JPH09136282A - Electronic part suction nozzle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely bring a lead wire of a TCP into contact with a pad in a printed circuit board when the TCP is mounted on the printed circuit board. SOLUTION: An electronic part suction nozzle for sucking and holding a TCP 51, which is an electronic part to be mounted on a printed circuit board, is provided with a nozzle main body 11, a suction body 18 which is arranged in the nozzle main body 11 so as to suck and hold the TCP, and a pressing body 31 which is arranged in the nozzle main body 11 freely oscillationally by means of a spring part 34 and presses the electronic part when the TCP sucked and held on the suction body 18 is mounted on the printed circuit board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mounting apparatus, in which an electronic component incorporated in a mount head for mounting an electronic component such as a tape carrier package (hereinafter referred to as "TCP") on a printed circuit board. It relates to a suction nozzle.

[0002]

2. Description of the Related Art Conventionally, a TCP has been used for a mount head of an outer lead bonding apparatus which is a semiconductor mounting apparatus.
An electronic component suction nozzle is used to suck and hold electronic components such as. When the TCP is mounted on the printed circuit board by the electronic component suction nozzle, the suction surface of the suction nozzle and the mounting surface of the printed circuit board are kept parallel to each other to reliably bond the lead of the TCP and the pad of the printed circuit board. I was trying to do it. Therefore, it is necessary to adjust the angle of the lower surface of the suction nozzle with high accuracy.

However, in actuality, it is easy to set the parallelism between the suction surface of the suction nozzle and the mounting surface of the printed circuit board with high accuracy because the plane accuracy of the printed circuit board varies due to warping or the like. Not. If these parallelisms are not set with high precision, a defective portion may occur in the contact state between the pad of the printed board and the lead of the TCP, and the lead may not be reliably soldered to the pad. There was that.

In order to improve the contact state of the lead, the TCP may be strongly pressed against the printed board.
However, when the applied pressure is strong, the semiconductor chip provided on the TCP is strongly pressed against the printed circuit board, so that the semiconductor chip may be cracked.

In addition, when the applied pressure is strong, the printed circuit board is deformed, so that it is necessary to back up the back surface of the printed circuit board to prevent the deformation. As a result, components cannot be mounted on the back surface of the printed circuit board to which the backup contacts, which may result in low mounting density.

In addition, TCP, which has a large heat generation amount such as CPU
In order to improve heat dissipation, the printed circuit board and T
A heat dissipation material such as a silver paste is provided between the CP and the CP to improve heat transfer between them.

In that case, it is required to press the central portion where the TCP semiconductor chip is provided and the peripheral portion where the lead is provided with appropriate pressing forces, respectively, but conventionally, the entire TCP is pressed with the same pressing force. I was pressing. for that reason,
Since the central portion and the peripheral portion of the TCP cannot be pressed with appropriate pressures, contact failure of the semiconductor chip and TCP
In some cases, this could lead to mounting defects such as lead bending.

The TCP is formed by punching out a carrier tape. At that time, although the lead is molded into a predetermined shape, if the metal material forming each lead does not have a uniform shape due to variations in hardness, when TCP is pressed onto the printed circuit board, There are leads that float from the pad and leads that are deformed into a shape different from the predetermined shape. Therefore, the lead may not be surely soldered to the pad.

[0009]

As described above, conventionally, when mounting an electronic component, it is necessary to ensure the parallelism between the printed circuit board and the electronic component with high accuracy. However, in reality, the parallelism of the printed circuit board is high. Since the parallelism cannot be set with high accuracy due to the variation in, the mounting failure may be caused.

The present invention has been made based on the above circumstances, and an object of the present invention is to provide an electronic component suction nozzle capable of mounting electronic components on a printed circuit board with high precision.

[0011]

In order to solve the above-mentioned problems, the invention of claim 1 is an electronic component suction nozzle for sucking and holding an electronic component mounted on a printed circuit board. A suction portion provided to suck and hold the electronic component, and an electronic component that is swingably provided to the nozzle body by an elastic member and that is sucked and held by the suction portion when the electronic component is mounted on the printed circuit board. And a pressing body having a pressing surface for pressing the component.

According to a second aspect of the invention, in the first aspect of the invention, the suction portion is structured to swingably hold the electronic component. The invention of claim 3 is
In the invention of claim 1, the suction part is elastically displaceably provided on the nozzle body.

According to a fourth aspect of the present invention, in the first aspect of the present invention, when the electronic component is mounted on the printed circuit board, the electronic component is applied to the printed circuit board with a predetermined force or more. It is characterized in that a stopper for preventing pressing is provided.

According to a fifth aspect of the present invention, in the first aspect of the present invention, when the electronic component is mounted on the printed circuit board, the pressure body is deformed by a lead provided on the electronic component. A straightening member for straightening is provided.

According to a sixth aspect of the present invention, there is provided an electronic component suction nozzle for sucking and holding an electronic component mounted on a printed circuit board, the nozzle body and the electronic component provided on the nozzle body for sucking and holding the electronic component. And an adsorbent made of an elastic material that can be deformed by a force applied when it is mounted on the printed circuit board.

According to the first aspect of the present invention, since the pressurizing body having the pressurizing surface for pressurizing the electronic component is swingably provided, when the electronic component is not parallel to the printed circuit board, By pressing the electronic parts against the printed circuit board,
It swings together with the pressure body. Therefore, the lead of the electronic component can be surely brought into contact with the pad of the printed circuit board, so that the soldering can be surely performed.

According to the second aspect of the present invention, since the electronic component is swingably held by the suction portion, the electronic component easily swings when being pressed by the printed circuit board. According to the invention of claim 3, when the electronic component is pressed against the printed circuit board, the suction portion is elastically displaced, so that the portion corresponding to the suction portion is pressed against the printed circuit board with an appropriate pressing force. You can

According to the fourth aspect of the present invention, since the pressing force applied to the electronic component is limited by the stopper provided on the pressurizing body, it is possible to prevent the lead from being crushed. Claim 5
According to the invention, even if the lead shape varies,
When the electronic component is mounted on the printed circuit board, the shape thereof is corrected to a substantially constant value by the correction member provided on the pressing body, so that each lead can be surely brought into contact with the pad of the printed circuit board. .

According to the sixth aspect of the invention, when the electronic component is mounted on the printed circuit board, the nozzle body is deformed in accordance with the force applied to the electronic component to swing the electronic component. Even if it is not parallel to, it can be surely mounted.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 6 show a first embodiment of the present invention. FIG. 1 shows an electronic component suction nozzle 1 according to the present invention.
The suction nozzle 1 is detachably attached to the attachment shaft 2 of the mount head of the outer bonding device. That is, the chuck mechanism 3 is provided at the lower end of the mounting shaft 2. The chuck mechanism 3 has a cylindrical body 4 which is externally fitted and fixed to the lower end of the mounting shaft 2. A plurality of through holes 5 are formed in the peripheral wall of the cylindrical body 4 at predetermined intervals in the circumferential direction. A ball 6 is provided in the through hole 5.
The ball 6 is elastically pressed by the other end of the leaf spring 7 having one end fixed to the cylindrical body 4.

The outer peripheral surface of the lower end portion of the mounting shaft 2 and the cylindrical body 4
Recessed step portions 2a, 4a are formed at the lower ends of the inner peripheral surfaces of the two, and an insert portion 8 is formed between the mounting shaft 2 and the cylindrical body 4 by these step portions. The leaf spring 7
The ball 6 pressed by the step portion 2a of the mounting shaft 2 is
Since it comes into contact with the outer peripheral surface of, it does not fall off from the through hole 5.

The suction nozzle 1 has a nozzle body 11. The nozzle body 11 includes a disk-shaped lower member 12 and an upper member 13 joined and fixed to the upper surface of the lower member 12. The upper member 13 includes a hollow shaft portion 14 and the hollow shaft portion 1
4 is provided at the lower end of the lower member 4 and is joined to the upper surface of the lower member 12 and is fixed by a screw 15a.

The hollow shaft portion 14 is set to have inner and outer diameter dimensions that can be inserted into the insertion portion 8, and a plurality of conical recesses 16 are formed on the outer peripheral surface thereof at intervals corresponding to the through holes 5 in the circumferential direction. Are formed. By inserting the hollow shaft portion 14 into the insertion portion 8, the hollow 16 is inserted into the recess 16 of the hollow shaft portion 14.
The elastic nozzle 6 engages elastically, so that the suction nozzle 1 is detachably held by the mounting shaft 2.

The lower member 12 of the nozzle body 11 is formed with an accommodating portion 17 penetrating in the vertical direction in the central portion thereof. The storage unit 17 has an adsorbent 1 forming an adsorption unit.
8 is slidably stored in an airtight state. The adsorbent 18 has a shaft portion 19 formed at its tip (lower end). The shaft portion 19 is provided with a suction hole 21 having one end opened to the tip surface of the shaft portion 19. The other end of the suction hole 21 communicates with a recess 22 formed in the rear end surface (upper end) of the suction body 18 and opened.

The recess 22 is provided with a spring 23 that biases the adsorbent 18 in a direction projecting from the housing 17. That is, the adsorbent 18 is elastically displaceably held in the storage portion 17 by the spring 23.

A collar 24 is provided at the open end of the accommodating portion 17, and a step portion 18a formed at the lower end of the adsorbent 18 engages with the collar 24 to accommodate the adsorbent 18. It is prevented from being pulled out from the portion 17. The collar 24 projects from the lower surface of the lower member 12 by a predetermined dimension.

The suction hole 21 communicates with the suction passage 2a formed in the mounting shaft 2 through the recess 22. The suction passage 2 a communicates with the suction pump 25. Therefore, by operating the suction pump 25, the suction holes 2
1 can generate a suction force.

An O-ring 26 as an elastic member is provided on the shaft portion 19 of the adsorbent 18. This O-ring 2
As shown in FIG. 4, 6 is provided so as to slightly project from the tip end surface of the shaft portion 19. This protruding dimension is indicated by A in the figure. As a result, the TCP 51 as an electronic component that is sucked and held by the shaft portion 19 by the suction force generated in the suction hole 21 comes into contact with the O-ring 26, so that the O-ring 26 can be elastically deformed and swung. Has become.

As shown in FIG. 4, the TCP 51 has a resin tape 51a having a predetermined shape, a semiconductor chip 51c provided in a device hole 51b formed in the central portion of the tape 51a, and the tape. Lead 51d derived from the peripheral portion of the plug 51a. The lead 51d is formed in a predetermined shape when the TCP 51 is punched out from a long tape, that is, a wing shape in this embodiment.

A pressure member 31 having a lower surface as a pressing surface 31a is provided on the lower surface side of the nozzle body 11. As shown in FIG. 2, the pressurizing body 31 is formed by a rectangular frame portion 32, an annular portion 33 provided in the central portion of the frame portion 32, and the annular portion 33 and a leaf spring material. It is formed of four strip-shaped spring portions 34.

The annular portion 33 is fixed to the lower surface of the collar 24 provided on the lower member 12 of the nozzle body 11 by a mounting pin 35. Therefore, the frame portion 32 of the pressing body 31 can be swung by elastically deforming the spring portion 34.

Mounting portions 36 are formed at the four corners of the frame portion 32. A stopper pin 37 as a stopper is projected from the mounting portion 36. The stopper pin 37 is a lower surface of the mounting portion 36, which is a pressing surface 31a.
It protrudes from the specified size. This protruding dimension is indicated by B in FIG.

Further, the lower end of the stopper pin 37 is
Lead 5 of TCP 51 adsorbed and held on the adsorbent 18
The length is set to be above the lower end surface of 1d by a predetermined dimension. This dimension is indicated by C in FIG. 1, and this dimension is set to, for example, about 0.6 mm.

Therefore, when the TCP 51 adsorbed and held by the adsorbent 18 is mounted on the printed circuit board 61, the TC
In this embodiment, P51 can be displaced downward by about 0.6 mm from the contact of the lead 51d with the pad 61a of the printed circuit board 61 to the contact of the lower end of the stopper pin 37 with the printed circuit board 61. It has become. Therefore, the stopper pin 37 is connected to the lead 51d.
The pad 61a is prevented from being pressed by a force greater than a predetermined value to collapse the bent shape. The thickness of the pad 61a provided on the printed board 61 is about 30 μm.

A wire 38 as a correction member is stretched on each side of the frame 32 of the pressing body 31.
In this embodiment, the wire 38 is stretched by welding both ends to the stopper pins 37 provided at the corners of the frame 32. The wire 38 is TCP5 as shown in FIG.
When mounting 1 on the printed circuit board 61, it is provided at such a height that it comes into contact with the tip portion of the lead 51d molded into a predetermined shape.

As a result, even if the wire 38 has a lead 51d that jumps up as shown by a chain line in FIG. 5 at the time of molding, the lead 51d is pushed down as shown by a solid line in FIG. The pad 61a of 61 is brought into contact with the pad. That is, the wire 38 can correct the deformation of the lead 51d.

The pad 61a is pre-plated with solder. Therefore, TCP5 is added to the pad 61a.
After contacting the lead 51d of No. 1 and irradiating the portion with laser light L as shown in FIG. 5, the solder is melted and the lead 51d is soldered to the pad 61a. . The wire 38 is made of a heat-resistant material such as tungsten so as not to be melted by the heat of the laser light L.

Although the tip of the lead 51d is covered with the wire 38 and the laser light L cannot be directly applied to the entire portion, the solder can be melted by heat conduction from the wire 38.

Using the suction nozzle 1 having the above structure, TCP 5
When mounting 1 on the printed circuit board 61, first, the adsorbent 18
The TCP 51 is adsorbed and held by. The semiconductor chip 51c of the TCP 51 adsorbed and held by the adsorbent 18 comes into contact with the O-ring 26 provided on the shaft portion 19, so that the tip end of the shaft portion 19 is indicated by the dimension A as shown in FIG. Since the surface has a predetermined gap, the O-ring 26 elastically holds the surface.

After the TCP 51 is held on the suction body 18, the suction nozzle 1 is positioned above a predetermined position on the printed circuit board 61 and then lowered. As a result, first, the leading end of the lead 51d of the TCP 51 is attached to the printed circuit board 6.
By contacting the first pad 61a and further lowering it, the lead 51d is pressed against the pad 61a by the pressing surface 31a of the pressing body 31 via the tape 51a. The semiconductor chip 51c is pressed by the O-ring 26.

When the lead 51d comes in contact with the pad 61a and then descends by a predetermined distance, the lower end of the stopper pin 37 provided on the pressurizing member 31 comes into contact with the printed circuit board 61. At this time, if the printed circuit board 61 and the TCP 51 are not parallel to each other as shown in FIG. 6A, all the four stopper pins 37 will not come into contact with the printed circuit board 61.

In this case, a reaction force is applied to the pressurizing body 31 from the stopper pin 37 in contact with the pressurizing body 3 by the reaction force.
By elastically deforming the spring part 34 of FIG.
Since the frame portion 32 swings as shown in (b), the TCP 51 also interlocks with the swing of the frame portion 32. Therefore, even if the printed circuit board 61 is deformed, the leads 51d on each side of the TCP 51 can be surely brought into contact with the pad 61a.

Further, at that time, the wires 38 provided in the peripheral portion of the frame portion 32 come into contact with the upper surface of the tip portion of each lead 51d. Therefore, of the many leads 51d, even if there is a lead 51d that has jumped upward as shown by the chain line in FIG. 5, the deformation of the lead 51d is corrected by the wire 38 and contacts the pad 61a. To do. Therefore, each lead 51d of the TCP 51 can be surely brought into contact with the pad 61a.

In this way, the suction nozzle 1 is lowered to a predetermined position and each lead 51d of the TCP 51 is moved to the pad 61a.
When the lead 51d is brought into contact with the pad 51a, the lead 51d (the portion of the wire 38) is irradiated with the laser light L in this state, so that the lead 51d is soldered to the pad 61a.

The semiconductor chip 51 is provided between the semiconductor chip 51c of the TCP 51 and the printed circuit board 61.
In order to improve the heat dissipation of c, as shown in FIG.
The strike 71 may be interposed. In that case, the semiconductor chip 51c is attached to the shaft portion 19 of the adsorbent 18 by the O
It is pressed by the ring 26, and the adhesion with the silver paste 71 is enhanced.

The adsorbent 18 provided with the O-ring 26 is
It is slidably provided in the housing portion 17 of the nozzle body 11, and is elastically held by the spring 23. Therefore, although the suction body 18 presses the semiconductor chip 51c as the suction nozzle 1 descends, when the pressing force exceeds a certain level, the spring 23 elastically deforms upwards regardless of the suction nozzle 1 descending. Since the semiconductor chip 51c is displaced, the semiconductor chip 51c will not be excessively pressed and damaged.

That is, in the TCP 51, the semiconductor chip 51c provided in the central portion and the lead 51d provided in the peripheral portion are pressed by the adsorbing member 18 and the pressing member 31 with appropriate forces. It will be.

If the electronic component is TCP 51, the
The cap 51a has flexibility. Therefore, the O
A ring 26 is provided, and the semiconductor chip 51 is attached to the adsorbent 18.
Even if c is not supported so that it can be swung, only the tape 51a is elastically bent by the swing of the pressurizing body 31, and the lead 51d provided around the tape 51a is swung. You can

FIG. 7 shows a second modification of the first embodiment.
In this embodiment, this embodiment shows a modified example of the suction member provided in the housing portion 17 of the lower member 12 of the nozzle body 11.
The adsorbent 18A of this embodiment is formed by independently foaming an elastic material such as PORON (trade name), is not slidable in the accommodating portion 17, and has a lower end protruding from the lower surface of the lower member 12 by a predetermined dimension. It is stored and held so that it cannot be pulled out.

A suction hole 21A communicating with the suction passage 2a of the shaft portion 2 of the mount head is formed in the suction member 18A, and TC is generated by the suction force generated in the suction hole 21A.
P51 is adsorbed and held.

Since the adsorbent 18A is formed of an elastic material as described above, when the TCP 51 is pressed against the printed board 61 when the TCP 51 is mounted on the printed board 61, the adsorbent 18A is elastically deformed by its reaction force. However, the TCP 51 adsorbed and held by the TCP 51 can be swung, and the reaction force applied to the semiconductor chip 51c can be reduced.

Therefore, in order to securely mount the TCP 51, the adsorbent 18A does not need to be slidably provided in the adsorbing hole 21A or elastically held by the spring 23, so that the structure can be simplified. .

8 to 10 show a third embodiment of the present invention. In this embodiment, the same parts as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted. That is, this embodiment is a modification of the nozzle body, and the nozzle body 11A of this embodiment has a lower member 81 and an upper member 82.
And The upper member 82 is provided with a hollow shaft portion 14A elastically held by the chuck mechanism 3, and
A communication passage 83 communicating with the suction passage 2a of the shaft portion 2 of the mount head is formed. The communication passages 83 open at the four corners of the lower surface of the upper member 81.

The lower member 81 has a rectangular mounting plate 84,
An adsorbent 18B, which is formed into a hollow shape by independently foaming an elastic material such as PORON (trade name) on the lower surface of the mounting plate 84
And the mounting plate 83 is screwed onto the upper member 82.
5 fixed.

One end of each of the four corners of the lower member 81 communicates with the communication passage 83, and the other end of the lower member 81 has the other end.
The suction hole 86 opened on the lower surface of B is formed, and the TCP 51 is suction-held on the lower surface of the adsorbent 18B by the suction force generated in the suction hole 86. That is, in the TCP 51, the semiconductor chip 51c is located inside the hollow portion of the adsorbent 18B, and the tape 51a portion is joined to the lower surface of the adsorbent 18B to be adsorbed and held. Therefore, the lower surface of the adsorbent 18B serves as a pressing surface 87 that presses the TCP 51 when the TCP 51 is mounted on the printed circuit board 61.

According to the suction nozzle 1 having such a structure,
When mounting the TCP 51 on the printed circuit board 61, as shown in FIG.
As shown in (a), the TCP 51 and the printed circuit board 61 may not be parallel to each other. In such a case, the suction nozzle 1
As the lead 51d in the peripheral portion of the TCP 51 does not evenly contact the printed circuit board 61 when is lowered, as shown in FIG.
As shown in 0 (b), the adsorbent 18B is compressed and deformed according to the force applied to the adsorbent 18B via the lead 51d.

That is, the adsorbent 18B is deformed so that the leads 51d provided in the peripheral portion of the TCP 51 abut the printed circuit board 61 substantially uniformly. Therefore, TCP51
Even if the parallelism between the printed circuit board 61 and the printed circuit board 61 is not precisely set, the adsorbent 18B is compressed and deformed in accordance with the error in the parallelism so that the TCP 51 swings and each lead 51d is placed on the printed circuit board 61. Since it is possible to make sure contact, if the laser light L is applied in that state, the lead 5
1d can be reliably soldered.

In the third embodiment, although not shown, mounting portions are provided at four corners of the mounting plate 84, the stopper pins 37 shown in the first embodiment are provided therein, and the lead 51d is provided. A wire 38 that corrects the deformation may be provided.

Laser light was used as a heat source for welding the lead 51d to the pad 61a of the printed circuit board 61, but instead of this, an electron beam or hot air heated to a temperature for melting the solder may be used. May be.

[0060]

As described above, according to the first aspect of the invention, the nozzle body having the suction portion for sucking and holding the electronic component is provided with the pressure member having the pressure surface for pressing the electronic component in a swingable manner. I did it.

Therefore, when the electronic component is not parallel to the printed circuit board, the electronic component is pressed against the printed circuit board and swings together with the pressing body. The pads can be reliably contacted, and thus the soldering can be reliably performed.

According to a second aspect of the present invention, in the first aspect of the present invention, the suction portion is structured such that an electronic component can be swingably sucked and held. Therefore, when the electronic component is pressed against the printed circuit board, the electronic component is likely to swing, so that the lead of the electronic component can be more surely brought into contact with the pad of the printed circuit board.

According to a third aspect of the invention, in the first aspect of the invention, the suction portion can be elastically displaced when the electronic component is pressed against the printed circuit board. Therefore, since the electronic component can press the portion corresponding to the suction portion with a force different from the pressure surface of the pressure body, for example, it is suitable for a printed circuit board without damaging the semiconductor chip provided in the electronic component. It is possible to press with a sufficient pressing force.

According to a fourth aspect of the present invention, in the first aspect of the invention, a stopper is provided on the pressing body, and the pressing force applied to the electronic component can be limited by the pressing body. Therefore, it is possible to prevent the electronic component from being over-pressurized on the printed circuit board and crushing the lead.

According to a fifth aspect of the present invention, in the first aspect of the present invention, the pressing member is provided with a correction member, and even if the lead shape varies, when the electronic component is mounted on the printed circuit board, The shape can be corrected almost uniformly.

Therefore, a lead that is not molded into a predetermined shape
Even if there is a lead, the lead can be surely brought into contact with the pad of the printed board. According to the invention of claim 6, the adsorbent for adsorbing and holding the electronic component is made of an elastically deformable material.

Therefore, when the electronic component is mounted on the printed circuit board, the suction member can be deformed to swing the electronic component according to the force applied to the electronic component, so that the electronic component is parallel to the printed circuit board. Even without it, the lead can be surely brought into contact with the printed circuit board.

[Brief description of the drawings]

FIG. 1 is a vertical cross-sectional view of a suction nozzle showing a first embodiment of the present invention.

FIG. 2 is a plan view of the suction nozzle as seen from the lower surface side.

FIG. 3 is a perspective view of the suction nozzle.

FIG. 4 is an enlarged cross-sectional view of a state where TCP is pressed against a printed circuit board.

FIG. 5 is an explanatory view of a state where the tip of the lead is also straightened by a wire.

6 (a) and 6 (b) are explanatory views when mounting a TCP on a printed circuit board.

FIG. 7 is a vertical sectional view showing a suction nozzle according to a second embodiment of the present invention.

FIG. 8 is a vertical cross-sectional view of a suction nozzle showing a third embodiment of the present invention.

FIG. 9 is a plan view of the same seen from the lower surface side.

FIG. 10A and FIG. 10B are explanatory views similarly when mounting the TCP on the printed circuit board.

[Explanation of symbols]

11, 11A ... Nozzle body, 18, 18A ... Adsorption body (adsorption part), 23 ... Spring, 26 ... O ring, 31 ... Pressurization body, 31a ... Pressurization surface, 34 ... Spring part (elastic member), 37
... stopper pin (stopper), 38 ... wire (correction member), 51 ... TCP (electronic component), 61 ... printed circuit board.

Claims (6)

[Claims] 1. An electronic component suction nozzle for sucking and holding an electronic component mounted on a printed circuit board, comprising: a nozzle body, a suction portion provided on the nozzle body for sucking and holding the electronic component, and elastic to the nozzle body. A pressure member having a pressure surface that is swingably provided by a member and that presses the electronic component when the electronic component sucked and held by the suction unit is mounted on the printed circuit board. An electronic component suction nozzle. 2. The electronic component suction nozzle according to claim 1, wherein the suction portion is configured to swingably suck and hold the electronic component. 3. The suction unit is elastically displaceably provided on the nozzle body.
The electronic component suction nozzle described. 4. The pressing body is provided with a stopper that prevents the electronic component from being pressed against the printed circuit board with a force greater than a predetermined value when the electronic component is mounted on the printed circuit board. The electronic component suction nozzle according to claim 1, wherein: 5. The pressing member is provided with a correction member for correcting deformation of a lead provided on the electronic component when the electronic component is mounted on the printed circuit board. The electronic component suction nozzle according to claim 1. 6. An electronic component suction nozzle for sucking and holding an electronic component to be mounted on a printed circuit board, comprising: a nozzle body; and the electronic component provided on the nozzle body for sucking and holding the electronic component and the electronic component on the printed circuit board. An electronic component adsorption nozzle, comprising: an adsorption body made of an elastic material that can be deformed by a force applied when it is mounted.