CN107615467A - The manufacture method of connecting structure body, stationary fixture, the stationary fixture for possessing cover - Google Patents

The manufacture method of connecting structure body, stationary fixture, the stationary fixture for possessing cover Download PDF

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Publication number
CN107615467A
CN107615467A CN201680031399.7A CN201680031399A CN107615467A CN 107615467 A CN107615467 A CN 107615467A CN 201680031399 A CN201680031399 A CN 201680031399A CN 107615467 A CN107615467 A CN 107615467A
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CN
China
Prior art keywords
object part
connecting object
stationary fixture
electrode
structure body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680031399.7A
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Chinese (zh)
Inventor
久保田敬士
松下清人
高桥英之
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN107615467A publication Critical patent/CN107615467A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

A kind of manufacture method for the connecting structure body that can improve interelectrode conducting reliability is provided.The manufacture method of the connecting structure body of the present invention, using the conductive material comprising multiple scolding tin particles and adhesive, in first connecting object part of the upper surface with first electrode, in second connecting object part of the lower surface with second electrode, wherein, the manufacture method of the connecting structure body possesses：First arrangement step, the conductive material is configured in the upper surface of the first connecting object part；Second arrangement step, the second connecting object part is configured in the upper surface of the conductive material；Heating process, it is heated to more than the fusing point of the scolding tin particle, in the heating process, the state that the first connecting object part is fixed on stationary fixture is heated.

Description

The manufacture method of connecting structure body, stationary fixture, the stationary fixture for possessing cover
Technical field
The present invention relates to the manufacture method of the connecting structure body using the conductive material comprising multiple scolding tin particles.In addition, The present invention relates to the stationary fixture for the manufacture method for being used in the connecting structure body, possesses the stationary fixture of cover.
Background technology
The anisotropic conductive material such as anisotropic conductive paste and anisotropic conductive film is well known.Described In anisotropic conductive material, electroconductive particle is dispersed with adhesive resin.
In order to obtain various connecting structure bodies, the anisotropic conductive material be used in such as flexible printing substrate with Connection (COF (the Chip on of the connection (FOG (Film on Glass)) of glass substrate, semiconductor element and flexible printing substrate Film)), connection (COG (Chip on Glass)), flexible printing substrate and the glass epoxide of semiconductor element and glass substrate Connection (FOB (Film on Board)) of substrate etc..
In the electrode and glass using the anisotropic conductive material to such as flexible printing substrate (connecting object part) When the electrode of glass epoxy substrate (connecting object part) is electrically connected, is configured on glass epoxy substrate and contain electroconductive particle Anisotropic conductive material.Next, it is laminated flexible printing substrate and is heated and pressurizeed.Thus, anisotropy is made Conductive material solidifies, by electroconductive particle being electrically connected electrode, so as to obtain connecting structure body.
As an example of the anisotropic conductive material, one kind has been recorded in following patent documents 1 respectively to different Property conductive material, its include electroconductive particle and will not be completed under the fusing point of the electroconductive particle solidification resin component.Make For the electroconductive particle, specifically, tin (Sn), indium (In), bismuth (Bi), silver-colored (Ag), copper (Cu), zinc (Zn), lead can be enumerated (Pb), the alloy of the metal such as cadmium (Cd), gallium (Ga) and thallium (Tl) or these metals.
Recorded in patent document 1, via high and the tree will not be completed with the fusing point than the electroconductive particle The resin heating stepses that the temperature of the solidification of fat composition heats anisotropic conductive resin, and solidify the resin component Resin component curing schedule, will be electrically connected between electrode.In addition, Fig. 8 institutes with patent document 1 are recorded in patent document 1 The contour line shown is installed.In patent document 1, solidification is completed in the temperature not being heated with anisotropic conductive resin In resin component, electroconductive particle melting.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2004-260131 publications
The content of the invention
The problem that invention will solve
Used comprising scolding tin particle (electroconductive particle), the electroconductive particle on surface with soldering-tin layer it is each to different Property conductive material conventional connecting structure body manufacture method in, as described in Patent Document 1, heating when, sometimes Electroconductive particle moves in anisotropic conductive material.Therefore, the connection pair such as flexible printing substrate, glass substrate is easily produced As the position of part is offset.
In addition, when configuring connecting object part in the upper surface of anisotropic conductive material, connecting object portion is easily produced The position skew of part.
If in addition, using hot blast during heating when obtaining connecting structure body, the efficiency of heating surface can be improved.But In the case of having used hot blast, the position skew of connecting object part is easily produced because of hot blast.
If produce the position skew of connecting structure body, in the connecting structure body of acquisition, interelectrode conducting reliability Reduce.In addition, in recent years, the miniaturization of electrode is developed.Due to the miniaturization of electrode, it more difficult to be reliably achieved interelectrode lead It is logical, easily produce poor flow.
It is an object of the invention to provide a kind of manufacture for the connecting structure body that can improve interelectrode conducting reliability Method.In addition, it is an object of the invention to provide a kind of can obtain to improve the interelectrode connecting structure for turning on reliability The stationary fixture of body, the stationary fixture for possessing cover.
Means for solving the problems
According to the wide in range aspect of the present invention, there is provided a kind of manufacture method of connecting structure body, using including multiple scolding tin The conductive material of particle and adhesive, first connecting object part of the upper surface with first electrode, in lower surface with Second connecting object part of two electrodes, it is characterised in that the manufacture method of the connecting structure body possesses：First arrangement step, The conductive material is configured in the upper surface of the first connecting object part；Second arrangement step, so that the first electrode The mode opposed with the second electrode, the second connecting object part is configured in the upper surface of the conductive material；Heating Process, by being heated to more than the fusing point of the scolding tin particle, described first is connected so as to be formed using the conductive material The connecting portion that object Part is connected with the second connecting object part, and using the solder sections in the connecting portion by described in First electrode is electrically connected with the second electrode, and in the heating process, the first connecting object part is fixed on The state of stationary fixture is heated.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, the stationary fixture is in upper table mask There is the first recess, the first connecting object part is configured in the inner side of first recess of the stationary fixture.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, in second arrangement step, So that the first connecting object part to be fixed on to the state of the stationary fixture, institute is configured in the upper surface of the conductive material State the second connecting object part.
In a certain specific aspect of the manufacture method of the connecting structure body of the present invention, the second connecting object part tool There is the first area for the upper surface that the conductive material is configured in second arrangement step, configure work described second The second area of the upper surface of the conductive material is not configured in sequence, in second arrangement step, in the conduction The upper surface of material configures the first area of the second connecting object part, not by the second connecting object part The second area is configured at the upper surface of the conductive material, configuration second connection in the upper surface of the stationary fixture The second area of object Part.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, the confession of the stationary fixture described the The upper surface of the second area configuration of two connecting object parts rolls downwards oblique from outside towards medially.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, in the heating process, make institute The first area for stating the second connecting object part rolls downwards tiltedly towards opposite side from side.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, the stationary fixture is in upper table mask There is second recess different from first recess, in the inner side configuration described second of second recess of the stationary fixture The second area of connecting object part.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, the confession of the stationary fixture described the The material of one connecting object part upper surface portion above is ceramics, aluminium alloy, titanium alloy or stainless steel.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, in the heating process, in institute State the top configuration cover of the second connecting object part.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, the cover is connected to described Stationary fixture.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, in the heating process, make institute State the upper surface that cover contacts the second connecting object part.
In a certain specific aspect of the manufacture method of the connecting structure body of the present invention, the confession described second of the cover The material of the underlying bottom surface section of connecting object part is ceramics, aluminium alloy, titanium alloy or stainless steel.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, the confession of the stationary fixture described the The confession of cover described in the thermal conductivity ratio of the material of one connecting object part upper surface portion above described second connects The pyroconductivity for connecing the material of the underlying bottom surface section of object Part is high.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, in the heating process, pass through Non-contacting heating arrangements enter to the first connecting object part, the conductive material and the second connecting object part Row heating.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, in the heating process, pass through Hot blast is heated.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, in the heating process, make not The scolding tin particle between the first electrode and the second electrode is to the first electrode and the second electrode Between move.
At a certain specific aspect of the manufacture method of the connecting structure body of the present invention, following connecting structure body is obtained： The connecting structure body from the direction orthogonal with the stacked direction of the first electrode, the connecting portion and the second electrode When, the solder sections that are configured with the first electrode and the mutually opposing part of the second electrode in the connecting portion More than 70% in 100%.
According to the wide in range aspect of the present invention, there is provided a kind of stationary fixture, the stationary fixture is in order to obtain connecting structure body And use, the connecting structure body possesses：First connecting object part, it has first electrode in upper surface；Second connecting object Part, it has second electrode in lower surface；Connecting portion, it is by the first connecting object part and second connecting object Part connects, and is formed by the conductive material comprising multiple scolding tin particles and adhesive, the first electrode and described second Electrode utilizes the solder sections electrical connection in the connecting portion, and stationary fixture is in order to obtain the connecting structure via following process Body and use, these processes are：First arrangement step, the conduction material is configured in the upper surface of the first connecting object part Material；Second arrangement step, in a manner of making the first electrode opposed with the second electrode, in the upper table of the conductive material Face configures the second connecting object part；Heating process, by being heated to more than the fusing point of the scolding tin particle, so as to utilize The conductive material forms the connecting portion for being connected the first connecting object part with the second connecting object part, and The first electrode is electrically connected with the second electrode using the solder sections in the connecting portion, stationary fixture is in upper table mask There is the first recess, when obtaining the connecting structure body, configuration described first connects stationary fixture in the inner side of first recess Object Part is connect to use.
At a certain specific aspect of the stationary fixture of the present invention, the second connecting object part has described second The first area of the upper surface of the conductive material is configured in arrangement step, is not configured in second arrangement step Second area in the upper surface of the conductive material, stationary fixture in second arrangement step by described second to connect The first area of object Part is configured at the upper surface of the conductive material, not by the institute of the second connecting object part The mode that second area is configured at the upper surface of the conductive material is stated, is used to obtain the connecting structure body, it is fixed The upper surface that the second area for the second connecting object part of fixture configures is from outside towards medially to downside Tilt.
At a certain specific aspect of the stationary fixture of the present invention, the second connecting object part has described second The first area of the upper surface of the conductive material is configured in arrangement step, is not configured in second arrangement step Second area in the upper surface of the conductive material, stationary fixture have different from first recess second in upper surface Recess, stationary fixture configure the second area of the second connecting object part in the inner side of second recess and made With.
In a certain specific aspect of the stationary fixture of the present invention, confession the first connecting object portion of the stationary fixture The material of part upper surface portion above is ceramics, aluminium alloy, titanium alloy or stainless steel.
According to the wide in range aspect of the present invention, there is provided a kind of stationary fixture for possessing cover, it possesses the geometrical clamp Tool and cover, described in possess the stationary fixture of cover in order in the heating process, in second connecting object The top of part configures the cover obtaining the connecting structure body and used.
At a certain specific aspect of the stationary fixture for possessing cover of the present invention, the cover is connected to described Stationary fixture.
In a certain specific aspect of the stationary fixture for possessing cover of the present invention, the confession described second of the cover The material of the underlying bottom surface section of connecting object part is ceramics, aluminium alloy, titanium alloy or stainless steel.
At a certain specific aspect of the stationary fixture for possessing cover of the present invention, the confession of the stationary fixture described the The confession of cover described in the thermal conductivity ratio of the material of one connecting object part upper surface portion above described second connects The pyroconductivity for connecing the material of the underlying bottom surface section of object Part is high.
Invention effect
The manufacture method of the connecting structure body of the present invention, uses the conduction material for including multiple scolding tin particles and adhesive Material, in first connecting object part of the upper surface with first electrode, in second connecting object of the lower surface with second electrode Part, wherein, the manufacture method of the connecting structure body possesses：First arrangement step, in the upper of the first connecting object part Conductive material described in surface configuration；Second arrangement step, in a manner of making the first electrode opposed with the second electrode, The upper surface of the conductive material configures the second connecting object part；Heating process, by being heated to the scolding tin particle Fusing point more than, so as to be formed using the conductive material by the first connecting object part and the second connecting object portion The connecting portion of part connection, and the first electrode and the second electrode are electrically connected using the solder sections in the connecting portion Connect, in the heating process, the state that the first connecting object part is fixed on stationary fixture is heated, because This, it is possible to increase interelectrode conducting reliability.
The stationary fixture that the stationary fixture of the present invention uses to obtain connecting structure body, the connecting structure body possess： First connecting object part, it has first electrode in upper surface；Second connecting object part, it has the second electricity in lower surface Pole；Connecting portion, the first connecting object part is connected by it with the second connecting object part, and by including multiple welderings The conductive material of tin particle and adhesive is formed, and the first electrode utilizes the scolding tin in the connecting portion with the second electrode Portion electrically connects, and stationary fixture uses to obtain the connecting structure body via following process, and these processes are：First matches somebody with somebody Process is put, the conductive material is configured in the upper surface of the first connecting object part；Second arrangement step, so that described The one electrode mode opposed with the second electrode, the second connecting object portion is configured in the upper surface of the conductive material Part；Heating process, by being heated to more than the fusing point of the scolding tin particle, so as to be formed using the conductive material by described the The connecting portion that one connecting object part is connected with the second connecting object part, and utilize the solder sections in the connecting portion The first electrode is electrically connected with the second electrode, stationary fixture has the first recess in upper surface, and stationary fixture is obtaining When obtaining the connecting structure body, the first connecting object part is configured to use in the inner side of first recess, therefore energy It is enough to obtain the connecting structure body for improving interelectrode conducting reliability.
Brief description of the drawings
Fig. 1 is to schematically show the company obtained by the manufacture method of the connecting structure body of one embodiment of the present invention Connect the front cross-sectional view of tectosome.
Fig. 2 is to schematically show the company obtained by the manufacture method of the connecting structure body of one embodiment of the present invention Connect the side cut away view of tectosome.
Fig. 3 (a)~(d) is each operation for illustrating the manufacture method of the connecting structure body of one embodiment of the present invention Side cut away view.
Fig. 4 is the layered product for illustrating to obtain in the manufacture method of the connecting structure body of one embodiment of the present invention Front cross-sectional view.
Fig. 5 is the side cut away view for the variation for representing connecting structure body.
Fig. 6 is the top view for the stationary fixture for possessing cover for representing one embodiment of the present invention.
Fig. 7 (a)~(e) is the profile for the stationary fixture for possessing cover for representing one embodiment of the present invention.
Fig. 8 (a) is top view corresponding with Fig. 6, and Fig. 8 (b) is profile corresponding with Fig. 7 (d).
Embodiment
Hereinafter, the present invention is explained.
In the manufacture method of the connecting structure body of the present invention, connected using conductive material, the first connecting object part, second Connect object Part.The conductive material includes multiple scolding tin particles and adhesive.The first connecting object part is in upper surface (surface) has first electrode.The second connecting object part has second electrode on lower surface (surface).
The manufacture method of the connecting structure body of the present invention possesses：First arrangement step, in the first connecting object part Upper surface configure the conductive material；Second arrangement step, so that the side that the first electrode is opposed with the second electrode Formula, the second connecting object part is configured in the upper surface of the conductive material；Heating process, by being heated to the scolding tin More than the fusing point of particle, the first connecting object part is connected pair with described second so as to be formed using the conductive material As the connecting portion that part connects, and it is using the solder sections in the connecting portion that the first electrode and the second electrode is electric Connection.
In the manufacture method of the connecting structure body of the present invention, in the heating process, by the described first connection pair The state that stationary fixture is fixed on as part is heated.
In the manufacture method of the connecting structure body of the present invention, following connecting structure body can be obtained：Possess described first Connecting object part, the second connecting object part, by the first connecting object part and the second connecting object portion Part connect and using includes the conductive material of multiple scolding tin particles and adhesive formed connecting portion, the first electrode with The second electrode utilizes the solder sections electrical connection in the connecting portion.
In the manufacture method of the connecting structure body of the present invention, due to possessing described composition, therefore electrode can be improved Between conducting reliability.In the heating process, even if scolding tin particle flow, also by the first connecting object part of limitation It is mobile, it can prevent the position of the first electrode and the second electrode from offseting.As a result, it is possible to improve the first electrode with The conducting reliability of the second electrode.In the manufacture method of the connecting structure body of the present invention, conducting reliability improves, can Tackle thin space.
In the manufacture method of the connecting structure body of the present invention, it is preferred that in second arrangement step, by institute The state that the first connecting object part is fixed on the stationary fixture is stated, described second is configured in the upper surface of the conductive material Connecting object part.Particularly, in second arrangement step, when in the upper surface of conductive material configuration described second It during connecting object part, can accurately make the first electrode opposed with the second electrode, and then can prevent described The position of first electrode and the second electrode is offset.As a result, it is possible to improve leading for the first electrode and the second electrode Logical reliability.In the manufacture method of the connecting structure body of the present invention, conducting reliability improves, and copes with thin space.
In the manufacture method of the connecting structure body of the present invention, it is preferred that the stationary fixture has the in upper surface One recess.In the manufacture method of the connecting structure body of the present invention, it is preferred that in first recess of the stationary fixture Inner side configure the first connecting object part.Now, it is easy to the first connecting object part being fixed on defined position Put.
The stationary fixture of the present invention uses to obtain connecting structure body, and the connecting structure body possesses：First connection pair As part, it has first electrode in upper surface；Second connecting object part, it has second electrode in lower surface；Connecting portion, The first connecting object part is connected by it with the second connecting object part, and by including multiple scolding tin particles and viscous The conductive material of mixture is formed, and the first electrode utilizes the solder sections in the connecting portion to electrically connect with the second electrode.
The stationary fixture of the present invention uses, these processes to obtain the connecting structure body via following process It is：First arrangement step, the conductive material is configured in the upper surface of the first connecting object part；Second arrangement step, In a manner of making the first electrode opposed with the second electrode, in the upper surface of the conductive material, configuration described second connects Connect object Part；Heating process, by being heated to more than the fusing point of the scolding tin particle, so as to be formed using the conductive material The connecting portion that the first connecting object part is connected with the second connecting object part, and utilize the connecting portion In solder sections the first electrode is electrically connected with the second electrode.
The stationary fixture of the present invention has the first recess in upper surface.
The stationary fixture of the present invention configures described the when obtaining the connecting structure body, in the inner side of first recess One connecting object part uses.
In the stationary fixture of the present invention, due to possessing described composition, therefore it can obtain and improve interelectrode lead The connecting structure body of logical reliability.Particularly, in second arrangement step, configured when in the upper surface of the conductive material During the second connecting object part, it can accurately make the first electrode with the second electrode with opposed, Jin Erneng Enough prevent the first electrode and the second electrode and position offset.Also, in the heating process, even if scolding tin grain Subflow is moved, and also can prevent the first electrode and the second electrode by limiting the movement of the first connecting object part Position skew.As a result, it is possible to improve the conducting reliability of the first electrode and the second electrode.By using the present invention Stationary fixture, conducting reliability improve, cope with thin space.
Preferably, the second connecting object part has is configured in the conduction in second arrangement step The first area of the upper surface of material, be not configured in second arrangement step conductive material upper surface Two regions.Preferably, so that the first area of the second connecting object part to be matched somebody with somebody in second arrangement step It is placed in the upper surface of the conductive material, the second area of the second connecting object part is not configured at the conduction The mode of the upper surface of material, secondth area of the second connecting object part is configured in the upper surface of the stationary fixture Domain.In this case, the first connecting object part and the second connecting object part locally opposed connection structure can be obtained Make body.
The conductive material can be conductive paste or conducting film.
Preferably, the conductive material and described adhesive include thermoplastic composition or Thermocurable composition.Institute Thermocurable composition can be included by stating conductive material, can also include thermoplastic composition.Due to the scolding tin particle can be made Solidify during the heating of melting, therefore the conductive material preferably includes Thermocurable composition.
Oxide-film for the surface for effectively removing scolding tin particle and electrode simultaneously further improves and turns on reliability Viewpoint, the conductive material preferably include fluxing agent.
The conductive material can also be as needed, such as is urged comprising filler, extender, softening agent, plasticizer, polymerization It is agent, curing catalysts, colouring agent, antioxidant, heat stabilizer, light stabilizer, ultra-violet absorber, lubricant, anti-powered The various additives such as agent and fire retardant.
Hereinafter, on one side referring to the drawings, while being illustrated to the specific embodiment of the present invention.
Fig. 1 is to schematically show the company obtained by the manufacture method of the connecting structure body of one embodiment of the present invention Connect the front cross-sectional view of tectosome.Fig. 2 is the system for schematically showing the connecting structure body by one embodiment of the present invention Make the side cut away view of the connecting structure body of method acquisition.In fig. 2, the section along Fig. 1 I-I lines is enlargedly shown Figure.
Fig. 1, the connecting structure body 1 shown in 2 possess the first connecting object part 2, the second connecting object part 3, by first The connecting portion 4 that connecting object part 2 is connected with the second connecting object part 3.The material of connecting portion 4 is to include multiple scolding tin particles With the conductive material of adhesive.Connecting portion 4 is formed by the conductive material comprising multiple scolding tin particles and adhesive.In this embodiment party In formula, described adhesive includes Thermocurable composition.In addition, described adhesive can also not include Thermocurable composition.
Solder sections 4A, the Thermocurable composition that connecting portion 4 has multiple scolding tin particle buildups and is bonded with each other are able to thermosetting The solidfied material portion 4B of change.In the present embodiment, in order to form solder sections 4A, as electroconductive particle, scolding tin particle has been used. The core of scolding tin particle and the outer surface part of conductive part are scolding tin, are formed by scolding tin.
First connecting object part 2 has multiple first electrode 2a in surface (upper surface).Multiple first electrode 2a are from Fig. 1 With front side towards it is inboard, configure from Fig. 2 right side towards left side arrangement.Second connecting object part 3 is in surface (following table Face) there are multiple second electrode 3a.Multiple second electrode 3a from Fig. 1 with front side towards it is inboard, from Fig. 2 right side towards left side The configuration of arrangement ground.As shown in figure 1, the second electrode 3a part opposed with first electrode 2a is located at than the second connecting object part 3 Center lean on one end 3b sides position.
First electrode 2a is electrically connected with second electrode 3a using solder sections 4A.Therefore, the first connecting object part 2 and second Connecting object part 3 utilizes solder sections 4A electrical connections.In addition, in connecting portion 4, with being gathered in the electricity of first electrode 2a and second Region (solidfied material portion 4B parts) different solder sections 4A between the 3a of pole, in the absence of scolding tin.In the area different from solder sections 4A Domain (solidfied material portion 4B parts), in the absence of the scolding tin separated with solder sections 4A.In addition, if a small amount of, then can with aggregation Scolding tin be present in the different region (solidfied material portion 4B parts) of solder sections 4A between first electrode 2a and second electrode 3a.
As shown in Figure 1, 2, in connecting structure body 1, between first electrode 2a and second electrode 3a, multiple scolding tin particles Assemble, after multiple scolding tin pellet meltings, the fused mass of scolding tin particle in the profit exhibition of the surface of electrode and then solidifies, formation solder sections 4A.Therefore, solder sections 4A and first electrode 2a and solder sections 4A and second electrode 3a connection area becomes big.Thus, also can Improve the conducting reliability in connecting structure body 1, and the connection reliability of connecting structure body 1 also improves.In addition, in conduction In the case that material includes fluxing agent, fluxing agent is normally due to heating and gradually inactivating.
In connecting structure body 1, in the first connecting object part 2, the layer of the connecting object part 3 of connecting portion 4 and second Folded part (by the region of Fig. 1 enclosed with dashed lines), the second connecting object part 3 roll oblique from a side side towards the opposing party.To On the direction that one end 3b and other end 3c of second connecting object part 3 link, the second connecting object part 3 connects relative to first Object Part 2 is connect to have tilted more than 1 degree (tilt angle alpha shown in Fig. 1).3b sides at one end, compared to other end 3c sides, first Connecting object part 2 and the distance between the second connecting object part 3 are narrower.
By the present invention connecting structure body manufacture method obtain connecting structure body in or, first Connecting object part, connecting portion, the laminated portions of the second connecting object part, by one end of the second connecting object part and separately On the direction that one end links, the second connecting object part does not tilt relative to the first connecting object part.
In connecting structure body, the first connecting object part, connecting portion, the second connecting object part laminated portions, On the direction for linking one end of the second connecting object part and the other end, the second connecting object part is relative to the first connection The tilt angle alpha of object Part can be more than 0 degree, preferably more than 1 degree, more preferably more than 2 degree, preferably 10 Below degree, more preferably less than 8 degree.
In addition, in the first connecting object part 2, the side of the first electrode 2a part opposed with second electrode 3a with And the side of connecting portion 4, formed with solder resist film 5 on first electrode 2a surface.By the formation of solder resist film, conducting can Further improved by property and High Speed Transfer matching.In the second connecting object part 3, opposed with first electrode 2a The side of two electrode 3a parts, formed with coating 6 on second electrode 3a surface.
In addition, in the connecting structure body 1 shown in Fig. 2, solder sections 4A's is entirely located between first, second electrode 2a, 3a Opposed region.Connecting structure body 1 shown in the connecting structure body 1X only connecting portion 4X and Fig. 2 of variation shown in Fig. 5 is not Together.Connecting portion 4X has solder sections 4XA and solidfied material portion 4XB.Can be as connecting structure body 1X, the big multidigits of solder sections 4XA In first, second electrode 2a, 3a opposed region, a solder sections 4XA part is from the opposed of first, second electrode 2a, 3a Region it is prominent to side.The solder sections 4XA prominent to side from first, second electrode 2a, 3a opposed region is scolding tin A portion 4XA part, not leave solder sections 4XA scolding tin.In addition, in the present embodiment, weldering is left although can reduce The amount of the scolding tin in tin portion, but leave the scolding tin of solder sections there may also be in solidfied material portion.
If reducing the usage amount of scolding tin particle, connecting structure body 1 is easily obtained.If increase the use of scolding tin particle Amount, then be easily obtained connecting structure body 1X.
In order to which further efficiently scolding tin particle is configured on electrode, 25 DEG C of viscosity (η 25) of the conductive material Preferably more than 10Pas, more preferably more than 20Pas, it is further preferred that more than 50Pas, and preferably Be below 800Pas, more preferably below 600Pas, it is further preferred that below 500Pas.If the viscosity More than the lower limit, then conductive material is difficult to excessively flows out after firm coating.If the viscosity is below the upper limit, Scolding tin further efficiently condenses.
The viscosity can adapt to be adjusted in the species of blending constituent and combined amount.In addition, by using filling out Material, can make viscosity of a relatively high.
The viscosity is entered such as can use E types viscosimeter (Dong Ji industrial groups system) with the condition of 25 DEG C and 5rpm Row measure.
Next, the manufacture method of the connecting structure body of one embodiment of the present invention is illustrated.
Before the manufacture method of the connecting structure body of explanation one embodiment of the present invention, to the present invention can be used in An embodiment connecting structure body manufacture method one embodiment of the present invention the stationary fixture for possessing cover Illustrate.
Fig. 6 is the top view for the stationary fixture 20 for possessing cover for representing one embodiment of the present invention.Fig. 7 (a)~ (e) be the stationary fixture 20 for possessing cover for representing one embodiment of the present invention profile.Fig. 7 (a) is along Fig. 6 The profile of I-I lines, Fig. 7 (b) are along the profile of Fig. 6 II-II lines, and Fig. 7 (c) is the III-III lines along Fig. 6 Profile, Fig. 7 (d) is along the profile of Fig. 6 IV-IV lines, and Fig. 7 (e) is the profile along Fig. 6 V-V lines.Figure 8 (a) is top view corresponding with Fig. 6, and Fig. 8 (b) is profile corresponding with Fig. 7 (d).
The stationary fixture 20 for possessing cover includes stationary fixture 21 and cover 22.Cover 22 is connected to stationary fixture 21.The stationary fixture 20 for possessing cover also includes connection member 23.Cover 22 is connected to geometrical clamp using connection member 23 Tool 21.Connection member 23 is, for example, hinge.
Cover can also be not attached to stationary fixture.
In addition, in Fig. 6 and Fig. 8 (a), the state that cover 22 is opened is shown, in Fig. 7 (a)~(e) and Fig. 8 (b) in, the state that cover 22 is closed is shown.
Stationary fixture 21 has the first recess 21a in upper surface.As shown in Fig. 8 (a), (b), the first recess 21a be in order to The first connecting object part 2 is configured in the first recess 21a inner side and is set.
Stationary fixture can also have multiple first recesses, so as to configure multiple first connecting object parts.
Stationary fixture 21 has multiple second recess 21b in upper surface.Second recess 21b is different from the first recess 21a.The Two recess 21b are set to configure the second connecting object part 3 in the second recess 21b inner side.
The height of upper surface (upper end) of the height and position of the upper surface of second recess 21b lower end than the first recess 21a Position is high.Second recess 21b has positioned at the part than the first recess 21a in the outer part.Being located at for second recess 21b is more recessed than first The parts of portion 21a in the outer part are set to configure the second area of the second connecting object part.
First recess 21a depth is contemplated that the first connecting object part 2 and is configured at the upper of the first connecting object part 2 Total thickness of the connecting portion 4 on surface selects.First recess 21a depth is for example preferably the first connecting object part 2 with more than -30 μm of total thickness of connecting portion 4, and preferably the first connecting object part 2 and connecting portion 4 is total It is more than thickness.The depth of the upper surface of first recess 21a upper surface (upper end) to the second recess 21b lower end is for example preferable Total thickness ± 30 μm of the first connecting object part 2 and connecting portion 4, and preferably the first connecting object part 2 with It is more than total thickness of connecting portion 4, the first connecting object part 2, the first connecting object part 2 and connecting portion 4 it is total + 30 μm of thickness below.
The upper surface that the second area for the second connecting object part of the stationary fixture configures is preferable It is from outside towards medially inclination is oblique downwards.The upper surface of second recess preferably from outside towards inner side (such as The corresponding position in the center of connecting structure body with being obtained) roll downwards it is oblique.The tilt angle alpha is preferably more than 1 degree, More preferably more than 2 degree, and preferably less than 10 degree, more preferably less than 8 degree.Now, in the second connecting object In the first area of part, what can further be consolidated is connection as a result, conducting reliability further improves.Especially It is, even the second connecting object part resin film, flexible printing substrate, flexible flat cable or rigid-flexible combination substrate, The conducting reliability of the second connecting object part can be improved.
As shown in Fig. 8 (a), (b), in stationary fixture 21, it can match somebody with somebody in the first recess 21a 4 corner 21c inner side Put the first connecting object part 2.Using corner 21c, the movement of the first connecting object part 2 can be limited.
Stationary fixture 21 has the clearance portion 21d being connected with the first recess 21a.As shown in Fig. 8 (a), in the first recess 21a Inner side configure the first connecting object part 2 when, can ensure to be based on clearance portion in the side of the side of the first connecting object part 2 21d gap.When configuring the first connecting object part 2, in clearance portion 21d, the side of the first connecting object part 2 is not with consolidating The contact of clamp tool 21.Also, in clearance portion 21d, the side of the connecting structure body 1 obtained does not contact with stationary fixture 21.Its As a result, it is easy to the connecting structure body 1 for taking out the first connecting object part 2 and obtaining.
Material, institute as the upper surface portion above for the first connecting object part of the stationary fixture The material of the upper surface portion above of the second area for the second connecting object part of stationary fixture is stated, can Enumerate ceramics, aluminium alloy, titanium alloy and stainless steel etc..Because heat conductivity is excellent, therefore described in the confession of the stationary fixture The material of first connecting object part upper surface portion above, the confession of the stationary fixture the second connecting object portion The material of the second area of part upper surface portion above is preferably ceramics, aluminium alloy, titanium alloy or stainless Steel, more preferably aluminium alloy.
As the material for the underlying bottom surface section of the second connecting object part of the cover, can arrange Lift ceramics, aluminium alloy, titanium alloy or stainless steel etc..Because the confession described second of excellent heat resistance, therefore the cover connects The material for connecing the underlying bottom surface section of object Part is preferably ceramics, aluminium alloy, titanium alloy or stainless steel, more excellent Choosing is ceramics.Now, even if the thinner thickness of cover, heat resistance can be also improved, thermal deformation can be suppressed and heat is bad Change.
The heat biography of the material of the upper surface portion above for the first connecting object part of the stationary fixture Conductance (A1), the preferably material for the underlying bottom surface section of the second connecting object part than the cover The pyroconductivity (B) of matter is high.The second area for the second connecting object part of the stationary fixture is above Upper surface portion material pyroconductivity (A2), the second connecting object part preferably more described than the confession of the cover The pyroconductivity (B) of the material of underlying bottom surface section is high.
The heat biography of the material of the upper surface portion above for the first connecting object part of the stationary fixture Conductance (A1), the second area for the second connecting object part of the stationary fixture upper surface part above The pyroconductivity (A2) for the material divided is preferably more than 10W/mK, more preferably more than 20W/mK.The heat transfer Rate (A1), (A2) are higher preferably.
It is described for the viewpoint for effectively improving thermal diffusivity, further improving durability and further improving operability The thickness of the part above for the first connecting object part of stationary fixture is preferably more than 1mm, more preferably It is more than 3mm, and preferably below 20mm, more preferably below 10mm.
For the further viewpoint for improving heat resistance and further improving operability, the confession described second of the cover The thickness of the underlying part of connecting object part is preferably more than 0.05mm, more preferably more than 0.1mm, and excellent Choosing is below 1mm, more preferably below 0.5mm.
Using the stationary fixture 20 for possessing cover, connecting structure body 1 can obtain as described below.
Fig. 3 (a)~(d) is the side cut away view of part corresponding with Fig. 2.Fig. 4 is that the front of part corresponding with Fig. 1 is cutd open Face figure.
Prepare the first connecting object part 2 that there is first electrode 2a on upper surface (surface).In addition, prepare possess cap The stationary fixture 20 of part.
As shown in Fig. 3 (a), specifically in the position shown in Fig. 8 (a), (b), in the first recess of stationary fixture 20 21a inner side configures the first connecting object part 2.The movement of the first connecting object part 2 is limited using corner 21c.It is preferred that Be that the first recess 21a inner wall part is located at the side of the first connecting object part 2.
Next, as shown in Fig. 3 (b), in the upper surface of the first connecting object part 2, configuration includes the heat as adhesive Curability composition 11B and multiple scolding tin particle 11A conductive material 11 (the first arrangement step).In addition, adhesive can not also Include Thermocurable composition.
Conductive material 11 is configured on the surface provided with first electrode 2a of the first connecting object part 2.It is conductive in configuration After material 11, scolding tin particle 11A is configured on first electrode 2a (line) and (empty for the region formed with first electrode 2a Between) on this two side.
As the collocation method of conductive material 11, although being not particularly limited, can enumerate using point gum machine carry out coating, Silk-screen printing, the discharge carried out using ink discharge device etc..
In addition, prepare the second connecting object part 3 that there is second electrode 3a on lower surface (surface).Next, such as Fig. 3 (c) shown in, at the conductive material 11 on the upper surface of the first connecting object part 2, configured in the upper surface of conductive material 11 Second connecting object part 3 and obtain layered product (the second arrangement step, the process for obtaining layered product).Work is configured described second In sequence, in the state of the first connecting object part 3 is fixed on into stationary fixture 21, the configuration the in the upper surface of conductive material 11 Two connecting object parts 3.In the upper surface of conductive material 11, the second connecting object part 3 is configured from second electrode 3a sides.This When, make first electrode 2a opposed with second electrode 3a.
For the viewpoint that scolding tin particle is further efficiently configured on electrode, preferably in second arrangement step In not by the second connecting object part pressurize, or with below 0.1MPa (more preferably below 0.05MPa, further preferably Be below 0.02MPa) pressure pressurizeed, more preferably without pressurization.In second arrangement step, preferably Be not by the second connecting object part pressurize to conductive material apply the second connecting object part weight.
In second arrangement step, preferably the second connecting object part is configured in the upper surface of conductive material 11 3 first area, the second area of the second connecting object part 3 is not configured in the upper surface of conductive material 11.It is excellent Choosing is to configure the second area of the second connecting object part 3 in the upper surface of stationary fixture 21.Preferably in fixation Second recess 21b of fixture 21 inner side configures the second area of the second connecting object part 3.Preferably the second recess 21b inner wall part is located at the side of the second connecting object part 3.
As shown in Fig. 4 corresponding with Fig. 3 (c), in second arrangement step, preferably in the first connecting object portion Part 2, conductive material 11, the laminated portions (by the region of Fig. 4 enclosed with dashed lines) of the second connecting object part 3, connect by second Connect and be connected second pair relative to the first connecting object part 2 on the direction that one end 3b of object Part 3 links with other end 3c As part 3 configures with tilting more than 1 degree (tilt angle alpha).One end where the second electrode 3a of the second connecting object part 3 3b sides, compared to the other end 3c side opposite with one end 3b sides of the second connecting object part 3, the first connecting object part 2 with The distance between second connecting object part 3 narrows.
In second arrangement step, preferably relative to the first connecting object part 2, the second connecting object part 3 tilt angle alpha is more than 1 degree.
For the viewpoint for improving interelectrode conducting reliability, in the layered product before heating, in the first connection pair As part, conductive material, the second connecting object part laminated portions, the tilt angle alpha is preferably more than 2 degree, and Preferably less than 10 degree, more preferably less than 8 degree.
Next, conductive material 11 is heated to more than scolding tin particle 11A fusing point (heating process).In the heater In sequence, the state that the first connecting object part 2 is fixed on to stationary fixture 21 is heated.Preferably by conductive material 11 It is heated to more than Thermocurable composition 11B (adhesive) solidification temperature.In the heating process, preferably with relative to The state that first connecting object part 2 has tilted the second connecting object part 3 is begun to warm up.In the heating, it is present in non-shape Scolding tin particle 11A into the region for having electrode assembles (from condensation effect) between first electrode 2a and second electrode 3a.Make With conductive paste simultaneously in the case of non-conductive film, scolding tin particle 11A is effectively gathered in first electrode 2a and second electrode 3a Between.In addition, scolding tin particle 11A is melted and is bonded with each other.In addition, Thermocurable composition 11B heat cures.As a result, such as Fig. 3 (d) shown in, the connecting portion for being connected the first connecting object part 2 with the second connecting object part 3 is formed using conductive material 11 4.Connecting portion 4 is formed using conductive material 11, by making multiple scolding tin particle 11A engagements form solder sections 4A, by making heat Curability composition 11B heat cures and form solidfied material portion 4B.
In the heating process, the first area of the second connecting object part 3 is preferably set to be formed from side Opposite side goes and tilted towards downside.
In the present embodiment, following connecting structure body is obtained：In the first connecting object part 2, connecting portion 4, second The laminated portions of connecting object part 3, on the direction for linking one end 3b of the second connecting object part 3 and other end 3c, Second connecting object part 3 tilts more than 1 degree, less than 10 degree relative to the first connecting object part 2.
Preferably obtain following connecting structure body：In the first connecting object part, the connecting portion, described second The laminated portions of connecting object part, in the direction for linking described one end of the second connecting object part and the other end On, the second connecting object part tilts more than 1 degree, less than 10 degree relative to the first connecting object part.
In the case of the inclination for requiring the second connecting object part is less, it is also possible to obtain following connecting structure body： The laminated portions of the first connecting object part, the connecting portion and the second connecting object part, by described On the direction that described one end of two connecting object parts links with the other end, the second connecting object part is relative to described the One connecting object part is not tilted or tilted less than 1 degree.
As shown in Fig. 3 (d), in the present embodiment, due to that can suppress the movement of the second connecting object part, therefore In the heating process, cover 22 is configured in the top of the second connecting object part 3.Due to the second connecting object can be suppressed The mobile suppression of part 3, it is therefore preferred in the heating process, make cover 22 contact the second connecting object part 3 Upper surface.
In the heating process, stationary fixture and layered product can also be configured in heating part.In the heating process In, configure stationary fixture and layered product after the heating in space that can also be.In the heating process, it can also heat Stationary fixture is configured on part.
For the further viewpoint for improving conducting reliability, preferably in the heating process, by non-contacting Heater meanses heat to the first connecting object part, the conductive material and the second connecting object part.
For the viewpoint efficiently heated, preferably heated in the heating process by hot blast.Separately Outside, in the heating process, in the case of the top of the second connecting object part configuration cover, even if being entered by hot blast Heating is gone, also hot blast directly will not have been blowed to the second connecting object part, the shifting of the second connecting object part etc. can be suppressed It is dynamic.Therefore, the more excellent connecting structure body of conducting reliability can be obtained.
For the viewpoint being more efficiently configured at scolding tin particle on electrode, will not preferably in the heating process Second connecting object part pressurize, or with below 0.1MPa (more preferably below 0.05MPa, it is further preferred that Below 0.02MPa) pressure pressurizeed, more preferably without pressurization.
In the heating process, preferably make to be not located at the scolding tin between first electrode 2a and second electrode 3a Particle 11A is moved between first electrode 2a and second electrode 3a.The viewpoint of reliability is turned on for further raising, preferably It is to obtain following connecting structure body：Along with the first electrode, the connecting portion and the second electrode and stacking side When observing connecting structure body to orthogonal direction, configured in the mutually opposing part of the first electrode and the second electrode Have in the solder sections 100% in the connecting portion more than 50% (preferably more than 60%, more preferably 70% with On).
The heating-up temperature in the heating process is preferably more than 140 DEG C, more preferably more than 160 DEG C, and And preferably less than 450 DEG C, more preferably less than 250 DEG C, it is further preferred that less than 200 DEG C.
As described, Fig. 1, the connecting structure body 1 shown in 2 are obtained., can be from possessing cap after the heating process The stationary fixture 20 of part takes out connecting structure body 1.Because stationary fixture 21 has clearance portion 21d, therefore can easily take out Connecting structure body 1.
The first, second connecting object part is not specifically limited.As the first, second connecting object part, Specifically, the ministrys of electronics industry such as semiconductor chip, semiconductor packages, LED chip, LED encapsulation, capacitor and diode can be enumerated Part, there are resin film, tellite, flexible printing substrate, flexible flat cable, rigid-flexible combination substrate, glass ring epoxide Electronic units such as the circuit substrate such as plate and glass substrate etc..The first, second connecting object part is preferably the ministry of electronics industry Part.
At least one party in the first connecting object part and the second connecting object part is preferably resin Film, flexible printing substrate, flexible flat cable or rigid-flexible combination substrate.The second connecting object part is preferably resin Film, flexible printing substrate, flexible flat cable or rigid-flexible combination substrate.Resin film, flexible printing substrate, flexible flat cable And rigid-flexible combination substrate has flexibility higher and the property of relative lighter.Make in the connection of this connecting object part In the case of with conducting film, scolding tin be present and be difficult to gather trend on electrode.On the other hand, conductive paste is being used In the case of, even with resin film, flexible printing substrate, flexible flat cable or rigid-flexible combination substrate, can also pass through Scolding tin is efficiently gathered on electrode using conductive paste, fully improves interelectrode conducting reliability.Using resin In the case of film, flexible printing substrate, flexible flat cable or rigid-flexible combination substrate, with using other companies such as semiconductor wafer The situation for connecing object Part is compared, and can effectively further obtain the raising of interelectrode conducting reliability caused by the present invention Effect.
As the electrode located at the connecting object part, gold electrode, nickel electrode, tin electrode, aluminium electrode, copper electricity can be enumerated The metal electrodes such as pole, molybdenum electrode, silver electrode, SUS electrodes, tungsten electrode.It is flexible printing substrate in the connecting object part In the case of, the electrode is preferably gold electrode, nickel electrode, tin electrode, silver electrode or copper electrode.In the connecting object portion In the case that part is glass substrate, the electrode is preferably aluminium electrode, copper electrode, molybdenum electrode, silver electrode or tungsten electrode.This Outside, can be the electrode that is only formed by aluminium or in metal oxide layer in the case where the electrode is aluminium electrode Surface is laminated with the electrode of aluminium lamination.As the material of the metal oxide layer, the oxygen for the metallic element for being doped with trivalent can be enumerated Change indium and be doped with zinc oxide of metallic element of trivalent etc..As the metallic element of the trivalent, Sn, Al and Ga can be enumerated Deng.
Hereinafter, enumerate embodiment and comparative example specifically describes the present invention.The present invention is not limited to following reality Apply example.
(embodiment 1)
In embodiment 1, the stationary fixture 20 for possessing lid shown in Fig. 6, Fig. 7 (a)~(e) and Fig. 8 has been used.In reality Apply in example 1, Fig. 1, the connecting structure body 1 shown in 2 is made via each operation shown in Fig. 3 (a)~(d) and Fig. 4.
Prepare following conductive paste, it is included as the weight portion of phenoxy resin 25 of polymer, as Thermocurable chemical combination The weight portion of resorcinol type ring oxygen compound 15 of thing, pentaerythrite four (3- mercaptobutylates) 10 weights as thermal curing agents Amount portion, the weight portion of glutaric acid 2 as fluxing agent, the weight portion of scolding tin particle 48.
Prepare L/S to be 300 μm/200 μm and there is the electrode length 3mm copper electrode pattern (thickness of copper electrode in upper surface Degree 12 μm) glass epoxy substrate (FR-4 substrates, thickness 0.6mm) (the first connecting object part).
Prepare L/S to be 300 μm/200 μm and there is the electrode length 5mm copper electrode pattern (thickness of copper electrode in lower surface Degree 12 μm) flexible printing substrate (being formed using polyimides, the second connecting object part, thickness 0.1mm).
In first recess 21a of the stationary fixture 21 in the stationary fixture 20 for possessing cover, the glass is configured Glass epoxy substrate.
In the upper surface of the glass epoxy substrate, to turn into the side of 100 μm of thickness on the electrode of glass epoxy substrate Formula, using metal mask, the conductive paste is coated with by silk-screen printing, forms electroconductive paste oxidant layer (the first arrangement step). Next, in the upper surface of electroconductive paste oxidant layer, the flexible printing substrate is laminated in a manner of making electrode opposite each other (the second arrangement step).Now, it is configured with flexible printing substrate on the inside of the second recess 21b.Next, close cover 22.Afterwards, in a manner of the temperature for making electroconductive paste oxidant layer reaches 190 DEG C, while make melting with Hot-blast Heating one side scolding tin, and Make electroconductive paste oxidant layer with 190 DEG C and 10 seconds solidifications (heating process).In the heating, make to be not located at first electrode and the second electricity The scolding tin particle between pole moves between the first electrode and the second electrode, obtains connecting structure body.This Outside, in second arrangement step and the heating process, flexible printing substrate is not pressurizeed.
It is orthogonal with the stacked direction of first electrode, connecting portion and second electrode on edge in the connecting structure body of acquisition Direction observation connecting structure body when, the weldering that is configured with the mutually opposing part of first electrode and second electrode in connecting portion More than 70% in tin portion 100%.
In 20 connecting structure bodies of acquisition, respectively by 4 terminal methods, upper and lower interelectrode every 1 connection is determined The connection resistance of position.Calculate the average value of connection resistance.In addition, according to the relation of voltage=electric current × resistance, Neng Goutong Voltage when measure flows through constant electric current is crossed to obtain connection resistance.Connection resistance in the connecting structure body of acquisition is averaged It is worth for below 50m Ω, conducting is excellent in reliability.
(embodiment 2)
In second arrangement step, in addition to being pressurizeed with 0.02MPa pressure to flexible printing substrate with Embodiment 1 is identical, obtains connecting structure body.
The average value of the connection resistance of the connecting structure body obtained in example 2 is the connection obtained in embodiment 1 1.02 times of the average value of the connection resistance of tectosome.
(embodiment 3)
In second arrangement step, in addition to being pressurizeed with 0.05MPa pressure to flexible printing substrate with Embodiment 1 is identical, obtains connecting structure body.
The average value of the connection resistance of the connecting structure body obtained in embodiment 3 is the connection obtained in embodiment 1 1.05 times of the average value of the connection resistance of tectosome.
(embodiment 4)
In second arrangement step, in addition to being pressurizeed with 0.1MPa pressure to flexible printing substrate with reality It is identical to apply example 1, obtains connecting structure body.
The average value of the connection resistance of the connecting structure body obtained in example 4 is the connection obtained in embodiment 1 1.1 times of the average value of the connection resistance of tectosome.
(embodiment 5)
In second arrangement step, in addition to being pressurizeed with 0.2MPa pressure to flexible printing substrate with reality It is identical to apply example 1, obtains connecting structure body.
The average value of the connection resistance of the connecting structure body obtained in embodiment 5 is the connection obtained in embodiment 1 1.5 times of the average value of the connection resistance of tectosome.
Description of reference numerals
1st, 1X ... connecting structure body
2 ... first connecting object parts
2a ... first electrodes
3 ... second connecting object parts
3a ... second electrodes
3b ... one end
3c ... the other ends
4th, 4X ... connecting portions
4A, 4XA ... solder sections
4B, 4XB ... solidfied material portion
5 ... solder resist films
6 ... coatings
11 ... conductive materials
11A ... scolding tin particles
11B ... Thermocurable compositions
20 ... covers possess stationary fixture
21 ... stationary fixtures
The recesses of 21a ... first
The recesses of 21b ... second
21c ... corners
21d ... clearance portions
22 ... covers
23 ... connection members (hinge)

Claims (25)

  1. A kind of 1. manufacture method of connecting structure body, using the conductive material comprising multiple scolding tin particles and adhesive, in upper table First connecting object part of the face with first electrode, in second connecting object part of the lower surface with second electrode, it is special Sign is that the manufacture method of the connecting structure body possesses：
    First arrangement step, the conductive material is configured in the upper surface of the first connecting object part；
    Second arrangement step, in a manner of making the first electrode opposed with the second electrode, in the upper of the conductive material Second connecting object part described in surface configuration；
    Heating process, by being heated to more than the fusing point of the scolding tin particle, so as to be formed using the conductive material by described in The connecting portion that first connecting object part is connected with the second connecting object part, and utilize the scolding tin in the connecting portion Portion electrically connects the first electrode with the second electrode,
    In the heating process, the state that the first connecting object part is fixed on stationary fixture is heated.
  2. 2. the manufacture method of connecting structure body according to claim 1, it is characterised in that
    The stationary fixture has the first recess in upper surface,
    The first connecting object part is configured in the inner side of first recess of the stationary fixture.
  3. 3. the manufacture method of connecting structure body according to claim 1 or 2, it is characterised in that
    In second arrangement step, the first connecting object part is fixed on to the state of the stationary fixture, The upper surface of the conductive material configures the second connecting object part.
  4. 4. the manufacture method of connecting structure body according to any one of claim 1 to 3, it is characterised in that
    The second connecting object part has the upper surface that the conductive material is configured in second arrangement step First area, be not configured in second arrangement step conductive material upper surface second area,
    In second arrangement step, configured in the upper surface of the conductive material described in the second connecting object part First area, the second area of the second connecting object part is not configured to the upper surface of the conductive material,
    The second area of the second connecting object part is configured in the upper surface of the stationary fixture.
  5. 5. the manufacture method of connecting structure body according to claim 4, it is characterised in that
    The upper surface that the second area for the second connecting object part of the stationary fixture configures is from outside direction Medially roll downwards oblique.
  6. 6. the manufacture method of the connecting structure body according to claim 4 or 5, it is characterised in that
    In the heating process, make the first area of the second connecting object part from side towards opposite side to Downside tilts.
  7. 7. the manufacture method of the connecting structure body according to any one of claim 4 to 6, it is characterised in that
    The stationary fixture has second recess different from first recess in upper surface,
    The second area of the second connecting object part is configured in the inner side of second recess of the stationary fixture.
  8. 8. the manufacture method of connecting structure body according to any one of claim 1 to 7, it is characterised in that
    The material of the upper surface portion above for the first connecting object part of the stationary fixture is ceramics, aluminium conjunction Gold, titanium alloy or stainless steel.
  9. 9. the manufacture method of connecting structure body according to any one of claim 1 to 8, it is characterised in that
    In the heating process, cover is configured in the top of the second connecting object part.
  10. 10. the manufacture method of connecting structure body according to claim 9, it is characterised in that
    The cover is connected to the stationary fixture.
  11. 11. the manufacture method of the connecting structure body according to claim 9 or 10, it is characterised in that
    In the heating process, the cover is set to contact the upper surface of the second connecting object part.
  12. 12. the manufacture method of the connecting structure body according to any one of claim 9 to 11, it is characterised in that
    The material for the underlying bottom surface section of the second connecting object part of the cover is ceramics, aluminium conjunction Gold, titanium alloy or stainless steel.
  13. 13. the manufacture method of the connecting structure body according to any one of claim 9 to 12, it is characterised in that
    The pyroconductivity of the material of the upper surface portion above for the first connecting object part of the stationary fixture Pyroconductivity than the material for the underlying bottom surface section of the second connecting object part of the cover is high.
  14. 14. the manufacture method of the connecting structure body according to any one of claim 1 to 13, it is characterised in that
    In the heating process, by non-contacting heating arrangements to the first connecting object part, the conductive material And the second connecting object part is heated.
  15. 15. the manufacture method of the connecting structure body according to any one of claim 1 to 14, it is characterised in that
    In the heating process, heated by hot blast.
  16. 16. the manufacture method of the connecting structure body according to any one of claim 1 to 15, it is characterised in that
    In the heating process, make to be not located at the scolding tin particle between the first electrode and the second electrode to institute State and moved between first electrode and the second electrode.
  17. 17. the manufacture method of the connecting structure body according to any one of claim 1 to 16, it is characterised in that
    Obtain following connecting structure body：From the stacking side with the first electrode, the connecting portion and the second electrode When observing connecting structure body to orthogonal direction, it is configured with the first electrode part mutually opposing with the second electrode More than 70% in the solder sections 100% in the connecting portion.
  18. 18. a kind of stationary fixture, the stationary fixture uses to obtain connecting structure body, and the connecting structure body possesses：First Connecting object part, it has first electrode in upper surface；Second connecting object part, it has second electrode in lower surface； Connecting portion, the first connecting object part is connected by it with the second connecting object part, and by including multiple scolding tin The conductive material of particle and adhesive is formed, and the first electrode utilizes the solder sections in the connecting portion with the second electrode Electrical connection,
    Stationary fixture uses to obtain the connecting structure body via following process, and these processes are：First configuration work Sequence, the conductive material is configured in the upper surface of the first connecting object part；Second arrangement step, so that first electricity The pole mode opposed with the second electrode, the second connecting object part is configured in the upper surface of the conductive material；Add Thermal technology's sequence, by being heated to more than the fusing point of the scolding tin particle, described first is connected so as to be formed using the conductive material Connect the connecting portion that object Part is connected with the second connecting object part, and using the solder sections in the connecting portion by institute First electrode is stated to electrically connect with the second electrode,
    Stationary fixture has the first recess in upper surface,
    Stationary fixture configures the first connecting object portion when obtaining the connecting structure body, in the inner side of first recess Part uses.
  19. 19. stationary fixture according to claim 18, it is characterised in that
    The second connecting object part has the upper surface that the conductive material is configured in second arrangement step First area, be not configured in second arrangement step conductive material upper surface second area,
    The first area of the second connecting object part to be configured at by stationary fixture in second arrangement step The upper surface of the conductive material, the second area of the second connecting object part the conductive material is not configured at Upper surface mode, used to obtain the connecting structure body,
    The upper surface that the second area for the second connecting object part of stationary fixture configures is from outside towards inner side Ground rolls downwards oblique.
  20. 20. the stationary fixture according to claim 18 or 19, it is characterised in that
    The second connecting object part has the upper surface that the conductive material is configured in second arrangement step First area, be not configured in second arrangement step conductive material upper surface second area,
    The first area of the second connecting object part to be configured at by stationary fixture in second arrangement step The upper surface of the conductive material, the second area of the second connecting object part the conductive material is not configured at Upper surface mode, used to obtain the connecting structure body,
    Stationary fixture has second recess different from first recess in upper surface,
    Stationary fixture configures the second area of the second connecting object part in the inner side of second recess and used.
  21. 21. the stationary fixture according to any one of claim 18 to 20, it is characterised in that
    The material of the upper surface portion above for the first connecting object part of stationary fixture be ceramics, aluminium alloy, Titanium alloy or stainless steel.
  22. 22. a kind of stationary fixture for possessing cover, it possesses：Stationary fixture any one of claim 18~21； Cover；
    The stationary fixture for possessing cover is in order in the heating process, in the top of the second connecting object part Configure the cover and used to obtain the connecting structure body.
  23. 23. the stationary fixture according to claim 22 for possessing cover, it is characterised in that
    The cover is connected to the stationary fixture.
  24. 24. the stationary fixture for possessing cover according to claim 22 or 23, it is characterised in that
    The material for the underlying bottom surface section of the second connecting object part of the cover is ceramics, aluminium conjunction Gold, titanium alloy or stainless steel.
  25. 25. the stationary fixture for possessing cover according to any one of claim 22 to 24, it is characterised in that
    The pyroconductivity of the material of the upper surface portion above for the first connecting object part of the stationary fixture Pyroconductivity than the material for the underlying bottom surface section of the second connecting object part of the cover is high.
CN201680031399.7A 2015-11-10 2016-11-09 The manufacture method of connecting structure body, stationary fixture, the stationary fixture for possessing cover Pending CN107615467A (en)

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JP2015220199 2015-11-10
JP2015-220199 2015-11-10
PCT/JP2016/083184 WO2017082277A1 (en) 2015-11-10 2016-11-09 Method for producing connected structure, fixing jig, and fixing jig provided with cover member

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Publication number Priority date Publication date Assignee Title
JPH0463174U (en) * 1990-10-03 1992-05-29
JPH04293296A (en) * 1991-03-22 1992-10-16 Murata Mfg Co Ltd Circuit substrate
JPH0897551A (en) * 1994-09-26 1996-04-12 Nec Kansai Ltd Board holding jig
CN1820361A (en) * 2003-02-05 2006-08-16 千住金属工业株式会社 Method for interconnecting terminals and method for mounting semiconductor device
US20080012193A1 (en) * 2006-07-14 2008-01-17 Nec Electronics Corporation Heat treatment jig and heat treatment jig set

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3769688B2 (en) * 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 Terminal connection method and semiconductor device mounting method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0463174U (en) * 1990-10-03 1992-05-29
JPH04293296A (en) * 1991-03-22 1992-10-16 Murata Mfg Co Ltd Circuit substrate
JPH0897551A (en) * 1994-09-26 1996-04-12 Nec Kansai Ltd Board holding jig
CN1820361A (en) * 2003-02-05 2006-08-16 千住金属工业株式会社 Method for interconnecting terminals and method for mounting semiconductor device
US20080012193A1 (en) * 2006-07-14 2008-01-17 Nec Electronics Corporation Heat treatment jig and heat treatment jig set

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WO2017082277A1 (en) 2017-05-18
TW201737773A (en) 2017-10-16

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Application publication date: 20180119