JPH09111089A - Semiconductive composition - Google Patents

Semiconductive composition

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Publication number
JPH09111089A
JPH09111089A JP27455095A JP27455095A JPH09111089A JP H09111089 A JPH09111089 A JP H09111089A JP 27455095 A JP27455095 A JP 27455095A JP 27455095 A JP27455095 A JP 27455095A JP H09111089 A JPH09111089 A JP H09111089A
Authority
JP
Japan
Prior art keywords
weight
vinyl acetate
styrene
acetate copolymer
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27455095A
Other languages
Japanese (ja)
Other versions
JP3313268B2 (en
Inventor
Kazuhiko Goto
和彦 後藤
Izumi Ishikawa
泉 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
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Priority to JP27455095A priority Critical patent/JP3313268B2/en
Publication of JPH09111089A publication Critical patent/JPH09111089A/en
Application granted granted Critical
Publication of JP3313268B2 publication Critical patent/JP3313268B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductive composition excellent in adhesivity to and releasability from an insulator of a power cable, extrusion processability, surface smoothness and electroconductivity, capable of forming an external semiconductive layer excellent in electroconductivity as well. SOLUTION: This semiconductive composition is obtained by blending 100 pts.wt. of a styrene-modified ethylene-vinyl acetate copolymer prepared by grafting 3-10wt.% of a styrene-based monomer onto an ethylene-vinyl acetate copolymer having 20-30wt.% vinyl acetate content with 40-80 pts.wt. of oil furnace carbon black having 35-45nm average particle diameter and 55-65mg/g iodine adsorption and 155-180cc/100g DBP oil absorption and 1.5-5 pts.wt. of an antioxidant.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、プラスチック絶縁
電力ケーブルの外部半導電層に有用な半導電性組成物、
特に架橋ポリエチレン絶縁体との密着性および剥離性の
両方に優れ、かつ押出加工性、表面平滑性にも優れた外
部半導電層を形成することのできる半導電性組成物に関
する。
FIELD OF THE INVENTION The present invention relates to a semiconductive composition useful in the outer semiconductive layer of plastic insulated power cables,
In particular, the present invention relates to a semiconductive composition capable of forming an external semiconductive layer which is excellent in both adhesiveness and peelability with respect to a crosslinked polyethylene insulator and is also excellent in extrusion processability and surface smoothness.

【0002】[0002]

【従来の技術】プラスチック絶縁電力ケーブル、特に、
架橋ポリエチレン絶縁電力ケーブルの外部半導電層は、
押出被覆により形成されるのが一般的である。この外部
半導電層は、コロナ放電を起こさないよう、架橋ポリエ
チレン絶縁体と密着している必要がある。しかし、一方
では、ケーブルの端末処理を行う場合、絶縁体を傷付け
ることなく容易に外部半導電層を取り除くことが要求さ
れている。従って、通常は絶縁体と良好に密着し、必要
に応じて容易に剥離することができる外部半導電層が望
まれている。このような半導電層を得るには、架橋ポリ
エチレン絶縁体と親和性を持たないポリマをベースとす
ることが有効であり、従来より、エチレン−酢酸ビニル
共重合体をベースとする組成物が用いられてきている。
BACKGROUND OF THE INVENTION Plastic insulated power cables, especially
The outer semiconductive layer of the crosslinked polyethylene insulated power cable is
It is generally formed by extrusion coating. This outer semiconductive layer must be in close contact with the crosslinked polyethylene insulator so that corona discharge does not occur. On the other hand, however, it is required that the outer semiconductive layer be easily removed without damaging the insulator when terminating the cable. Therefore, there is a demand for an external semiconductive layer that normally adheres well to an insulator and can be easily peeled off when necessary. In order to obtain such a semiconductive layer, it is effective to use a polymer having no affinity with the crosslinked polyethylene insulator as a base, and conventionally, a composition based on an ethylene-vinyl acetate copolymer has been used. Has been done.

【0003】このような半導電性組成物として、特公平
5−77123号公報に開示のものがある。この半導電
性組成物は、エチレン−酢酸ビニル共重合体を主体とす
るベースポリマーに、パラフィンワックスなどのワック
ス状炭化水素と平均粒子径25〜40nm、ヨウ素吸着
量40〜60mg/g、DBP吸油量120〜150m
l/100gのファーネスカーボンブラックを配合した
もので、特にワックス状炭化水素とファーネスカーボン
ブラックの相乗作用により、優れた剥離性と押出加工性
が得られると言うものである。
As such a semiconductive composition, there is one disclosed in Japanese Patent Publication No. 5-77123. This semiconductive composition comprises a base polymer mainly composed of an ethylene-vinyl acetate copolymer, a wax-like hydrocarbon such as paraffin wax and an average particle size of 25 to 40 nm, an iodine adsorption amount of 40 to 60 mg / g, a DBP oil absorption. Quantity 120-150m
It is a blend of 1/100 g of furnace carbon black, and it is said that excellent peelability and extrusion processability can be obtained by the synergistic action of waxy hydrocarbon and furnace carbon black.

【0004】しかしながら、この半導電性組成物にあっ
ては、ワックス状炭化水素の配合により組成物の耐熱性
が低下することがあり、また上記ファーネスカーボンブ
ラックはベースポリマー中への分散が良好ではなく、外
部半導電層としたときにその表面に微小な突起が多数生
じ、この微小突起による水トリーを誘発する場合があ
り、また十分な導電性が得られにくいなどの不都合があ
った。
However, in this semiconductive composition, the heat resistance of the composition may be lowered by the addition of a waxy hydrocarbon, and the above-mentioned furnace carbon black is not well dispersed in the base polymer. However, when the outer semiconductive layer is formed, a large number of minute projections are formed on the surface thereof, water particles may be induced by the minute projections, and sufficient conductivity is difficult to obtain.

【0005】[0005]

【発明が解決しようとする課題】よって、本発明におけ
る課題は、良好な密着性と易剥離性の両方を確保しつ
つ、優れた押出加工性、表面平滑性、導電性を有する外
部半導電層となりうる半導電性組成物を得ることにあ
る。
Therefore, an object of the present invention is to provide an external semiconductive layer having excellent extrusion processability, surface smoothness and conductivity while ensuring both good adhesion and easy peeling property. To obtain a semiconductive composition that can be

【0006】[0006]

【課題を解決するための手段】かかる課題は、酢酸ビニ
ル含量20〜30重量%のエチレン−酢酸ビニル共重合
体にスチレン系モノマーを3〜10重量%グラフト処理
して得られたスチレン変性エチレン−酢酸ビニル共重合
体100重量部に対して、平均粒子径35〜45nm、
ヨウ素吸着量55〜65mg/g、DBP吸油量155
〜180cc/100gであるオイルファーネスカーボ
ンブラック40〜80重量部、老化防止剤1.5〜5重
量部を配合してなる半導電性組成物によって解決され
る。
The object of the present invention is to provide a styrene-modified ethylene-obtained by graft-treating an ethylene-vinyl acetate copolymer having a vinyl acetate content of 20 to 30% by weight with a styrene-based monomer in an amount of 3 to 10% by weight. An average particle diameter of 35 to 45 nm, relative to 100 parts by weight of the vinyl acetate copolymer,
Iodine adsorption amount 55-65 mg / g, DBP oil absorption amount 155
The problem is solved by a semiconductive composition containing 40 to 80 parts by weight of oil furnace carbon black of 180 cc / 100 g and 1.5 to 5 parts by weight of an antioxidant.

【0007】[0007]

【作用】上記オイルファーネスカーボンブラックの使用
により、良好な導電性、押出加工性、表面平滑性が得ら
れ、老化防止剤の使用により絶縁体と外部半導電層との
界面における共架橋が阻害され、優れた剥離性が得られ
る。
The use of the above oil furnace carbon black provides good conductivity, extrusion processability and surface smoothness, and the use of an antioxidant inhibits co-crosslinking at the interface between the insulator and the outer semiconductive layer. Excellent peelability can be obtained.

【0008】[0008]

【発明の実施の形態】本発明で用いられるスチレン変性
エチレン−酢酸ビニル共重合体は、酢酸ビニル含有量が
20〜30重量%のエチレン−酢酸ビニル共重合体に、
スチレン、メチルスチレン、α−メチルスチレン、クロ
ルメチルスチレンなどのスチレン系モノマーをグラフト
共重合したものである。このグラフト共重合は、エチレ
ン−酢酸ビニル共重合体粒子にスチレン系モノマーの大
部分を含浸せしめたのち、水性懸濁重合する方法などに
よって行われる。このグラフト共重合体中のスチレン系
モノマーの量は3〜10重量%とされ、3重量%未満で
は剥離性が低下し、10重量%を越えると組成物の溶融
粘度が上昇して押出加工性が低下する。また、エチレン
−酢酸ビニル共重合体中の酢酸ビニル含有量が20重量
%未満では、剥離性が低く、30重量%を越えるとペレ
ット間の融着が生じやすく加工性に支障を来す。
BEST MODE FOR CARRYING OUT THE INVENTION The styrene-modified ethylene-vinyl acetate copolymer used in the present invention is an ethylene-vinyl acetate copolymer having a vinyl acetate content of 20 to 30% by weight,
It is obtained by graft-copolymerizing styrene-based monomers such as styrene, methylstyrene, α-methylstyrene and chloromethylstyrene. This graft copolymerization is carried out by a method of impregnating ethylene-vinyl acetate copolymer particles with most of the styrene-based monomer, and then performing aqueous suspension polymerization. The amount of the styrene-based monomer in this graft copolymer is 3 to 10% by weight, and if it is less than 3% by weight, the releasability is lowered, and if it exceeds 10% by weight, the melt viscosity of the composition is increased and the extrusion processability is increased. Is reduced. If the content of vinyl acetate in the ethylene-vinyl acetate copolymer is less than 20% by weight, the releasability is low, and if it exceeds 30% by weight, fusion between pellets is likely to occur and workability is impaired.

【0009】また、本発明で用いられるオイルファーネ
スカーボンブラックの平均粒子径は電子顕微鏡法による
ものであり、35nm未満ではコンパウンドの粘度が上
昇するため加工性が悪くなり、45nmを越えると十分
な導電性が得られない。また、ヨウ素吸着量は、JIS
−K−6221によるものであり、55mg/g未満で
は導電性が不足し、65mg/gを越えると溶融粘度が
大きくなり、押出加工性が低下する。DBP吸油量は、
JIS−K−6221によるもので、155cc/10
0g未満では導電性が不足となり、180cc/100
gを越えるとコンパウンドの粘度が上昇し不都合とな
る。
The average particle size of the oil-furnace carbon black used in the present invention is measured by an electron microscope. If the average particle size is less than 35 nm, the viscosity of the compound increases and the workability deteriorates. I can not get sex. Also, the iodine adsorption amount is JIS
This is due to -K-6221. If it is less than 55 mg / g, the conductivity is insufficient, and if it exceeds 65 mg / g, the melt viscosity becomes large and the extrusion processability deteriorates. DBP oil absorption is
According to JIS-K-6221, 155cc / 10
If it is less than 0 g, the conductivity becomes insufficient, and 180 cc / 100
If it exceeds g, the viscosity of the compound increases, which is inconvenient.

【0010】このオイルファーネスカーボンブラックの
配合量は、スチレン変性エチレン−酢酸ビニル共重合体
100重量部に対して、40〜80重量部の範囲とさ
れ、40重量部未満では導電性が不足し、80重量部を
越えるとコンパウンドの粘度が上昇するために不都合と
なる。また、上記特定のオイルファーネスカーボンブラ
ック以外に混練作業性、剥離性に支障がない限り、アセ
チレンブラックを併用することもできる。
The blending amount of this oil furnace carbon black is in the range of 40 to 80 parts by weight with respect to 100 parts by weight of the styrene-modified ethylene-vinyl acetate copolymer. If it is less than 40 parts by weight, the conductivity will be insufficient. If it exceeds 80 parts by weight, the viscosity of the compound increases, which is inconvenient. In addition to the above specific oil furnace carbon black, acetylene black may be used in combination as long as it does not hinder the kneading workability and peeling property.

【0011】本発明では、また老化防止剤を必須成分と
し、老化防止剤をスチレン変性エチレン−酢酸ビニル共
重合体100重量部に対して1.5〜5重量部添加され
る。1.5重量部未満では絶縁体と外部半導電層との界
面での共架橋を阻害することができなくなり十分な剥離
性が得られず、5重量部を越えると混練性、機械的強度
が低下して好ましくない。この老化防止剤としては、
4,4′−チオビス−(6−第3ブチル−3−メチルフ
ェノール)が上述の効果を得るうえで、最も好ましい
が、これ以外に2,6,ジ−第3ブチル−4−メチルフ
ェノール、2,2′−メチレン−ビス−(4−メチル−
6−第3ブチルフェノール)スチレン化フェノール、フ
ェニル−α−ナフチルアミン、フェニル−β−ナフチル
アミン、N−イソプロピル−N′−フェニル−p−フェ
ニルジアミン、N,N′−ジ−2−ナフチル−p−フェ
ニレンジアミンなども良好な効果を示し、使用可能であ
る。
In the present invention, the antioxidant is also an essential component, and 1.5 to 5 parts by weight of the antioxidant is added to 100 parts by weight of the styrene-modified ethylene-vinyl acetate copolymer. If it is less than 1.5 parts by weight, co-crosslinking at the interface between the insulator and the outer semiconductive layer cannot be inhibited and sufficient releasability cannot be obtained. If it exceeds 5 parts by weight, the kneading property and mechanical strength are poor. It is not preferable because it decreases. As this anti-aging agent,
4,4'-thiobis- (6-tert-butyl-3-methylphenol) is the most preferable for obtaining the above-mentioned effect, but other than this, 2,6, -di-tert-butyl-4-methylphenol, 2,2'-methylene-bis- (4-methyl-
6-tert-butylphenol) styrenated phenol, phenyl-α-naphthylamine, phenyl-β-naphthylamine, N-isopropyl-N′-phenyl-p-phenyldiamine, N, N′-di-2-naphthyl-p-phenylene Diamine and the like also have good effects and can be used.

【0012】本発明の半導電性組成物は、架橋型でも非
架橋型でもよい。架橋型とする場合にはジクミルパーオ
キサイド、2,5−ジメチル−2,5−ジ(第3ブチル
−ペルオキシ)ヘキサン、2,5−ジメチル−2,5−
ジ(第3ブチル−ペルオキシ)ヘキシン、1,3−ビス
(第3ブチル−ペルオキシイソプロピル)ベンゼンなど
の過酸化物をベースポリマー100重量部に対して0.
2〜2重量部程度配合すればよい。また、本発明の組成
物にあっては、ステアリン酸亜鉛、ステアリン酸鉛、ス
テアリン酸マグネシウムなどの脂肪酸金属塩や脂肪酸エ
ステルなどの滑剤を必要に応じて配合することができ
る。
The semiconductive composition of the present invention may be crosslinked or non-crosslinked. When the cross-linking type is used, dicumyl peroxide, 2,5-dimethyl-2,5-di (tertiary butyl-peroxy) hexane, 2,5-dimethyl-2,5-
Peroxides such as di (tertiary butyl-peroxy) hexyne and 1,3-bis (tertiary butyl-peroxyisopropyl) benzene are added in an amount of 0.
The amount may be about 2 to 2 parts by weight. Further, in the composition of the present invention, a lubricant such as a fatty acid metal salt such as zinc stearate, lead stearate, magnesium stearate or a fatty acid ester can be blended, if necessary.

【0013】本発明の電力ケーブルは、上述の半導電性
組成物をバンバリミキサなどで混練し、これをポリエチ
レンなどの絶縁体上に押出被覆して外部半導電層とした
ものである。外部半導電層の押出成形は、絶縁体の押出
成形と同時に共押出によって行うこともできる。この外
部半導電層の厚みは、通常0.2〜2mm程度とされ
る。
The power cable of the present invention is obtained by kneading the above-mentioned semiconductive composition with a Banbury mixer or the like, and extrusion-coating this on an insulator such as polyethylene to form an external semiconductive layer. The outer semiconductive layer can be extruded by coextrusion at the same time as the insulator is extruded. The thickness of this outer semiconductive layer is usually about 0.2 to 2 mm.

【0014】本発明の半導電性組成物にあっては、これ
を外部半導電層とした際、絶縁体と良好に密着し、必要
に応じて絶縁体から容易に剥離することができる。ま
た、優れた機械的特性を有し、表面が平滑で微小な突起
が無く、熱安定性に優れ、溶融粘度が低く、押出加工性
も良好となる。また、導電性も良好となる。
When the semiconductive composition of the present invention is used as an external semiconductive layer, it is in good contact with the insulator and can be easily peeled off from the insulator if necessary. Further, it has excellent mechanical properties, the surface is smooth and there are no minute projections, it has excellent thermal stability, low melt viscosity, and good extrusion processability. Also, the conductivity becomes good.

【0015】以下、具体例を示す。ベースポリマーとし
て、酢酸ビニル含量28重量%、メルトフローレート4
のエチレン−酢酸ビニル共重合体にスチレンモノマーを
種々の割合でグラフト共重合させて、スチレンモノマー
含有量が0重量%、2重量%、5重量%、7重量%およ
び12重量%のスチレン変性エチレン−酢酸ビニル共重
合体(以下、S−EVA−0,S−EVA−2,S−E
VA−5,S−EVA−7,S−EVA−12と表記す
る。)を用い、これに表1ないし表3に示すオイルファ
ーネスカーボンブラック、老化防止剤、有機過酸化物、
滑剤を配合し、バンバリーミキサで混練して半導電性組
成物とした。
Hereinafter, specific examples will be described. As base polymer, vinyl acetate content 28% by weight, melt flow rate 4
Styrene-modified ethylene having a styrene monomer content of 0% by weight, 2% by weight, 5% by weight, 7% by weight and 12% by weight is obtained by graft-copolymerizing a styrene monomer at various ratios with the ethylene-vinyl acetate copolymer of. -Vinyl acetate copolymer (hereinafter referred to as S-EVA-0, S-EVA-2, S-E
Notated as VA-5, S-EVA-7, S-EVA-12. ), Oil furnace carbon black shown in Tables 1 to 3, an antioxidant, an organic peroxide,
A lubricant was blended and kneaded with a Banbury mixer to obtain a semiconductive composition.

【0016】これらの半導電性組成物を架橋ポリエチレ
ン絶縁体上に押出被覆して外部半導電層としたうえ、窒
素ガス雰囲気中で赤外線ヒーターを用いて加熱、架橋
し、6kV 1×100mm2 の架橋ポリエチレン絶縁
電力ケーブルを製造した。この電力ケーブルの外部半導
電層について、剥離性、押出加工性、平滑性、導電性を
検討した。
These semiconductive compositions were extrusion-coated on a crosslinked polyethylene insulator to form an external semiconductive layer, which was then heated and crosslinked by using an infrared heater in a nitrogen gas atmosphere to obtain 6 kV 1 × 100 mm 2 . A crosslinked polyethylene insulated power cable was manufactured. The outer semiconductive layer of this power cable was examined for peelability, extrudability, smoothness, and conductivity.

【0017】剥離性は、得られた電力ケーブルの外部半
導電層にケーブルの長手方向に0.5インチ幅の平行な
切り目を入れ、50℃で絶縁体からの剥離の容易さで評
価した。押出加工性は、半導電性組成物を押出機で押し
出す際、組成物が押出機から出ないか、電動機の負荷が
著しく高い場合を×として評価した。
The peeling property was evaluated by making parallel cuts having a width of 0.5 inch in the longitudinal direction of the cable in the outer semiconductive layer of the obtained power cable and by peeling from the insulator at 50 ° C. The extrusion processability was evaluated as x when the semiconductive composition was extruded by an extruder or the composition did not come out of the extruder or the load of the electric motor was extremely high.

【0018】平滑性は、得られたケーブルの外部半導電
層の表面を面積10cm2 にわたって顕微鏡観察し、5
0μm以上の高さの突起の有無によって評価し、突起が
無い場合を○とし、5個未満の場合は△とし、5個以上
ある場合には×として表示した。導電性は、外部半導電
層の体積抵抗率を測定し、その値が104 Ω・cm未満
のものを○とし、104 〜105 Ω・cmのものを△と
し、105 Ω・cmを越えるものを×として表示した。
The smoothness was determined by observing the surface of the outer semiconductive layer of the obtained cable with a microscope over an area of 10 cm 2.
The evaluation was made based on the presence or absence of protrusions having a height of 0 μm or more. When there were no protrusions, the result was indicated by ◯, when there were less than 5 protrusions, it was indicated by Δ, and when there were 5 or more protrusions, it was indicated by x. For the conductivity, the volume resistivity of the outer semiconductive layer is measured, and the value less than 10 4 Ω · cm is ◯, and the value of 10 4 to 10 5 Ω · cm is Δ, 10 5 Ω · cm Those exceeding the above are displayed as x.

【0019】また、表1ないし表3において、FCB−
Aは平均粒子径40nm、ヨウ素吸着量60mg/g、
DBP吸油量170cc/100gのオイルファーネス
カーボンブラックを示し、FCB−Xは平均粒子径30
nm、ヨウ素吸着量50mg/g、DBP吸油量135
cc/100gのオイルファーネスカーボンブラックを
示す。さらに、老化防止剤には、4,4′−チオビス−
(6−第3ブチル−3−メチルフェノール)を用い、滑
剤にはステアリン酸亜鉛を、有機過酸化物にはジクミル
パーオキサイドを用いた。配合量はすべて重量部で表し
た。結果を表1ないし表3に示す。
In Tables 1 to 3, FCB-
A has an average particle size of 40 nm, an iodine adsorption amount of 60 mg / g,
It shows an oil furnace carbon black having a DBP oil absorption of 170 cc / 100 g, and FCB-X has an average particle size of 30.
nm, iodine adsorption amount 50 mg / g, DBP oil absorption amount 135
cc / 100 g of oil furnace carbon black is shown. Further, the antiaging agent is 4,4'-thiobis-
(6-tert-butyl-3-methylphenol) was used, zinc stearate was used as the lubricant, and dicumyl peroxide was used as the organic peroxide. All blending amounts are expressed in parts by weight. The results are shown in Tables 1 to 3.

【0020】[0020]

【表1】 [Table 1]

【0021】[0021]

【表2】 [Table 2]

【0022】[0022]

【表3】 [Table 3]

【0023】表1ないし表3の結果から、本発明の半導
電性組成物は、押出加工性、剥離性、平滑性、導電性に
優れた外部半導電層を形成しうることが明らかである。
From the results shown in Tables 1 to 3, it is clear that the semiconductive composition of the present invention can form an external semiconductive layer excellent in extrusion processability, peelability, smoothness and conductivity. .

【0024】[0024]

【発明の効果】以上説明したように、本発明の半導電性
組成物によれば、絶縁体に対する良好な密着性と易剥離
性の両方を有し、かつ優れた押出加工性、表面平滑性、
導電性を有する電力ケーブル用の外部半導電層を得るこ
とができる。
As described above, according to the semiconductive composition of the present invention, it has both good adhesion to an insulator and easy peeling property, and excellent extrusion processability and surface smoothness. ,
An outer semiconducting layer for the power cable can be obtained which is electrically conductive.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 酢酸ビニル含量20〜30重量%のエチ
レン−酢酸ビニル共重合体にスチレン系モノマーを3〜
10重量%グラフト処理して得られたスチレン変性エチ
レン−酢酸ビニル共重合体100重量部に対して、平均
粒子径35〜45nm、ヨウ素吸着量55〜65mg/
g、DBP吸油量155〜180cc/100gである
オイルファーネスカーボンブラック40〜80重量部、
老化防止剤1.5〜5重量部を配合してなる半導電性組
成物。
1. An ethylene-vinyl acetate copolymer having a vinyl acetate content of 20 to 30% by weight and 3 to 3 of a styrene-based monomer.
An average particle diameter of 35 to 45 nm and an iodine adsorption amount of 55 to 65 mg / 100 parts by weight of a styrene-modified ethylene-vinyl acetate copolymer obtained by 10% by weight graft treatment.
g, 40 to 80 parts by weight of oil furnace carbon black having a DBP oil absorption of 155 to 180 cc / 100 g,
A semiconductive composition containing 1.5 to 5 parts by weight of an antioxidant.
【請求項2】 上記老化防止剤が、4,4′−チオビス
−(6−第3ブチル−3−メチルフェノール)である請
求項1記載の半導電性組成物。
2. The semiconductive composition according to claim 1, wherein the antiaging agent is 4,4′-thiobis- (6-tert-butyl-3-methylphenol).
【請求項3】 請求項1または2記載の半導電性組成物
からなる外部半導電層を有する電力ケーブル。
3. A power cable having an outer semiconducting layer comprising the semiconducting composition of claim 1 or 2.
JP27455095A 1995-10-23 1995-10-23 Semiconductive composition Expired - Fee Related JP3313268B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27455095A JP3313268B2 (en) 1995-10-23 1995-10-23 Semiconductive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27455095A JP3313268B2 (en) 1995-10-23 1995-10-23 Semiconductive composition

Publications (2)

Publication Number Publication Date
JPH09111089A true JPH09111089A (en) 1997-04-28
JP3313268B2 JP3313268B2 (en) 2002-08-12

Family

ID=17543291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27455095A Expired - Fee Related JP3313268B2 (en) 1995-10-23 1995-10-23 Semiconductive composition

Country Status (1)

Country Link
JP (1) JP3313268B2 (en)

Also Published As

Publication number Publication date
JP3313268B2 (en) 2002-08-12

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