CN107148653A - The manufacture method of conductive paste, connection structural bodies and connection structural bodies - Google Patents

The manufacture method of conductive paste, connection structural bodies and connection structural bodies Download PDF

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Publication number
CN107148653A
CN107148653A CN201580057986.9A CN201580057986A CN107148653A CN 107148653 A CN107148653 A CN 107148653A CN 201580057986 A CN201580057986 A CN 201580057986A CN 107148653 A CN107148653 A CN 107148653A
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Prior art keywords
electrode
scolding tin
mentioned
conductive paste
object part
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CN201580057986.9A
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CN107148653B (en
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石泽英亮
上野山伸也
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/115—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
    • H01L2224/1152—Self-assembly, e.g. self-agglomeration of the bump material in a fluid

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention provides a kind of conductive paste, interval that can accurately between coordination electrode, scolding tin particle can also be efficiently configured on electrode, it is possible to improve interelectrode conducting reliability.The second connecting object part that the conductive paste of the present invention has second electrode for having the first connecting object part of first electrode and surface to surface is attached, and above-mentioned first electrode and above-mentioned second electrode are electrically connected, the conductive paste contains multiple septs that Thermocurable composition, multiple scolding tin particles and fusing point are more than 250 DEG C, and the average grain diameter of above-mentioned sept is bigger than the average grain diameter of above-mentioned scolding tin particle.

Description

The manufacture method of conductive paste, connection structural bodies and connection structural bodies
Technical field
The present invention relates to the conductive paste containing scolding tin particle.The invention further relates to used the connection of above-mentioned conductive paste The manufacture method of structure and connection structural bodies.
Background technology
The anisotropic conductive material such as anisotropic conductive paste and anisotropic conductive film is well known.With regard to above-mentioned each For anisotropy conductive material, electroconductive particle is dispersed with adhesive resin.
In order to obtain various connection structural bodies, above-mentioned anisotropic conductive material have been used for such as flexible printing substrate with Connection (COF (the Chip on of the connection (FOG (Film on Glass)) of glass substrate, semiconductor chip and flexible printing substrate Film)), the connection (COG (Chip on Glass)) of semiconductor chip and glass substrate and flexible printing substrate and glass Connection (FOB (Film on Board)) of epoxy substrate etc..
Utilizing electricity of the above-mentioned anisotropic conductive material to such as electrode of flexible printing substrate and glass epoxy substrate When pole is electrically connected, the anisotropic conductive material containing electroconductive particle is configured on glass epoxy substrate.Then, lamination Flexible printing substrate, and heated and pressurizeed.Thus, solidify anisotropic conductive material, by electroconductive particle to electricity Interpolar is electrically connected, so as to obtain connection structural bodies.
As an example of above-mentioned anisotropic conductive material, there is a kind of jointing tape disclosed in following patent documents 1, It includes the resin bed containing heat-curing resin, solder powder and curing agent, and above-mentioned solder powder and above-mentioned curing agent are present in In above-mentioned resin bed.The splicing tape is membranaceous rather than pasty state.
A kind of adhering method for having used above-mentioned jointing tape is also disclosed in patent document 1.Specifically, to the first base Plate, splicing tape, second substrate, splicing tape and the 3rd substrate start to carry out lamination successively from below, so as to obtain laminated body.This When, the first electrode for making to be arranged at first substrate surface and the second electrode located at second substrate surface are opposed.In addition, making to be located at The second electrode on second substrate surface and the 3rd electrode contraposition located at the 3rd substrate surface.Moreover, with specified temperature to folded Layer body is heated and is bonded.Thus, connection structural bodies is obtained.
In addition, there is a kind of bonding agent of anisotropic conductive disclosed in following patent documents 2, make as the first electronics zero The electrode of the connecting portion of part is first electrode and electrically connected as the electrode i.e. second electrode of the connecting portion of the second electronic component.On The bonding agent for stating anisotropic conductive contains insulating polymers resin, engagement particle and spacer particle.Above-mentioned engagement grain Son by the heat that the ultrasonic wave that the bonding agent to above-mentioned anisotropic conductive applies is produced by being melted.Above-mentioned sept grain Son has the fusing point higher than above-mentioned engagement particle.As above-mentioned engagement particle, scolding tin particle can be enumerated.
Prior art literature
Patent document
Patent document 1：WO2008/023452A1
Patent document 2：Japanese Unexamined Patent Application Publication 2012-532979 publications
The content of the invention
The technical problems to be solved by the invention
Jointing tape described in patent document 1 is membranaceous rather than pasty state.Accordingly, it is difficult to which solder powder is effectively configured In on electrode (line).For example, in jointing tape described in patent document 1, a part for solder powder is easily configurable at no shape Into the region (interval) of electrode.It is configured at and does not form the solder powder of electrode zone and do not contribute to interelectrode conducting.
Even in addition, the anisotropic conductive paste containing solder powder, solder powder can not be efficiently configured to sometimes On electrode (line).In addition, in the case where having used the anisotropic conductive paste containing solder powder, after being conductively connected, easily It is uneven in being produced in interelectrode interval., sometimes can not be by addition, in the bonding agent described in patent document 2 The engagement particle such as scolding tin particle is efficiently configured on electrode (line).In addition, as patent document 2 record, even if with scolding tin grain The engagement particle such as son separately uses spacer particle, and engagement particle can not be efficiently configured on electrode (line) sometimes.
It is an object of the present invention to provide a kind of conductive paste, the interval that it can accurately between coordination electrode may be used also So that scolding tin particle is efficiently configured on electrode, it is possible to improve interelectrode conducting reliability.The present invention also provides a kind of The connection structural bodies of the conductive paste and the manufacture method of connection structural bodies are used.
Technical scheme for solving technical problem
According to the wide in range aspect of the present invention there is provided a kind of conductive paste, it is used for having the first of first electrode to surface The second connecting object part that connecting object part and surface have second electrode is attached, and to the first electrode and institute Second electrode is stated to be electrically connected, wherein, the conductive paste contains Thermocurable composition, multiple scolding tin particles and fusing point and is More than 250 DEG C of multiple septs, the average grain diameter of the sept is bigger than the average grain diameter of the scolding tin particle.
In some particular aspects of the conductive paste of the present invention, the sept is insulating properties particle.
In some particular aspects of the conductive paste of the present invention, the conductive paste is connected with the sept with described first Mode that object Part and the second connecting object part this both sides connect is connect to use.
In some particular aspects of the conductive paste of the present invention, the conductive paste is used as described below：To the described first electricity When pole and the second electrode are electrically connected, the conductive paste is heated to more than the fusing point of the scolding tin particle and described More than the solidification temperature of Thermocurable composition, make multiple scolding tin particle coacervations and integration.
In some particular aspects of the conductive paste of the present invention, the average grain diameter of the sept and the scolding tin particle The ratio between average grain diameter is more than 1.1, less than 15.
In some particular aspects of the conductive paste of the present invention, the content of the sept is more than 0.1 weight %, 10 weights Measure below %.
In some particular aspects of the conductive paste of the present invention, the average grain diameter of the scolding tin particle is more than 1 μm, 40 μm Below.
In some particular aspects of the conductive paste of the present invention, the content of the scolding tin particle is more than 10 weight %, 80 Below weight %.
The present invention conductive paste some particular aspects, the content of the scolding tin particle in terms of weight % units with The ratio between content of the sept in terms of weight % units is more than 2, less than 100.
According to the wide in range aspect of the present invention there is provided a kind of connection structural bodies, it includes：
First connecting object part of the surface with least one first electrode,
Second connecting object part of the surface with least one second electrode,
The connecting portion that the first connecting object part and the second connecting object part are connected,
The material of the connecting portion is described conductive paste, and the first electrode and the second electrode pass through the company Solder sections in socket part realize electrical connection, the sept and the first connecting object part and second connecting object Part this both sides contact.
According to the wide in range aspect of the present invention there is provided a kind of manufacture method of connection structural bodies, it includes：
There is the surface of the first connecting object part of at least one first electrode using described conductive paste on surface The process of the upper configuration conductive paste；
On the surface opposite with the first connecting object component side of the conductive paste, configuration surface has at least Second connecting object part of one second electrode, and cause the first electrode and the opposed process of the second electrode；
By the conductive paste be heated to more than the fusing point of the scolding tin particle and the Thermocurable composition solidification temperature More than degree, the first connecting object part and the second connecting object part are connected from there through conductive paste formation The connecting portion being connected together, and the first electrode and the second electrode are realized by the solder sections in the connecting portion Electrical connection, the work for contacting the sept and the first connecting object part and the second connecting object part this both sides Sequence.
In some particular aspects of the manufacture method of the connection structural bodies of the present invention, wherein,
When being electrically connected to the first electrode and the second electrode, the conductive paste is heated to the weldering More than the fusing point of tin particle and more than the solidification temperature of the Thermocurable composition, make multiple scolding tin particle coacervations and integral Change.
In some particular aspects of the manufacture method of the connection structural bodies of the present invention, in the second connecting object portion of the configuration In the process of part and the process of the formation connecting portion, apply the weight of the second connecting object part to the conductive paste Amount, and without pressurization.
The second connecting object part is preferably resin film, flexible printing substrate, flexible flat cable or rigid-flexible combination Substrate.
The effect of invention
It is multiple for more than 250 DEG C that the conductive paste of the present invention contains Thermocurable composition, multiple scolding tin particles and fusing point Sept, therefore, have second electrode in the first connecting object part and surface to surface with first electrode second connect Object Part is connect to be attached, and to the first electrode and the second electrode electrical connection in the case of, can be accurately Scolding tin particle, can also be efficiently configured on electrode by the interval between coordination electrode, can improve interelectrode conducting reliable Property.
Brief description of the drawings
Fig. 1 is to schematically show cuing open for the connection structural bodies that is obtained using the conductive paste of one embodiment of the present invention View；
Fig. 2 (a)~Fig. 2 (c) is for manufacturing connection structural bodies using the conductive paste of one embodiment of the present invention The sectional view of each operation of one example of method；
Fig. 3 is the sectional view for the variation for representing connection structural bodies；
Fig. 4 is the sectional view for the variation for representing connection structural bodies.
Description of symbols
1st, 1X, 1Y ... connection structural bodies
2nd, the first connecting objects of 2Y ... part
2a ... first electrodes
The convex portions of 2y ... first
3rd, the second connecting objects of 3Y ... part
3a ... second electrodes
The convex portions of 3y ... second
4th, 4X, 4Y ... connecting portion
4A, 4XA, 4YA ... solder sections
4B, 4XB, 4YB ... solidfied material portion
5th, 5X, 5Y ... sept
11 ... conductive pastes
11A ... scolding tin particles
11B ... Thermocurable compositions
Embodiment
Hereinafter, the details of the present invention are illustrated.
(conductive paste)
The conductive paste of the present invention, which is used for the first connecting object part to surface with first electrode and surface, has the Second connecting object part of two electrodes is attached, and above-mentioned first electrode and above-mentioned second electrode are electrically connected.This The conductive paste of invention contains multiple septs that Thermocurable composition, multiple scolding tin particles, fusing point are more than 250 DEG C.
In the conductive paste of the present invention, the average grain diameter of above-mentioned sept is bigger than the average grain diameter of above-mentioned scolding tin particle.
In the conductive paste of the present invention, using said structure, therefore, and in the case of being electrically connected electrode, Ke Yigao Interval of the precision ground between coordination electrode.In addition, when scolding tin particle is concentrated between electrode, substantially ensured that using sept above and below The interval of electrode, thus, it is easy to multiple scolding tin particles be concentrated between electrode opposed up and down, can have multiple scolding tin particles It is configured on electrode (line) to effect.In addition, a part for multiple scolding tin particles be difficult to be configured at do not formed electrode region ( Every), it can largely reduce the amount for the scolding tin particle for being configured at the region for not forming electrode.It is thus possible to improve interelectrode Turn on reliability.Furthermore, it is possible to prevent interelectrode electrical connection adjacent on not attachable transverse direction, it is possible to improve insulation Reliability.In the present invention, by coordinating sept, scolding tin particle can be efficiently configured on electrode.In addition, of the invention In, sept is not coordinated only, and the average grain diameter of sept and scolding tin particle is set to specific scope, therefore, can So that scolding tin particle is efficiently configured on electrode.The use of sept with specific average grain diameter significantly contributes to connect The amount of interelectrode scolding tin above and below connecing and the raising for configuring precision.
Bigger than the average grain diameter of above-mentioned scolding tin particle by the average grain diameter of above-mentioned sept, scolding tin particle is moved up in electrode When dynamic, the interval that scolding tin particle can be moved is ensured between the first connecting object part and the second connecting object part, Promote the movement of scolding tin particle.As a result, the interelectrode scolding tin quantitative change above and below being configured at is more, and therefore, interelectrode conducting Reliability is improved.
In addition, being found in the present invention, by the use of sept, sept is not only facilitated between limitation upper/lower electrode Every, and sept is favorably improved the coherency of scolding tin particle.
Also, in the present invention, interelectrode location dislocation can be prevented.In the present invention, the of conductive paste is being coated with On one connecting object part during overlapping second connecting object part, connect even in the electrode of the first connecting object part and second Connect the electrode of object Part calibration misplace in the state of, the first connecting object part and the second connecting object part are overlapping In the case of, the dislocation can also be corrected, the electrode of electrode and the second connecting object part to the first connecting object part connects Connect (self calibration effect).
In addition, in the scolding tin for not being the substrate particle formed by scolding tin using possessing and being configured on the surface of substrate particle Layer electroconductive particle and without using above-mentioned scolding tin particle in the case of, electroconductive particle is difficult to concentrate on electrode, electric conductivity The mutual scolding tin zygosity of particle is relatively low, therefore, and the electroconductive particle moved on electrode is be easily moved to outside electrode.Therefore, The inhibition of interelectrode location dislocation is also reduced.
In order to which scolding tin particle is further efficiently configured on electrode, viscosity (η of the above-mentioned conductive paste at 25 DEG C 25) it is preferably more than 10Pas, more preferably more than 50Pas, more preferably more than 100Pas are preferably Below 800Pas, more preferably below 600Pas, more preferably below 500Pas.
Above-mentioned viscosity (η 25) can suitably adjust according to the species and use level of gradation composition.In addition, making by filler With viscosity being made higher.
Above-mentioned viscosity (η 25) can use such as E types viscosimeter (Toki Sangyo Co., Ltd.'s manufacture)
Determined under conditions of 25 DEG C and 5rpm.
The conductive paste of the present invention can be preferred for the system of connection structural bodies of the invention described later and connection structural bodies Make method.
From the viewpoint of conducting reliability is further improved, above-mentioned conductive paste is to above-mentioned first electrode and above-mentioned When second electrode is electrically connected, be heated to more than the fusing point of above-mentioned scolding tin particle and above-mentioned Thermocurable composition solidification temperature More than, make multiple above-mentioned scolding tin particle coacervations and integration is used.By the integration of multiple scolding tin particles, more large area is formed Solder sections.In 1 solder sections, more than two scolding tin particles in preferred pair conductive paste have carried out integration, more preferably Integration is carried out to the scolding tin particle of more than 3 in conductive paste, further preferably to more than 5 in conductive paste Scolding tin particle has carried out integration.
Above-mentioned conductive paste is preferred for the electrical connection of electrode.Above-mentioned conductive paste is preferably circuit connection material.
Hereinafter, each composition contained by above-mentioned conductive paste is illustrated.
(scolding tin particle)
Above-mentioned scolding tin particle has scolding tin on electric conductivity outer surface.In above-mentioned scolding tin particle, core and electric conductivity Outer surface formed by scolding tin.Above-mentioned scolding tin particle is the core of above-mentioned scolding tin particle and the outer surface of electric conductivity is The particle of scolding tin.
From the viewpoint of scolding tin particle is effectively concentrated on electrode, the zeta potential of above-mentioned scolding tin particle surface is preferably Just.But, in the present invention, the zeta potential of above-mentioned scolding tin particle surface can not also be for just.
Zeta potential is determined as follows.
The assay method of zeta potential：
By the way that scolding tin particle 0.05g is put into methanol 10g and ultrasonication etc. is carried out, it is uniformly dispersed, is obtained To dispersion liquid.Using the dispersion liquid, and using the manufacture of Beckman Coulter companies, " Delsamax PRO ", can be at 23 DEG C Down zeta potential is determined by electrophoresis assays.
The zeta potential of scolding tin particle is preferably more than 0mV, more preferably above 0mV, preferably below 10mV, more preferably 5mV Hereinafter, it is still more preferably below 1mV, more preferably below 0.7mV, particularly preferably below 0.5mV.Zeta potential is When below the above-mentioned upper limit, in the conductive paste before use, scolding tin particle is difficult cohesion.When zeta potential is more than 0mV, installing When scolding tin particle effectively condense upon on electrode.
Due to easily the zeta potential on surface being adjusted to just, therefore, above-mentioned scolding tin particle preferably have scolding tin particle main body and It is configured at the anionic polymer in above-mentioned scolding tin particle body surfaces.Above-mentioned scolding tin particle is preferably by anionic polymerisation Thing is surface-treated as the compound of anionic polymer and obtained to scolding tin particle main body.Above-mentioned scolding tin particle is preferred For the surface treatment of the compound progress by anionic polymer or as anionic polymer.Above-mentioned anionic polymer and Compound as above-mentioned anionic polymer can be used alone one kind respectively, can also be applied in combination two or more.
As the method being surface-treated using anionic polymer to scolding tin particle main body, it can enumerate using following poly- Compound is as anionic polymer, the method for making the carboxyl of anionic polymer and the hydroxyl reaction of scolding tin particle body surfaces, The polymer is for example to make (methyl) acrylate copolymer of (methyl) acrylic acid copolymer conjunction, closed by dicarboxylic acids and glycol Into and two ends there are the polyester polymers of carboxyl, obtained by the intermolecular dehydration condensation of dicarboxylic acids and two ends have There is the polymer of carboxyl, synthesized by dicarboxylic acids and diamines and two ends have the polyester polymers of carboxyl and changing with carboxyl Property polyvinyl alcohol (Japan synthesis KCC manufacture " GOHSENX T ") etc..
As the anionicsite of above-mentioned anionic polymer, above-mentioned carboxyl can be enumerated, in addition, toluene can be also enumerated Sulfonyl (p-H3CC6H4S (=O)2-) and sulfonate ion group (- SO3 -), phosphate anion group (- PO4 -) etc..
In addition, as another method, following methods can be enumerated：Using with the hydroxyl reaction with scolding tin particle body surfaces Functional group and also there is compound by the polymerizable functional group of addition, condensation reaction, and the compound polymerization is existed On the surface of scolding tin particle main body.Carboxyl and isocyanide can be enumerated as the functional group with the hydroxyl reaction of scolding tin particle body surfaces Perester radical etc., hydroxyl, carboxyl, amino and (methyl) propylene can be enumerated as the functional group polymerizeing by addition, condensation reaction Acyl group.
The weight average molecular weight of above-mentioned anionic polymer is preferably more than 2000, and more preferably more than 3000, be preferably Less than 10000, more preferably less than 8000.
When above-mentioned weight average molecular weight is more than above-mentioned lower limit and below the above-mentioned upper limit, easily on the surface of scolding tin particle main body The zeta potential on the surface of scolding tin particle, is easily adjusted to just by upper configuration anionic polymer, can make scolding tin particle further It is efficiently configured on electrode.
Above-mentioned weight average molecular weight represents with what polystyrene converted again to divide equally by what gel permeation chromatography (GPC) was determined Son amount.
Polymer obtained from being surface-treated using the compound as anionic polymer to scolding tin particle main body Weight average molecular weight can try to achieve as follows, dissolving scolding tin particle in scolding tin, utilize will not cause polymer decompose watery hydrochloric acid Deng scolding tin particle is removed, then, the weight average molecular weight of the polymer of residual is determined.
Above-mentioned scolding tin is preferably the metal (low-melting-point metal) that fusing point is less than 450 DEG C.Above-mentioned scolding tin particle is preferably to melt Point is less than 450 DEG C of metallic (low-melting-point metal particle).Above-mentioned low-melting-point metal particle is containing low-melting-point metal Particle.The low-melting-point metal represents the metal below 450 DEG C of fusing point.The fusing point of low-melting-point metal is preferably less than 300 DEG C, more excellent Elect less than 160 DEG C as.In addition, above-mentioned scolding tin particle contains tin.In the weight % of metal 100 contained by above-mentioned scolding tin particle, tin Content is preferably more than 30 weight % more preferably more than 40 weight %, more preferably more than 70 weight %, particularly preferably For more than 90 weight %.The content of tin in above-mentioned scolding tin particle be above-mentioned lower limit more than when, further improve solder sections with The connection reliability of electrode.
In addition, the content of above-mentioned tin can utilize high-frequency inductive coupling plasma body emission spectrographic analysis device (Co., Ltd. Hole makes manufactured " ICP-AES ") or the fluorescent x-ray analyzer (" EDX- of Shimadzu Scisakusho Ltd's manufacture 800HS ") etc. be measured.
By using above-mentioned scolding tin particle, scolding tin is melted and electrode engagement, and solder sections make conducting between electrode.Example Such as, solder sections and electrode easily carry out face contact and without a contact, therefore, connection resistance is reduced.In addition, passing through scolding tin grain The bond strength of the use of son, solder sections and electrode is uprised, as a result, be further not likely to produce the stripping of solder sections and electrode, And effectively improve conducting reliability and connection reliability.
The metal (low-melting-point metal) for constituting above-mentioned scolding tin particle is not particularly limited.The low-melting-point metal be preferably tin, Or the alloy containing tin.The alloy can be enumerated：Tin-silver alloy, tin-copper alloy, tin-silver-copper alloy, tin-bismuth alloy electroplating, tin-zinc Alloy, Sn-In alloy etc..Because the wetability to electrode is excellent, therefore, above-mentioned low-melting-point metal is preferably tin, Xi-silver conjunction Gold, more preferably tin-silver-copper alloy, tin-bismuth alloy electroplating, Sn-In alloy, tin-bismuth alloy electroplating, Sn-In alloy.
In addition, above-mentioned scolding tin particle is preferably based on JIS Z3001:Welding terminology, liquidus curve are less than 450 DEG C of filling Metal.As the composition of above-mentioned scolding tin particle, the metal group such as containing zinc, gold, silver, lead, copper, tin, bismuth, indium can be enumerated Into.It is preferred that low melting point and lead-free tin-indium class (117 DEG C of eutectics) or Sn-Bi class (139 DEG C of eutectics).That is, above-mentioned scolding tin grain Son does not preferably contain lead, is preferably the scolding tin containing tin and indium or the scolding tin containing tin and bismuth.
In order to further improve the bond strength of above-mentioned solder sections and electrode, above-mentioned scolding tin particle can comprising nickel, copper, The metals such as antimony, aluminium, zinc, iron, gold, titanium, phosphorus, germanium, tellurium, cobalt, bismuth, manganese, chromium, molybdenum, palladium.In addition, from it is further improve solder sections and From the viewpoint of the bond strength of electrode, above-mentioned scolding tin particle preferably comprises nickel, copper, antimony, aluminium or zinc.Scolding tin is improved from further From the viewpoint of the weld strength of portion and electrode, in the weight % of scolding tin particle 100, these metals for improving bond strength Content be preferably more than 0.0001 weight %, be preferably below 1 weight %.
The average grain diameter of above-mentioned scolding tin particle is preferably more than 0.5 μm, more preferably more than 1 μm, more preferably 3 μm More than, particularly preferably more than 5 μm, preferably less than 100 μm, more preferably less than 80 μm, be still more preferably less than 75 μm, It is still more preferably less than 60 μm, is still more preferably less than 40 μm, is still more preferably less than 30 μm, it is further excellent Elect less than 20 μm, most preferably particularly preferably less than 15 μm, less than 10 μm as.The average grain diameter of above-mentioned scolding tin particle is above-mentioned When more than lower limit and below the above-mentioned upper limit, scolding tin particle can be further efficiently configured on electrode.Above-mentioned scolding tin grain The average grain diameter of son is particularly preferably more than 3 μm and less than 30 μm.
" average grain diameter " of above-mentioned scolding tin particle represents number average particle diameter.The average grain diameter of scolding tin particle is by using for example Electron microscope or any 50 scolding tin particles of observation by light microscope, and calculate average value or carry out laser diffraction formula granularity point Cloth is determined and tried to achieve.
The coefficient of alteration of the particle diameter of above-mentioned scolding tin particle is preferably more than 5%, more preferably more than 10%, preferably 40% Hereinafter, more preferably less than 30%., can be with when the coefficient of alteration of above-mentioned particle diameter is more than above-mentioned lower limit and below the above-mentioned upper limit Scolding tin particle is set further to be efficiently configured on electrode.But, the coefficient of alteration of the particle diameter of above-mentioned scolding tin particle can also Less than 5%.
Above-mentioned coefficient of alteration (CV values) is represented with following formula.
CV values (%)=(ρ/Dn) × 100
ρ：The standard deviation of the particle diameter of scolding tin particle
Dn：The average value of the particle diameter of scolding tin particle
The shape of above-mentioned scolding tin particle is not particularly limited.The shape of above-mentioned scolding tin particle can be spherical, or Shape beyond the spherical shape of flat etc..
In the above-mentioned weight % of conductive paste 100, the content of above-mentioned scolding tin particle is preferably more than 1 weight % more preferably 2 More than weight %, more preferably more than 10 weight %, particularly preferably more than 20 weight %, most preferably 30 weight % with On, preferably below 80 weight %, more preferably below 60 weight %, more preferably below 50 weight %.Above-mentioned scolding tin When the content of particle is more than above-mentioned lower limit and below the above-mentioned upper limit, scolding tin particle can be made further to be efficiently configured to electricity On extremely, easily scolding tin particle is largely configured between electrode, and further improves conducting reliability.Led from further improving From the viewpoint of logical reliability, the content of preferably above-mentioned scolding tin particle is more.
Be formed with the line of part of electrode (L) for 50 μm less than 150 μm in the case of, from further improving Turn on from the viewpoint of reliability, in the above-mentioned weight % of conductive paste 100, the content of above-mentioned scolding tin particle is preferably 20 weight % More than, more preferably more than 30 weight %, preferably below 55 weight %, more preferably below 45 weight %.
Do not formed the interval of part of electrode (S) for 50 μm less than 150 μm in the case of, from further Improve from the viewpoint of conducting reliability, in the above-mentioned weight % of conductive paste 100, the content of above-mentioned scolding tin particle is preferably 30 weights Measure more than %, more preferably more preferably more than 40 weight %, preferably below 70 weight %, below 60 weight %.
Be formed with the line of part of electrode (L) for 150 μm less than 1000 μm in the case of, from further carrying From the viewpoint of height conducting reliability, in the above-mentioned weight % of conductive paste 100, the content of above-mentioned scolding tin particle is preferably 30 weights Measure more than %, more preferably more preferably more than 40 weight %, preferably below 70 weight %, below 60 weight %.
Do not formed the interval of part of electrode (S) for 150 μm less than 1000 μm in the case of, from more entering one Step is improved from the viewpoint of conducting reliability, and in the above-mentioned weight % of conductive paste 100, the content of above-mentioned scolding tin particle is preferably 30 More than weight %, more preferably more than 40 weight %, preferably below 70 weight %, more preferably below 60 weight %.
(sept)
Above-mentioned sept preferably with above-mentioned first connecting object part and above-mentioned this both sides' phase of second connecting object part The mode connect is used.Therefore, conductive paste of the invention is preferably with above-mentioned sept and above-mentioned first connecting object part and upper The mode that second connecting object part this both sides connect is stated to use.Above-mentioned sept preferably with above-mentioned first connecting object part The above-mentioned first electrode region of above-mentioned first electrode (be provided with) and the above-mentioned second electrode of above-mentioned second connecting object part (set Having the region of above-mentioned second electrode) mode that connects of this both sides uses.Above-mentioned sept with above-mentioned first further preferably to be connected pair As part the region for being not provided with above-mentioned first electrode and above-mentioned second connecting object part be not provided with it is above-mentioned second electricity The mode that this both sides of the region of pole connect is used.When being conductively connected, by the way that scolding tin is concentrated on into interelectrode effect, interval Thing is easy to move to the region for being not provided with electrode.On the other hand, above-mentioned sept is configured between electrode sometimes.
The fusing point of above-mentioned sept is more than 250 DEG C.In the electrical connection of first electrode and second electrode, set higher Fusing point, makes above-mentioned sept not melt.The upper limit of the fusing point of above-mentioned sept is not particularly limited.The fusing point of above-mentioned sept It can be less than 400 DEG C.
From the viewpoint of the melting for further preventing sept, the fusing point of above-mentioned sept is preferably more than 300 DEG C, More preferably more than 350 DEG C.
Above-mentioned sept can be resin particle.As the material of resin particle, for example, it can enumerate：Vistanex, third Olefin(e) acid resin, phenolic resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturation Polyester resin, polyethylene terephthalate, polysulfones, polyphenylene oxide, polyacetals, polyimides, polyamidoimide, polyethers ether Ketone, polyether sulfone, divinyl benzene polymers and vinyl benzene-styrol copolymer or divinylbenzene-(methyl) acrylate Divinylbenzene analog copolymer such as copolymer etc..The hardness of above-mentioned resin particle can be controlled into easily to appropriate scope, because This, the material of above-mentioned resin particle is preferably to make one or more kinds of polymerizations of the polymerizable monomer with olefinic unsaturated group Polymer.Particularly preferably divinyl benzene polymers, polyimides or polyamidoimide.
In addition, as the material of above-mentioned sept, in addition to resin, can also enumerate：Silica, glass, quartz, Silicon, metal and metal oxide etc..The material of above-mentioned sept can not be metal.The material of above-mentioned sept is preferably tree Fat, more preferably divinylbenzene analog copolymer.Above-mentioned divinylbenzene analog copolymer for example contains divinylbenzene as altogether Polymeric composition.
Sometimes configuration space thing between the electrode abutted in the transverse direction, therefore, from further raising insulating reliability Viewpoint is set out, and above-mentioned sept is preferably insulating properties particle.
The average grain diameter of above-mentioned sept is preferably more than 10 μm, more preferably more than 20 μm, more preferably 25 μm More than, preferably less than 100 μm, more preferably less than 75 μm, be still more preferably less than 50 μm.Above-mentioned sept is averaged When particle diameter is more than above-mentioned lower limit and below the above-mentioned upper limit, interval that can further accurately between coordination electrode, and can So that scolding tin particle is further efficiently configured on electrode.
" average grain diameter " of above-mentioned sept represents number average particle diameter.The average grain diameter of sept is by using such as electronics Microscope or any 50 septs of observation by light microscope, and calculate average value or carry out laser diffraction formula particle size distribution And try to achieve.
From between accurately coordination electrode, and from the viewpoint of scolding tin is efficiently configured on electrode, above-mentioned sept Average grain diameter it is bigger than the average grain diameter of above-mentioned scolding tin particle.
From further accurately between coordination electrode, and scolding tin is further efficiently configured to the viewpoint on electrode Set out, the ratio between average grain diameter of the average grain diameter of above-mentioned sept and above-mentioned scolding tin particle (average grain diameter of sept/scolding tin grain The average grain diameter of son) it is preferably more than 1.1, more preferably more than 1.5, more preferably more than 2, preferably less than 15, more Preferably less than 10, more preferably less than 8.From further accurately being controlled electrode, and by scolding tin more From the viewpoint of being effectively further configured on electrode, the average grain diameter of above-mentioned sept is flat relative to above-mentioned scolding tin particle The ratio (average grain diameter of the average grain diameter of sept/scolding tin particle) of equal particle diameter is preferably more than 1.0, and more preferably more than 1.5, Preferably less than 15, more preferably less than 10.
The coefficient of alteration in the particle footpath of above-mentioned sept is preferably more than 3%, more preferably more than 5%, preferably 30% Hereinafter, more preferably less than 20%., can be with when the coefficient of alteration in above-mentioned particle footpath is more than above-mentioned lower limit and below the above-mentioned upper limit Interval further accurately between coordination electrode.
Above-mentioned coefficient of alteration (CV values) is represented with following formula.
CV values (%)=(ρ/Dn) × 100
ρ：The standard deviation in the particle footpath of sept
Dn：The average value in the particle footpath of sept
From further accurately between coordination electrode, and scolding tin is further efficiently configured to the viewpoint on electrode Set out, the content (in the weight % of conductive paste 100) in terms of weight % units of above-mentioned scolding tin particle and above-mentioned sept with (content (weight %)/sept of scolding tin particle contains for the ratio between content (in the weight % of conductive paste 100) of weight % unit meters Measure (weight %)) it is preferably more than 2, more preferably more than 5, more preferably more than 10, preferably less than 100, more preferably For less than 80, more preferably 70.
From further accurately being controlled electrode, and scolding tin is further efficiently configured on electrode From the viewpoint of, the 10%K values (modulus of elasticity in comperssion during 10% compression) of above-mentioned sept are preferably 2000N/mm2Above more Preferably 3500N/mm2More than, preferably 8000N/mm2Hereinafter, more preferably 6000N/mm2Below.In addition, above-mentioned sept 10%K values for more than above-mentioned lower limit and below the above-mentioned upper limit when, can be in sept and first electrode and second electrode this pair After side connects, prevent the transition of sept from moving, the cohesion of scolding tin particle can also be promoted, first electrode and second electrode is prevented Location dislocation, it is possible to improve conducting reliability.
The 10%K values of above-mentioned sept can be determined as following.
It is right with the smooth pressure head end face of cylinder (50 μm of diameter, diamond fabrication) at 25 DEG C using micro-compression tester Maximum test load 90mN carries out load and compresses sept under conditions of 30 seconds.Determine load value (N) now and compression displacement (mm)., can be in the hope of modulus of elasticity in comperssion by following formula according to obtained measured value.It is used as above-mentioned micro-compression tester, example " the Fischer scope H-100 " of Fischer Co., Ltd. manufacture such as can be used.
K values (N/mm2)=(3/21/2)·F·S-3/2·R-1/2
F：Sept carries out the load value (N) during 10% compression
S：Sept carries out the compression displacement (mm) during 10% compression
R：The radius (mm) of sept
From further accurately being controlled electrode, and scolding tin is further efficiently configured on electrode From the viewpoint of, the compression recovery of above-mentioned sept is preferably more than 30%, more preferably more than 40%, preferably 80% with Under, more preferably less than 70%.In addition, the compression recovery of above-mentioned sept is more than above-mentioned lower limit and below the above-mentioned upper limit When, it can prevent the transition of sept from moving after sept and first electrode and second electrode this both sides connect, can also promote Enter the cohesion of scolding tin particle, so as to prevent the location dislocation of first electrode and second electrode, it is possible to improve conducting reliability.
Above-mentioned compression recovery can be determined as following.
Sept is spread on sample bench.It is (straight with cylinder using micro-compression tester for the sept of 1 distribution 100 μm of footpath, diamond fabrication) smooth pressure head end face, at 25 DEG C along sept center position assign load (reversion load Value), until 40% compression occurs for sept.Then, carry out except lotus is until origin is with load value (0.40mN).It can determine Load-compression displacement of this period, and compression recovery is tried to achieve according to following formula.In addition, load speed is set to 0.33mN/ seconds.Make For above-mentioned micro-compression tester, manufactured such as usable Fischer Co., Ltd. " Fischer scope H-100 ".
Compression recovery (%)=[(L1-L2)/L1] × 100
L1：From compression displacement of origin load value when assigning load until inverting load value
L2：Lotus displacement is removed from bounce-back load value when discharging load until origin load value
In the above-mentioned weight % of conductive paste 100, the content of above-mentioned sept is preferably more than 0.1 weight %, more preferably More than 0.5 weight %, more preferably more than 1 weight %, preferably below 10 weight %, more preferably below 5 weight %, More preferably below 4 weight %, particularly preferably below 3 weight %.The content of above-mentioned sept is more than above-mentioned lower limit And when below the above-mentioned upper limit, further accurately interelectrode interval can be controlled, can more entered on electrode One step effectively configures scolding tin particle, easily a large amount of configuration scolding tin particles between electrode, and conducting reliability is further improved.
(Thermocurable compound：Thermocurable composition)
Above-mentioned Thermocurable compound is by heating curable compound., can as above-mentioned Thermocurable compound Enumerate：Oxetane compound, epoxide, episulfide compound, (methyl) acyclic compound, phenol chemical combination Thing, amino-compound, unsaturated polyester compound, urethanes, polysiloxane compound and polyimide compound etc.. From the viewpoint of making the curability and viscosity of conductive paste further good and further improving connection reliability, preferably For epoxide.
In the above-mentioned weight % of conductive paste 100, the content of above-mentioned Thermocurable compound is preferably more than 20 weight %, more Preferably more than 40 weight %, more preferably more than 50 weight %, preferably below 99 weight %, more preferably 98 weights Measure below %, particularly preferably more preferably below 90 weight %, below 80 weight %.From further improving impact resistance From the viewpoint of property, the content of above-mentioned Thermocurable composition is The more the better.
(thermal curing agents：Thermocurable composition)
Above-mentioned thermal curing agents make above-mentioned Thermocurable compound heat cure.As above-mentioned thermal curing agents, it can enumerate：Imidazoles is consolidated The polythiol hardeners such as agent, amine hardener, phenol cured agent, polythiol curing agent, acid anhydrides, hot cationic initiator (heat sun from Sub- curing agent) and hot radical producing agent etc..Above-mentioned thermal curing agents can be used alone one kind, can also be applied in combination two kinds with On.
Conductive paste can be made further rapidly to solidify at low temperature, it is therefore preferable that imidazole curing agent, thiol-cured Agent or amine hardener.In addition, when the mixing curability compound curable by heating and above-mentioned thermal curing agents, storage stability Uprise, it is therefore preferable that being latent curing agent.Latent curing agent be preferably latency imidazole curing agent, latency mercaptan consolidate Agent or latency amine hardener.In addition, above-mentioned thermal curing agents can be by the polymer of polyurethane resin or polyester resin etc. Matter is coated.
It is not particularly limited, can enumerates as above-mentioned imidazole curing agent：2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazole trimellitic acid salt, 2,4- diaminourea -6- [2 '-methylimidazoles Base-(1 ')]-ethyl-s-triazine and 2,4- diaminourea -6- [2 '-methylimidazolyl-(1 ')]-ethyl-s-triazine isocyanuric acid add Into thing etc..
It is not particularly limited, can includes as above-mentioned polythiol curing agent：Trimethylolpropane tris -3- mercaptopropionic acids Ester, six -3-thiopropionate of four -3-thiopropionate of pentaerythrite and dipentaerythritol etc..
It is not particularly limited, can enumerates as above-mentioned amine hardener：Hexamethylene diamine, eight methylene diamines, ten methylenes Double (3- aminopropyls) -2,4,8,10- four spiral shell [5.5] hendecanes of base diamines, 3,9-, double (4- aminocyclohexyls) methane, Phenylenediamine and diamino diphenyl sulfone etc..
As above-mentioned hot cationic initiator, can enumerate iodine cationoid curing agent, oxygen cationoid curing agent and Sulphur cationoid curing agent etc..As above-mentioned iodine cationoid curing agent, double (4- tert-butyl-phenyls) iodine six can be enumerated Fluorophosphate etc..As above-mentioned oxygen cationoid curing agent, trimethyl oxygen tetrafluoroborate etc. can be enumerated.It is used as above-mentioned sulfonium Cationoid curing agent, can enumerate three p-methylphenyl sulfonium hexafluorophosphates etc..
As above-mentioned hot radical producing agent, it is not particularly limited, azo-compound and organic peroxide etc. can be enumerated. As above-mentioned azo-compound, azodiisobutyronitrile (AIBN) etc. can be enumerated.As above-mentioned organic peroxide, two uncles can be enumerated Butylperoxide and methyl-ethyl-ketone peroxide etc..
The reaction start temperature of above-mentioned thermal curing agents is preferably more than 50 DEG C, more preferably more than 70 DEG C, further preferably For more than 80 DEG C, preferably less than 250 DEG C, more preferably less than 200 DEG C, more preferably less than 150 DEG C, particularly preferably Less than 140 DEG C.When the reaction start temperature of above-mentioned thermal curing agents is more than above-mentioned lower limit and below the above-mentioned upper limit, by scolding tin particle Further it is efficiently configured on electrode.The reaction start temperature of above-mentioned thermal curing agents is particularly preferably more than 80 DEG C and 140 Below DEG C.
From the viewpoint of scolding tin is further efficiently configured on electrode, the reaction of above-mentioned thermal curing agents starts temperature The fusing point spent preferably than above-mentioned scolding tin particle is high, more preferably high more than 5 DEG C, further preferably high more than 10 DEG C.
The reaction start temperature of above-mentioned thermal curing agents refers to, the temperature begun to ramp up of the exothermal peak in DSC.
The content of above-mentioned thermal curing agents is not particularly limited.It is above-mentioned relative to the above-mentioned parts by weight of Thermocurable compound 100 The content of thermal curing agents is preferably more than 0.01 parts by weight, more than more preferably 1 parts by weight, below preferably 200 parts by weight, more Below preferably 100 parts by weight, below more preferably 75 parts by weight.When the content of thermal curing agents is more than above-mentioned lower limit When, easily conductive paste is fully solidified.When the content of thermal curing agents is below the above-mentioned upper limit, solidification is not used for after hardening Remaining thermal curing agents be difficult residual, and further improve solidfied material heat resistance.
(fluxing agent)
Above-mentioned conductive paste preferably comprises fluxing agent.By the use of fluxing agent, scolding tin can be made further effectively It is configured on electrode.As fluxing agent, the fluxing agent for being generally used for scolding tin combination etc. can be used.Above-mentioned fluxing agent does not have special limit System.As above-mentioned fluxing agent, it can enumerate for example：Zinc chloride, the mixture of zinc chloride and inorganic halides, zinc chloride and inorganic acid Mixture, fuse salt, phosphoric acid, the derivative of phosphoric acid, organohalogen compounds, hydrazine, organic acid and rosin etc..Above-mentioned fluxing agent can be with One kind is used alone, can also be applied in combination two or more.
As above-mentioned fuse salt, ammonium chloride etc. can be enumerated.As above-mentioned organic acid, lactic acid, citric acid, tristearin can be enumerated Acid, glutamic acid and glutaric acid etc..As above-mentioned rosin, activation rosin and disactivation rosin etc. can be enumerated.Above-mentioned fluxing agent is preferred For the organic acid containing two or more carboxyl, rosin.Above-mentioned fluxing agent can be the organic acid containing more than two carboxyls, Can be rosin.By using the organic acid with more than two carboxyls, rosin, further improving interelectrode conducting can By property.
Above-mentioned rosin is the rosin using rosin acid as principal component.Fluxing agent is preferably rosin, more preferably rosin acid. By using the preferred fluxing agent, interelectrode conducting reliability is further improved.
The active temperature (fusing point) of above-mentioned fluxing agent is preferably more than 50 DEG C, more preferably more than 70 DEG C, further preferably For more than 80 DEG C, preferably less than 200 DEG C, more preferably less than 190 DEG C, be still more preferably less than 160 DEG C, further excellent Elect less than 150 DEG C as, be still more preferably less than 140 DEG C.The active temperature of above-mentioned fluxing agent be above-mentioned lower limit more than and on When stating below the upper limit, fluxing agent effect is further effectively played, and scolding tin particle is further efficiently configured to electricity On extremely.The active temperature of above-mentioned fluxing agent is preferably more than 80 DEG C and less than 190 DEG C.The active temperature of above-mentioned fluxing agent is especially excellent Elect more than 80 DEG C and less than 140 DEG C as.
As the above-mentioned fluxing agent that fusing point is more than 80 DEG C and less than 190 DEG C, it can enumerate：Butanedioic acid (186 DEG C of fusing point), penta The dicarboxylic acids such as diacid (96 DEG C of fusing point), adipic acid (152 DEG C of fusing point), pimelic acid (104 DEG C of fusing point), suberic acid (142 DEG C of fusing point), Benzoic acid (122 DEG C of fusing point), malic acid (130 DEG C of fusing point) etc..
In addition, the boiling point of above-mentioned fluxing agent is preferably less than 200 DEG C.
From the viewpoint of scolding tin is further efficiently configured on electrode, the fusing point of above-mentioned fluxing agent is preferably than upper The fusing point for stating scolding tin particle is high, more preferably high more than 5 DEG C, further preferably high more than 10 DEG C.
From the viewpoint of scolding tin is further efficiently configured on electrode, the fusing point of above-mentioned fluxing agent is preferably than upper The reaction start temperature for stating thermal curing agents is high, more preferably high more than 5 DEG C, further preferably high more than 10 DEG C.
By making the fusing point of fluxing agent higher than the fusing point of scolding tin, scolding tin particle can be made effectively to condense in electrode part. This is because, in the case of assigning heat in engagement, to the electrode being formed on connecting object part and the connection of electrode perimeter When the part of object Part is compared, the heat biography of the connecting object element portion of the thermal conductivity ratio electrode perimeter of electrode part Conductance is high, thus, causes being rapidly heated for electrode part.In the stage of the fusing point more than scolding tin particle, the inside of scolding tin particle Dissolving, but the fusing point (active temperature) that the oxide film thereon on surface does not reach fluxing agent is formed at, it is thus impossible to be removed.At this Under state, the temperature of electrode part first reaches the fusing point (active temperature) of fluxing agent, therefore, it can on preferential self-electrode in future The oxide film thereon on the surface of scolding tin particle is removed, and scolding tin particle moistens diffusion on the surface of electrode.Thus, it is possible to make scolding tin grain Son is effectively condensed on electrode.
Above-mentioned fluxing agent can also be scattered in conductive paste, on the surface that can also be attached to scolding tin particle.
Above-mentioned fluxing agent releases the fluxing agent of cation preferably by heating.Cation is released by using based on heating Fluxing agent, scolding tin particle can be made further to be efficiently configured on electrode.
In the above-mentioned weight % of conductive paste 100, the content of above-mentioned fluxing agent is preferably more than 0.5 weight % preferably 30 Below weight %, more preferably below 25 weight %.Above-mentioned conductive paste can not contain fluxing agent.The content of fluxing agent is upper When stating more than lower limit and below the above-mentioned upper limit, further it is difficult to form oxide film thereon on the surface of scolding tin and electrode, also, It further can effectively remove the oxide film thereon for being formed at scolding tin and electrode surface.
(filler)
Filler can be added in above-mentioned conductive paste.Filler can be organic filler or inorganic filler.By filling out The addition of material, can suppress the distance that scolding tin particle condenses, and make scolding tin particle on the whole electrode of substrate equably Cohesion.
In the above-mentioned weight % of conductive paste 100, the content of above-mentioned filler is preferably more than 0 weight % preferably 5 weight % Hereinafter, more preferably below 2 weight %, more preferably below 1 weight %.The content of above-mentioned filler is more than above-mentioned lower limit And when below the above-mentioned upper limit, scolding tin particle is further efficiently configured on electrode.
(other compositions)
Above-mentioned conductive paste can be as needed, for example containing：Filler, extender, softening agent, plasticizer, polymerization are urged It is agent, curing catalysts, colouring agent, antioxidant, heat stabilizer, light stabilizer, ultra-violet absorber, lubricant, anti-quiet The various additives such as electric agent and fire retardant.
(manufacture method of connection structural bodies and connection structural bodies)
The connection structural bodies of the present invention possesses：On surface with least one first electrode the first connecting object part, The second connecting object part with least one second electrode on surface, by above-mentioned first connecting object part and above-mentioned second The connecting portion that connecting object part links together.In the connection structural bodies of the present invention, above-mentioned connecting portion is by above-mentioned electroconductive paste Dosage form is into being the solidfied material of above-mentioned conductive paste.In the connection structural bodies of the present invention, the material of above-mentioned connecting portion is above-mentioned Conductive paste.In the connection structural bodies of the present invention, above-mentioned first electrode and above-mentioned second electrode pass through the weldering in above-mentioned connecting portion Tin portion is electrically connected.Above-mentioned sept preferably with above-mentioned first connecting object part and above-mentioned this pair of second connecting object part Side's contact.
The manufacture method of the connection structural bodies of the present invention possesses：Using above-mentioned conductive paste, there is at least one on surface The process that above-mentioned conductive paste is configured on the surface of first connecting object part of first electrode；Above-mentioned conductive paste with it is upper Stating configuration surface on the opposite surface of the first connecting object component side has the second connecting object portion of at least one second electrode Part, and make above-mentioned first electrode and the opposed process of above-mentioned second electrode；By the way that above-mentioned conductive paste is heated into above-mentioned scolding tin More than the fusing point of particle and more than the solidification temperature of above-mentioned Thermocurable composition, formed using above-mentioned conductive paste by above-mentioned first The connecting portion that connecting object part and above-mentioned second connecting object part link together, and pass through the scolding tin in above-mentioned connecting portion The process that portion is electrically connected to above-mentioned first electrode and above-mentioned second electrode.It is preferred that making above-mentioned sept be connected with above-mentioned first Object Part and this both sides contact of above-mentioned second connecting object part.
In the manufacture method of the connection structural bodies of the present invention and the connection structural bodies of the present invention, specific electroconductive paste is used Agent, therefore, multiple scolding tin particles are easy to concentrate between first electrode and second electrode, can be by multiple scolding tin particles effectively It is configured on electrode (line).In addition, a part for multiple scolding tin particles is difficult to be configured at the region (interval) for not forming electrode, The amount for the scolding tin particle that can make to be configured at the region for not forming electrode is considerably less.It is thus possible to improve first electrode and Conducting reliability between two electrodes.Furthermore, it is possible to being electrically connected between preventing the adjacent electrode on the transverse direction that can not be attached Connect, insulating reliability can be improved.
From the viewpoint of conducting reliability is further improved, to above-mentioned first electrode and the progress of above-mentioned second electrode During electrical connection, it is preferably heated to more than the fusing point of above-mentioned scolding tin particle and more than the solidification temperature of above-mentioned Thermocurable composition, make Multiple above-mentioned scolding tin particle coacervations and integration.
In addition, it was found by the inventors of the present invention that in order to which multiple scolding tin particles are efficiently configured on electrode, and make configuration It is considerably less in the amount of the scolding tin particle in the region for not forming electrode, without using conducting film, and need to use conductive paste.
In the present invention, further interelectrode other methods can be effectively concentrated on using by multiple scolding tin particles.Make For multiple scolding tin particles are effectively concentrated into interelectrode method, following method can be enumerated：To the first connecting object part and When conductive paste between second connecting object part assigns heat, the viscosity of conductive paste is set reduce by heat, thus, generation the Convection current of conductive paste between one connecting object part and the second connecting object part etc..In this method, it can enumerate：By even The method for connecing the difference of the thermal capacity between the electrode and surface elements in addition on object Part surface and producing convection current；It is logical Overheat the method that the moisture of connecting object part is made vapor and produces convection current；And by the first connecting object part and Temperature difference between second connecting object part produces method of convection current etc..Thus, it is possible to make the scolding tin particle in conductive paste Effectively it is moved to electrode surface.
, can be further using the method condensed with making scolding tin particle selection in electrode surface in the present invention.As making The method in electrode surface is condensed to scolding tin particle selection, can be enumerated：The wettability of scolding tin particle of the selection by melting is good Electrode material and melting scolding tin particle wettability difference the formation of other Facing materials connecting object part, and make arrival Electrode is attached to the scolding tin particle selection of the melting of electrode surface, relative to the scolding tin particle of the melting, makes other scolding tin Pellet melting and the method adhered to；Select other Facing material shapes by the good electrode material of heat conductivity and heat conductivity difference Into connecting object part, assign heat when, electrode temperature is raised relative to other surface elements, thus, selecting property in electrode The method of upper choosing melting scolding tin；Using treated scolding tin particle, make scolding tin particle relative in the electrode formed by metal Present on negative electrical charge there is positive charge, condense in the method on electrode with making scolding tin particle selection；And relative to The electrode on hydrophilic metal surface, hydrophobicity is set to by the resin beyond the scolding tin particle in conductive paste, thus, makes scolding tin grain Son is optionally condensed in method on electrode etc..
Be preferably more than 10 μm in the thickness of interelectrode solder sections, more preferably more than 20 μm, preferably 100 μm with Under, more preferably less than 80 μm.(scolding tin in the area 100% that electrode exposes connects scolding tin wetted area on the surface of electrode Tactile area) be preferably more than 50%, more preferably more than 60%, more preferably more than 70%, preferably 100% with Under.
In the manufacture method of the connection structural bodies of the present invention, preferably configure the process of above-mentioned second connecting object part and In the process for forming above-mentioned connecting portion, the weight of above-mentioned second connecting object part is applied on above-mentioned conductive paste without entering Row pressurization, or at least one work in the process of above-mentioned the second connecting object of configuration part and the process of the above-mentioned connecting portion of formation Pressurizeed in sequence, and above-mentioned the second connecting object of configuration part process and form the process of above-mentioned connecting portion the two works In sequence, the pressure of pressurization is less than
1MPa.By not applying the pressure that more than 1MPa pressurizes, the cohesion of scolding tin particle can be promoted.From suppression connecting object From the viewpoint of the warpage of part, in the manufacture method of connection structural bodies of the invention, above-mentioned second connection pair can configured As being pressurizeed at least one process in the process of part and the process of the above-mentioned connecting portion of formation, and in configuration above-mentioned second The process of connecting object part and formed in the process of above-mentioned connecting portion the two processes, the pressure of pressurization is less than 1MPa.Entering In the case of row pressurization, only it can be pressurizeed in the process for configuring above-mentioned second connecting object part, can also be only in shape Pressurizeed into the process of above-mentioned connecting portion, the process of above-mentioned second connecting object part can also configured and formed above-mentioned In the two processes of the process of connecting portion, pressurizeed.The pressure of pressurization is less than in 1MPa non-pressurized situation that includes.Carrying out In the case of pressurization, the pressure of pressurization is preferably below 0.9MPa, more preferably below 0.8MPa.It is in the pressure of pressurization In the case of below 0.8MPa, compared with the pressure of pressurization exceedes 0.8MPa situation, scolding tin grain is further obviously promoted The cohesion of son.
In the manufacture method of the connection structural bodies of the present invention, preferably configure the process of above-mentioned second connecting object part and Formed in the process of above-mentioned connecting portion without pressurization, apply the weight of above-mentioned second connecting object part to above-mentioned conductive paste Amount, is preferably configuring the process of above-mentioned second connecting object part and is being formed in the process of above-mentioned connecting portion, not to above-mentioned conduction Paste applies the moulding pressure of the power more than above-mentioned second connecting object component weight.In situations such as these, in multiple scolding tin In portion, the uniformity of soldering tin amount can be further improved.And it is possible to the thickness of solder sections is further effectively thickened, It is easy to make multiple scolding tin particles largely concentrate between electrode, multiple scolding tin particles can be further efficiently configured to electrode On (line).In addition, a part for multiple scolding tin particles is difficult to be configured at the region (interval) for not forming electrode, it can more enter one Step reduces the amount for the scolding tin particle for being configured at the region for not forming electrode.It therefore, it can further improve interelectrode lead Logical reliability.Furthermore, it is possible to the electrical connection between the adjacent electrode on the transverse direction that can not be attached further is prevented, and can Further to improve insulating reliability.
In addition, the present inventors have additionally discovered that, if configuring the process of above-mentioned second connecting object part and forming above-mentioned company Without pressurization in the process of socket part, and apply the weight of above-mentioned second connecting object part to above-mentioned conductive paste, then in shape Into before connecting portion, the scolding tin particle for being configured at the region (interval) for not forming electrode is further easy to concentrate on the first electricity Between pole and second electrode, multiple scolding tin particles can be further efficiently configured on electrode (line).In the present invention, group Close and the effect for obtaining the present invention is significant using following constitute：Using the composition of conductive paste, and without using leading Electrolemma, applies the composition of the weight of above-mentioned second connecting object part to above-mentioned conductive paste, and without pressurization.
In addition, in WO2008/023452A1, describe from promoting solder powder along electrode surface and move with being effective Viewpoint is set out, and can be pressurizeed in welding with specified pressure, and describe from the sight that soldering tin is formed more reliably Point sets out, and moulding pressure is adjusted to such as more than 0MPa, preferably more than 1MPa, even if also describing apply intentional to jointing tape Pressure be 0MPa, due to the deadweight of part being configured on jointing tape, the pressure that specify can also be applied to splicing tape. In WO2008/023452A1, it can be 0MPa to describe to the pressure of the intentional application of jointing tape, but to applying more than 0MPa The difference of the situation of pressure and the effect for the situation for being adjusted to 0MPa does not have any record.In addition, in WO2008/023452A1, To using being not membranaceous but the importance of the conductive paste of pasty state does not have any understanding.
In addition, if without using conducting film, and use conductive paste, then easily according to the coating weight of conductive paste, adjustment The thickness of connecting portion and solder sections.On the other hand, there are the following problems in conducting film：For the thickness of variations or modifications connecting portion Degree, it is necessary to prepare the conducting film of different-thickness or prepare the conducting film of appointed thickness.In addition, there are the following problems in conducting film： Under the melting temperature of scolding tin, it is impossible to which making the melt viscosity of conducting film fully reduces, so as to hinder the cohesion of scolding tin particle.
Hereinafter, with reference to the accompanying drawings of specific embodiment of the present invention.
Fig. 1 is to schematically show cuing open for the connection structural bodies that is obtained using the conductive paste of one embodiment of the present invention View.
Connection structural bodies 1 shown in Fig. 1 possesses：First connecting object part 2, the second connecting object part 3, by first connect Connect the connecting portion 4 that the connecting object part 3 of object Part 2 and second links together.Connecting portion 4 is by containing Thermocurable chemical combination Thing, thermal curing agents, the conductive paste of multiple scolding tin particles and multiple septs 5 are formed.Above-mentioned Thermocurable compound and above-mentioned Thermal curing agents are Thermocurable composition.
Connecting portion 4 have multiple scolding tin particles concentrate and be bonded with each other solder sections 4A, make Thermocurable composition heat The solidfied material portion 4B and sept 5 being solidified to form.
There are multiple first electrode 2a on the surface (upper surface) of first connecting object part 2.Second connecting object part 3 Surface (lower surface) on have multiple second electrode 3a.First electrode 2a and second electrode 3a realize electricity by solder sections 4A Connection.Therefore, the first connecting object part 2 and the second connecting object part 3 realize electrical connection by solder sections 4A.In addition, In connecting portion 4, in region (the solidfied material portion 4B different from concentrating on the solder sections 4A between first electrode 2a and second electrode 3a Part) in, in the absence of scolding tin.In the region (solidfied material portion 4B part) different from solder sections 4A, in the absence of disengaging solder sections 4A scolding tin.In addition, if a small amount of, then scolding tin be may reside in and be concentrated between first electrode 2a and second electrode 3a Regions (solidfied material portion 4B parts) different solder sections 4A.
The first electrode 2a of the connecting object part 2 of the sept 5 and first and second electrode 3a of the second connecting object part 3 This both sides connects.Using sept 5, the interval of the first connecting object part 2 of limitation and the second connecting object part 3, and limit First electrode 2a and second electrode 3a interval.Sept 5 can be with being not provided with the first electrode of the first connecting object part 2 2a region and it is not provided with the two regions of the second electrode 3a region of the second connecting object part 3 and connects.
As shown in figure 1, in connection structural bodies 1, multiple scolding tin particles are assembled between first electrode 2a and second electrode 3a, After multiple scolding tin pellet meltings, solidify after the fused mass wetting electrode surface of scolding tin particle and diffusion, so as to form scolding tin Portion 4A.Therefore, solder sections 4A and first electrode 2a and solder sections 4A and second electrode 3a connection area become big.That is, pass through Use scolding tin particle, compared with the situation of electroconductive particle for using the outer surface of electric conductivity being the metals such as nickel, gold or copper, scolding tin Portion 4A and first electrode 2a, and solder sections 4A and second electrode 3a contact area become big.Therefore, in connection structural bodies 1 Turn on reliability and connection reliability is improved.In addition, conductive paste can contain fluxing agent.In the case of using fluxing agent, Generally, fluxing agent can gradually be inactivated due to heating.
In addition, in connection structural bodies 1 shown in Fig. 1, solder sections 4A is entirely located between first electrode 2a, second electrode 3a Opposed region.In the connection structural bodies 1X of variation shown in Fig. 3, the connection structural bodies 1 shown in only connecting portion 4X and Fig. 1 is not Together.Connecting portion 4X has solder sections 4XA, solidfied material portion 4XB and sept 5X.Can be as connection structural bodies 1X, a large amount of welderings Tin portion 4XA is located at the opposed region of first electrode 2a, second electrode 3a, and a solder sections 4XA part is from first electrode 2a, second Expose to side in region opposed electrode 3a.The scolding tin exposed from first electrode 2a and the opposed regions of second electrode 3a to side Portion 4XA is a solder sections 4XA part, is not the scolding tin for departing from solder sections 4XA.In addition, in present embodiment, it is possible to reduce de- Scolding tin from the amount of the scolding tin of solder sections, but disengaging solder sections may reside in solidfied material portion.
If reducing the usage amount of scolding tin particle, connection structural bodies 1 is readily obtained.If increasing the use of scolding tin particle Amount, then be readily obtained connection structural bodies 1X.As long as in addition, scolding tin moistens diffusion on the surface of electrode, scolding tin can also Between electrode above and below not necessarily concentrating on.
Furthermore it is possible to which connection structural bodies 1Y as shown in Figure 4 like that, is connected using the first connecting object part 2Y and second Object Part 3Y, the surface of the first connecting object part 2Y has first electrode 2a, and not having in first electrode 2a sides First electrode 2a region has the first convex portion 2y, and the surface of the second connecting object part 3Y has second electrode 3a, and There is the second convex portion 3y in the region without second electrode 3a of second electrode 3a sides.First convex portion 2y is more prominent than first electrode 2a Go out.Second convex portion 3y is more prominent than second electrode 3a.First convex portion 2y and the second convex portion 3y interval are than first electrode 2a and Two electrode 3a interval is narrow.In connection structural bodies 1Y, connecting portion 4Y has solder sections 4YA, solidfied material portion 4YB and sept 5Y.In connection structural bodies 1Y, sept 5Y and the first convex portion 2y and second convex portion 3y this both sides contact.As a result, the first electricity Pole 2a and second electrode 3a interval are limited by sept 5Y.
From the viewpoint of conducting reliability is further improved, along above-mentioned first electrode, above-mentioned connecting portion and above-mentioned When the stack direction of second electrode observes above-mentioned first electrode and above-mentioned second electrode opposed part, preferably in the above-mentioned first electricity More than 50% in the area 100% of pole and the opposed part of above-mentioned second electrode (is preferably more than 60%, more preferably 70% More than, more preferably more than 80%, particularly preferably more than 90%) it is configured with the solder sections in above-mentioned connecting portion.
From further improve conducting reliability from the viewpoint of, preferably along with above-mentioned first electrode, above-mentioned connecting portion Observe above-mentioned first electrode, the opposite part of above-mentioned second electrode in the direction vertical with the stack direction of above-mentioned second electrode When, it is configured with 70% of the solder sections in above-mentioned connecting portion in the above-mentioned first electrode part opposite with above-mentioned second electrode More than.
Then, using the conductive paste of one embodiment of the present invention, manufacture the method for connection structural bodies 1 one is illustrated Example.
First, the first connecting object part 2 on surface (upper surface) with first electrode 2a is prepared.Then, such as Fig. 2 (a) shown in, on the surface of the first connecting object part 2 configuration containing Thermocurable composition 11B and multiple scolding tin particle 11A, The conductive paste 11 (the first process) of sept 5.Configured on the surface provided with first electrode 2a of the first connecting object part 2 Conductive paste 11.Configure after conductive paste 11, scolding tin particle 11A is configured at first electrode 2a (line) and does not form first electrode 2a region (interval) the two regions.
As the collocation method of conductive paste 11, it is not particularly limited, the coating carried out using point gum machine, silk screen can be enumerated Printing and the spraying that passes through ink discharge device etc..
In addition, preparing the second connecting object part 3 on surface (lower surface) with second electrode 3a.Then, such as Fig. 2 (b) shown in, in the conductive paste 11 on the surface of the first connecting object part 2, in conductive paste 11 and the first connecting object The second connecting object part 3 (the second process) is configured on the surface of the side opposite side of part 2.On the surface of conductive paste 11, The second connecting object part 3 is configured from second electrode 3a sides.Now, make first electrode 2a and second electrode 3a opposed.
Then, by conductive paste 11 be heated to more than scolding tin particle 11A fusing point and Thermocurable composition 11B solidification temperature More than degree (the 3rd process).That is, conductive paste 11 is heated to fusing point than scolding tin particle 11A and Thermocurable composition 11B It is more than the lower temperature in solidification temperature.In the heating, the scolding tin particle 11A for being present in the region for not forming electrode exists (self-coagulation effect) is concentrated between first electrode 2a and second electrode 3a.In present embodiment, using conductive paste, and without using Conducting film, therefore, conductive paste also have specific composition, and scolding tin particle 11A is between first electrode 2a and second electrode 3a Effectively condense.In addition, scolding tin particle 11A is melted and be combined with each other.In addition, Thermocurable composition 11B carries out heat cure.The knot Really, shown in such as Fig. 2 (c), the formation of conductive paste 11 the first connecting object part 2 of connection and the second connecting object part 3 are utilized Connecting portion 4.Using the formation connecting portion 4 of conductive paste 11, combined by multiple scolding tin particle 11A and form solder sections 4A, passed through Thermocurable composition 11B carries out heat cure and forms solidfied material portion 4B.If scolding tin particle 11A is fully moved, from positioned at After the mobile beginning of scolding tin particle 11A between one electrode 2a and second electrode 3a, until scolding tin particle 11A is moved to the first electricity Terminate between pole 2a and second electrode 3a, temperature can not be kept into necessarily.
For present embodiment, in above-mentioned second process and above-mentioned 3rd process, without pressurization.Present embodiment In, apply the weight of the second connecting object part 3 to conductive paste 11.Therefore, when forming connecting portion 4, scolding tin particle 11A has Concentrate between first electrode 2a and second electrode 3a to effect.In addition, connecting portion 4X have solder sections 4XA, solidfied material portion 4XB and Sept 5.Pass through scolding tin particle 11A aggregation, it is easy to extrude sept 5.When forming connecting portion 4, sept 5 can be with the One connecting object part 2 and the second this both sides contact of connecting object part 3.Specifically, when forming connecting portion 4, sept 5 It can be contacted with first electrode 2a and second electrode 3a this both sides.If in addition, in above-mentioned second process and above-mentioned 3rd process In at least one party pressurizeed, then the tendency of effect for hindering scolding tin particle to concentrate between first electrode and second electrode Uprise.The situation by the inventors discovered that.
In addition, in present embodiment, without pressurization, therefore, being coated with the first connecting object part of conductive paste During the second connecting object part of upper coincidence, even in the electricity of the electrode of the first connecting object part and the second connecting object part The state of the calibration dislocation of pole, in the case of making the first connecting object part and the second connecting object part overlapping, can also be repaiied The just dislocation, and make the electrode connection (self calibration effect) of the electrode and the second connecting object part of the first connecting object part. This is because, between the electrode of the first connecting object part and the electrode of the second connecting object part the melting of self-coagulation weldering In tin, scolding tin and conductive paste between the electrode of the electrode of the first connecting object part and the second connecting object part it is other The energy stabilization of the area minimum of composition contact, therefore, becomes the connection after the calibration as the attachment structure of minimum area The power of structure plays a role.Now, preferably conductive paste was not solidified and in the temperature, time, the scolding tin grain of conductive paste The viscosity of composition beyond son is substantially low.
Sept is present between the first connecting object part and the second connecting object part, it is possible thereby to substantially ensure that The distance between electrode of the electrode of one connecting object part and the second connecting object part.Thus, it can be ensured that scolding tin particle coagulates Poly- space, it is possible to improve the coherency of scolding tin particle.Furthermore it is possible to connect in the electrode of the first connecting object part and second Sufficient soldering tin amount is ensured between the electrode for connecing object Part, therefore, in the case that relative malposition of electrode is overlapping, from Calibration effect is also easy to show.The magnitude of misalignment of preferred electrode after on being conductively connected, electrode width is being set to L situation Under, preferably more than 0L (more than 0), more preferably preferably below 0.9L, below 0.75L.In addition, on excellent after electrical connection The magnitude of misalignment X of choosing, in the case where the particle footpath of sept is set into R, preferably more than 0R (more than 0), preferably below 3R, More preferably below 2R.
The viscosity of conductive paste under the melting temperature of scolding tin is preferably below 50Pas, more preferably
Below 10Pas, more preferably below 1Pas, preferably more than 0.1Pas, more preferably 0.2Pa More than s.Below specified viscosity, then scolding tin particle can be made effectively to condense, more than specified viscosity, then The space of connecting portion can be suppressed, and suppression conductive paste is spilled over to beyond connecting portion.
As described above, can obtain the connection structural bodies 1 shown in Fig. 1.In addition, above-mentioned second process and above-mentioned 3rd process can To be carried out continuously.Furthermore it is possible to after above-mentioned second process is carried out, so as to get the first connecting object part 2, conductive paste 11 Heating part is transferred to the laminated body of the second connecting object part 3, above-mentioned 3rd process is carried out., can in order to carry out above-mentioned heating To configure above-mentioned laminated body on heater block, above-mentioned laminated body can also be configured in the space of heating.
As long as it is more than the fusing point of the heating-up temperature scolding tin particle in above-mentioned 3rd process and Thermocurable composition solidification More than temperature, it is not particularly limited.Above-mentioned heating-up temperature is preferably more than 140 DEG C, more preferably more than 160 DEG C, preferably For less than 450 DEG C, more preferably less than 250 DEG C, more preferably less than 200 DEG C.
Before the 3rd process, in order that the cohesion homogenization of the scolding tin particle before melting, can set heating process.On It is preferably more than 60 DEG C to state the heating-up temperature in heating process, more preferably more than 80 DEG C, preferably less than 130 DEG C, more preferably Under less than 120 DEG C of temperature conditionss, preferably to keep more than 5 seconds, preferably kept for less than 120 seconds.Pass through the heating process, thermosetting The property changed composition lowering viscousity, scolding tin particle coacervation before melting by heat, thus, it is possible to eyed structure is formed, and the 3rd When scolding tin pellet melting condenses in process, uncongealed scolding tin particle is reduced.
In 3rd process, preferably more than the fusing point (DEG C) of scolding tin, more preferably more than+5 DEG C of the fusing point (DEG C) of scolding tin is excellent Elect as below+20 DEG C of the fusing point (DEG C) of scolding tin, more preferably at the temperature below+10 DEG C of the fusing point (DEG C) of scolding tin, preferably keep More than 10 seconds, after preferably being kept for less than 120 seconds, the solidification temperature of Thermocurable composition can be warming up to.Thus, it is possible in thermosetting In the state of the viscosity of before the property changed composition solidification, Thermocurable composition is relatively low, terminates the cohesion of scolding tin particle, can carry out The cohesion of further uniform scolding tin particle.
Programming rate in 3rd process, on the heating from 30 DEG C to the fusing point of scolding tin particle, preferably 50 DEG C/sec with Under, more preferably less than 20 DEG C/sec, more preferably less than 10 DEG C/sec, preferably more than 1 DEG C/sec, more preferably 5 DEG C/ More than second.When programming rate is more than above-mentioned lower limit, the cohesion of scolding tin particle is further uniform.When programming rate is above-mentioned When below the upper limit, suppress excess stickiness caused by the solidification growth of Thermocurable composition and rise, be difficult to hinder the solidifying of scolding tin particle It is poly-.
In addition, after above-mentioned 3rd process, for the purpose of the repeatability of the amendment of position and manufacture, can be peeled off from connecting portion First connecting object part or the second connecting object part.Heating-up temperature for carrying out the stripping is preferably the molten of scolding tin particle It is more than point, more preferably more than+10 DEG C of the fusing point (DEG C) of scolding tin particle.Heating-up temperature for carrying out the stripping can be scolding tin Below+100 DEG C of the fusing point (DEG C) of particle.
As the heating means in above-mentioned 3rd process, it can enumerate more than the fusing point of scolding tin particle and Thermocurable composition Solidification temperature more than, using reflow ovens or use baking box, the method integrally heated to connection structural bodies, or only partly The method heated to the connecting portion of connection structural bodies.
As utensil used in the method for local heating, it can enumerate：Heating plate, assign the heat gun of hot blast, flatiron and Infrared heater etc..
In addition, when carrying out local heating using heating plate, being preferably as follows to form heating plate upper surface：Immediately below connecting portion Formed using the higher metal of heat conductivity, other positions preferably do not heated are relatively low using heat conductivities such as fluororesin Material is formed.
Above-mentioned first, second connecting object part is not particularly limited.As above-mentioned first, second connecting object part, Specifically, it can enumerate：The electronics zero such as semiconductor chip, semiconductor packages, LED chip, LED encapsulation, capacitor and diode Part and resin film, printed base plate, flexible printing substrate, flexble flat's cable, rigid-flexible combination substrate, glass epoxy substrate and Electronic component of the circuit substrates such as glass substrate etc. etc..Above-mentioned first, second connecting object part is preferably electronic unit.
At least one connecting object part in above-mentioned first connecting object part and above-mentioned second connecting object part is excellent Elect resin film, flexible printing substrate, flexble flat's cable or rigid-flexible combination substrate as.Above-mentioned second connecting object part is preferably Resin film, flexible printing substrate, flexble flat's cable or rigid-flexible combination substrate.Resin film, flexible printing substrate, flexble flat's line Cable and rigid-flexible combination substrate have flexibility high and than the property of relatively lightweight.Conducting film is being used for this connecting object part In the case of connection, it is difficult to concentrate on the tendency on electrode with scolding tin particle.In contrast, even if using resin film, flexibility Printed base plate, flexble flat's cable or rigid-flexible combination substrate, can also be such that scolding tin particle effectively collects by using conductive paste In on electrode, so as to fully improve interelectrode conducting reliability.Using resin film, flexible printing substrate, flexble flat In the case of cable or rigid-flexible combination substrate, compared with having used the situation of other connecting object parts such as semiconductor chip, no The raising effect for the interelectrode conducting reliability pressurizeed can be further enhanced.
As the electrode located at above-mentioned connecting object part, it can enumerate：Gold electrode, nickel electrode, tin electrode, aluminium electrode, copper The metal electrodes such as electrode, molybdenum electrode, silver electrode, SUS electrodes and tungsten electrode.It is flexible printing substrate in above-mentioned connecting object part In the case of, above-mentioned electrode is preferably gold electrode, nickel electrode, tin electrode, silver electrode or copper electrode.In above-mentioned connecting object part In the case of for glass substrate, above-mentioned electrode is preferably aluminium electrode, copper electrode, molybdenum electrode, silver electrode or tungsten electrode.In addition, Can be the electrode or the surface in metal oxide layer only formed by aluminium in the case that above-mentioned electrode is aluminium electrode The electrode of lamination aluminium lamination.As the material of above-mentioned metal oxide layer, it can enumerate：Doped with the oxygen of trivalent metallic element Change indium and the zinc oxide doped with trivalent metallic element etc..As above-mentioned trivalent metallic element, it can enumerate：Sn, Al and Ga etc..
Above-mentioned first electrode and above-mentioned second electrode are preferably with face battle array or periphery configuration.By electrode with face battle array, periphery simultaneously In the case of being configured according to face, the effect of the present invention is more effectively played.Face battle array is the electrode configuration in connecting object part On face, the structure of electrode is configured to clathrate.Periphery is the structure in the peripheral part configuration electrode of connecting object part.By electricity In the case of the structure arranged pole comb type, as long as scolding tin particle condenses along the direction vertical with comb, phase therewith It is right, it is necessary to equably condense scolding tin particle in the entire surface of configuration electrode in said structure, therefore, in existing method, Soldering tin amount is easily uneven, in contrast, in method of the invention, more effectively plays the effect of the present invention.
Hereinafter, embodiment and comparative example are enumerated, the present invention is specifically described.The present invention is not limited to following implementation Example.
Polymer A：
The reactant (polymer A) of Bisphenol F and 1,6-HD diglycidyl ether and bisphenol f type epoxy resin Synthesis：
Bisphenol F (is contained 2 with weight ratio meter:3:The 4,4 ' of 1-methylene bis-phenol, 2,4 '-methylene bis-phenol and 2,2 '-Asia Methyl bisphenol) (DIC plants of 100 parts by weight, the parts by weight of 1,6-HD diglycidyl ether 130 and bisphenol f type epoxy resin Formula commercial firm manufacture " EPICLON EXA-830CRP ") 5 parts by weight, resorcinol type epoxide (Chemtex plants of Nagase Formula commercial firm manufactures " EX-201 ") 10 parts by weight are put into 3 mouthfuls of flasks, under nitrogen flowing, with 100 DEG C of dissolvings.Then, conduct is added The parts by weight of triphenylbut base phosphonium bromide 0.15 of hydroxyl and the addition reaction catalyst of epoxy radicals, under nitrogen flowing, are added with 140 DEG C Into polymerisation 4 hours, thus, reactant (polymer A) is obtained.
By NMR, confirmation has carried out polyaddition reaction, further acknowledges that reactant (polymer A) has on main chain The knot being bonded from the hydroxyl of Bisphenol F with the epoxy radicals of 1,6-HD diglycidyl ether and bisphenol f type epoxy resin Structure unit, and there is epoxy radicals in two ends.
Weight average molecular weight by the obtained reactants (polymer A) of GPC is 28000, and number mean molecule quantity is 8000.
Polymer B：Two terminal epoxy groups rigid backbone phenoxy resins, Mitsubishi chemical Co., Ltd's manufacture " YX6900BH45 ", weight average molecular weight 16000
Thermocurable compound 1：Resorcinol type epoxide, Nagase Chemtex Co., Ltd. manufacture " EX- 201”
Thermocurable compound 2：Epoxide, Dainippon Ink Chemicals's manufacture " EXA-4850-150 ", molecular weight 900, ring Oxygen equivalent 450g/eq
Thermal curing agents 1：Trimethylolpropane tris (3-thiopropionate), SC organic chemistry Co., Ltd. manufacture " TMMP "
Latency epoxy thermosetting agent 1：T＆KTOKA Co., Ltd. manufactures " Fujicure7000 "
Fluxing agent 1：Glutaric acid, Wako Pure Chemical Industries, Ltd.'s manufacture, 96 DEG C of fusing point (active temperature)
The preparation method of scolding tin particle 1~3：
Scolding tin particle with anionic polymer 1：Scolding tin particle main body of being weighed in three-necked flask 200g, adipic acid 40g, acetone 70g, then, addition 0.3g Dibutyltin oxides are used as the hydroxyl of scolding tin particle body surfaces and the carboxyl of adipic acid The catalyst of dehydrating condensation is carried out, is reacted 4 hours at 60 DEG C.Then, reclaimed by filtering scolding tin particle.
Weigh scolding tin particle, adipic acid 50g, toluene 200g, the p-methyl benzenesulfonic acid 0.3g of recovery in three-necked flask, on one side Vacuumized and flowed back, while being reacted 3 hours at 120 DEG C.Now, using Dean-Stark extraction elements, and on one side The water generated by dehydrating condensation is removed while being reacted.
Then, scolding tin particle is recovered by filtration, hexane washing and drying is utilized.Then, crushed and obtained using ball mill Scolding tin particle after, selection screen cloth become the CV values specified.
(zeta potential measure)
In addition, the scolding tin particle 0.05g by obtained scolding tin particle, with anionic polymer 1 is put into methanol 10g, And ultrasonication is carried out, thus, it is uniformly dispersed, obtains dispersion liquid.Using the dispersion liquid, and use Beckman Coulter companies manufacture " Delsamax PRO ", zeta potential is determined by electrophoresis assays.
(weight average molecular weight of anionic polymer)
For the weight average molecular weight of the anionic polymer 1 on the surface of scolding tin particle, 0.1N hydrochloric acid, dissolving weldering are used After tin, polymer is recovered by filtration, and try to achieve by GPC.
(the CV values of scolding tin particle)
CV values utilize laser diffraction formula particle size distribution device (" LA-920 " of Horiba Ltd's manufacture) It is measured.
(SnBi scolding tin particles, 139 DEG C of fusing point enter scolding tin particle 1 using to " ST-3 " that Co., Ltd. of Mitsui Metal Co., Ltd. manufactures Go scolding tin particle main body obtained from sorting, and the scolding tin particle with surface treated anionic polymer 1, it is average 4 μm of particle diameter, CV values 7%, the zeta potential on surface：+ 0.65mV, polymer molecular weight Mw=6500)
(SnBi scolding tin particles, 139 DEG C of fusing point enter scolding tin particle 2 using to " DS10 " that Co., Ltd. of Mitsui Metal Co., Ltd. manufactures Gone sorting scolding tin particle main body, and with surface treated anionic polymer 1 scolding tin particle, average grain diameter 13 μm, CV values 20%, the zeta potential on surface：+ 0.48mV, polymer molecular weight Mw=7000)
(SnBi scolding tin particles, 139 DEG C of fusing point use " 10-25 " manufactured to Co., Ltd. of Mitsui Metal Co., Ltd. to scolding tin particle 3 The scolding tin particle main body sorted, and the scolding tin particle with surface treated anionic polymer 1, average grain diameter 25 μm, CV values 15%, the zeta potential on surface：+ 0.4mV, polymer molecular weight Mw=8000)
(SnBi scolding tin particles, 139 DEG C of fusing point enter scolding tin particle 4 using to " ST-3 " that Co., Ltd. of Mitsui Metal Co., Ltd. manufactures Go scolding tin particle main body obtained from sorting, and the scolding tin particle with surface treated anionic polymer 1, it is average 3 μm of particle diameter, CV values 7%, the zeta potential on surface：+ 0.65mV, polymer molecular weight Mw=6500)
Electroconductive particle 1：The layers of copper that thickness is 1 μm is formed with the surface of resin particle, and on the surface of the layers of copper On be formed with the soldering-tin layer (tin of 3 μm of thickness:The weight % of bismuth=43:57 weight %) electroconductive particle
The preparation method of electroconductive particle 1：
To 10 μm of divinylbenzene resin particle (Sekisui Chemical Co., Ltd's manufacture of average grain diameter " MICROPEARL SP-210 ") process for electroless nickel plating is carried out, the substrate nickel plating of 0.1 μm of thickness is formed on the surface of resin particle Layer.Then, electrolytic copper plating is carried out to the resin particle for being formed with substrate nickel coating, forms the layers of copper of 1 μm of thickness.Further use Electrolysis plating solution containing tin and bismuth, carries out electrolysis plating, forms the soldering-tin layer of 3 μm of thickness.So, it is produced on resin particle Layers of copper that thickness is 1 μm is formed with surface and the soldering-tin layer (tin of 3 μm of thickness is formed with the surface of the layers of copper:Bismuth=43 Weight %:57 weight %) electroconductive particle 1.
Sept 1 (20 μm of average grain diameter, CV values 5%, 330 DEG C of softening point, Sekisui Chemical Co., Ltd's manufacture, two Vinyl benzene crosslinked particle, 10%K values 4400N/mm2, compression recovery 55%)
Sept 2 (30 μm of average grain diameter, CV values 5%, 330 DEG C of softening point, Sekisui Chemical Co., Ltd's manufacture, two Vinyl benzene crosslinked particle, 10%K values 4200N/mm2, compression recovery 54%)
Sept 3 (50 μm of average grain diameter, CV values 5%, 330 DEG C of softening point, Sekisui Chemical Co., Ltd's manufacture, two Vinyl benzene crosslinked particle, 10%K values 4100N/mm2, compression recovery 54%)
Phenoxy resin (Nippon Steel ＆ Sumitomo Metal Corporation manufactures " YP-50S ")
(embodiment 1~10)
(1) making of anisotropic conductive paste
Composition shown in table 1 below is coordinated with the use level shown in table 1 below, anisotropic conductive paste is obtained.
The making of (2) first connection structural bodies (L/S=50 μm/50 μm)
Preparing upper surface has the copper electrode pattern (thickness 12 of copper electrode that L/S is 50 μm/50 μm, electrode length is 3mm μm) glass epoxy substrate (FR-4 substrates) (the first connecting object part).In addition, preparing lower surface there is L/S to be 50 μm/50 μm, electrode length for 3mm copper electrode pattern (12 μm of the thickness of copper electrode) flexible printing substrate (the second connecting object portion Part).
The glass epoxy substrate area overlapping with flexible printing substrate is set to 1.5cm × 3mm, and the number of electrodes of connection is set to 75 It is right.
In the upper surface of above-mentioned glass epoxy substrate, using metal mask, be coated by silk-screen printing, formed it is each to Different in nature electroconductive paste oxidant layer, it is 100 μm of thickness on the electrode of glass epoxy substrate to make the anisotropic conductive paste after just making. Then, in the above-mentioned flexible printing substrate of upper surface lamination of anisotropic conductive paste layer, make electrode opposite each other.Now, no Pressurizeed.Apply the weight of above-mentioned flexible printing substrate to anisotropic conductive paste layer.Then, while carrying out heating makes respectively The temperature of anisotropy electroconductive paste oxidant layer turns into 190 DEG C, while melting scolding tin, and makes anisotropic conductive paste layer at 190 DEG C It is lower solidify within 10 seconds, obtain the first connection structural bodies.
The making of (3) second connection structural bodies (L/S=75 μm/75 μm)
Preparing upper surface has the copper electrode pattern (thickness 12 of copper electrode that L/S is 75 μm/75 μm, electrode length is 3mm μm) glass epoxy substrate (FR-4 substrates) (the first connecting object part).In addition, preparing lower surface there is L/S to be 75 μm/75 μm, the flexible printing substrate (the second connecting object part) of electrode length 3mm copper electrode pattern (12 μm of the thickness of copper electrode).
In addition to the above-mentioned glass epoxy substrate and flexible printing substrate different using L/S, with the first connection structural bodies Making it is same, obtain the second connection structural bodies.
The making of (4) the 3rd connection structural bodies (L/S=100 μm/100 μm)
Preparing upper surface has the copper electrode pattern (thickness of copper electrode that L/S is 100 μm/100 μm, electrode length is 3mm 12 μm) glass epoxy substrate (FR-4 substrates) (the first connecting object part).In addition, preparing lower surface there is L/S to be 100 μ M/100 μm, flexible printing substrate (the second connection pair for the copper electrode pattern (12 μm of the thickness of copper electrode) that electrode length is 3mm As part).
In addition to the above-mentioned glass epoxy substrate and flexible printing substrate different using L/S, with the first connection structural bodies Making as, obtain the 3rd connection structural bodies.
(comparative example 1)
Composition shown in table 1 below is coordinated with the use level shown in table 1 below, anisotropic conductive paste is obtained Agent.In addition to using obtained anisotropic conductive paste, in the same manner as in Example 1, the first connection structural bodies, the second company are obtained Connect structure, the 3rd connection structural bodies.
(comparative example 2)
Composition shown in table 1 below is coordinated with the use level shown in table 1 below, anisotropic conductive paste is obtained Agent.In addition to applying 1MPa pressure using obtained anisotropic conductive paste and in heating, in the same manner as in Example 1, Obtain the first connection structural bodies, the second connection structural bodies, the 3rd connection structural bodies.
(comparative example 3)
Phenoxy resin (Nippon Steel ＆ Sumitomo Metal Corporation manufactures " YP-50S ") is set to be dissolved in methyl ethyl ketone (MEK) In, solid constituent is turned into 50 weight %, obtain lysate.By shown in table 1 below removing phenoxy resin composition according to The total amount of use level and above-mentioned lysate shown in table 1 below is coordinated, and 5 are stirred with 2000rpm using planetary stirring machine After minute, it is coated on using rod coater on demoulding PET (polyethylene terephthalate) film, makes its dried thickness For 30 μm.By being dried in vacuo at room temperature, MEK is removed, thus, anisotropic conductive film is obtained.
In addition to using anisotropic conductive film, in the same manner as in Example 1, the first connection structural bodies, the second connection are obtained Structure, the 3rd connection structural bodies.
(comparative example 4,5)
The composition shown in table 1 below is coordinated with the use level shown in table 1 below, anisotropic conductive paste is obtained Agent.In addition to using obtained anisotropic conductive paste, in the same manner as in Example 1, the first connection structural bodies, the second company are obtained Connect structure, the 3rd connection structural bodies.
(evaluation)
(1) viscosity
Using E types viscosimeter (Toki Sangyo Co., Ltd.'s manufacture), anisotropy is determined under conditions of 25 DEG C and 5rpm Viscosity (η 25) of the conductive paste at 25 DEG C.
(2) thickness of solder sections
Cross-section is carried out to obtained connection structural bodies, the thickness of the solder sections between the electrode above and below being located at is evaluated.
(3) self-correcting parasexuality
Except in the making of the 3rd connection structural bodies by the electrode of glass epoxy substrate and the electrode of flexible printing substrate Magnitude of misalignment be set to 25 μm (the 4th connection structural bodies use), 50 μm of (the 5th connection structural bodies use), 75 μm of (the 6th connection structural bodies With), 90 μm (the 7th connection structural bodies with) carry out it is overlapping beyond, similarly turnover operation, obtains the 4th~the 7th attachment structure Body.
Determine the electrode and the electricity of flexible printing substrate of the glass epoxy substrate of the 4th~the 7th obtained connection structural bodies The magnitude of misalignment of pole.25 the 4th~the 7th connection structural bodies are made, using the electrode positioned at each connection structural bodies two ends, are determined The magnitude of misalignment of upper/lower electrode, tries to achieve the average value of its measured value.Judge self-correcting parasexuality with following benchmark.
○○：The average value of magnitude of misalignment is less than 10 μm
○：The average value of magnitude of misalignment is more than 10 μm, less than 25 μm
△：The average value of magnitude of misalignment is more than 25 μm, less than 50 μm
×：The average value of magnitude of misalignment is more than 50 μm
(4) the configuration precision 1 of the scolding tin on electrode
In obtained the first connection structural bodies, the second connection structural bodies, the 3rd connection structural bodies, evaluate along the first electricity When pole, the stack direction observation first electrode part opposite with second electrode of connecting portion and second electrode, first electrode and The ratio X of the area in the area 100% of the opposite part of second electrode, in connecting portion for being configured with solder sections.Below State the configuration precision 1 that benchmark judges the scolding tin on electrode.
[determinating reference of the configuration precision 1 of the scolding tin on electrode]
○○：Ratio X is more than 70%
○：Ratio X is more than 60%, less than 70%
△：Ratio X is more than 50%, less than 60%
×：Ratio X is less than 50%
(5) the configuration precision 2 of the scolding tin on electrode
In obtained the first connection structural bodies, the second connection structural bodies, the 3rd connection structural bodies, evaluate along with first Electrode, connecting portion the direction observation first electrode vertical with the stack direction of the second electrode part opposite with second electrode When, in the solder sections 100% in connecting portion, the weldering that is configured in the connecting portion of the first electrode part opposite with second electrode The ratio Y in tin portion.The configuration precision 2 of the scolding tin on electrode is judged with following benchmark.
[determinating reference of the configuration precision 2 of the scolding tin on electrode]
○○：Ratio Y is more than 99%
○：Ratio Y is more than 90%, less than 99%
△：Ratio Y is more than 70%, less than 90%
×：Ratio Y is less than 70%
(6) the interelectrode conducting reliability above and below
In obtained the first connection structural bodies, the second connection structural bodies, the 3rd connection structural bodies (n=15), pass through four The connection resistance of each the interelectrode connecting portion of terminal method respectively to above and below is measured.Calculate being averaged for connection resistance Value.In addition, according to the relation of voltage=electric current × resistance, voltage when flowing through certain electric current is determined, can be in the hope of connection resistance. Conducting reliability is judged with following benchmark.
[determinating reference of conducting reliability]
○○：The average value of connection resistance is below 50m Ω
○：The average value of resistance is connected more than 50m Ω and below 70m Ω
△：The average value of resistance is connected more than 70m Ω and below 100m Ω
×：The average value of resistance is connected more than 100m Ω or bad connection is produced
(7) insulating reliability between adjacent electrode
In obtained the first connection structural bodies, the second connection structural bodies, the 3rd connection structural bodies (n=15), 85 DEG C, After being placed 100 hours in the atmosphere of humidity 85%, applying 5V adjacent electrode, and in 25 Site Determination resistance values.With Following benchmark judge insulating reliability.
[determinating reference of insulating reliability]
○○：The average value of connection resistance is 107More than Ω
○：The average value of connection resistance is 106More than Ω, less than 107Ω
△：The average value of connection resistance is 105More than Ω, less than 106Ω
×：The average value of connection resistance is less than 105Ω
(8) the interelectrode location dislocation above and below
In obtained the first connection structural bodies, the second connection structural bodies, the 3rd connection structural bodies, along first electrode, even When the stack direction observation first electrode of socket part and second electrode and the opposed part of second electrode, the center of first electrode is evaluated Line and the center line of second electrode whether align and location dislocation distance.It is wrong with the position between upper/lower electrode with following benchmark Position is judged.
[determinating reference of interelectrode position deviation up and down]
○○：Position deviation is less than 15 μm
○：Position deviation is more than 15 μm, less than 25 μm
△：Position deviation is more than 25 μm, less than 40 μm
×：Position deviation is more than 40 μm
Details and result are shown in table 1 below, 2.
Not only in the case of using flexible printing substrate, resin film, flexble flat's cable and rigid-flexible combination base are being used In the case of plate, see that identical is inclined to.

Claims (15)

1. a kind of conductive paste, its first connecting object part for being used to have surface first electrode and surface have the second electricity Second connecting object part of pole is attached, and the first electrode and the second electrode are electrically connected, wherein,
The conductive paste contains multiple septs that Thermocurable composition, multiple scolding tin particles and fusing point are more than 250 DEG C,
The average grain diameter of the sept is bigger than the average grain diameter of the scolding tin particle.
2. conductive paste as claimed in claim 1, wherein,
The sept is insulating properties particle.
3. conductive paste as claimed in claim 1 or 2, wherein,
The side being in contact with the sept and the first connecting object part and the second connecting object part this both sides Formula uses the conductive paste.
4. such as conductive paste according to any one of claims 1 to 3, wherein,
The conductive paste is used as described below：When being electrically connected to the first electrode and the second electrode, led described Electric paste is heated to more than the fusing point of the scolding tin particle and more than the solidification temperature of the Thermocurable composition, is made multiple described Scolding tin particle coacervation and integration.
5. such as conductive paste according to any one of claims 1 to 4, wherein,
The ratio between the average grain diameter of the sept and the average grain diameter of the scolding tin particle are more than 1.1, less than 15.
6. such as conductive paste according to any one of claims 1 to 5, wherein,
The content of the sept is more than 0.1 weight %, below 10 weight %.
7. such as conductive paste according to any one of claims 1 to 6, wherein,
The average grain diameter of the scolding tin particle is more than 1 μm, less than 40 μm.
8. such as conductive paste according to any one of claims 1 to 7, wherein,
The content of the scolding tin particle is more than 10 weight %, below 80 weight %.
9. such as conductive paste according to any one of claims 1 to 8, wherein,
The ratio between the content of the scolding tin particle in terms of weight % units and the content of the sept in terms of weight % units For more than 2, less than 100.
10. a kind of connection structural bodies, it includes：
First connecting object part of the surface with least one first electrode,
Second connecting object part of the surface with least one second electrode,
The connecting portion that the first connecting object part and the second connecting object part are connected,
The material of the connecting portion is conductive paste according to any one of claims 1 to 9,
The first electrode and the second electrode realize electrical connection by the solder sections in the connecting portion,
The sept and the first connecting object part and the second connecting object part this both sides contact.
11. connection structural bodies as claimed in claim 10, wherein,
The second connecting object part is resin film, flexible printing substrate, flexible flat cable or rigid-flexible combination substrate.
12. a kind of manufacture method of connection structural bodies, it includes：
Conductive paste any one of usage right requirement 1~9 has the first of at least one first electrode to connect on surface Connect the process that the conductive paste is configured on the surface of object Part；
On the surface opposite with the first connecting object component side of the conductive paste, configuration surface has at least one Second connecting object part of second electrode, and cause the first electrode and the opposed process of the second electrode；
By the conductive paste be heated to more than the fusing point of the scolding tin particle and the solidification temperature of the Thermocurable composition with On, the first connecting object part and the second connecting object part are connected to from there through conductive paste formation Connecting portion together, and the first electrode and the second electrode are realized and be electrically connected by the solder sections in the connecting portion Connect, the process for contacting the sept and the first connecting object part and the second connecting object part this both sides.
13. the manufacture method of connection structural bodies as claimed in claim 12, wherein,
When being electrically connected to the first electrode and the second electrode, the conductive paste is heated to the scolding tin grain More than the fusing point of son and more than the solidification temperature of the Thermocurable composition, make multiple scolding tin particle coacervations and integration.
14. the manufacture method of the connection structural bodies as described in claim 12 or 13, wherein,
In the process of the second connecting object part of the configuration and the process of the formation connecting portion, the conductive paste is applied Plus the weight of the second connecting object part, and without pressurization.
15. the manufacture method of the connection structural bodies as any one of claim 12~14, wherein,
The second connecting object part is resin film, flexible printing substrate, flexible flat cable or rigid-flexible combination substrate.
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