easily scattered, and the scattered dust may be attached to the surface of the wafer 1 to be damaged.

Therefore, the present invention is to provide a wafer braking device capable of braking along a half-cut line of a wafer and preventing dust on the braking surface from scattering and adhering to the wafer.

[0005]

In order to achieve this object, according to the invention described in claim 1, in a wafer braking apparatus for braking a half-cut wafer stuck on a tape to each chip, The half-cut lines are provided in a grid pattern, and pressurizing means for applying pressure from the tape side to brake from the cut line is provided, and the pressurizing means slides while applying pressure on the tape. The pressurizing unit has a moving part that moves in a direction perpendicular to one of the orthogonal cut lines, brakes from the one cut line, and then moves in a direction perpendicular to the other cut line. Then, braking is performed from the other cut line.

In such a case, since the braking can be performed along the half-cut line from the back surface side of the tape, the braking line does not become zigzag, and even if the wafer is braked upward. Even if the brakes are applied downward, there is little dust and there is little risk of damaging the wafer.

According to the second aspect of the present invention, in a wafer braking apparatus for braking a half-cut wafer attached on a tape to each chip, the tape is set so as to be located above the wafer. On the upper side of the tape, there is provided a pressing means that slides while pressing on the tape to brake from the cut line of the half cut, while the lower side of the tape is sealed so as to cover the periphery of the wafer. It is characterized in that a chamber is formed, and suction means for sucking dust in the closed chamber is provided after completion of pressurization of the pressurizing means.

In such a structure, even if dust is generated due to braking, it does not adhere to the surface of the wafer because it falls downward, is further sucked and discharged.

According to the third aspect of the invention, in the wafer breaking apparatus according to the second aspect, the state in which the wafer is attached to the upper surface of the tape is turned over so that the tape is located on the upper surface of the wafer. The feature is that it is set.

In such a structure, the dust adhering thereto can be dropped by turning it over. Further, by adjusting the air pressure in the closed chamber, which is the closed chamber in which the tape having the adhesive surface turned upside down is set, the amount of displacement of the wafer by the pressing means becomes appropriate, and uniform braking can be performed.

According to a fourth aspect of the present invention, in the wafer braking device according to the first to third aspects, a plurality of braking poles are provided so as to be vertically movable and urged toward the tape. That is a feature.

In such a structure, even if there is a partial difference in adhesive strength between the wafers, the vertical movement of each braking pole absorbs a partial pressing force and the pressure is even.

According to a fifth aspect of the present invention, in the wafer breaking apparatus according to the second to fourth aspects, a suction pad is provided so that the tape covering the closed chamber can be peeled and conveyed, and a peeling chuck is provided. The feature is that it is provided.

In such a case, the adhesive surface of the tape holding the wafer may be adhered to the flange surface of the closed chamber and may not come off easily, and the suction force of the suction pad may be insufficient. Also, it can be peeled off mechanically with a peeling chuck, and can be peeled and conveyed while making it easy to peel by putting air in the closed chamber.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a plan view of the wafer breaking device 20A, which shows a loader section 21 and a transfer section 31 of the wafer 20.
And a braking unit 41.

First, the structure of the loader unit 21 will be described. FIG. 1 shows the structure of the loader unit 21 in a plan view, and FIG. 2 shows the structure of the loader unit 21 in the direction of arrow A in FIG.

In the figure, reference numeral 211 is a cassette loader zone, and 20 is a wafer which is a frame 23 via a tape 20a.
It is stored in a cassette 22 in a step-like manner in a state of being attached to the.

Reference numeral 212 is a carry-in / out zone, 25 is a lift, and 26 is a fork of the lift 25, on which the cassette 22 is placed and which moves up and down.

Reference numeral 213 denotes an unloader zone, which is a cassette 22 in which the wafers 20 for which braking has been completed are stored.
Is a part of the table 27 that sends out to the next process.

Next, the operation of the loader unit 21 will be described. A cassette 22 in which a plurality of wafers 20 half-cut in the previous step are stored in a stepwise manner is placed on the cassette loader 24 in the cassette loader zone 211. The cassette 22 is placed and pushed by an air cylinder (not shown), and the fork 2 of the lift 25, which is the loading / unloading zone 212.
Moved to 6.

The lift 25 is used for the frame 2 of the wafer.
3 is adjusted to an appropriate height, and the wafer frame 23 is unloaded. After that, when the braking is finished, it is returned to the original position, and the fork 26 of the lift 25 is moved up and down to the carrying-out height of the frame 23 of the wafer to be braked next, and when the braking is finished, it is returned to the original position. , Fork 2 of lift 25 to the position of frame 23 of the next wafer
The vertical movement of 6 is repeated to complete the braking of the wafer 20 in the cassette 22.

At this time, the lift 25 descends and the cassette 22 is pulled out from the fork 26 by the air cylinder and transferred to the unloader zone 213. then,
The lift 25 ascends to receive the cassette 22 pushed by the air cylinder from the cassette loader zone 211. The loader unit 21 repeats this operation.

Next, the structure of the carrying section 31 will be described. FIG. 1 shows the plan view, and FIG. 3 shows the structure of the carrying section 31 as seen from the arrow B in FIG.

In the figure, 31a is a drive motor, and 32 is a belt which is rotatably provided in a side T-shape so as to be movable back and forth. A transfer arm 33 is fixed on the plane of the T-shaped belt 32. An air-driven chuck portion 34 is attached to the transfer arm 33. A rotary arm 35 is fixed to the rotary shaft 36. A plurality of suction pads 37 and a peeling chuck 38 are attached to the rotating arm 35 at appropriate positions.

Next, the operation of the carrying section 31 will be described.

First, the drive motor 31a is driven, the transfer arm 35 is advanced to the loading / unloading zone 212 side of the cassette 22 via the belt 32, and the chuck portion 34 provided on the transfer arm 33 is air-operated to operate the wafer frame 23. Grab and retreat. Then, it retracts to the position of the suction pad 37 provided on the rotary arm 35 and is sucked.

Then, the rotary arm 35 rotates about the rotary shaft 36 to reversely set the wafer frame 23 on the flange surface 43 of the sealed chamber 42 and return to the original position.

In the next operation, the frame 23 of the wafer after braking is fixed to the suction pad 37 and the peeling chuck 38 provided on the rotary arm 35 and returned to the transfer section 31 from the closed chamber to suck the wafer. The pad 37 and the peeling chuck 38 are opened. Then, the wafer frame 23 is gripped by the chuck portion 34 provided on the transfer arm 33, and the belt 32 is operated by the drive motor 31 a to move the transfer arm 33 forward and return it to the cassette 22. This operation is repeated.

Next, the structure of the braking portion 41 will be described. In FIG. 1, the plan view is shown, and in FIG. 4, the pressing means 46 is viewed from the front (a) of FIG. The configuration of the braking portion 21 is shown on the side surface (b) of the pressurizing means 46 as viewed from the arrow D of a).

In the figure, reference numeral 42 designates a closed chamber in which a flange surface 43 is provided on the outer periphery of the upper surface and a plurality of clamps 44 are provided on the outside thereof. Further, suction means 45 having a plurality of vacuum holes is provided on the bottom surface of the closed chamber 42.

Reference numeral 46 denotes a pressing means, and 46 is a plurality of braking poles 47, the number of which exceeds the width of the wafer 20. This pole 47 is provided with a tip end portion 48 having a curved surface, and a spring 50 and a nut 51 are inserted and removed at the center of the pole 47 so that the reaction force of the spring 50 can be adjusted by adjusting the position of the nut 51. It is attached to 52. Further, as shown in FIG. 4B, the poles 47 are mounted in a row.

The pole holder 52 is used for the tilting shaft 5
4 to the pressure plate 55, and the pressure plate 55 is assembled to the pressure unit 46a having a pressure mechanism.

Next, the operation of the braking portion 41 will be described.

The transfer chamber 31 is turned over and the sealed chamber 42 is turned on.
Wafer frame 23 set on the flange surface 43 of the
Are fixed from the surroundings by a clamp 44. At that time, the pressurizing unit 46a moves along the guide rail 53,
The wafer 20 near the wafer 20 attached to the tape 20a is moved to a start position along a half-cut line of the wafer 20 to start a braking operation.

That is, the braking operation is as shown in FIG.
As shown by the arrow line in (b), the braking pole 47 is pushed to a set depth at the start position on the back surface side of the tape 20a attached to the frame 23 of the wafer. While maintaining this state, the back surface of the wafer 20 is slid.

Then, the pole 47 is lifted away from the tape surface 20a at a position after passing through the substantially central position of the tape 20a, and is moved to a position after passing through the wafer 20. Then, the pole 47 is pushed in again from the tape surface to the set depth and slid until it passes the position in the approximate center, and the braking in one direction is completed.

Then, the pole 47 is lifted to raise the closed chamber 4
2 is rotated about 90 degrees, the pole 47 is returned to the start position along the half-cut line of the wafer 20, and the same operation as the previous time is repeated to end the braking in the other direction.

When the braking operation in the two directions orthogonal to each other is completed, the rotary arm 35 of the transfer section 31 moves the frame 23 to the position of the frame 23 of the wafer in the closed chamber 42.
Then, the suction pad 37 and the peeling chuck 38 are fixed to each other, and the peeling chuck 38 is peeled from the closed chamber 42 and returned to the conveying unit 31 side.

As described above, the loader section 21.
Each mechanism of the transport unit 31 and the braking unit 41 cooperates to configure the braking device 20A, and the tape 20a
The wafer 20 affixed to is braked from the back surface side in a grid pattern orthogonal to each other along the half-cut line.

Here, the tape 20a refers to one in which vinyl chloride is used as a normal material and has a thickness of about 80 μm, and one side is coated with an adhesive and the wafer is adhered and held on this coated surface.

The outer periphery of the tape 20a, which holds the wafer 20 by adhesion, is a frame 23 of a substantially ring shape.
When it is attached to the frame 23 and is half-cut by a dicing device (not shown) and is being braked, it is attached to the frame 23 and moved in the processing process.

In the braking portion 41 of the present embodiment, the adhesive surface of the tape 20a is adhered to the flange surface 43 of the hermetically sealed chamber 42 when it is transported, so that the hermetically sealed chamber can be formed. Therefore, although it is effective as a sealing surface when discharging dust during braking, it is difficult to peel off the tape when transporting after breaking, so that the peeling chuck 38 is provided in addition to the suction pad 37 for peeling. I am sure.

Here, inversion of the wafer frame 23 is a dicing device which is a pre-processing step of breaking, and the wafer 20 attached to the tape 20a is half-cut from the upper surface side, and the wafer breaking device 2
It is conveyed to the 0 A loader section 21. Then, since this wafer 20 is stuck on the upper surface of the tape,
In the present embodiment in which braking is performed from the back surface side of the tape 20a, it is necessary to invert the wafer 20 via the rotating arm 35 in the transfer section 41 and set it in the closed chamber 42.

However, when a wafer reversing mechanism (not shown) is provided before being transferred to the loader section 21, the transfer section 3 is used.
It is also possible to set it in the braking part 41 without reversing it in 1.

[0046]

As described above, according to the first aspect of the present invention, since it is possible to brake linearly along the half-cut line from the back surface side of the tape, the wafer is braked upward. Dust is small even if it is pressed or braked downward, there is little risk of damaging the wafer, and the defect rate can be reduced.

According to the invention described in claim 2, since the braking is performed from the back surface side holding the wafer,
Even if dust is generated due to braking, it does not adhere to the surface of the wafer because it falls downward and is further sucked and discharged. Therefore, the quality is kept stable and the occurrence of defects is eliminated.

According to the invention described in claim 3, it is possible to drop the attached dust by turning it over. Also, by adjusting the air pressure of the closed chamber where the tape that turned inside out and became a glue surface was set,
The amount of displacement of the wafer by the pressing means becomes appropriate, and uniform braking can be performed. Therefore, generation of dust during braking is reduced, and damage to the wafer is reduced.

According to the fourth aspect of the present invention, even if there is a partial difference in adhesive strength between the wafers, the partial upward pressure of each braking pole is absorbed and equalized. Therefore, braking can be reliably performed along the half cut line.

According to the fifth aspect of the present invention, the peeling chuck mechanically peels off the air, and the air can be introduced into the closed chamber to ensure the peeling while facilitating the peeling. Therefore, productivity is improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a view taken in the direction of arrow A in FIG. 1;

FIG. 3 is a view taken in the direction of arrow B in FIG. 1;

FIG. 4A is a view taken in the direction of arrow C in FIG. (B)
It is a D arrow line view of Fig.4 (a).

FIG. 5A is a perspective view of a conventional braking device. FIG. 5B is a view as seen from an arrow E in FIG.

[Explanation of symbols]

 20A ... Wafer braking device 20 ... Wafer 20a ... Tape, 20b ... Chip 37 ... Adsorption pad 38 ... Peeling chuck 42 ... Sealing chamber 45 ... Suction means 46 ... Pressurizing means 46a ... Pressurizing section 47 ... Braking pole

Claims (5)

[Claims] 1. A wafer breaking device for breaking a half-cut wafer attached on a tape to each chip, wherein the half-cut lines are provided in a grid pattern, and
A pressurizing unit that pressurizes from the tape side and brakes from the cut line is provided, and the pressurizing unit has a pressurizing unit that slides while pressurizing on the tape, and the pressurizing unit includes:
After moving in a direction perpendicular to one of the orthogonal cut lines and braking from the one cut line, it is moved in a direction perpendicular to the other cut line and braking from the other cut line. A wafer breaking device characterized by the above. 2. A wafer breaking device for breaking a half-cut wafer adhered on a tape to each chip, wherein the tape is set so as to be located above the wafer,
On the upper side of the tape, a pressure means for sliding while pressing the tape to brake from the cut line of the half cut is provided, while on the lower side of the tape, a closed chamber is provided so as to cover the periphery of the wafer. A wafer breaking device, which is provided with suction means for sucking dust in the closed chamber after the pressurization of the pressurizing means is completed. 3. The wafer breaking apparatus according to claim 2, wherein the tape is set up so that the tape is positioned on the upper surface of the wafer by turning it over from the state in which the wafer is attached to the upper surface of the tape. 4. The wafer braking apparatus according to claim 1, wherein a plurality of braking poles are provided so as to be vertically movable and urged toward the tape. 5. The wafer breaking apparatus according to claim 2, wherein a suction pad is provided so that the tape covering the closed chamber can be peeled and conveyed, and a peeling chuck is provided.