JPH0897551A - Board holding jig - Google Patents
Board holding jigInfo
- Publication number
- JPH0897551A JPH0897551A JP22941394A JP22941394A JPH0897551A JP H0897551 A JPH0897551 A JP H0897551A JP 22941394 A JP22941394 A JP 22941394A JP 22941394 A JP22941394 A JP 22941394A JP H0897551 A JPH0897551 A JP H0897551A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- holding jig
- printed circuit
- spring
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はプリント基板へのディス
クリート部品の半田付け作業において、ディスクリート
部品をプリント基板上に保持する治具(以下「基板保持
治具」と記す。)に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for holding discrete components on a printed circuit board (hereinafter referred to as a "substrate holding jig") in the soldering work of the discrete components to the printed circuit board.
【0002】[0002]
【従来の技術】従来、パーソナルコンピュータ等の電子
機器には、半導体集積回路やコンデンサ等のリードを有
するディスクリート部品が回路接続されたプリント基板
が内蔵されている。このプリント基板の組立工程では、
基板へのリード挿入が困難なため、チップ部品のように
組立の自動化ができず、プリント基板にディスクリート
部品を手作業で搭載し、半田付けしている。そこで、作
業性を良くするために、通常、基板保持治具が使用され
ている。2. Description of the Related Art Conventionally, an electronic device such as a personal computer has a built-in printed circuit board to which discrete components having leads such as a semiconductor integrated circuit and a capacitor are circuit-connected. In this printed circuit board assembly process,
Since it is difficult to insert leads into the board, it is not possible to automate the assembly like chip parts, and discrete parts are manually mounted and soldered on a printed board. Therefore, in order to improve workability, a substrate holding jig is usually used.
【0003】この基板保持治具について、実開平5−0
95078号公報に開示されているものを例にして、図
面を参照して説明する。図4に示すように、ハンドル1
を固定枠2にロック機構3により固定して、蓋4がスプ
リング5により開かれた状態で、プリント基板6を回転
枠7のレール8の上に置き、ディスクリート部品9を回
路にしたがって搭載する。そして、蓋4を閉じると、蓋
4の内面の所定の場所に装着されたスポンジ10によ
り、ディスクリート部品9が押え込まれ支えられる。次
いで、ハンドル1からロック機構3を解除して、回転枠
7を180度回転させ、ディスクリート部品9を搭載し
た位置とは反対側にハンドル1を固定する。この状態で
半田付けを実施し、半田付け終了後、ロック機構3を解
除して回転枠7を元に戻し、蓋4を開いて半田付けされ
たプリント基板6を取り出す。Regarding this substrate holding jig, an actual flat plate 5-0
An example disclosed in Japanese Patent Publication No. 95078 will be described with reference to the drawings. As shown in FIG. 4, the handle 1
Is fixed to the fixed frame 2 by the lock mechanism 3, the printed board 6 is placed on the rail 8 of the rotary frame 7 with the lid 4 opened by the spring 5, and the discrete component 9 is mounted according to the circuit. Then, when the lid 4 is closed, the discrete component 9 is pressed and supported by the sponge 10 mounted at a predetermined position on the inner surface of the lid 4. Next, the lock mechanism 3 is released from the handle 1, the rotating frame 7 is rotated 180 degrees, and the handle 1 is fixed to the side opposite to the position where the discrete component 9 is mounted. Soldering is performed in this state, and after the soldering is completed, the lock mechanism 3 is released, the rotary frame 7 is returned to the original position, the lid 4 is opened, and the soldered printed circuit board 6 is taken out.
【0004】[0004]
【発明が解決しようとする課題】ところが、上述した構
成の基板保持治具を使用して半田付けを実施すると、通
常、ディスクリート部品には外形寸法に差があり、特に
高低差の大きなディスクリート部品を近接して配置した
構成のプリント基板を半田付けする場合、スポンジによ
る押え込みが不十分となり、高さの低いディスクリート
部品が半田付けのため、プリント基板を反転した時にプ
リント基板より浮き上がったり、抜けてしまうことがあ
り、半田付け不良が発生するという問題があった。However, when soldering is performed by using the substrate holding jig having the above-described structure, the discrete components usually have different outer dimensions, and in particular, the discrete components having a large height difference are used. When soldering printed circuit boards that are placed close to each other, the sponge cannot be pressed down sufficiently and discrete components with a low height are soldered, so when the printed circuit board is turned upside down, it rises or comes off. In some cases, there is a problem that soldering failure occurs.
【0005】また、この問題を解決するためには、種々
の厚さのスポンジを用意して、プリント基板に応じて、
最適な位置に最適な厚さのスポンジを貼り替えるという
手間のかかる準備作業を要するとともに、細長のスポン
ジを貼りつける場合は非常に困難な作業となるという問
題も生じていた。In order to solve this problem, sponges having various thicknesses are prepared, and depending on the printed board,
There has been a problem that a laborious preparation work of replacing a sponge having an optimum thickness at an optimum position is required, and that a work of attaching an elongated sponge is very difficult.
【0006】本発明の目的は、上述したような問題を解
決するため、簡単な構成で、高低差の大きなディスクリ
ート部品を近接して配置しても、それぞれの部品に最適
な押圧で押え込みができる基板保持治具を提供すること
にある。In order to solve the above-mentioned problems, an object of the present invention is to provide a simple structure, and even if discrete components with a large difference in height are arranged close to each other, they can be pressed down with the optimum pressure. It is to provide a substrate holding jig.
【0007】[0007]
【課題を解決するための手段】本発明は、ディスクリー
ト部品を搭載したプリント基板を支持する反転自在な回
転枠と、前記プリント基板上に搭載されたディスクリー
ト部品を前記プリント基板上に押圧固定するように所定
の間隔で植立した複数のバネ付きピンを具備した蓋と、
前記回転枠と前記蓋とを開閉可能に保持する回転支持部
と、前記回転枠の位置を固定する位置固定手段とを具備
することを特徴とした基板保持治具を提供する。また、
前記バネつきピンが前記ディスクリート部品の押圧調整
手段を具備し、前記回転部が、前記回転枠の一辺を回転
軸とする回転支持部と、前記回転枠を水平に支持する台
板からなる回転枠の位置固定手段を具備することが望ま
しい。また、前記ピンを所定の間隔で密に蓋に植立する
前記基板保持治具を提供する。SUMMARY OF THE INVENTION According to the present invention, a reversible rotating frame for supporting a printed circuit board on which discrete components are mounted and a discrete component mounted on the printed circuit board are pressed and fixed onto the printed circuit board. A lid equipped with a plurality of spring-loaded pins that are planted at predetermined intervals,
There is provided a substrate holding jig comprising: a rotation supporting portion that holds the rotation frame and the lid so as to be openable and closable, and a position fixing unit that fixes the position of the rotation frame. Also,
The spring-loaded pin includes a pressure adjusting means for the discrete component, and the rotating portion includes a rotation supporting portion having one side of the rotation frame as a rotation axis and a base plate for horizontally supporting the rotation frame. It is desirable to provide the position fixing means. Further, the substrate holding jig for densely arranging the pins on a lid at a predetermined interval is provided.
【0008】[0008]
【作用】上記構成によれば、プリント基板上の個々のデ
ィスクリート部品に対応した位置のバネつきピンをそれ
ぞれのディスクリート部品の高さに応じた押圧に調整し
ておくことにより、蓋を閉じるだけで最適な押圧で個々
のディスクリート部品をプリント基板に押え込むことが
できるので、ディスクリート部品の浮きや抜け落ちによ
る不良の発生を防止できる。According to the above construction, the spring-loaded pin at a position corresponding to each discrete component on the printed circuit board is adjusted to be pressed according to the height of each discrete component, so that the lid can be closed. Since individual discrete components can be pressed into the printed circuit board with the optimum pressure, it is possible to prevent defects due to floating and falling of the discrete components.
【0009】また、細いバネ付きピンによる押え込みの
ため、非常に近接した配置の高低差の大きなディスクリ
ート部品に対しても個々に最適な押圧の押え込みができ
る。更に押圧調整手段もバネの長さを調節するだけでよ
く準備作業も簡単になる。Further, since the pins are pressed by the thin spring-loaded pins, it is possible to individually press the optimum pressed parts even for discrete components which are arranged very close to each other and have a large height difference. Furthermore, the pressure adjusting means can be prepared simply by adjusting the length of the spring.
【0010】[0010]
【実施例】以下、本発明の一実施例につき図面を参照し
て説明する。図において従来例と同一部分には同一符号
を付し説明を省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In the figure, the same parts as those in the conventional example are designated by the same reference numerals and the description thereof will be omitted.
【0011】本発明の基板保持治具は、図1に示すよう
に、台板11の上に回転支持部12により180度回転
して裏返しできるように保持された回転枠13と、この
回転枠13に開閉自在に取付けられ、複数のバネ付きピ
ン14、14・・・が比較的密にマトリクス状に配さ
れ、内部に向かって押圧されるように装着された蓋15
と、その蓋15と回転枠13とを閉じた状態で固定する
ロック機構16とから構成されている。As shown in FIG. 1, the substrate holding jig of the present invention includes a rotating frame 13 which is held on a base plate 11 by a rotation supporting portion 12 so that it can be turned upside down by being rotated 180 degrees, and this rotating frame. A lid 15 that is openably and closably attached to a plurality of springs 13 and has a plurality of spring-loaded pins 14, 14, ... Arranged relatively densely in a matrix and is attached so as to be pressed inward.
And a lock mechanism 16 for fixing the lid 15 and the rotary frame 13 in a closed state.
【0012】そして、この基板保持治具は下記のように
して使用される。まず、蓋15が開かれた状態(図示せ
ず)で、プリント基板6を回転枠13の上に置き、ディ
スクリート部品9を回路にしたがって搭載する。そし
て、蓋15を閉じ、ロック機構16で蓋15を回転枠1
3に固定する。すると、蓋15にマトリクス状に配さ
れ、内部に向かって押圧されるように装着された複数の
バネ付きピン14、14・・・により、ディスクリート
部品9がプリント基板6上に押え込まれ支えられる。Then, this substrate holding jig is used as follows. First, with the lid 15 opened (not shown), the printed circuit board 6 is placed on the rotary frame 13 and the discrete component 9 is mounted according to the circuit. Then, the lid 15 is closed, and the lid 15 is rotated by the lock mechanism 16 to rotate the frame 1.
Fix to 3. Then, the discrete component 9 is pressed and supported on the printed circuit board 6 by the plurality of spring-loaded pins 14, 14 ... Arranged in a matrix on the lid 15 and mounted so as to be pressed inward. .
【0013】次いで、図2に示すように、蓋15を閉じ
たまま、回転枠13を回転支持部12を中心に180度
回転させ、ディスクリート部品9を搭載した位置とは反
対側のプリント基板6の面が上になるように、回転枠1
3を裏返して固定する。この状態でプリント基板6の裏
面に突出しているディスクリート部品9のリードとプリ
ント基板6上の回路との半田付けを実施し、半田付け終
了後、回転枠13を回転支持部12を中心に180度回
転させて元の状態に戻し、ロック機構16を解除して、
蓋15を開いて半田付けされたプリント基板6を取り出
す。Then, as shown in FIG. 2, with the lid 15 closed, the rotary frame 13 is rotated by 180 degrees about the rotary support portion 12, and the printed circuit board 6 on the side opposite to the position where the discrete component 9 is mounted. Rotation frame 1 so that the side of
Turn 3 over and fix. In this state, the leads of the discrete component 9 protruding on the back surface of the printed circuit board 6 and the circuit on the printed circuit board 6 are soldered, and after the soldering is completed, the rotary frame 13 is rotated by 180 degrees around the rotary support portion 12. Turn it back to its original state, release the lock mechanism 16,
The lid 15 is opened, and the soldered printed circuit board 6 is taken out.
【0014】この実施例によれば、ディスクリート部品
のプリント基板への搭載及び半田付けが、扉を開閉する
のと同じように回転枠を180度回転させるだけで、台
板上に水平に保持して実施できるので作業性が向上す
る。According to this embodiment, the mounting and soldering of the discrete component on the printed circuit board can be held horizontally on the base plate simply by rotating the rotary frame 180 degrees like opening and closing the door. Workability is improved because it can be carried out.
【0015】なお、上記複数のバネ付きピン14は、図
3に示すように、それぞれ独立した押圧調整手段とし
て、バネの長さを調整する調整ナット17を具備してい
るため、この調整ナット17により、押圧するディスク
リート部品9の高さに合わせてバネ付きピン14のバネ
の長さを調整しておけば、個々のディスクリート部品9
がそれぞれ最適な押圧力でプリント基板6に押し込まれ
保持されるため、半田付け時の反転によりディスクリー
ト部品9がプリント基板6から浮き上がったり、抜け落
ちたりすることがない。したがつて、半田付け不良の発
生が防止できるとともに、バネの調整作業も簡単にでき
る。As shown in FIG. 3, each of the plurality of spring-equipped pins 14 is provided with an adjusting nut 17 for adjusting the length of the spring as independent pressure adjusting means. By adjusting the length of the spring of the spring-loaded pin 14 according to the height of the discrete component 9 to be pressed, the individual discrete component 9
Since each of them is pushed into and held by the printed circuit board 6 with an optimum pressing force, the discrete component 9 does not rise or fall off from the printed circuit board 6 due to reversal at the time of soldering. Therefore, it is possible to prevent the occurrence of defective soldering and to easily adjust the spring.
【0016】以上、プリント基板を保持する回転枠が、
回転枠の一辺を回転軸として180度回転して反転する
構造の基板保持治具と、バネの長さを調整する調整ナッ
トとを使用した例について説明したが、本発明は上述し
た例に限定されず、従来例に示した回転枠の中央部を回
転軸とし360度回転する構造の基板保持治具にも適用
できると共に、バネ付きピンの押圧調整手段として空圧
を利用した空気バネ等押圧を調整可能なバネであればど
んなものでも採用できる。また、バネ付きピンはマトリ
クス状に比較的密に植立しているため、プリント基板上
のディスクリート部品の位置が製品により異なっても、
その都度バネ付きピンの位置を変更する必要がなく煩雑
さも解消する。As described above, the rotary frame for holding the printed circuit board is
The example in which the substrate holding jig having a structure in which one side of the rotating frame is rotated by 180 degrees and inverted and the adjusting nut for adjusting the length of the spring is used has been described, but the present invention is limited to the example described above. However, the present invention can be applied to a substrate holding jig having a structure in which the central portion of a rotary frame shown in the conventional example is rotated 360 degrees about a rotary shaft, and a pneumatic spring or the like that uses air pressure as a pressure adjusting means for a spring-loaded pin Any adjustable spring can be used. Also, since the spring-loaded pins are relatively densely erected in a matrix, even if the positions of discrete components on the printed circuit board differ depending on the product,
There is no need to change the position of the spring-loaded pin each time, and the complexity is eliminated.
【0017】[0017]
【発明の効果】本発明によれば、個々のディスクリート
部品に対応した位置のバネ付きピンをそれぞれのディス
クリート部品の高さに応じた押圧に調整しておくことに
より、蓋を閉じるだけで最適な押圧で個々のディスクリ
ート部品をプリント基板に押え込むことができるので、
部品の浮きや抜け落ちによる不良の発生を防止できる。
また、バネ付きピンによる押え込みのため非常に近接し
た配置の高低差の大きなディスクリート部品に対しても
対応できる。更に押圧調整手段もバネの長さを調節する
だけでよく準備作業も簡単になる。According to the present invention, the spring-equipped pin at a position corresponding to each discrete component is adjusted to be pressed according to the height of each discrete component, so that it is optimal only by closing the lid. Since individual discrete parts can be pressed into the printed circuit board by pressing,
It is possible to prevent the occurrence of defects due to floating or falling of parts.
Further, since the spring-loaded pin is used for pressing, it is possible to cope with a discrete component having a large height difference which is arranged very close to each other. Furthermore, the pressure adjusting means can be prepared simply by adjusting the length of the spring.
【図1】 本発明の一実施例の基板保持治具の斜視図FIG. 1 is a perspective view of a substrate holding jig according to an embodiment of the present invention.
【図2】 本発明の一実施例の基板保持治具の使用状態
を示す斜視図FIG. 2 is a perspective view showing a usage state of a substrate holding jig according to an embodiment of the present invention.
【図3】 本発明の一実施例のバネ付きピンの要部の側
面図FIG. 3 is a side view of a main part of a spring-loaded pin according to an embodiment of the present invention.
【図4】 従来の基板保持治具の斜視図FIG. 4 is a perspective view of a conventional substrate holding jig.
6 プリント基板 9 ディスクリート部品 11 台板 12 回転支持部 13 回転枠 14 バネ付きピン 15 蓋 16 ロック機構 17 調整ナット 6 Printed Circuit Board 9 Discrete Parts 11 Base Plate 12 Rotation Support Section 13 Rotating Frame 14 Spring Pin 15 Lid 16 Lock Mechanism 17 Adjustment Nut
Claims (4)
板を支持する反転自在な回転枠と、前記プリント基板上
に搭載されたディスクリート部品を前記プリント基板上
に押圧固定するように所定の間隔で植立した複数のバネ
付きピンを具備した蓋と、前記回転枠と前記蓋とを開閉
可能に保持する回転支持部と、前記回転枠の位置を固定
する位置固定手段とを具備することを特徴とした基板保
持治具。1. A reversible rotating frame for supporting a printed circuit board on which discrete components are mounted, and discrete components mounted on the printed circuit board are planted at predetermined intervals so as to be fixedly fixed on the printed circuit board. A substrate comprising: a lid including a plurality of spring-loaded pins; a rotation support portion that holds the rotation frame and the lid so that the rotation frame can be opened and closed; and a position fixing unit that fixes the position of the rotation frame. Holding jig.
ート部品の押圧調整手段を具備することを特徴とする請
求項1記載の基板保持治具。2. The substrate holding jig according to claim 1, wherein the plurality of spring-equipped pins are provided with pressure adjusting means for the discrete components.
とする回転支持部と、前記回転枠を水平に支持する台板
からなる位置固定手段とを具備することを特徴とする請
求項1記載の基板保持治具。3. The rotating part comprises a rotating support part having one side of the rotating frame as a rotation axis, and a position fixing means composed of a base plate for horizontally supporting the rotating frame. Item 1. A substrate holding jig according to item 1.
植立されたことを特徴とする請求項1に記載の基板保持
治具。4. The substrate holding jig according to claim 1, wherein the spring-loaded pins are erected on the lid at predetermined intervals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22941394A JPH0897551A (en) | 1994-09-26 | 1994-09-26 | Board holding jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22941394A JPH0897551A (en) | 1994-09-26 | 1994-09-26 | Board holding jig |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0897551A true JPH0897551A (en) | 1996-04-12 |
Family
ID=16891841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22941394A Pending JPH0897551A (en) | 1994-09-26 | 1994-09-26 | Board holding jig |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0897551A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010165781A (en) * | 2009-01-14 | 2010-07-29 | Kyoraku Sangyo Kk | Structure of temporarily fixing mounting component to printed circuit board and carrier of printed circuit board using the same |
JP2011159719A (en) * | 2010-01-29 | 2011-08-18 | Icom Inc | Soldering jig for led |
JP2011176196A (en) * | 2010-02-25 | 2011-09-08 | Mitsubishi Electric Corp | Correction jig for solder inspection |
US20120217285A1 (en) * | 2009-11-10 | 2012-08-30 | Dongguk University Industry-Academic Cooperation Foundation | Soldering jig |
CN105855782A (en) * | 2016-06-03 | 2016-08-17 | 上海福宇龙汽车科技有限公司 | Welding fixture capable of being turned over |
WO2017082277A1 (en) * | 2015-11-10 | 2017-05-18 | 積水化学工業株式会社 | Method for producing connected structure, fixing jig, and fixing jig provided with cover member |
CN111571282A (en) * | 2020-05-21 | 2020-08-25 | 安徽鸿海新材料股份有限公司 | Copper-clad plate automatic turnover structure capable of changing turnover number |
-
1994
- 1994-09-26 JP JP22941394A patent/JPH0897551A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010165781A (en) * | 2009-01-14 | 2010-07-29 | Kyoraku Sangyo Kk | Structure of temporarily fixing mounting component to printed circuit board and carrier of printed circuit board using the same |
US20120217285A1 (en) * | 2009-11-10 | 2012-08-30 | Dongguk University Industry-Academic Cooperation Foundation | Soldering jig |
JP2011159719A (en) * | 2010-01-29 | 2011-08-18 | Icom Inc | Soldering jig for led |
JP2011176196A (en) * | 2010-02-25 | 2011-09-08 | Mitsubishi Electric Corp | Correction jig for solder inspection |
WO2017082277A1 (en) * | 2015-11-10 | 2017-05-18 | 積水化学工業株式会社 | Method for producing connected structure, fixing jig, and fixing jig provided with cover member |
CN107615467A (en) * | 2015-11-10 | 2018-01-19 | 积水化学工业株式会社 | The manufacture method of connecting structure body, stationary fixture, the stationary fixture for possessing cover |
JPWO2017082277A1 (en) * | 2015-11-10 | 2018-08-30 | 積水化学工業株式会社 | Manufacturing method of connection structure, fixing jig, and fixing jig provided with lid member |
CN105855782A (en) * | 2016-06-03 | 2016-08-17 | 上海福宇龙汽车科技有限公司 | Welding fixture capable of being turned over |
CN111571282A (en) * | 2020-05-21 | 2020-08-25 | 安徽鸿海新材料股份有限公司 | Copper-clad plate automatic turnover structure capable of changing turnover number |
CN111571282B (en) * | 2020-05-21 | 2021-07-20 | 安徽鸿海新材料股份有限公司 | Copper-clad plate automatic turnover structure capable of changing turnover number |
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