KR20060053370A - Lamination apparatus - Google Patents

Abstract

Lamination apparatus of the present invention, a feed roller wound a plurality of films, a cutter assembly for cutting a predetermined length of the film supplied from the feed roller, the film is released from the feed roller with a predetermined time difference so that the transfer through the travel path A substrate for transferring the substrate to the transfer roller by a predetermined time unit, and a transfer roller for compressing and adhering the film introduced through the suction member to the substrate, the substrate being sequentially transferred through the table. It works to attach the film at regular intervals.

Multifaceted, Plasma, Display, Panel, Lamination, Sheet

Description

Lamination Device {LAMINATION APPARATUS}

1 is a front configuration diagram schematically showing the configuration of a lamination device according to the present invention.

Figure 2 is a perspective view showing a cutter assembly shown in FIG.

3 is a cross-sectional view showing a portion of the adsorption member shown in FIG.

Figure 4 is a plan view showing a glass substrate to which the lamination sheet is continuously attached by the lamination apparatus of the present invention.

The present invention relates to a lamination device, and more particularly, to a lamination device having a structure capable of continuously attaching a film on a substrate at regular intervals when manufacturing a plasma display panel in a multi-sided manner.

In a general semiconductor manufacturing process, a plurality of stacks are sequentially stacked on a substrate to manufacture a semiconductor in order to manufacture layers having different properties by stacking layers having different properties. In the semiconductor manufacturing process, various lamination methods such as photolithography, lift-off, and screen printing are used.

Among these, the photolithographic method which is easy to manufacture especially is widely used. The photolithography method uses photo printing technology to implement components, wirings, and thin films constituting a semiconductor integrated circuit. That is, in the photolithography method, a photoresist (PR) having a photosensitive property is applied thinly on a semiconductor wafer, and then a circuit is constructed in the same manner as taking a photograph by applying a light on a desired mark pattern.

Here, the photoresist is a photosensitive material for an exposure process that allows a fine circuit pattern to be formed by differently responding to irradiation of light when transferring a designed semiconductor circuit to a wafer, and is a material for forming an anticorrosive coating by exposure. It is used for fine processing of semiconductors such as photoetching, integrated circuit (IC), and large scale integration (LSI), which perform precision processing of various metal plates in addition to photolithography for photolithography.

The photoresist is particularly used in the form of a lamination sheet (hereinafter, referred to as a 'film'), and the liquid crystal display panel (LCD) and the plasma display panel due to the uniformity of the thickness and the advantages of the process simplification. , PDP). In the case of the plasma display panel, not only an electrode but also a dielectric and a partition wall are used as the film.

However, when manufacturing a plurality of substrates using the film as described above there is a problem in the process. For example, in the case of a plasma display panel, when manufacturing a plurality of plasma display panels on a single substrate, the films should be attached to the substrate at regular intervals. In the case of mounting the component, it is not only impossible to remove the dielectric, but also has a problem of covering an electrode part that must be exposed for connection with a flexible printed circuit (FPC).

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to space the film on a substrate so as to be suitable for manufacturing a plurality of semiconductor elements, liquid crystal display panels or plasma display panels on a substrate. To provide a lamination device having a structure that can be attached continuously.

Lamination apparatus provided by this invention in order to achieve such an objective,

A feed roller wound with a plurality of films, a cutter assembly for cutting a film of a predetermined length supplied from the feed roller, an adsorption member for supporting the film to be unloaded from the feed roller at a predetermined time interval and transported through a traveling path, and the adsorption A transfer roller for pressing and attaching the film introduced through the member to the substrate and a table for transferring the substrate to the transfer roller in predetermined time units, and attaching the film to the substrate sequentially transferred through the table at a predetermined interval. It works.

In the present invention, the film is preferably supplied at least two rows or more in the advancing direction of the substrate, the feed roller is free to rotate while the film is released by the adsorption member.

And, the support member, the adsorption roller for adsorbing the film wound on the feed roller at a predetermined time difference to transfer in the vertical direction to attach to the front end of the substrate; And an adsorption plate for adsorbing the film supplied from the adsorption roller, converting the traveling path in the vertical direction into the horizontal direction, and feeding the film into the transfer roller.

Lamination apparatus provided in another embodiment of the present invention,

A feed roller wound with a plurality of films, a cutter assembly for cutting a film of a predetermined length supplied from the feed roller, an adsorption member for supporting the film to be unloaded from the feed roller at a predetermined time interval and transported through a traveling path, and the adsorption A transfer roller for compressing the film fed through the member and attaching the film to the substrate, and a table on which the substrate is mounted in a fixed state, and a frame on which the substrate is mounted and reciprocating along the table. The frame is operated to attach the film at regular intervals to the substrate which has been sequentially transported while reciprocating over the substrate placed thereon.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

1 is a front configuration diagram schematically showing the configuration of a lamination device according to the present invention.

Referring to the drawings, the lamination apparatus according to the present invention, when forming an electrode, a dielectric or a partition on the substrate 1 to form a plurality of plasma display panel on one substrate 1, the film 10 ) Can be continuously attached at regular intervals.

The lamination apparatus according to the present invention may attach the film 10 on the substrate 1 at regular intervals in two rows, and may be attached at regular intervals in one or more rows according to the size of the substrate 1. . However, below, the example which attaches the film 10 on the board | substrate 1 at regular intervals in 2 rows is demonstrated.

The apparatus is divided into various components as follows. These components may be installed in one frame 20, or each of the divided frames 20 may be combined. In addition, each component is controlled by a control unit (not shown).

The frame 20 is configured to support the device with respect to the ground, and is equipped with various motors for driving the device, a high pressure air system, a vacuum system, an electronic measurement system, and the like.

The components of the present invention described below are all installed in the frame 20, and various brackets, blocks, plates, housings, covers, collars, and the like are attached elements for installing the respective components in the frame 20. Therefore, except for exceptional cases, the frame 20 is generally referred to as a rule.

Lamination apparatus according to the present invention is a supply roller 30 wound with two rows of film 10, recovery roller 40 for recovering the cover film 11 attached to the film 10, and the tension of the film 10 Tension member 50 to maintain the holding, cutter assembly 60 for cutting the film 10 of a predetermined length supplied from the supply roller 30, and the corona electrostatic transfer to the surface of the cut film 10 to run The transfer roller 70 attached to the upper surface of the substrate 1 supplied along the path, and the support roller disposed below the transfer roller 70 so that the substrate 1 travels along the traveling path of the film 10 ( 80 and an adsorption member 90 for releasing the feed roller 30 from the feed roller 30 at a predetermined time interval to support it to travel through the travel path and supply the film 10 to the transfer roller 70. do.

The film 10 described above is composed of a cover film 11 and a transfer material attached to the cover film 11. In the case of a plasma display panel, the transfer material includes an electrode material, a dielectric material, and a partition wall. Examples thereof include a solvent material. As the electrode material, indium tin oxide (ITO) and SnO ₂ for transparent electrodes, Cr-Cu-Cr or Ag for bus electrodes, and Ag for address electrodes are widely used. In addition, as the dielectric, a paste mainly composed of low melting point glass powder, that is, glass paste is used. As the partition wall, a material in which an organic solution (organic solvent + resin) or various fillers (alumina or various metals) is added to the low melting glass powder is used.

The supply roller 30 is rotatably installed on the frame 20, the film 10 as described above is wound in a roll shape, and the film 10 is unloaded and supplied to the traveling path. Preferably, the supply roller 30 is not driven by a predetermined drive source, and is rotated while the film 10 is freely released by the suction member 90 described below. In addition, the supply roller 30 is supported by a separate holder (not shown) may be rotatably mounted to the frame 20. The feed roller 30 is provided with two sets of films. In order to show this, the feed roller 30 is separately shown in FIG. 1.

The recovery roller 40 is installed in close proximity to the supply roller 30, and is rotatably mounted to the frame 20 to wind the cover film 11 attached to the film 10. The recovery roller 40 has a structure in which the rotating shaft is connected to the rotating shaft (not shown) of the feed roller 30 by a belt or a chain and rotated together as the feed roller 30 is rotated. The recovery roller 40 may be supported by a separate holder together with the supply roller 30 to be rotatably mounted to the frame 20.

In addition, the tension member 50 acts to maintain a constant tension on the film 10 by changing the traveling path of the film to work with the adsorption member 90 described later. This will be described together with the description of the adsorption member 90 described later.

The transfer roller 70 transfers corona static electricity to the surface of the film 10 supplied from the supply roller 30 so that the film 10 is easily attached to the upper surface of the substrate 1. The transfer roller 70 has its surface charged by a separate corona device (not shown). In addition, the transfer roller 70 may be attached to a substrate by thermally compressing the film. In this case, the transfer roller 70 is provided with a heater for raising the temperature of the surface thereof.

On the other hand, the substrate 1 is a substrate for manufacturing a plurality of plasma display panel, passing between the transfer roller 70 and the support roller 80 disposed below the transfer roller 70, the transfer roller 70 ) Is supplied in the same direction as the traveling direction of the film 10 to be supplied. The support roller 80 supports the lower surface of the substrate 1 and is rotated by a separate driving source. Therefore, as the substrate 1 is supplied between the transfer roller 70 and the support roller 80 and at the same time the film 10 is supplied between the transfer roller 70 and the substrate 1, the film 10 is transferred to the transfer roller ( 70) and the support roller 80 are adhered to the upper surface of the substrate 1 by the complementary pressing force and the corona static electricity charged on the surface thereof.

On the other hand, Figure 2 is a perspective view showing an embodiment of the cutter assembly shown in FIG.

Referring to this, the cutter assembly 60 has a structure capable of cutting the film 10 in a direction perpendicular to the travel path while the film 10 is supplied by the feed roller 30 by a predetermined length. To this end, the cutter assembly 60 is installed at the end of the lead screw 61 and the lead screw 61 rotatably installed in the frame 20 along a direction perpendicular to the travel path of the film 10 and a predetermined driving force. A drive motor 62 for forward and reverse rotation of the lead screw 61 by the screw, a mount block 63 coupled to the lead screw 61, and horizontally movable by rotation of the lead screw 61, and a mount block 63. A pair of guide rods 64 mounted on the frame 20 to guide the horizontal movement of the cutter, and a cutter installed on the mounting block 63 to cut the film 10 by the horizontal movement of the mount block 63 ( 65). As will be described in detail later, the cutter 65 operates to cut the film horizontally along the guide groove provided in the suction member 90.

3 is a configuration diagram illustrating the adsorption member illustrated in FIG. 1.

Adsorption member 90 according to an embodiment of the present invention is a film 10 cut by a predetermined length by the cutter assembly 60 continuously attached to the upper surface of the substrate 1 spaced apart at regular intervals and the film 10 Maintain tension.

The adsorption member 90 is an adsorption roller 91 for adsorbing the film 10 wound on the supply roller 30 with a predetermined time difference and supplying it through a traveling path, and a film supplied by the adsorption roller 91 ( 10 is provided with an adsorption plate 92 for adsorbing and supplying it to the transfer roller 70.

The adsorption roller 91 is for unwinding the film 10 wound on the supply roller 30 to travel along the travel path. The suction roller 91 is positioned close to the cutter assembly 60 and is slidably installed in the frame 20 to reciprocate along the travel path of the film 10. That is, the adsorption roller 91 is screwed to a predetermined driving means 93, for example, a ball screw, and the ball screw is rotated by a servo motor, so that the film 10 travels along the guide rail formed on the frame 20. Sliding in the direction. As an alternative, the drive means 93 is not limited to having a ball screw and a servomotor, and may also include a cylinder which is normally operated by oil or pneumatic pressure.

In addition, the adsorption roller 91 has a structure capable of selectively adsorbing the film 10 to release the film 10 wound on the supply roller 30 and to travel along the travel path. To this end, the suction roller 91 is formed with a suction hole 95 that can adsorb the film 10 by the vacuum pressure generated from the vacuum pump 94. The suction roller 91 further includes a guide groove 97 in the advancing direction of the cutter assembly 60. The guide groove 97 guides the cutter assembly 60 so that the cutter is positioned along the guide groove 97 when cutting the film 10 so that the film 10 can be cut in one straight line in the horizontal direction. .

The adsorption plate 92 is for adsorbing the film 10 adsorbed on the adsorption roller 91 and supplying it to the transfer roller 70. The adsorption plate 92 is spaced apart by a predetermined distance in the downward direction by the transfer roller 70, and is located toward the rear side relative to the adsorption roller 91. That is, with respect to the advancing direction of the board | substrate 1, the adsorption plate 92 is located relatively behind the adsorption roller 91. As shown in FIG.

And this adsorption plate 92 is '??' It is bent in a shape to change the traveling path of the film from the vertical direction to the horizontal direction and at the same time acts with the tension member 50 to keep the tension of the film 10 constant. That is, the tension member 50 also switches the traveling path of the film 10 from the horizontal direction to the vertical direction, so that the film 10 maintains the tension by using the tension member 50 and the suction plate 92 as inflection points, respectively. do.

The adsorption plate 92 is fixed to the frame 20 and can selectively adsorb the film 10 to receive the film 10 adsorbed on the adsorption roller 91 and supply the film 10 to the transfer roller 70. Has a structure. To this end, the suction plate 92 is formed with a suction hole 95 that can adsorb the film 10 by the vacuum pressure generated from the vacuum pump 94.

On the other hand, the table 5 which transfers the board | substrate 1 is further provided in the front end of this adsorption plate 92 in the horizontal direction. This table 5 is connected by predetermined drive means (not shown), and is provided so that the left and right reciprocating motions can be performed with reference to the drawings. The driving means may be a screw screwed to the ball screw and the ball screw is rotated by the servo motor to slide along the guide rail formed in the frame 20, alternatively provided with a ball screw and a servo motor It is not limited, and may also be provided with the cylinder normally operated by hydraulic or pneumatic pressure.

Optionally, the table 5 may be fixed and the frame 20 itself may be connected to the above-mentioned driving means so as to be able to reciprocate forward and backward.

Referring to the operation of the lamination device according to an embodiment of the present invention configured as described above in detail. In this description, the frame 20 is fixed and the table 5 reciprocates.

First, the film 10 wound around the feed roller 30 is released to the position of the adsorption roller 91, and the film 10 is adsorbed to the adsorption roller 91. Then, the adsorption roller 91 is moved to the second adsorption plate 92 side along the travel path of the film 10.

As a result, the adsorption roller 91 travels in the vertical direction and approaches the substrate 10 positioned below it. At this time, the substrate 1 is conveyed to the origin by the transfer operation of the table 5, but the film should not be applied like an alignment mark or an electrode terminal portion formed at the tip of the substrate 1 in position. It is located at the beginning of the application.

The adsorption roller 91 continuously transfers the film in the vertical direction to adhere it to the origin of the substrate 1, then stops adsorption of the film 10 and returns to the original position.

Next, in a state where the film 10 is attached to the substrate 1, the table 5 for transporting the substrate 1 moves the substrate 1 toward the transfer roller 70 along the traveling path of the film 10. Transfer.

Subsequently, when the film 10 comes close to the transfer roller 70 side, the adsorption plate 92 operates to adsorb the film 10 and acts with the tension member 50 to maintain the tension of the film 10. The furnace film 10 and the substrate 1 are simultaneously introduced to the transfer roller 70 side.

Next, the cutter assembly 60 is started. Then, the lead screw 61 is rotated by the rotation of the drive motor 62, the mount block 63 is guided along the guide rod 64 by the rotation of the lead screw 61, the width of the film 10 Is moved horizontally in the direction. At this time, the cutter 65 of the cutter assembly 60 is seated in the guide groove 97 of the suction roller 91 to be rotated, whereby the film 10 by the cutter 65 installed in the mount block 63. Is cut.

Subsequently, when the cutting of the film 10 is completed, the mount block 63 is returned to its original position by the driving of the driving motor 62. At this time, the adsorption roller 91 is in a state where the adsorption of the film 10 is stopped while the cutter 65 cuts the film 10, and the transfer roller 70 and the support roller 80 are supported by the support roller 80. The substrate 1 enters a state therebetween while being rotated by the driving of the "

As such, when the cutting of the film 10 is completed, the adsorption plate 92 absorbs the cut film 10, converts the traveling path of the film from the horizontal direction to the vertical direction, and transfers the film 10 to the transfer roller. It supplies to 70. At this time, the transfer roller 70 transfers the corona static electricity (or heat) to the surface of the film 10. Therefore, the film 10 has the upper surface of the substrate 1 by the complementary pressing force of the transfer roller 70 and the support roller 80 between the transfer roller 70 and the substrate 1 and the static electricity charged on the surface thereof. Is attached to.

During this process, after the cutting of the film 10 is completed, the adsorption roller 91 absorbs the remaining film 10 again after being cut, and slides downward along the travel path. Then, the film 10 is driven along the travel path while being released from the supply roller 30.

Subsequently, the adsorption roller 91 comes close to the substrate 1, and as described above, the film 10 is attached to the origin of the substrate 1 to be fed and supplied to the adsorption plate 92. At this time, the table 5 operates to transfer the substrate 1 to the starting point, and operates so that the film is not applied to the electrodes or alignment marks formed between the substrates formed in a line on the multi-faceted substrate.

On the other hand, Figure 4 is a plan view showing a glass substrate to which the film is continuously attached by the lamination apparatus of the present invention.

As shown in FIG. 5, the film 10 maintains a constant distance between the first region 1a and the second region 1b divided in the longitudinal direction of the substrate 1 by the above-described operation. Attached. At this time, since two sets of films are provided on the feed roller, the film is not substantially applied between the first region 1a and the second region 1b. In addition, the table 5 sequentially supplies the substrate to the transfer roller 70 so as to selectively apply the lengthwise portion of the film.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the lamination apparatus of the present invention, there is an advantage in that electrodes, dielectrics and barrier ribs can be easily formed in successively forming a plurality of plasma display panels on one substrate.

In addition, the present invention can be applied to a semiconductor device and a liquid crystal display panel in addition to the plasma display panel, and the manufacturing process is quick and convenient.

In addition, since it is possible to apply the film continuously can greatly reduce the laminating equipment, it is possible to secure a competitive advantage in terms of cost.

Claims (12)

A feed roller on which a plurality of films are wound; A cutter assembly for cutting a predetermined length of film supplied from the feed roller; An adsorption member for supporting the film so as to be transported through a travel path by being released from a supply roller with a predetermined time difference;  A transfer roller which compresses the film introduced through the adsorption member and attaches the film to the substrate; And, And a table for transferring the substrate to the transfer roller in predetermined time units. Lamination apparatus for attaching the film at a predetermined interval to the substrate sequentially supplied through the table reciprocating. The method of claim 1, And at least two rows of the film are supplied in the advancing direction of the substrate. The method of claim 1, The supply roller is a lamination device that is free to rotate while the film is released by the suction member. The method of claim 1, And a recovery roller for recovering the cover film attached to the film in pairs with the supply roller. The method of claim 1, The support member, An adsorption roller for adsorbing the film wound on the supply roller at a predetermined time difference and transporting the film in a vertical direction to attach to the front end of the substrate; And, And an adsorption plate for adsorbing the film supplied from the adsorption roller, converting the traveling path in the vertical direction into the horizontal direction, and feeding the film into the transfer roller. The method of claim 5, Lamination apparatus further comprises a guide groove for the suction roller to guide the cutter assembly. A feed roller on which a plurality of films are wound; A cutter assembly for cutting a predetermined length of film supplied from the feed roller; An adsorption member for supporting the film so as to be transported through a travel path by being released from a supply roller with a predetermined time difference;  A transfer roller which compresses the film introduced through the adsorption member and attaches the film to the substrate; And, A table seating the substrate in a fixed state; And, And frames installed therein so as to reciprocate along the table. Lamination apparatus for attaching the film to the substrate that is sequentially transported while the frame is reciprocating over the substrate placed on the table. The method of claim 7, wherein And at least two rows of the film are supplied in the advancing direction of the frame. The method of claim 7, wherein The supply roller is a lamination device that is free to rotate while the film is released by the suction member. The method of claim 7, wherein And a recovery roller for recovering the cover film attached to the film in pairs with the supply roller. The method of claim 7, wherein The support member, An adsorption roller for adsorbing the film wound on the supply roller at a predetermined time difference and transporting the film in a vertical direction to attach to the front end of the substrate; And, And an adsorption plate for adsorbing the film supplied from the adsorption roller, converting the traveling path in the vertical direction into the horizontal direction, and feeding the film into the transfer roller. The method of claim 11, Lamination apparatus further comprises a guide groove for the suction roller to guide the cutter assembly.

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