JPH09130097A - Method and device for clinchless mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance mounting density and tensile strength by a method wherein a lead is kinked at the base of the surface where the lead of an electronic part is passed, and the lead is soldered to the conductive pattern of a printed board. SOLUTION: The lead of an electronic part is successively inserted from the mounting side of the part into lead guides 106a3, 106b3, 106a5 and 106b5. Then, when cutter blocks 107a and 107b are pressed and moved to the direction of sliding blocks 106a2 and 106b2 by driving cylinders 109a and 109b, the lead is kink-treated on the upper part of the lead guides 106a3 and 106b3 by kink protruding parts 107a1 and 107b1, and the surplus tip is cut off between lead cutters 107a1, 107b1, cutters 107a2 and 107b2 and cutter supporting grooves 106a4 and 106b4. After repeating the above-mentioned operation on each electronic part, the conductive pattern of a printed board and the kink part are soldered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a clinchless mounting method and device for mounting an electronic component having connection terminals drawn out as leads on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, as a method of mounting an electronic component on which a connection terminal has been pulled out by a lead on a printed circuit board, the lead of the electronic component is inserted into a lead insertion hole formed through the printed circuit board to make the printed circuit board conductive. A so-called cut clinch mounting method is generally adopted in which the lead is bent to either the inner side or the outer side on the pattern surface, the surplus tip of the lead is cut off, and then soldering is performed.

A conventional cut clinch mounting apparatus will be described with reference to the drawings. 4 is a plan view of a cut clinch mounting device of a conventional device example, FIG. 5 (a) is a perspective view showing the same cut clinch mounting state, and FIG. 5 (b) is the same sectional view.
(C) is a bottom view of the same.

In the figure, α is a cut clinch mounting device, P is a printed circuit board, Pa is a lead insertion hole, S is a solder fillet, X is an electronic component, Xa is a lead, 1 is a frame, 2 is a guide rod, 3a, 3b is a sliding block, 4a and 4b are cutters, 5a and 5b are piston rods, and 6a and 6b are cylinders.

In the conventional cut clinch mounting device α shown in FIGS. 4 to 5, a frame body 1, a guide rod 2 stretched between the left and right frame bodies 1a of the frame body 1, and a guide rod 2 inside the frame. Sliding blocks 3a and 3b that penetrate and move in the left-right direction,
Cutters 4a and 4b that can advance and retract on the inclined heads 3a1 and 3b1 of the sliding blocks 3a and 3b, and a piston rod 5 that is connected to the base ends of the cutters 4a and 4b, respectively.
a and 5b, and cylinders 6a and 6b connected to the piston rods 5a and 5b, respectively.

Inclined heads 3a1 and 3b1 provided with inclined surfaces are provided on the opposing surfaces of the sliding blocks 3a and 3b, and the lead insertion holes 3a are formed on the inclined surfaces.
2, 3b2 are vertically formed to penetrate the cutter 4a,
4b is adjacent to the lead insertion holes 3a2, 3b2, and can advance and retract.

Next, a cut clinch mounting method of a conventional method using a conventional apparatus will be described with reference to the drawings. First, the cut clinch device α is brought close to the conductive pattern surface side of the printed circuit board P, and the slide blocks 3a and 3b are placed so that the lead guide holes 3a2 and 3b2 are located immediately below the predetermined lead insertion holes Pa of the printed circuit board P. To move.

Each lead Xa of the electronic component X is inserted into the lead insertion hole Pa of the printed circuit board P, and then inserted into the lead guide holes 3a2 and 3b2.

Next, when a pair of clinch cutters 4a and 4b are moved forward by using a driving means (not shown), FIG.
As shown in (a), the lead Xa is bent along the conductive pattern surface of the printed board P.

Subsequently, when the cylinders 6a and 6b are driven to move the clinch cutters 4a and 4b, the clinch cutters 4a and 4b and the lead guide holes 3a2.
The surplus tip of the lead Xa is cut off between 3b2 and the clinch cutters 4a and 4b.

This is carried out for each electronic component X, and finally, the conductive pattern surface of the printed circuit board P is dipped in a solder bath (not shown) for soldering processing, and the series of cut clinch mounting methods is completed.

In such a conventional cut clinch mounting method, as shown in FIGS. 5 (b) to 5 (c), the shape of the solder fillet S formed on the lead Xa after the soldering treatment is as follows. It was streamlined along the lead Xa.

[0013]

However, the above-described conventional cut clinch mounting method and apparatus α have the following drawbacks. That is, as a first point, since the lead Xa of the electronic component X was clinched and soldered along a conductive pattern (not shown), the solder fillet S spreads flat on the conductive pattern surface, and the solder fillet Since the area S is a mounting restriction area where the electronic component X cannot be mounted, there is a drawback that the mounting density of the printed circuit board P as a whole decreases.

The second point is that the solder fillet S formed when the lead Xa of the electronic component X is soldered has a flat shape along the lead Xa and the solder does not sufficiently spread around the lead Xa. There was a defect that the tensile strength against was weak.

Thirdly, there is a drawback that the solder easily flows along the lead Xa and the solder flows to the adjacent pattern to form a solder bridge.

An object of the present invention is to provide a clinchless mounting method and device which have a high mounting density, a high tensile strength, and excellent electrical characteristics.

[0017]

In order to solve the above-mentioned problems, the present invention adopts the concrete solution methods and means listed below. That is, the feature of the method of the present invention is that the leads of the electronic component with leads are inserted through from one surface side of the printed board to the other surface side, then the lead is kink at the root of the other surface side, and subsequently the kink portion It is a clinchless mounting method in which the lead is soldered to a conductive pattern of the printed board.

The first feature of the device of the present invention is that the lead of the electronic component inserted into the printed circuit board is further positioned because the lead guide hole is located immediately below the lead insertion hole of the printed circuit board while approaching the conductive pattern of the printed circuit board. A clinchless device including a lead guide to be inserted, and a cutter that kinks the lead held in the lead guide by meshing with the lead guide in the vicinity of the conductive pattern of the printed circuit board and cutting off an excess tip of the lead. It is a mounting device.

A second feature of the device of the present invention is that the frame and a left and right frame of the frame are rotatably stretched by a pulse motor, and screw grooves are provided in opposite directions from the center toward both left and right ends. A threaded screw rod, a guide rod stretched between the left and right frame bodies of the frame body, a sliding block screwed to the screw rod to move the base frame in the left and right direction, A clinchless mounting device including a cutter block fixed to a moving block and including a kink protrusion and a lead cutter, a piston rod connected to the base end of the cutter block, and a cylinder connected to the piston rod. Is.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of the device of the present invention will be described below with reference to the drawings. FIG. 1 is an overall perspective view of a clinchless mounting device of an example of the device of the present invention, FIG.
3B is an enlarged side sectional view of the same part, FIG. 3A is a perspective view showing the same clinchless mounting state, FIG. 3B is the same sectional view, and FIG. 3C is the same bottom surface. It is a figure.

In the figure, β is a clinchless mounting device, 101
Is a base, 102 is a frame rotation mechanism, 103 is a frame, 104
Is a screw rod, 105 is a guide rod, 106
Reference numerals a and 106b are sliding blocks, 107a and 107b are cutter blocks, 108a and 108b are piston rods, and 109a and 109b are cylinders. The same elements as those in the conventional example are designated by the same reference numerals.

An example of a clinchless mounting device of the present invention will be described with reference to the drawings. The clinchless mounting apparatus β shown in FIGS. 1 and 2 includes a base 101, a frame rotating mechanism 102 fixed to the base 101 and rotatable by a pulse motor or the like (not shown), and a frame rotating. A frame 103 rotatable by a mechanism 102 and a left and right frame 103a of the frame 103 are rotatably stretched by a pulse motor 104b, and screw grooves 104 are provided in opposite directions from the center toward both left and right ends.
A guide rod 105 stretched between a left and right frame body 103a of the frame body 103 and a screw rod 104 in which the
And a sliding block 10 that is screwed onto the screw rod 104 across the beam body 103c to move the base frame 103 in the left-right direction.
6a and 106b, and kink protrusions 107a1 and 107b1
Cutter blocks 107a and 107b each including a lead cutter 107a2 and 107b2, piston rods 108a and 108b connected to the base ends of the cutter blocks 107a and 107b, and a piston rod 108, respectively.
Cylinder 109 connected to a and 108b, respectively
a and 109b.

The frame 103 is rotatable with respect to the base 101 by driving a pulse motor or the like (not shown) of the frame rotating mechanism 102 provided on the base 101.

The sliding blocks 106a and 106b are formed with sliding grooves 106a1 and 106b1 in which the cutter blocks 107a and 107b linearly move, and the cutter receiving blocks 106a2 and 106b2 are provided on the upper part thereof in a protruding manner.

Cutter receiving blocks 106a2, 106
b2 is a mortar-shaped lead guide hole 106a3, 106b3 into which the lead Xa is inserted, and a lead cutter 107.
Cutter receiving groove 1 that meshes with a2 and 107b2 respectively
06a4 and 106b4 and lead guide holes 106a5 and 106b5 through which the lead Xa is inserted are integrally formed from the upper side.

The cutter blocks 107a and 107b are
Kink protrusion 10 for kinking the inserted lead Xa
Lead cutters 107a2 and 107b2 for cutting off the excess tip of the lead Xa with 7a1 and 107b1 at the upper tip.
Is integrally formed in the upper center. The cutter blocks 107a and 107b are cylinders 109a and 1
09b is connected to the piston rods 108a and 108b, and the sliding groove 10 of the sliding blocks 106a and 106b is connected.
6a1 and 106b1 are moved linearly.

[0027]

EXAMPLE This apparatus example presents such a concrete embodiment, and then an example of a method applied to this apparatus example will be described. In the clinchless mounting device β, a frame motor 103 of the frame rotating mechanism 102 on the base 101 is driven to rotate the frame 103 to a predetermined angle.

After driving the pulse motor 104b to rotate the screw rod 104 to move the lead guides 106a3 and 106b3 directly below the lead insertion holes Pa of the printed circuit board P, a predetermined lead is inserted from the conductive pattern surface side of the printed circuit board P. Press to the position of hole Pa.

The leads Xa of the electronic component X are sequentially introduced from the component mounting surface side through the lead insertion holes Pa of the printed circuit board P, the lead guides 106a3 and 106b3, and the lead guide 10.
6a5 and 106b5.

Next, when the cylinders 109a and 109b are driven and the cutter blocks 107a and 107b are pressed and moved in the directions of the sliding blocks 106a2 and 106b2, respectively, as shown in FIG.
06a3, 106b3 and sliding blocks 106a5, 10
6b5 and the lead Xa held by the kink protrusion 107
lead guides 106a3, 10 by a1, 107b1
A kink process is performed on the upper portion of 6b3, and the lead cutters 107a2 and 107b2 and the cutter receiving groove 106a4 are provided.
The surplus tip is cut off with 106b4.

After repeating this for each electronic component X, the conductive pattern surface of the printed board P is dipped in a solder bath (not shown) and the conductive pattern of the printed board P and the kink portion X.
Solder with a2.

As shown in FIGS. 3 (b) to 3 (c),
The solder fillet S of the lead Xa of the electronic component X has a shape that rises in the vertical direction on the surface of the printed circuit board P along the lead Xa.

[0033]

As described above, according to the clinchless mounting method and device of the present invention, the leads of the electronic component are pulled out in a substantially vertical direction with respect to the printed circuit board surface, and therefore, compared with the cut clinch mounting method. There are advantages that the mounting restriction area of electronic parts is reduced and the mounting density is improved as the entire printed circuit board.

Further, when the electronic parts are soldered to the conductive pattern (not shown) of the printed circuit board, the solder fillet is formed in the vertical direction with respect to the printed circuit board surface, so that the probability of occurrence of solder bridge due to the solder flow is reduced. Then
As a result of reducing the possibility of electrical short circuit of the mounted circuit, there is an advantage that the electrical reliability of the electronic device can be increased and the life can be extended.

In addition, the tensile strength of the electronic component is significantly improved by using the kink treatment with higher mechanical strength in addition to the conventional soldering treatment, so that the reliability of the electronic equipment is improved in the long term. There is an advantage to

[Brief description of the drawings]

FIG. 1 is an overall perspective view of a clinchless mounting device according to an example of the present invention.

2A is a plan view of the same as above, and FIG. 2B is an enlarged side sectional view of the same as above.

3A is a perspective view showing the same as above, and a clinchless mounting state, FIG. 3B is a sectional view showing the same as above, and FIG. 3C is a bottom view showing the same.

FIG. 4 is a plan view of a cut clinch mounting device of a conventional device example.

FIG. 5A is a perspective view showing a state of mounting the same as above and a cut clinch, FIG. 5B is a sectional view of the same as above, and FIG.

[Explanation of symbols]

 α Cut clinch mounting device β Clinchless mounting device P Printed circuit board Pa Lead insertion hole S Solder fillet X Electronic component Xa Lead Xa1 Clinch part Xa2 Kink part 1 Frame 2 Guide rod 3 Sliding block 4 Clinch cutter 5 Piston rod 6 Cylinder 101 Base 102 Frame rotating mechanism 103 Frame 104 Screw rod 105 Guide rod 106a, 106b Sliding block 107a, 107b Cutter block 108a, 108b Piston rod 109a, 109b Cylinder

Claims (3)

[Claims] 1. A lead of an electronic component with leads is inserted from one surface side of a printed board to the other surface side, then the lead is kinked at the root of the other surface side, and subsequently, the lead of the kink portion is aforesaid. A clinchless mounting method, which comprises soldering a conductive pattern on a printed circuit board. 2. A lead guide for approaching a conductive pattern of a printed circuit board and having a lead guide hole immediately below a lead insertion hole of the printed circuit board, into which a lead of an electronic component inserted in the printed circuit board is further inserted. A clinchless mounting device, comprising: a cutter that meshes with the lead guide and is held by the lead guide to kink the lead in the vicinity of the conductive pattern of the printed circuit board and cut off an excess tip of the lead. 3. A frame body, and a screw rod in which a left and right frame body of the frame body is rotatably stretched by a pulse motor and screw grooves are threaded in opposite directions from the center toward both left and right ends. A guide rod stretched between the left and right frame bodies of the frame body, a sliding block screwed to the screw rod to move the base frame in the left and right direction, and a kink protrusion fixed on the sliding block. A clinchless mounting device comprising: a cutter block including a head and a lead cutter; a piston rod connected to a base end of the cutter block; and a cylinder connected to the piston rod.