JPH09173929A - Paste applicator for chip-like part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the adjustment of the distance between a holding plate holding chip-like parts and a coating roll and the adjustment of the thickness of the paste adhered to the peripheral surface of this coating roller, to facilitate the treatment when fareign matter adheres to the peripheral surface of the coating roller and to make it possible to surely apply the paste at the ends of the chip-like parts at prescribed sizes. SOLUTION: This paste applicator for the chip-like parts has the coating roller 80 which has the peripheral surface consisting of a cylindrical surface, a unit holding means 76 which freely rotatably supports the revolving shaft of the coating roller 80 and a coating head 77 which is mounted freely movably forward and backward toward the peripheral surface of the coating roller 80 by a linear guide 84 mounted at this unit holding means 76 and has a paste tank 78 at the front end parallel with the coating roller 80. The coating roller 80 is coated with the paste of the specified thickness by the coating head 77 under rotation. This paste is applied at the ends of the chip-like parts held at a part holding plate 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention inserts a chip-shaped component into a hole of a component-holding plate when, for example, a chip-shaped component having an electrode formed by applying a conductive paste to an end portion and baking the electrode is manufactured. The present invention relates to a device for applying a conductive paste to the end of the device while being held by.

[0002]

2. Description of the Related Art A chip-shaped component of this type is one in which external electrodes are formed on both ends of a chip element body made of a ceramic sintered body or the like. Such external electrodes are formed by applying a conductive paste to both ends of the chip-shaped component and baking it. At this time, a component holding plate is used to hold a large number of chip-shaped components. This component holding plate is a plate-shaped jig made of a metal frame in which a rectangular outer frame is framed in a grid pattern and an elastic material such as silicone rubber provided in this frame part. A large number of component holding holes, which are slightly thinner than the diameter of the chip-shaped component, are provided between them.

The chip-shaped component is inserted into the component retaining hole of the component retaining plate, is held with one end thereof protruding from the component retaining hole by a predetermined length, and a conductive paste is applied to the protruding end. And burned.

When the conductive paste is applied to the end portions of the chip-shaped component in this way, conventionally, an application roller for holding the paste in a film shape on the peripheral surface is used, and the peripheral surface of the application roller has a constant thickness. The paste is adhered, and while the application roller is rotated, the holding plate is moved in the tangential direction of the peripheral surface of the holding plate to apply the paste to the end portion of the chip-shaped component protruding from the plate surface of the holding plate. In this case, the paste is normally applied to the end of the chip-shaped component, and the end of the chip-shaped component is projected as much as possible from the plate surface of the component holding plate so that the applied dimension is constant. , The paste is applied after adjusting the distance between the plate surface of the component holding plate conveyed by the conveyor and the peripheral surface of the coating roller and the thickness of the paste adhered to the peripheral surface of the coating roller to be constant. Be seen.

[0005]

However, when the paste is applied to the end of the chip-shaped component by the conventional paste coating device, the plate surface of the component holding plate conveyed by the conveyor and the peripheral surface of the coating roller are removed. It was very troublesome to adjust the distance and the thickness of the paste adhered to the peripheral surface of the coating roller, and it was difficult to make an accurate adjustment. Therefore, each time the lot changes, trial coating must be repeated many times while adjusting the distance between the plate surface of the component holding plate and the peripheral surface of the coating roller and the thickness of the paste adhered to the peripheral surface of the coating roller. It took time to adjust the setup. Nevertheless, there are cases in which variations and errors occur in the paste application dimensions on the ends of the chip-shaped component.

Further, in the paste applicator, when chip-like parts, paint scraps of the chip-like parts, or chipping pieces of the chip-like parts adhere to the peripheral surface of the applying roller, the thickness of the paste at that part adheres. Fluctuates, which may cause scraping of the paste on the edge of the chip-shaped component. Therefore, every time these foreign substances adhere to the peripheral surface of the coating roller, a coating failure occurs, and the apparatus must be stopped each time. As a result, the operating rate of the device is reduced and the yield is reduced.

Therefore, in view of the above-mentioned conventional problems, the object of the present invention is to adjust the distance between the holding plate holding the chip-shaped component and the coating roller and the paste adhesion thickness on the peripheral surface of the coating roller. This facilitates the processing when foreign matter adheres to the peripheral surface of the coating roller, and enables the paste to be reliably coated on the end of the chip-shaped component with a predetermined size.

[0008]

A paste applicator for chip-shaped parts according to the present invention is a unit holding means for rotatably supporting an applicator roller 80 having a cylindrical peripheral surface and a rotary shaft of the applicator roller 80. 76, and a coating head 77 having a paste tank 78 at the tip end parallel to the coating roller 80 and mounted so as to be movable back and forth toward the peripheral surface of the coating roller 80 by a linear guide 84 mounted on the unit holding means 76. , A mechanism for moving the coating head 77 back and forth so that its tip comes into contact with and separates from the peripheral surface of the coating roller 80, a rotating mechanism for rotating the coating roller 80, and a chip-shaped component a in the component holding hole 14. And a conveyer 83 for inserting the component holding plate 11 protruding from the end of the chip-shaped component a in the tangential direction of the peripheral surface of the coating roller 80. .

In such a chip-shaped component paste coating apparatus, when the tip of the coating head 77 is slightly separated from the peripheral surface of the coating roller 80, the paste in the paste tank 78 of the coating head 77 rotates. It is pulled and attached to the peripheral surface of the coating roller 80. Then, the paste that exceeds the distance between the tip of the coating head 77 and the peripheral surface of the coating roller 80 is scraped off by the tip of the coating head 77 and returned to the paste tank 78, so that the coating roller 80 has a constant thickness. Only the paste adheres. Therefore, the thickness of the paste attached to the peripheral surface of the coating roller 80 is determined by the distance between the tip of the coating head 77 and the peripheral surface of the coating roller 80. Therefore, if the micrometer head 73 is provided to adjust the maximum separation distance, the thickness of the paste attached to the peripheral surface of the coating roller 80 can be accurately adjusted. In this case, since the micrometer head 73 is attached to the frame 70 integrated with the unit supporting means 76, the maximum distance between the tip of the coating head 77 and the peripheral surface of the coating roller 80 is accurately adjusted, It is possible to accurately adjust the thickness of the paste that adheres to the peripheral surface of the coating roller 80.

In this manner, the component holding plate 11 is conveyed by the conveyor 83 with the paste adhered to the peripheral surface of the coating roller 80, and the end of the chip-shaped component a projected from one surface of the component holding plate 11 is transferred to the coating roller 80. By being conveyed in the tangential direction of the peripheral surface of, the paste on the peripheral surface of the coating roller 80 is attached and applied to the end of the chip-shaped component a. In this case, a plurality of coating rollers 80 are arranged at the positions before and after the component holding plate 11 is conveyed by the conveyor 83, and the front coating roller 80 is provided at the end of the chip-shaped component a from one surface of the component holding plate 11. The protrusion size is made uniform, and the paste is then applied to the end of the chip-shaped component a by the application roller 80. By doing so,
The minimum distance between the end of the chip-shaped component a and the peripheral surface of the coating roller 80 is constant in any chip-shaped component a, and the size of the paste applied to the end of the chip-shaped component a is constant.

In this way, the minimum distance between the coating roller 80 and the end of the chip-shaped component a when the ends of the chip-shaped component a are aligned by the coating roller 80 and the paste is applied, that is, the chip-shaped component a is The distance when it comes closest to the circumferential surface of the coating roller 80 can be adjusted by adjusting the position of the unit supporting means 76 with respect to the component holding plate 11 conveyed by the conveyor 83. Therefore, by the adjustment mechanism, the size of the paste applied to the end of the chip-shaped component a can be adjusted to a predetermined size by accurately adjusting the distance with the micrometer head 82. .

Further, at the time of this coating, the coating roller 80
The peripheral speed and the conveying speed of the conveyor 83 are rotated and moved at a constant speed. For example, the coating roller 80 and the conveyor 83 are both driven by the same drive system, and the peripheral speed and the speed are synchronized. By doing so, there is no difference in speed between the end of the chip-shaped component a and the peripheral surface of the coating roller 80, so that the end of the chip-shaped component a does not adhere to the peripheral surface of the coating roller 80. It won't scratch. As a result, the amount of paste applied does not vary.

After the paste is applied to the end portion of the chip-shaped component a held by the component holding plate 11 in this manner, the coating head 77 is moved forward and its tip is brought into contact with the peripheral surface of the coating roller 80. The paste attached to the peripheral surface of the coating roller 80 is scraped off by the tip of the coating head 77 and collected in the paste tank 78. At this time, at the time of applying the paste, the chip-shaped component a which is detached from the component holding plate 11 and adheres to the peripheral surface of the application roller 80 due to the viscosity of the paste is collected in the paint tank 78 together with the paste. Further, the spiral groove 8 is formed on the peripheral surface of the coating roller 80.
By providing 9, the fine foreign matter is moved to the end side of the coating roller 80 by the groove 89 and removed. Therefore, even while the paste is being applied, it is possible to automatically eliminate the fine foreign matter attached to the peripheral surface of the applying roller 80. Further, the blade 7 is placed parallel to and close to the peripheral surface of the coating roller 80.
If the leading edge of 9 is directed, it is also effective for removing foreign matter. As a result, most of the foreign matter attached to the peripheral surface of the coating roller 80 is removed, so that it is not necessary to stop the device each time the foreign matter adheres to the peripheral surface of the coating roller 80.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described specifically and in detail with reference to the drawings. 2, 4, 9, and 10 show a state in which the chip-shaped component a is held by the component holding plate 11. The component holding plate 11 includes a frame 12 and an elastic member 13. As shown in FIGS. 2 and 4, the frame 12 is
A beam member 17 is stretched in a grid pattern between rectangular frame portions 18, and the elastic member 1 surrounds the beam member 17.
3 are provided. The elastic member 13 is formed in a flat plate shape as a whole, and has a large number of component holding holes 14 between the beam members 17. The diameter of the component holding hole 14 is smaller than the diameter of the chip-shaped component a, and by inserting the chip-shaped component a therein, the chip-shaped component a is held by the wall surface of the elastic member 13 around the component holding hole 14. To be done. When the paste is applied to the end of the chip-shaped component a, the chip-shaped component a is held by the component holding hole 14 with the end to be applied protruding from the component holding hole 14.

Next, an example of an apparatus for applying the paste to the end portion of the chip-shaped component a using the component holding plate 11 will be described. As shown in FIGS. 1 and 3,
The component holding plate 11 is placed on the platen 71 and is conveyed by the conveyor 83 to the paste coating apparatus shown in FIGS. In the illustrated case, the component holding plate 11 is
As the timing belt 88 of the conveyor 83, which will be described later, travels, it is horizontally conveyed at a constant speed in the direction indicated by the arrow in FIG.

As shown in FIG. 5, unit holding frames 72 face each other in parallel on both sides of the conveyor 83. As shown in FIGS. 1 and 2, the upper portion of the unit holding frame 72 has a rectangular window shape. A unit holding means 76 is housed in the window-shaped opening, and the unit holding means 76 has a support 81 having an adjusting screw.
Thus, the component holding plate 11 is attached to the holding frame 72 so that its position can be adjusted in a direction orthogonal to the conveying direction of the component holding plate 11 by the conveyor 83, that is, in the vertical direction in the illustrated example. A micrometer head 82 is erected vertically on the unit holding frame 72, and the tip end surface of the spindle of the micrometer head 82 projects toward the upper surface of the unit holding means 76. As a result, when the height of the unit holding means 76 is adjusted, the micrometer head 8 is placed on the upper surface of the holding means 76.
By hitting the tip surfaces of the second spindles, the height of the unit holding means 76 can be grasped numerically.
In particular, the heights of the unit holding means 76 on both sides of the conveyor 83 can be adjusted to the same height, which is effective for adjusting the height of the coating roller 80 while making it horizontal as described below.

Bearings (see FIG. 7) are provided at corresponding positions of the unit holding means 76 on both sides, and the shaft of the coating roller 80 is rotatably supported by the bearings. By adjusting the height of the unit holding means 76 on both sides, the shaft of the coating roller 80 is horizontally installed right above the conveyor 83 so as to be orthogonal to the traveling direction thereof. As will be described later, a drive motor 90 as a drive source (FIG. 7) is attached to one end of the shaft of the coating roller 80 via a pulley 86 and a belt 87.
(Refer to FIG. 1), and by the rotation of the drive motor 90, the application roller 80 is rotated in the direction opposite to the hour hand in FIGS. 1 and 3 as indicated by the arrow. As shown in FIG. 5, a thin shallow groove 89 is spirally formed on the peripheral surface of the coating roller 80. In the illustrated example, a plurality of spiral grooves 89 having the same lead (gradient) are formed at a uniform pitch.

Further, the unit holding means 76 on both sides is provided.
A frame 70 is installed on the conveyor 83 and on the rear side of the coating roller 80 between them, so that the frame 70 is parallel to the conveyance direction of the component holding plate 11, that is, orthogonal to the axis of the coating roller 80. Is provided with a linear guide 84. This linear guide 84 is attached to the frame 7
Two are arranged in parallel with each other, one on each side of 0. A slider 85 is slidably attached to the linear guides 84 on both sides of the slider.
Is a horizontally long one that is installed over the linear guides 84 on both sides. A spring 75 is mounted between the slider 85 and the frame 70, and elastic force is applied to the slider 85 so that the slider 85 is pulled leftward in FIGS. 1 and 3.

At the center of the unit holding means 76 and to the left of the slider 85 in FIG. 6, the linear guide 8 is provided.
A micrometer head 73 is fixed in parallel with the slider 4, and the tip end surface of its spindle is in contact with the slider 85. That is, the tip of the spindle of the micrometer head 73 functions as a stopper that restricts the slider 85 from moving leftward in FIG. It can be adjusted while checking numerically on the scale.

The slider 8 at the center of the frame 70
5, a pusher 74 formed of an air cylinder, a solenoid, or the like is attached to the left side of FIGS. 1 and 3, and the plunger of the pusher 74 performs a stroke operation toward the slider 85 in parallel with the micrometer head 73. Therefore, when the plunger of the pusher 74 extends, the slider 85 is pushed rightward in FIGS. 1 and 3 along the linear guide 84 against the elastic force of the spring 75. Further, when the plunger of the pusher 74 is pulled in, the slider 85 moves leftward in FIGS. 1 and 3 along the linear guide 84 due to the elasticity of the spring 75, and the slider 85 moves the tip surface of the spindle of the micrometer head 73. Will be stopped.

A coating head 77 is attached to the tip of the slider 85. The coating head 77 has a length over the entire paste coating effective width of the coating roller 80, has a paste tank 78 at its tip, and fills the paste to be coated at the edge of the chip-shaped component a.
The tip wall of the paste tank 78 has a coating roller 80.
When it comes into contact with the peripheral surface of the roller 80, it has a blade shape that is oriented substantially tangentially to the peripheral surface of the roller 80. A blade 79 is attached on the coating head 77 in the radial direction toward the peripheral surface of the coating roller 80.
The leading edge of 9 is close to the peripheral surface of the coating roller 80 with a predetermined gap.

The paste applying apparatus shown in FIG.
The paste application device shown in FIG. 3 is used for leveling in order to make the protruding dimensions of the ends of the chip-shaped components a protruding from the component holding plate 11 uniform. It is for applying the paste to the ends of the. This arrangement relationship is shown in FIG. As shown in this figure, paste applying devices each having an applying roller 80 are arranged side by side in the conveying direction of the component holding plate 11, and the front side is a paste applying device for leveling shown in FIG. It is a paste application device for paste application shown in FIG.

In such a paste coating apparatus, the support column 81 having the adjusting screw as shown in FIGS.
By preliminarily adjusting the height of the unit holding means 76, the coating roller 80 is leveled and the component holding plate 1 conveyed by the peripheral surface and the conveyor 83.
The distance in the height direction from the upper surface of 1 is adjusted. The height interval is adjusted by aligning the end portions of the chip-shaped component a or adjusting the distance between the upper surface of the component holding plate 11 and the peripheral surface of the coating roller 80 when the paste is applied to the end portions. so,
This is to optimize the leveling dimension at the end of the chip-shaped component a and the paste application dimension at the end. A micrometer head 82 is used for this adjustment.

The coating head 7 is used when the micrometer head 73 is used and the slider 85 hits the tip surface of the spindle of the micrometer head 73 and is stopped.
The distance between the leading edge of 7 and the peripheral surface of the coating roller 80 is adjusted. The distance is adjusted by adjusting the paste adhesion thickness on the peripheral surface of the application roller 80 when the paste is applied to the chip-shaped component a, so that the paste application size to the end of the chip-shaped component a is optimized. To do so. further,
The distance between the tip edge of the blade 79 and the peripheral surface of the coating roller 80 is adjusted to be substantially equal to the distance between the tip edge of the coating head 77 and the peripheral surface of the coating roller 80.

FIG. 7 shows a drive system of such a paste coating device. The rotation generated by the drive motor 90 is transmitted to the clutch brake unit 95 via the pulley and the belt, and the rotation is distributed to the coating roller 77 and the timing belt 88 of the conveyor via the clutch brake unit 95. That is, the rotation of the clutch / brake unit 95 causes the belt 8 to rotate between the two applying rollers 77, 77.
7, 87 and pulleys 86, 86 '. The rotation of the clutch brake unit 95 is transmitted to the timing belt 88 wound around the pulleys 97, 97 via the belt 96 and the pulley 98. The pulleys 86, 86 ′ and 98 have the same diameter, so that the peripheral speeds of the coating rollers 77 and 77 and the speed of the timing belt 88 become equal. Further, below the coating roller 80, the peripheral surfaces of the coating rollers 77, 77 and the timing belt 88 run in the same direction.

Next, the process of applying the paste to the end portion of the chip-shaped part a by using such a paste applying device will be described. First, in the front-side coating device shown in FIG. 1, the pusher 74 pushes the coating head 77 toward the coating roller 80, and the tip edge thereof contacts the peripheral surface of the coating roller 80. Then, the paste attached to the peripheral surface of the coating roller 80 is scraped off. The peripheral surface of the coating roller 80 in this state is shown in FIG. Leveling which is not intended to apply the paste to the end of the chip-shaped component a may be performed in this state. That is, the peripheral surface of the coating roller 80 is applied to the end portion of the chip-shaped component a protruding from the plate surface of the component holding plate 11, and the end portion of the chip-shaped component a protruding from the other chip-shaped component a is placed on the component holding plate. 11 is pushed into the component holding hole 14.

Next, in the front side coating apparatus shown in FIG. 3, the coating head 77 is pushed toward the coating roller 80 by the pusher 74 in the same manner as described above, and the tip edge thereof is the peripheral surface of the coating roller 80. Hit Then, the coating roller 8
The paste adhering to the 0 peripheral surface is scraped off. After that, the pusher 74 is returned, and the elasticity of the spring 75 causes the slider 8 to move.
When the coating head 75 is returned to the position where 5 hits the tip end surface of the spindle of the micrometer head 73 and stops, the paste is pulled out and adheres to the peripheral surface of the coating roller 80 due to the viscosity of the paste. At this time, the paste having a thickness exceeding the distance between the tip edge of the coating head 77 and the peripheral surface of the coating roller 80 is scraped by the tip edge of the coating head 77 and constantly returned to the coating tank 78. Inevitably, the adhered thickness of the paste is approximately equal to the distance between the tip edge of the coating head 77 and the peripheral surface of the coating roller 80.

After that, the conveyor 8 is mounted on the platen 71.
3, the component holding plate 11 is conveyed below the coating roller 80. At this time, the conveyance direction of the component holding plate 11 and the rotation direction of the coating roller 80 are the same, and the conveyance speed of the component holding plate 11 and the peripheral speed of the coating roller 80 are synchronized. As a result, as shown in FIG. 4, the paste p on the peripheral surface of the application roller 80 is applied without being rubbed on the end of the chip-shaped component a protruding from the upper surface of the component holding plate 11. At this time, the distance between the peripheral surface of the coating roller 80 and the end of the chip-shaped component a protruding from the upper surface of the component holding plate 11 and the thickness of the paste applied to the peripheral surface of the coating roller 80 are both constant. Has been adjusted. Therefore, the chip-shaped component a
The paste is applied almost uniformly to the end portions of the. However, some coating unevenness may occur due to a partial loss of the paste on the peripheral surface of the coating roller 80, or the like.

Next, the chip-shaped component a whose end is thus coated with the paste is sent to a defoaming device for removing bubbles of the paste while being held by the component holding plate 11 and included in the paste. Fine bubbles are released. FIG.
Is a defoaming device for removing air bubbles contained in the paste applied to the end of the chip-shaped component a in this manner. That is, the component holding plate 11 is conveyed onto the table 92, and the chamber container 91 is lowered by an elevating mechanism such as an air cylinder to form an airtight space in which the component holding plate 11 is stored. Then, the pressure is reduced to release fine bubbles from the paste applied to the end of the chip-shaped component a.

[0030]

As described above, according to the present invention, it is possible to adjust the distance between the holding plate 11 holding the chip-shaped component a and the coating roller 80 and the paste adhesion thickness on the peripheral surface of the coating roller 80. It will be easy. Further, even if foreign matter adheres to the peripheral surface of the coating roller 80, the foreign matter is eliminated by itself or each time the paste is applied, so that the foreign matter can be easily eliminated without stopping the apparatus each time. . Therefore, it becomes possible to reliably apply the paste to the end portion of the chip-shaped component with a predetermined size.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing an example of a first chip-shaped component paste coating apparatus according to the present invention with one unit holding frame removed.

FIG. 2 is an enlarged cross-sectional view showing how the end portion of the chip-shaped component held by the component holding plate is leveled and applied in the same apparatus.

FIG. 3 is a schematic side view showing an example of a paste applying device for a second chip-shaped component according to the present invention with one unit holding frame removed.

FIG. 4 is an enlarged cross-sectional view showing a state in which paste is applied to an end portion of a chip-shaped component held by a component holding plate in the same device.

FIG. 5 is a schematic plan view showing an example of a paste coating device for chip-shaped components according to the present invention.

FIG. 6 is a schematic side view showing an arrangement example of a paste application device for two chip-shaped components according to the present invention.

FIG. 7 is a drive mechanism diagram showing a drive system for a paste application device for two chip-shaped components and a conveyor according to the present invention.

FIG. 8 is a schematic vertical cross-sectional side view of a process of defoaming and drying the paste applied to the end portion of the chip-shaped component by the device.

[Explanation of symbols]

 11 Component Holding Plate 14 Component Holding Plate Component Holding Hole 70 Frame 73 Micrometer Head 76 Unit Holding Means 77 Coating Head 78 Coating Head Paste Tank 79 Blade 80 Coating Roller 82 Micrometer Head 83 Conveyor 84 Linear Guide 88 Conveyor Timing Belt a Chip-shaped component

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Susumu Hinohara 6-16-20 Ueno, Taito-ku, Tokyo Within Taiyo Electric Co., Ltd. (72) Genji Sakurai 6-16-20 Ueno, Taito-ku, Tokyo In Taiyo Denki Co., Ltd. (72) Inventor Shoichi Kurihara 6-16-20 Ueno, Taito-ku, Tokyo In Taiyo Denki Co., Ltd.

Claims (10)

[Claims] 1. A chip-shaped component which is inserted into a component-holding hole (14) having an elastic wall provided in a component-holding plate (11) and which applies paste to the end of the held chip-shaped component (a). In a paste coating apparatus, a coating roller (80) having a peripheral surface made of a cylindrical surface, a unit holding means (76) for rotatably supporting a rotation shaft of the coating roller (80), and a unit holding means (76). The linear guide (84) attached to the coating roller (8
0) is attached to the peripheral surface of the coating head (77) so as to be movable back and forth, and has a paste tank (78) at a tip end parallel to the coating roller (80), and the coating head (77).
A mechanism for moving back and forth so that its tip comes into contact with and separates from the peripheral surface of the applying roller (80), and the applying roller (80)
And a rotation mechanism for rotating the chip-shaped component (a) into the component-holding hole (14), and the component-holding plate (11) protruding from the end of the chip-shaped component (a) is applied to the application roller (80). (83) to convey in the tangential direction of the peripheral surface of the
A paste application device for chip-shaped parts, comprising: 2. A unit supporting means (7) for a component holding plate (11) conveyed by a conveyor (83).
The paste application device for a chip-shaped component according to claim 1, further comprising an adjusting mechanism for adjusting the position of 6). 3. A unit supporting means (7) for a component holding plate (11) conveyed by a conveyor (83).
The paste application device for a chip-shaped component according to claim 2, further comprising a micrometer head (82) for confirming the position of 6). 4. A micrometer head (73) for adjusting the maximum separation distance between the tip of the coating head (77) and the peripheral surface of the coating roller (80) and confirming the distance. The paste application device for a chip-shaped component according to any one of 1 to 3. 5. A micrometer head (73) for adjusting the maximum distance between the tip of the coating head (77) and the peripheral surface of the coating roller (80) and confirming the distance is integrated with the unit supporting means (76). 5. The paste application device for chip-like parts according to claim 4, wherein the paste application device is attached to the frame (70). 6. The coating roller (80) is provided with a spiral groove (89) on the peripheral surface thereof.
5. A paste application device for chip-shaped parts according to any one of 5 above. 7. The chip-shaped component according to claim 1, wherein the tip edge of the blade (79) is oriented parallel to and close to the peripheral surface of the coating roller (80). Paste applicator. 8. The chip-shaped component according to claim 1, wherein the coating roller (80) and the conveyor (83) rotate and move at a constant speed. Paste applicator. 9. A coating roller (80) and a conveyor (83)
Are both driven by the same drive system. 10. The coating roller (80) is a conveyor (8).
A plurality of component holding plates (11) are arranged at positions before and after being conveyed by (3), and the chip component paste coating device according to any one of claims 1 to 9, wherein.