JPH09102662A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the manufacturing cost of an electronic component mounting device and improve the quality and productivity of the electronic component mounting device by providing a transfer part, which transfers an electronic component from a supply part to an alignment part and from the aligning part to a mounting part through a coating part and interlocks with the roller of the coating part. SOLUTION: A suction nozzle 18 provided on a transfer part 19 transfers elements 1 from a line feeder 15 to an aligning part 11 using vacuum. That is, a line of elements 1 are supplied by the line feeder 15 of a supply part 23, transferred to the stopper 13 provided at the leading edge, sucked by the suction nozzle 18 of the transfer part 19 from the stopper and are transferred to the aligning part 11. A suction nozzle 4, which is on the transfer part 19 and uses vacuum, transfers the aligned elements 11 to the board 3 on a mounting part 20 through the coating part 10. A rack 21 meshed with a pinion 22 rotates and drives straight the roller 5, which is provided with a groove and is on the coating part 10, by interlocking the roller 5 with the movement of the suction nozzle 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for electronic components, such as a rectangular plate-shaped electronic component, which is mounted at a predetermined position after a paste is applied to both end surfaces of the element.

[0002]

2. Description of the Related Art Conventionally, as a mounting device for applying paste to both end surfaces of an element and mounting it at a predetermined position, a paste film is formed on both sides of the element held by a suction nozzle utilizing vacuum. There is a method of contacting the above pair of rollers with a roller to apply them to both end surfaces of the element, and a mounting apparatus for electronic components of this type will be described with reference to the drawings.

FIG. 3 is a perspective view of a main part of a conventional mounting device for electronic parts. The example shown in FIG. 3 is for processing four elements 1 at the same time. The element 1 is processed by a line feeder 15. The particles are aligned and transferred to the positioning section 38 by the suction nozzle 42 of the transfer section 41 which moves back and forth and up and down at the stopper 13.

Here, after the element 1 is positioned in the plane direction by the pair of comb teeth 37, the entire positioning portion 38 is moved to 9
The suction nozzle 3 of the transfer unit 39 is slid to a position immediately below the transfer unit 39 that is driven to rotate intermittently every 0 degrees and moves up and down.
2 is supplied.

Thereafter, the paste 2 is applied by the applying section 35 indexed 90 degrees. That is, as shown in FIG. 4, by a pair of rollers 31 and a plate 34 installed with a constant gap on the outer periphery thereof, the paste 2 is rotated to rotate the rollers 31 to form a film having a prescribed film thickness on the outer periphery thereof. Then, when the suction nozzle 32, which has completed the indexing, comes to rest at the specified position, the rotation of the roller 31 is stopped and the guide rail 30
By moving the stage 29 on which the tank 33 containing the paste 2 is placed, the rollers 31 are approached from both sides and the film portion of the paste 2 is brought into contact. Paste 2
The paste 2 is applied to the end surface of the element 1 by leaving the both ends of the element 1 for a certain period of time in order to conform the end surface of the element 1 and then separating them to their original sides.

Further, the element 1 is mounted on the substrate 3 by the mount portion 40 indexed by 90 degrees. During this indexing, the suction nozzle 3
It has a mechanism (not shown) for rotating the element 2 itself by 90 degrees to change the direction of the element 1 when mounted.

Further, the entire coating section 35 is the slide rail 3
6 is slidably mounted on the nozzle 6, and can be appropriately pulled out from the suction nozzle 32 so that the paste 2 can be replenished, cleaned, and maintained.

[0008]

However, in the above-mentioned conventional structure, the method of applying the paste 2 to the element 1 is complicated, and the number of steps is large, which is time-consuming, and the quality of the product is high. The coating amount of the paste 2 directly connected to is determined by the familiarity of the element 1 and the paste 2, and this is a time-dependent factor. Therefore, the speed of the device is determined by this mechanical part, so the speedup is very fast. It was very difficult.

Further, the positioning unit 38 as a whole device
Since the coating part 35 is placed on the slide rail 36 or a driving device for performing intermittent rotation and vertical movement is used, the structure is complicated and the number of components is increased.

Further, in recent years, as the miniaturization of elements has progressed, the assembly accuracy of the apparatus is required to have an accuracy of, for example, 50 microns or less, so that a high level of adjustment work is required, and at the same time maintenance and management are time and skill required. Was necessary.

The present invention is intended to solve such a conventional problem, and an object thereof is to provide an electronic component mounting apparatus which realizes high quality and high productivity at low cost.

[0012]

In order to solve the above problems, an electronic component mounting apparatus according to the present invention comprises a supply unit for supplying electronic components in an aligned state, and a positioning unit for positioning the electronic components at a predetermined position. And a roller provided with a groove having a width slightly wider than the length of the electronic component on the outer peripheral surface in a circular shape is rotatably provided at the upper part, and a tip end formed in a comb tooth shape fits in the groove of the roller. The plate is provided with a plate that forms a predetermined gap between each end face of the groove and the inside of the groove, and the paste is applied to the end face of the electronic component. Mount part for holding a substrate for mounting the electronic component mounted thereon, transfer the electronic component from the supply part to the positioning part, and from the positioning part through the coating part to the mount part, and apply the coating It is obtained by a configuration consisting configured transfer section to work with the roller.

According to the present invention, low cost, high quality,
Thus, a mounting device for electronic parts that achieves high productivity can be obtained.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention described in the claims of the present invention
A supply unit that supplies the electronic components in an aligned state, a positioning unit that positions the electronic components at a predetermined position, and a roller that has a groove having a width slightly wider than the length of the electronic components on the outer peripheral surface in a circular shape. The plate is provided rotatably on the upper part, and the plate is provided with a comb-teeth-shaped tip part that fits in the groove of the roller to form a predetermined gap between each end surface of the groove, and the electronic plate is internally provided. An application part composed of a tank that stores the paste to be applied to the end faces of the components, a mount part that holds a substrate that mounts the electronic component whose paste is applied to the end faces, and a positioning part from the supply part to the positioning part. From the coating part to the mounting part, and at the same time, the transfer part is configured to interlock with the roller of the coating part. It can be completed only by rapidly paste coating is passed through a groove of the.

Further, by slightly changing the rotational speed of the interlocking grooved roller and the moving speed of the electronic component, or changing the passage position of the electronic component's grooved roller,
It is possible to easily change the amount of paste applied to the electronic component and the shape of the applied paste without a time factor.

Further, by disposing the coating section between the positioning section and the mount section of the electronic component, the transfer of the electronic component does not require a drive device for performing intermittent rotation and vertical movement as in the conventional case. It is possible to simplify the device.

Embodiments of the present invention will be described below with reference to the drawings. It should be noted that parts having the same configurations as the parts described in the conventional example will be described by giving the same reference numerals.

(Embodiment) FIG. 1 is a perspective view of a main part showing a configuration of a mounting apparatus for electronic parts in the same embodiment. In FIG. 1, reference numeral 1 is a small rectangular chip part such as a resistor, a capacitor and a coil. A certain element, 15 is a line feeder that conveys the element 1, and a stopper 13 that restricts or stops the element 1 is installed at the tip of the line feeder to form a supply unit 23. Reference numeral 11 is a positioning portion that horizontally positions the element 1 with a pair of comb teeth 12.

Reference numeral 10 denotes a coating section, which is shown in FIGS. 2 (a) and 2 (b).
As shown in the front cross-sectional view and the side cross-sectional view of the main part, the outer peripheral surface is provided with a groove having a width slightly wider than the length of the element 1 in a circumferential shape, and the central axis is horizontally arranged to be a rotatable cylindrical shape. The grooved roller 5, the plate 6 that regulates the film deposition of the paste 2 installed with a certain gap in the groove, and the element 1.
It is composed of a thread cutting plate 8 for preventing the stringing immediately after the paste 2 is applied to and a tank 7 for storing the paste 2 such as an electrode material, an insulating material or an adhesive. 3
Is a substrate on which the element 1 is mounted on the mount section 20.

Reference numeral 19 denotes a transfer section, which is a line feeder 15
From the positioning unit 11 to the positioning unit 11, for example, a suction nozzle 18 using vacuum and the suction nozzle 18
Air cylinder 14 for rotating the rack and rack 16
Also, the pinion 17 and the element 1 after positioning are applied to the application unit 1.
In order to move the suction nozzle 4 which transfers to the substrate 3 of the mount portion 20 via 1 and the grooved roller 5 of the coating portion 10 in conjunction with the movement of the suction nozzle 4 to rotate and move straight, the pinion 22 Rack 21 interlocked
It is composed of

The operation of the electronic component mounting apparatus having the above structure will be described below.

First, the elements 1 are aligned and supplied by the line feeder 15 of the supply section 23, conveyed to the stopper 13 provided at the tip, and adsorbed by the adsorption nozzle 18 of the transfer section 19 at that location to be positioned. Transferred to 11. During this transfer, the suction nozzle 18 causes the pinion 17 provided above the nozzle 18 to rotate by the drive of the rack 16 by the air cylinder 14, thereby changing the direction of the element 1 by 90 degrees.

Next, in the positioning portion 11, the element 1 is set in order in the width direction and the length direction by the pair of facing comb teeth 12, and the stationary positioning is completed. Adsorption nozzle 1 in that state
The element 1 is re-adsorbed by the adsorption nozzle 4 that moves the same as 8 (however, there is no rotation mechanism) and starts moving to the coating section 10. On the other hand, in the coating unit 10, the pinion 22 provided with the grooved roller 5 at one end thereof is driven together with the operation of the rack 21 of the transfer unit 19 to interlock with the horizontal operation of the suction nozzle 4. 2 (a), the paste 2 in the tank 7 is filled in a gap having a width with the plate 6 by the rotation, and is deposited on the end surface of the groove of the grooved roller 5.

As for the dimensional relationship at this time, as shown in FIG. 2B, the width dimension L1 of the groove portion of the grooved roller 5 is the length L of the element 1.
2 is slightly wider than 2, and the dimension L3 between the pastes 2 formed by the film-coated plate 6 is slightly narrower than the length of the element 1. Therefore, when the element 1 adsorbed by the adsorption nozzle 4 passes through the coating section 10, it does not contact the grooved roller 5 but contacts the paste 2, so that the paste 2 becomes the element 1.
Will be applied to the end surface of.

At this time, the rotation speed of the grooved roller 5 when the element 1 passes is basically made to coincide with the passage speed of the element 1. However, the element 1 has a groove portion of the grooved roller 5. When passing through, the element 1 and the grooved roller 5 make a motion of rubbing the paste 2 with the movement of the element 1 due to the difference in the loci due to the difference in the linear movement and the rotational movement. Further, the element 1 that has passed through the grooved roller 5 is cut by the thread cutting plate 8 arranged immediately after the grooved roller 5 and moved to the substrate 3 of the mount portion 20, and the element 1 is passed to the substrate 3. Wear 1.

[0026]

As described above, the mounter for electronic parts according to the present invention has conventionally required a drive device for performing intermittent rotation and vertical movement and four sets of suction nozzles, but only one set of suction nozzles. The paste can be applied during the passage of the element only by providing the above-mentioned in the transfer section from the supply section to the positioning section, and the apparatus can be greatly simplified.

Further, the positioning unit and the coating unit do not need to be moved by the apparatus itself, and they may be fixed. Further, the coating unit can be constituted by one coating roller and the slide rail is not necessary. Is less than half of the conventional one, and the cost of the device can be reduced, and assembly adjustment and maintenance can be improved by greatly simplifying the device as described above.

Further, since the shape and amount of the paste applied can be easily controlled without changing the time factor, that is, the passing speed of the element, the productivity of the apparatus is not affected and the speed is increased. Can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part showing a configuration of a mount device for an electronic component according to an embodiment of the present invention.

FIG. 2 (a) is a front sectional view of the coating section, and (b) is a side sectional view of the main part.

FIG. 3 is a perspective view of a main part showing a configuration of a conventional mounting device for electronic components.

FIG. 4 is a side sectional view of the main part of the coating section.

[Explanation of symbols]

 1 Element 2 Paste 3 Substrate 4 Adsorption Nozzle 5 Grooved Roller 6 Plate 7 Tank 8 Thread Cutting Plate 10 Application Section 11 Positioning Section 12 Comb Tooth 13 Stopper 14 Air Cylinder 15 Line Feeder 16 Rack 17 Pinion 18 Adsorption Nozzle 19 Transfer Section 20 Mount part 21 Rack 22 Pinion 23 Supply part

Claims (1)

[Claims] 1. A supply unit for supplying electronic components in an aligned state, a positioning unit for positioning the electronic components in a predetermined position, and a groove having a width slightly wider than the length of the electronic components on the outer peripheral surface. A roller provided on the upper part of the roller so as to be rotatable, and a plate in which a tip end formed in a comb tooth shape is fitted in the groove of the roller to form a predetermined gap between each end surface of the groove, And a coating section configured by a tank that stores a paste to be applied to the end surface of the electronic component inside, a mount section that holds a substrate on which the electronic component whose paste is applied to the end surface is mounted, and a positioning section from the supply section An electronic component mounting device comprising a transfer unit configured to transfer an electronic component from the positioning unit to the mount unit through the coating unit and to interlock with a roller of the coating unit.