WO2017082277A1 - Method for producing connected structure, fixing jig, and fixing jig provided with cover member - Google Patents

Method for producing connected structure, fixing jig, and fixing jig provided with cover member Download PDF

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Publication number
WO2017082277A1
WO2017082277A1 PCT/JP2016/083184 JP2016083184W WO2017082277A1 WO 2017082277 A1 WO2017082277 A1 WO 2017082277A1 JP 2016083184 W JP2016083184 W JP 2016083184W WO 2017082277 A1 WO2017082277 A1 WO 2017082277A1
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WO
WIPO (PCT)
Prior art keywords
connection
target member
connection target
electrode
fixing jig
Prior art date
Application number
PCT/JP2016/083184
Other languages
French (fr)
Japanese (ja)
Inventor
敬士 久保田
松下　清人
高橋　英之
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to JP2016569098A priority Critical patent/JPWO2017082277A1/en
Priority to CN201680031399.7A priority patent/CN107615467A/en
Publication of WO2017082277A1 publication Critical patent/WO2017082277A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a method for manufacturing a connection structure using a conductive material including a plurality of solder particles. Moreover, this invention relates to the fixing jig used for the manufacturing method of the said connection structure, and the fixing jig provided with the cover member.
  • Anisotropic conductive materials such as anisotropic conductive paste and anisotropic conductive film are widely known.
  • anisotropic conductive material conductive particles are dispersed in a binder resin.
  • the anisotropic conductive material is, for example, a connection between a flexible printed circuit board and a glass substrate (FOG (Film on Glass)), and a connection between a semiconductor element and a flexible printed circuit board (COF ( (Chip on Film)), connection between a semiconductor element and a glass substrate (COG (Chip on Glass)), connection between a flexible printed circuit board and a glass epoxy substrate (FOB (Film on Board)), and the like.
  • FOG Flexible printed circuit board and a glass substrate
  • COF Chip on Film
  • COG Chip on Glass
  • FB Glass epoxy substrate
  • connection target member When the electrode of the flexible printed circuit board (connection target member) and the electrode of the glass epoxy board (connection target member) are electrically connected with the anisotropic conductive material, for example, the conductive property is formed on the glass epoxy board. An anisotropic conductive material including particles is disposed. Next, a flexible printed circuit board is laminated, and heated and pressurized. As a result, the anisotropic conductive material is cured, and the electrodes are electrically connected via the conductive particles to obtain a connection structure.
  • the following Patent Document 1 describes an anisotropic conductive material including conductive particles and a resin component that cannot be cured at the melting point of the conductive particles.
  • the conductive particles include tin (Sn), indium (In), bismuth (Bi), silver (Ag), copper (Cu), zinc (Zn), lead (Pb), cadmium (Cd ), Metals such as gallium (Ga) and thallium (Tl), and alloys of these metals.
  • Patent Document 1 a resin heating step for heating the anisotropic conductive resin to a temperature higher than the melting point of the conductive particles and at which the curing of the resin component is not completed, and a resin component curing step for curing the resin component The electrical connection between the electrodes is described.
  • Patent Document 1 describes that mounting is performed with the temperature profile shown in FIG. In Patent Document 1, the conductive particles melt in a resin component that is not completely cured at a temperature at which the anisotropic conductive resin is heated.
  • connection object members such as a flexible printed circuit board and a glass substrate
  • connection target member when the connection target member is arranged on the upper surface of the anisotropic conductive material, the connection target member is likely to be displaced.
  • the heating efficiency can be increased.
  • the displacement of the connection target member is likely to occur due to the hot air.
  • An object of the present invention is to provide a method for manufacturing a connection structure that can improve the conduction reliability between electrodes. Moreover, the objective of this invention is providing the fixing jig provided with the fixing jig which can obtain the connection structure with which the conduction
  • a conductive material including a plurality of solder particles and a binder, a first connection target member having a first electrode on an upper surface, and a second connection target having a second electrode on a lower surface
  • a connection structure manufacturing method using a member the first placement step of placing the conductive material on the upper surface of the first connection target member, the first electrode, the second electrode, The second connection step of disposing the second connection target member on the upper surface of the conductive material, and heating to a temperature equal to or higher than the melting point of the solder particles,
  • a connection part connecting the second connection target member is formed of the conductive material, and the first electrode and the second electrode are electrically connected by a solder part in the connection part.
  • a heating step connected to the heating step, While fixing the first connection object member to the fixture, heat, manufacturing method of the connecting structure is provided.
  • the fixing jig has a first recess on an upper surface, and the first jig is formed on the inner side of the first recess of the fixing jig.
  • a connection target member is arranged.
  • the first connection target member is fixed to the fixing jig, and the upper surface of the conductive material is The second connection target member is disposed.
  • the second connection target member is a first region arranged on the upper surface of the conductive material in the second arrangement step, and A second region not disposed on the top surface of the conductive material in the second placement step, and the first region of the second connection target member on the top surface of the conductive material in the second placement step.
  • the second region of the second connection target member is not disposed on the upper surface of the fixing jig without disposing the second region of the second connection target member on the upper surface of the conductive material. Place the area.
  • an upper surface on which the second region of the second connection target member of the fixing jig is disposed is directed downward from the outside to the inside. Inclined to the side.
  • the first region of the second connection target member is directed from one side to the other side and directed downward. And tilt.
  • the fixing jig has a second recess different from the first recess on the upper surface, and the second of the fixing jig The second region of the second connection target member is disposed inside the recess.
  • the material of the upper surface portion of the fixing jig on which the first connection target member is located is ceramic, aluminum alloy, titanium alloy, or stainless steel. is there.
  • a lid member is disposed above the second connection target member in the heating step.
  • the lid member is connected to the fixing jig.
  • the lid member is brought into contact with the upper surface of the second connection target member in the heating step.
  • the material of the lower surface part in which the said 2nd connection object member of the said cover member is located below is a ceramic, an aluminum alloy, a titanium alloy, or stainless steel.
  • the thermal conductivity of the material of the upper surface portion of the fixing jig on which the first connection target member is located is the first of the lid member.
  • the heat conductivity of the material of the lower surface part where 2 connection object members are located below is higher.
  • the first connection target member, the conductive material, and the second connection target member are heated by a non-contact heating unit. , Heating.
  • heating is performed with hot air in the heating step.
  • the solder particles that are not positioned between the first electrode and the second electrode are Move between the electrode and the second electrode.
  • connection structure when the connection structure is viewed in a direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode, A connection structure is obtained in which 70% or more of 100% of the solder portion in the connection portion is disposed at a portion where the first electrode and the second electrode face each other.
  • a first connection target member having a first electrode on an upper surface
  • a second connection target member having a second electrode on a lower surface
  • the first connection target member and the A connection portion formed of a conductive material including a plurality of solder particles and a binder, wherein the first electrode and the second electrode are connected to each other.
  • a fixing jig used for obtaining a connection structure electrically connected by a solder part in the part, wherein the fixing jig arranges the conductive material on the upper surface of the first connection target member
  • a second arrangement step of arranging the second connection target member on the upper surface of the conductive material so that the first electrode and the second electrode face each other.
  • the first connection object A connecting portion connecting a material and the second connection target member is formed of the conductive material, and the first electrode and the second electrode are formed by a solder portion in the connecting portion. It is used to obtain the connection structure through a heating step for electrical connection, the fixing jig has a first recess on the upper surface, and the fixing jig is used to obtain the connection structure.
  • a fixing jig is provided which is used by arranging the first connection target member inside the first recess.
  • the second connection target member includes a first region arranged on an upper surface of the conductive material in the second arrangement step, and the second A second jig that is not arranged on the upper surface of the conductive material in the arranging step, and the fixing jig is arranged on the upper surface of the conductive material in the second arranging step.
  • the first region is disposed and used to obtain the connection structure without disposing the second region of the second connection target member on the upper surface of the conductive material.
  • the upper surface on which the second region of the second connection target member is disposed is inclined downward from the outside toward the inside.
  • the second connection target member includes a first region arranged on an upper surface of the conductive material in the second arrangement step, and the second And the fixing jig has a second concave portion different from the first concave portion on the upper surface, and the fixing jig has the second region not disposed on the upper surface of the conductive material.
  • the second region of the second connection object member is disposed and used inside the second recess.
  • the material of the upper surface portion on which the first connection target member of the fixing jig is located is ceramic, aluminum alloy, titanium alloy, or stainless steel.
  • the connection structure includes the fixing jig described above and a lid member, and the lid member is disposed above the second connection target member in the heating step.
  • a fixing jig having a lid member which is used to obtain the above.
  • the lid member is connected to the fixing jig.
  • the material of the lower surface portion of the lid member on which the second connection target member is located is ceramic, aluminum alloy, titanium alloy, or stainless steel. It is.
  • the thermal conductivity of the material of the upper surface portion where the first connection target member of the fixing jig is located above is determined by the lid member.
  • the second connection object member is higher than the thermal conductivity of the material of the lower surface portion located below.
  • the manufacturing method of the connection structure according to the present invention includes a conductive material including a plurality of solder particles and a binder, a first connection target member having a first electrode on an upper surface, and a second electrode having a second electrode on a lower surface.
  • a connection portion connecting the target member and the second connection target member is formed of the conductive material, and the first electrode and the second electrode are connected to a solder portion in the connection portion.
  • a heating process that is electrically connected to the heating process.
  • the fixing jig includes a first connection target member having a first electrode on an upper surface, a second connection target member having a second electrode on a lower surface, the first connection target member, and the above A connection portion formed of a conductive material including a plurality of solder particles and a binder, wherein the first electrode and the second electrode are connected to each other.
  • the first connection target part And the second connection target member are formed of the conductive material, and the first electrode and the second electrode are electrically connected by the solder portion in the connection portion.
  • the fixing jig has a first recess on the upper surface, and the fixing jig obtains the connection structure, Since the first connection target member is disposed and used inside the first recess, a connection structure with improved conduction reliability between the electrodes can be obtained.
  • FIG. 1 is a front sectional view schematically showing a connection structure obtained by a method for manufacturing a connection structure according to an embodiment of the present invention.
  • FIG. 2 is a side cross-sectional view schematically showing a connection structure obtained by the method for manufacturing a connection structure according to one embodiment of the present invention.
  • 3 (a) to 3 (d) are side cross-sectional views for explaining each step of the method for manufacturing the connection structure according to one embodiment of the present invention.
  • FIG. 4 is a front cross-sectional view for explaining a laminated body obtained in the method for manufacturing a connection structure according to one embodiment of the present invention.
  • FIG. 5 is a side sectional view showing a modification of the connection structure.
  • FIG. 1 is a front sectional view schematically showing a connection structure obtained by a method for manufacturing a connection structure according to an embodiment of the present invention.
  • FIG. 2 is a side cross-sectional view schematically showing a connection structure obtained by the method for manufacturing a connection structure according to one embodiment of the present
  • FIG. 6 is a plan view showing a fixing jig provided with a lid member according to an embodiment of the present invention.
  • 7A to 7E are cross-sectional views showing a fixing jig provided with a lid member according to an embodiment of the present invention.
  • 8A is a plan view corresponding to FIG. 6, and
  • FIG. 8B is a cross-sectional view corresponding to FIG. 7D.
  • a conductive material in the method for manufacturing a connection structure according to the present invention, a conductive material, a first connection target member, and a second connection target member are used.
  • the conductive material includes a plurality of solder particles and a binder.
  • the first connection object member has a first electrode on an upper surface (surface).
  • the second connection target member has a second electrode on the lower surface (front surface).
  • the first arrangement step of arranging the conductive material on the upper surface of the first connection target member, and the first electrode and the second electrode are opposed to each other.
  • the second connection step of disposing the second connection target member on the upper surface of the conductive material, and heating to a temperature equal to or higher than the melting point of the solder particles, the first connection target member and the first A connecting portion connecting two connection target members is formed of the conductive material, and the first electrode and the second electrode are electrically connected by a solder portion in the connecting portion. Heating step.
  • heating is performed in a state where the first connection target member is fixed to a fixing jig.
  • connection structure In the manufacturing method of the connection structure according to the present invention, the first connection target member, the second connection target member, the first connection target member, and the second connection target member are connected. And a connection portion formed of a conductive material containing a plurality of solder particles and a binder, wherein the first electrode and the second electrode are electrically connected by the solder portion in the connection portion. Connection structure can be obtained.
  • the conduction reliability between the electrodes can be improved. Even if the solder particles flow in the heating step, positional displacement between the first electrode and the second electrode can be prevented by restricting the movement of the first connection target member. As a result, the conduction reliability between the first electrode and the second electrode can be increased. In the manufacturing method of the connection structure according to the present invention, the conduction reliability is increased and the pitch can be reduced.
  • the second connection target is formed on the upper surface of the conductive material in a state where the first connection target member is fixed to a fixing jig. It is preferable to arrange the members.
  • the first electrode and the second electrode can be opposed to each other with high accuracy. Further, it is possible to prevent the positional deviation between the first electrode and the second electrode. As a result, the conduction reliability between the first electrode and the second electrode can be increased. In the manufacturing method of the connection structure according to the present invention, the conduction reliability is increased and the pitch can be reduced.
  • the fixing jig preferably has a first recess on the upper surface.
  • the first connection target member is disposed inside the first recess of the fixing jig. In this case, it is easy to fix the first connection target member at a predetermined position.
  • the fixing jig includes a first connection target member having a first electrode on an upper surface, a second connection target member having a second electrode on a lower surface, the first connection target member, and the above
  • the fixing jig according to the present invention has a first recess on the upper surface.
  • the fixing jig according to the present invention is used by arranging the first connection object member inside the first recess when the connection structure is obtained.
  • the fixing jig according to the present invention has the above-described configuration, a connection structure with improved conduction reliability between the electrodes can be obtained.
  • the second arrangement step when the second connection target member is arranged on the upper surface of the conductive material, the first electrode and the second electrode can be opposed to each other with high accuracy. Further, it is possible to prevent the positional deviation between the first electrode and the second electrode. Further, in the heating step, even if the solder particles flow, the movement of the first connection target member is restricted, thereby preventing misalignment between the first electrode and the second electrode. it can. As a result, the conduction reliability between the first electrode and the second electrode can be increased. By using the fixing jig according to the present invention, the conduction reliability is increased and it is possible to cope with a narrow pitch.
  • the second connection target member is not disposed on the top surface of the conductive material in the second region, and the first region disposed on the top surface of the conductive material in the second placement step. It is preferable to have these areas.
  • the first region of the second connection target member is arranged on the upper surface of the conductive material, and the second of the second connection target member is arranged on the upper surface of the conductive material. It is preferable to arrange the second region of the second connection target member on the upper surface of the fixing jig without arranging the region. In such a case, a connection structure in which the first connection target member and the second connection target member are partially opposed can be obtained.
  • the conductive material may be a conductive paste or a conductive film.
  • the conductive material and the binder preferably contain a thermoplastic component or a thermosetting component.
  • the said electrically-conductive material may contain the thermosetting component and may contain the thermoplastic component.
  • the conductive material preferably contains a thermosetting component because it can be cured at the time of heating to melt the solder particles.
  • the conductive material preferably contains a flux.
  • the conductive material may be, for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, and a lubricant as necessary.
  • various additives such as an antistatic agent and a flame retardant may be included.
  • FIG. 1 is a front cross-sectional view schematically showing a connection structure obtained by a method for manufacturing a connection structure according to an embodiment of the present invention.
  • FIG. 2 is a side cross-sectional view schematically showing a connection structure obtained by the method for manufacturing a connection structure according to one embodiment of the present invention. 2 is an enlarged cross-sectional view taken along the line II of FIG.
  • connection structure 1 shown in FIGS. 1 and 2 connects the first connection target member 2, the second connection target member 3, the first connection target member 2, and the second connection target member 3.
  • a connecting portion 4 The material of the connection part 4 is a conductive material including a plurality of solder particles and a binder.
  • the connection part 4 is formed of a conductive material containing a plurality of solder particles and a binder.
  • the binder includes a thermosetting component.
  • the said binder does not need to contain the thermosetting component.
  • the connecting portion 4 includes a solder portion 4A in which a plurality of solder particles are gathered and joined to each other, and a cured product portion 4B in which a thermosetting component is thermally cured.
  • solder particles are used as the conductive particles in order to form the solder portion 4A.
  • both the central portion and the outer surface portion of the conductive portion are solder, and are formed of solder.
  • the first connection object member 2 has a plurality of first electrodes 2a on the surface (upper surface).
  • the plurality of first electrodes 2a are arranged side by side from the near side to the far side in FIG. 1 and from the right side to the left side in FIG.
  • the second connection target member 3 has a plurality of second electrodes 3a on the surface (lower surface).
  • the plurality of second electrodes 3a are arranged side by side from the near side to the far side in FIG. 1 and from the right side to the left side in FIG. As shown in FIG. 1, the portion of the second electrode 3 a facing the first electrode 2 a is located closer to the one end 3 b than the center of the second connection target member 3.
  • the first electrode 2a and the second electrode 3a are electrically connected by a solder portion 4A. Therefore, the first connection target member 2 and the second connection target member 3 are electrically connected by the solder portion 4A.
  • the connection portion 4 no solder exists in a region (cured product portion 4B portion) different from the solder portion 4A gathered between the first electrode 2a and the second electrode 3a.
  • the solder part 4A hardened product part 4B part
  • the solder may be present in a region (cured product portion 4B portion) different from the solder portion 4A gathered between the first electrode 2a and the second electrode 3a.
  • connection structure 1 a plurality of solder particles gather between the first electrode 2 a and the second electrode 3 a, and after the plurality of solder particles melt, After the melt wets and spreads on the surface of the electrode, it solidifies to form a solder portion 4A. For this reason, the connection area of 4 A of solder parts and the 1st electrode 2a, and 4 A of solder parts, and the 2nd electrode 3a becomes large. This also increases the conduction reliability in the connection structure 1 and also increases the connection reliability of the connection structure 1. In addition, when a flux is contained in the conductive material, the flux is generally gradually deactivated by heating.
  • the second connection target member 3 is formed in a layered portion (a region surrounded by a broken line in FIG. 1) of the first connection target member 2, the connection portion 4, and the second connection target member 3. , Inclined from one side to the other side.
  • the second connection target member 3 is at least 1 degree with respect to the first connection target member 2 in the direction connecting the one end 3b and the other end 3c of the second connection target member 3 (inclination angle ⁇ shown in FIG. 1). Tilted.
  • the distance between the first connection target member 2 and the second connection target member 3 is narrower on the one end 3b side than on the other end 3c side.
  • connection structure obtained by the method for manufacturing the connection structure according to the present invention, one end of the second connection target member and the other in the laminated portion of the first connection target member, the connection portion, and the second connection target member.
  • the second connection target member may not be inclined with respect to the first connection target member in the direction connecting the ends.
  • connection structure in the stacked portion of the first connection target member, the connection portion, and the second connection target member, the first connection target member in a direction connecting one end and the other end of the second connection target member.
  • the inclination angle ⁇ of the second connection target member may be 0 ° or more, preferably 1 ° or more, more preferably 2 ° or more, preferably 10 ° or less, more preferably 8 ° or less. is there.
  • a solder resist is formed on the surface of the first electrode 2 a on the side of the first electrode 2 a facing the second electrode 3 a and on the side of the connection portion 4.
  • a film 5 is formed. By forming the solder resist film, conduction reliability and high-speed transmission compatibility are further enhanced.
  • a coverlay 6 is formed on the surface of the second electrode 3 a on the side of the second electrode 3 a portion facing the first electrode 2 a.
  • connection structure 1 shown in FIG. 2 all of the solder portions 4A are located in the opposing region between the first and second electrodes 2a and 3a.
  • the connection structure 1X of the modification shown in FIG. 5 is different from the connection structure 1 shown in FIG. 2 only in the connection portion 4X.
  • the connection part 4X has the solder part 4XA and the hardened
  • most of the solder portions 4XA are located in regions where the first and second electrodes 2a and 3a are opposed to each other, and a part of the solder portion 4XA is first and second. You may protrude to the side from the area
  • the solder part 4XA protruding laterally from the region where the first and second electrodes 2a and 3a are opposed is a part of the solder part 4XA and is not a solder separated from the solder part 4XA.
  • the amount of solder away from the solder portion can be reduced, but the solder away from the solder portion may exist in the cured product portion.
  • connection structure 1 If the amount of solder particles used is reduced, the connection structure 1 can be easily obtained. If the amount of the solder particles used is increased, it becomes easy to obtain the connection structure 1X.
  • the viscosity ( ⁇ 25) at 25 ° C. of the conductive material is preferably 10 Pa ⁇ s or more, more preferably 20 Pa ⁇ s or more, and further preferably 50 Pa ⁇ s or more. Preferably, it is 800 Pa ⁇ s or less, more preferably 600 Pa ⁇ s or less, and still more preferably 500 Pa ⁇ s or less.
  • the viscosity is equal to or higher than the lower limit, the conductive material does not easily flow out immediately after application.
  • the viscosity is not more than the above upper limit, the solder is more efficiently aggregated.
  • the viscosity can be appropriately adjusted depending on the type and amount of the compounding component. Further, the use of a filler can make the viscosity relatively high.
  • the viscosity can be measured under conditions of 25 ° C. and 5 rpm using, for example, an E-type viscometer (manufactured by Toki Sangyo Co., Ltd.).
  • connection structure Next, a method for manufacturing a connection structure according to an embodiment of the present invention will be described.
  • a lid member according to an embodiment of the present invention that can be used in the method for manufacturing a connection structure according to an embodiment of the present invention.
  • the fixing jig provided will be described.
  • FIG. 6 is a plan view showing a fixing jig 20 provided with a lid member according to an embodiment of the present invention.
  • FIGS. 7A to 7E are cross-sectional views showing a fixing jig 20 provided with a lid member according to an embodiment of the present invention.
  • 7A is a cross-sectional view taken along the line II of FIG. 6,
  • FIG. 7B is a cross-sectional view taken along the line II-II of FIG. 6, and
  • FIG. 6 is a sectional view taken along line III-III in FIG. 6
  • FIG. 7D is a sectional view taken along line IV-IV in FIG. 6, and
  • FIG. 7E is taken along line VV in FIG. It is sectional drawing.
  • 8A is a plan view corresponding to FIG. 6, and
  • FIG. 8B is a cross-sectional view corresponding to FIG. 7D.
  • the fixing jig 20 provided with a lid member includes a fixing jig 21 and a lid member 22.
  • the lid member 22 is connected to the fixing jig 21.
  • the fixing jig 20 provided with the lid member further includes a connection member 23.
  • the lid member 22 is connected to the fixing jig 21 by the connecting member 23.
  • the connecting member 23 is a hinge, for example.
  • the lid member may not be connected to the fixing jig.
  • FIGS. 7A to 7E and FIG. 8B show a state in which the lid member 22 is opened, and in FIGS. 7A to 7E and FIG. 8B, a state in which the lid member 22 is closed is shown. It is shown.
  • the fixing jig 21 has a first recess 21a on the upper surface. As shown in FIGS. 8A and 8B, the first recess 21a is provided inside the first recess 21a in order to place the first connection target member 2.
  • the fixing jig may have a plurality of first recesses so that a plurality of first connection target members can be arranged.
  • the fixing jig 21 has a plurality of second recesses 21b on the upper surface.
  • the second recess 21b is different from the first recess 21a.
  • the 2nd recessed part 21b is provided in order to arrange
  • the height position of the upper surface of the lower end of the second recess 21b is higher than the height position of the upper surface (upper end) of the first recess 21a.
  • the 2nd recessed part 21b has a part located in the outer side rather than the 1st recessed part 21a.
  • the portion of the second recess 21b located outside the first recess 21a is provided to arrange the second region of the second connection target member.
  • the depth of the first recess 21a is selected in consideration of the total thickness of the first connection target member 2 and the connection portion 4 disposed on the upper surface of the first connection target member 2.
  • the depth of the first recess 21a is preferably, for example, a total thickness of the first connection target member 2 and the connection portion 4 of ⁇ 30 ⁇ m or more, and the first connection target member 2 and the connection portion 4 It is preferable that the total thickness or more.
  • the depth from the upper surface (upper end) of the first recess 21a to the upper surface of the lower end of the second recess 21b is, for example, the total thickness of the first connection target member 2 and the connection portion 4 ⁇ 30 ⁇ m.
  • the thickness is equal to or greater than the total thickness of the first connection target member 2 and the connection portion 4, and is equal to or less than the total thickness of the first connection target member 2, the first connection target member 2 and the connection portion 4 +30 ⁇ m. It is preferable.
  • an upper surface of the fixing jig on which the second region of the second connection target member is disposed is inclined downward from the outside toward the inside.
  • the upper surface of the second recess is preferably inclined downward from the outside toward the inside (for example, a position corresponding to the center of the obtained connection structure).
  • This inclination angle ⁇ is preferably 1 degree or more, more preferably 2 degrees or more, preferably 10 degrees or less, more preferably 8 degrees or less.
  • the connection reliability can be further enhanced as a result of the further strong connection.
  • the conduction reliability of the second connection target member can be increased.
  • the first connection target member 2 in the fixing jig 21, can be disposed inside the four corners 21c of the first recess 21a.
  • the movement of the first connection target member 2 can be restricted by the corner portion 21c.
  • the fixing jig 21 has a gap portion 21d connected to the first recess 21a. As shown in FIG. 8A, when the first connection target member 2 is arranged inside the first recess 21a, the gap 21d is formed on the side of the side surface of the first connection target member 2. A gap is secured. When the first connection target member 2 is disposed, the side surface of the first connection target member 2 does not contact the fixing jig 21 in the gap portion 21d. Furthermore, the side surface of the obtained connection structure 1 does not contact the fixing jig 21 in the gap portion 21 d. As a result, it is easy to take out the first connection target member 2 and the resulting connection structure 1.
  • the material of the upper surface portion where the first connection target member of the fixing jig is located above, and the upper surface portion where the second region of the second connection object member of the fixing jig is located above examples include ceramic, aluminum alloy, titanium alloy, and stainless steel. Since it is excellent in thermal conductivity, the material of the upper surface portion where the first connection target member of the fixing jig is located above, and the second of the second connection target member of the fixing jig.
  • the material of the upper surface portion in which the region is located is preferably ceramic, aluminum alloy, titanium alloy or stainless steel, and more preferably aluminum alloy.
  • the material of the lower surface portion of the lid member on which the second connection target member is positioned below is ceramic, aluminum alloy, titanium alloy, stainless steel, or the like. Since the heat resistance is excellent, the material of the lower surface portion of the lid member where the second connection target member is located below is preferably ceramic, aluminum alloy, titanium alloy or stainless steel, and is ceramic. Is more preferable. In this case, even if the lid member is thin, the heat resistance can be increased and thermal deformation and thermal deterioration can be suppressed.
  • the thermal conductivity (A1) of the material of the upper surface portion where the first connection object member of the fixing jig is located above is the material of the lower surface portion where the second connection object member of the lid member is located below. It is preferable that the thermal conductivity (B) is higher.
  • the thermal conductivity (A2) of the material of the upper surface portion where the second region of the second connection target member of the fixing jig is located above is lower than the second connection target member of the lid member. It is preferable that it is higher than the thermal conductivity (B) of the material of the lower surface part located.
  • the thermal conductivity (A1) of the material of the upper surface portion where the first connection target member of the fixing jig is located above, and the second region of the second connection target member of the fixing jig are
  • the thermal conductivity (A2) of the material of the upper surface portion located above is preferably 10 W / m ⁇ K or more, more preferably 20 W / m ⁇ K or more. The higher the thermal conductivity (A1) and (A2), the better.
  • the thickness of the portion of the fixing jig where the first connection target member is positioned is preferably Is 1 mm or more, more preferably 3 mm or more, preferably 20 mm or less, more preferably 10 mm or less.
  • the thickness of the portion where the second connection target member of the lid member is positioned below is preferably 0.05 mm or more, more preferably It is 0.1 mm or more, preferably 1 mm or less, more preferably 0.5 mm or less.
  • connection structure 1 can be obtained as follows.
  • FIG. 4 is a front sectional view of a portion corresponding to FIG.
  • 1st connection object member 2 which has the 1st electrode 2a on the upper surface (surface) is prepared. Moreover, the fixing jig 20 provided with the cover member is prepared.
  • the first connection target member 2 is placed inside the first recess 21a of the fixing jig 20 at the position shown in FIGS. Deploy.
  • the movement of the first connection target member 2 is restricted by the corner portion 21c.
  • the inner wall portion of the first concave portion 21 a is located on the side of the first connection target member 2.
  • a conductive material 11 including a thermosetting component 11B as a binder and a plurality of solder particles 11A is disposed on the upper surface of the first connection target member 2 (first). 1 arrangement step).
  • the binder does not need to contain the thermosetting component.
  • the conductive material 11 is disposed on the surface of the first connection target member 2 on which the first electrode 2a is provided. After the conductive material 11 is disposed, the solder particles 11A are disposed both on the first electrode 2a (line) and on a region (space) where the first electrode 2a is not formed.
  • the arrangement method of the conductive material 11 is not particularly limited, and examples thereof include application by a dispenser, screen printing, and discharge by an inkjet device.
  • the 2nd connection object member 3 which has the 2nd electrode 3a in a lower surface (surface) is prepared.
  • the second connection target member 3 is arranged on the upper surface of the conductive material 11, and the laminated body (2nd arrangement
  • the second connection target member 3 is arranged on the upper surface of the conductive material 11 in a state where the first connection target member 3 is fixed to the fixing jig 21.
  • the second connection target member 3 is disposed from the second electrode 3a side. At this time, the first electrode 2a and the second electrode 3a are opposed to each other.
  • the second connection target member is not pressurized or 0.1 MPa or less (more preferably 0.05 MPa or less, More preferably, pressurization is preferably performed at a pressure of 0.02 MPa or less, and more preferably, no pressurization is performed.
  • the second connection target member is not pressurized and the weight of the second connection target member is added to the conductive material.
  • the first region of the second connection target member 3 is arranged on the upper surface of the conductive material 11, and the second of the second connection target member 3 is arranged on the upper surface of the conductive material 11. It is preferable not to arrange the region. It is preferable to arrange the second region of the second connection target member 3 on the upper surface of the fixing jig 21. It is preferable to arrange the second region of the second connection target member 3 inside the second recess 21 b of the fixing jig 21. It is preferable that the inner wall part of the 2nd recessed part 21b is located in the side of the 2nd connection object member 3. As shown in FIG.
  • the laminated portion of the first connection target member 2, the conductive material 11, and the second connection target member 3 (in FIG. 4).
  • the second connection target member 3 is moved at least once. (Inclination angle ⁇ ) It is preferable to dispose them.
  • the first connection target member 2 is closer to the one end 3b side where the second electrode 3a of the second connection target member 3 is located than the other end 3c side opposite to the one end 3b side of the second connection target member 3. The distance between the second connection target member 3 is reduced.
  • the inclination angle ⁇ of the second connection target member 3 with respect to the first connection target member 2 is preferably 1 degree or more.
  • the inclination angle ⁇ is preferably 2 in the laminated portion before heating in the laminated portion of the first connection target member, the conductive material, and the second connection target member. It is more than 10 degrees, preferably 10 degrees or less, more preferably 8 degrees or less.
  • the conductive material 11 is heated above the melting point of the solder particles 11A (heating step).
  • heating is performed in a state where the first connection target member 2 is fixed to the fixing jig 21.
  • the conductive material 11 is heated above the curing temperature of the thermosetting component 11B (binder).
  • the solder particles 11A that existed in the region where no electrode is formed gather between the first electrode 2a and the second electrode 3a (self-aggregation effect).
  • the solder particles 11A are effectively collected between the first electrode 2a and the second electrode 3a. Also, the solder particles 11A are melted and joined together. Further, the thermosetting component 11B is thermoset. As a result, as shown in FIG. 3D, the connection portion 4 that connects the first connection target member 2 and the second connection target member 3 is formed of the conductive material 11.
  • the connection part 4 is formed of the conductive material 11, the solder part 4A is formed by joining a plurality of solder particles 11A, and the cured part 4B is formed by thermosetting the thermosetting component 11B.
  • the first region of the second connection target member 3 is inclined downward from one side to the other side.
  • connection target member 3 in the stacked portion of the first connection target member 2, the connection portion 4, and the second connection target member 3, the second connection target member 3 is connected in the direction connecting the one end 3 b and the other end 3 c.
  • a connection structure is obtained in which the second connection target member 3 is inclined at 1 degree or more and 10 degrees or less with respect to one connection target member 2.
  • the first connection target member is connected in a direction connecting the one end and the other end of the second connection target member.
  • the second connection target member is inclined at 1 degree or more and 10 degrees or less.
  • connection structure body in which the second connection target member is not tilted or tilted at less than 1 degree with respect to the first connection target member.
  • the cover member 22 is provided above the 2nd connection object member 3 in the said heating process. It is arranged. Since the movement of the second connection target member 3 can be suppressed, it is preferable that the lid member 22 is brought into contact with the upper surface of the second connection target member 3 in the heating step.
  • a fixing jig and a laminate may be disposed in the heating part.
  • a fixing jig and a laminated body may be disposed in the heated space.
  • a fixing jig may be disposed on the heating member.
  • the first connection target member, the conductive material, and the second connection target member may be heated by a non-contact heating means. preferable.
  • electrical_connection reliability is obtained.
  • the second connection target member is not pressurized, or is 0.1 MPa or less (more preferably 0.05 MPa or less, more preferably It is preferable to pressurize at a pressure of 0.02 MPa or less, and it is more preferable not to pressurize.
  • the connection structure is viewed in a direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode, the first electrode and the above A connection structure in which 50% or more (preferably 60% or more, more preferably 70% or more) of 100% of the solder portion in the connection portion is disposed in a portion facing the second electrode. It is preferable to obtain.
  • the heating temperature in the heating step is preferably 140 ° C. or higher, more preferably 160 ° C. or higher, preferably 450 ° C. or lower, more preferably 250 ° C. or lower, and further preferably 200 ° C. or lower.
  • connection structure 1 shown in FIGS. 1 and 2 is obtained. After the heating step, the connection structure 1 can be taken out from the fixing jig 20 provided with the lid member. Since the fixing jig 21 has the gap portion 21d, the connection structure 1 can be easily taken out.
  • the first and second connection target members are not particularly limited. Specifically as said 1st, 2nd connection object member, electronic components, such as a semiconductor chip, a semiconductor package, LED chip, LED package, a capacitor
  • the first and second connection target members are preferably electronic components.
  • At least one of the first connection target member and the second connection target member is a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board.
  • the second connection target member is preferably a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board. Resin films, flexible printed boards, flexible flat cables, and rigid flexible boards have the property of being highly flexible and relatively lightweight. When a conductive film is used for connection of such a connection object member, there exists a tendency for a solder not to gather on an electrode.
  • the electrode provided on the connection target member examples include metal electrodes such as a gold electrode, a nickel electrode, a tin electrode, an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, a SUS electrode, and a tungsten electrode.
  • the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, a silver electrode, or a copper electrode.
  • the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, or a tungsten electrode.
  • the electrode formed only with aluminum may be sufficient and the electrode by which the aluminum layer was laminated
  • the material for the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element.
  • the trivalent metal element include Sn, Al, and Ga.
  • Example 1 In Example 1, the fixing jig 20 provided with the lid shown in FIGS. 6, 7A to 7E and FIG. 8 was used. In Example 1, the connection structure 1 shown in FIGS. 1 and 2 was manufactured through the steps shown in FIGS. 3A to 3D and FIG.
  • a conductive paste containing 2 parts by weight and 48 parts by weight of solder particles was prepared.
  • a glass epoxy substrate (FR-4 substrate, thickness 0.6 mm) (first connection target member) having a copper electrode pattern (copper electrode thickness 12 ⁇ m) on the top surface with an L / S of 300 ⁇ m / 200 ⁇ m and an electrode length of 3 mm Prepared.
  • a flexible printed circuit board having a copper electrode pattern (copper electrode thickness 12 ⁇ m) with an L / S of 300 ⁇ m / 200 ⁇ m and an electrode length of 5 mm on the lower surface (second connection target member formed of polyimide, thickness 0.1 mm) Prepared.
  • the glass epoxy substrate was placed in the first recess 21a of the fixing jig 21 in the fixing jig 20 provided with the lid member described above.
  • the conductive paste was applied by screen printing using a metal mask so as to have a thickness of 100 ⁇ m on the electrode of the glass epoxy substrate to form a conductive paste layer (first paste) Placement process).
  • the flexible printed circuit board was laminated on the upper surface of the conductive paste layer so that the electrodes face each other (second arrangement step).
  • the flexible printed circuit board was arrange
  • the lid member 22 was closed. Thereafter, the solder was melted while being heated with hot air so that the temperature of the conductive paste layer was 190 ° C., and the conductive paste layer was cured at 190 ° C. for 10 seconds (heating step).
  • the solder particles that are not positioned between the first electrode and the second electrode are moved between the first electrode and the second electrode to obtain a connection structure. It was. Note that the flexible printed circuit board was not pressurized in the second arrangement step and the heating step.
  • connection structure when the connection structure is viewed in a direction perpendicular to the stacking direction of the first electrode, the connection portion, and the second electrode, the first electrode and the second electrode are opposed to each other. 70% or more of 100% of the solder part in the connection part was disposed in the matching part.
  • connection resistance per connection point between the upper and lower electrodes was measured by a four-terminal method.
  • the average value of the connection resistance in the obtained connection structure was 50 m ⁇ or less, and the conduction reliability was excellent.
  • Example 2 In the second arrangement step, a connection structure was obtained in the same manner as in Example 1 except that the flexible printed circuit board was pressurized with a pressure of 0.02 MPa.
  • the average value of the connection resistance of the connection structure obtained in Example 2 was 1.02 times the average value of the connection resistance of the connection structure obtained in Example 1.
  • Example 3 In the second arrangement step, a connection structure was obtained in the same manner as in Example 1 except that the flexible printed circuit board was pressurized with a pressure of 0.05 MPa.
  • the average connection resistance of the connection structure obtained in Example 3 was 1.05 times the average connection resistance of the connection structure obtained in Example 1.
  • Example 4 In the second arranging step, a connection structure was obtained in the same manner as in Example 1 except that the flexible printed circuit board was pressurized with a pressure of 0.1 MPa.
  • the average value of the connection resistance of the connection structure obtained in Example 4 was 1.1 times the average value of the connection resistance of the connection structure obtained in Example 1.
  • Example 5 In the second arranging step, a connection structure was obtained in the same manner as in Example 1 except that the flexible printed circuit board was pressurized with a pressure of 0.2 MPa.
  • the average connection resistance of the connection structure obtained in Example 5 was 1.5 times the average connection resistance of the connection structure obtained in Example 1.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

Provided is a method for producing a connected structure, which is capable of enhancing the conduction reliability between electrodes. A method for producing a connected structure according to the present invention uses a conductive material that contains a plurality of solder particles and a binder, a first connection object member that has a first electrode on the upper surface, and a second connection object member that has a second electrode on the lower surface. This method for producing a connected structure comprises: a first arrangement step for arranging the conductive material on the upper surface of the first connection object member; a second arrangement step for arranging the second connection object member on the upper surface of the conductive material; and a heating step for heating the assembly to a temperature that is not less than the melting point of the solder particles. In the heating step, heating is carried out, while maintaining the assembly in a state where the first connection object member is fixed to a fixing jig.

Description

接続構造体の製造方法、固定治具、及び蓋部材を備えた固定治具Manufacturing method of connection structure, fixing jig, and fixing jig provided with lid member
　本発明は、複数のはんだ粒子を含む導電材料を用いる接続構造体の製造方法に関する。また、本発明は、上記接続構造体の製造方法に用いられる固定治具、及び蓋部材を備えた固定治具に関する。 The present invention relates to a method for manufacturing a connection structure using a conductive material including a plurality of solder particles. Moreover, this invention relates to the fixing jig used for the manufacturing method of the said connection structure, and the fixing jig provided with the cover member.
　異方性導電ペースト及び異方性導電フィルム等の異方性導電材料が広く知られている。上記異方性導電材料では、バインダー樹脂中に導電性粒子が分散されている。 Anisotropic conductive materials such as anisotropic conductive paste and anisotropic conductive film are widely known. In the anisotropic conductive material, conductive particles are dispersed in a binder resin.
　上記異方性導電材料は、各種の接続構造体を得るために、例えば、フレキシブルプリント基板とガラス基板との接続（ＦＯＧ（Ｆｉｌｍ　ｏｎ　Ｇｌａｓｓ））、半導体素子とフレキシブルプリント基板との接続（ＣＯＦ（Ｃｈｉｐ　ｏｎ　Ｆｉｌｍ））、半導体素子とガラス基板との接続（ＣＯＧ（Ｃｈｉｐ　ｏｎ　Ｇｌａｓｓ））、並びにフレキシブルプリント基板とガラスエポキシ基板との接続（ＦＯＢ（Ｆｉｌｍ　ｏｎ　Ｂｏａｒｄ））等に使用されている。 In order to obtain various connection structures, the anisotropic conductive material is, for example, a connection between a flexible printed circuit board and a glass substrate (FOG (Film on Glass)), and a connection between a semiconductor element and a flexible printed circuit board (COF ( (Chip on Film)), connection between a semiconductor element and a glass substrate (COG (Chip on Glass)), connection between a flexible printed circuit board and a glass epoxy substrate (FOB (Film on Board)), and the like.
　上記異方性導電材料により、例えば、フレキシブルプリント基板（接続対象部材）の電極とガラスエポキシ基板（接続対象部材）の電極とを電気的に接続する際には、ガラスエポキシ基板上に、導電性粒子を含む異方性導電材料を配置する。次に、フレキシブルプリント基板を積層して、加熱及び加圧する。これにより、異方性導電材料を硬化させて、導電性粒子を介して電極間を電気的に接続して、接続構造体を得る。 When the electrode of the flexible printed circuit board (connection target member) and the electrode of the glass epoxy board (connection target member) are electrically connected with the anisotropic conductive material, for example, the conductive property is formed on the glass epoxy board. An anisotropic conductive material including particles is disposed. Next, a flexible printed circuit board is laminated, and heated and pressurized. As a result, the anisotropic conductive material is cured, and the electrodes are electrically connected via the conductive particles to obtain a connection structure.
　上記異方性導電材料の一例として、下記の特許文献１には、導電性粒子と、該導電性粒子の融点で硬化が完了しない樹脂成分とを含む異方性導電材料が記載されている。上記導電性粒子としては、具体的には、錫（Ｓｎ）、インジウム（Ｉｎ）、ビスマス（Ｂｉ）、銀（Ａｇ）、銅（Ｃｕ）、亜鉛（Ｚｎ）、鉛（Ｐｂ）、カドミウム（Ｃｄ）、ガリウム（Ｇａ）及びタリウム（Ｔｌ）等の金属や、これらの金属の合金が挙げられている。 As an example of the anisotropic conductive material, the following Patent Document 1 describes an anisotropic conductive material including conductive particles and a resin component that cannot be cured at the melting point of the conductive particles. Specifically, the conductive particles include tin (Sn), indium (In), bismuth (Bi), silver (Ag), copper (Cu), zinc (Zn), lead (Pb), cadmium (Cd ), Metals such as gallium (Ga) and thallium (Tl), and alloys of these metals.
　特許文献１では、上記導電性粒子の融点よりも高く、かつ上記樹脂成分の硬化が完了しない温度に、異方性導電樹脂を加熱する樹脂加熱ステップと、上記樹脂成分を硬化させる樹脂成分硬化ステップとを経て、電極間を電気的に接続することが記載されている。また、特許文献１には、特許文献１の図８に示された温度プロファイルで実装を行うことが記載されている。特許文献１では、異方性導電樹脂が加熱される温度にて硬化が完了しない樹脂成分内で、導電性粒子が溶融する。 In Patent Document 1, a resin heating step for heating the anisotropic conductive resin to a temperature higher than the melting point of the conductive particles and at which the curing of the resin component is not completed, and a resin component curing step for curing the resin component The electrical connection between the electrodes is described. Patent Document 1 describes that mounting is performed with the temperature profile shown in FIG. In Patent Document 1, the conductive particles melt in a resin component that is not completely cured at a temperature at which the anisotropic conductive resin is heated.
特開２００４－２６０１３１号公報JP 2004-260131 A
　はんだ粒子（導電性粒子）や、はんだ層を表面に有する導電性粒子を含む異方性導電材料を用いた従来の接続構造体の製造方法では、特許文献１に記載のように、加熱時に、異方性導電材料内で導電性粒子が移動することがある。このため、フレキシブルプリント基板やガラス基板などの接続対象部材の位置ずれが生じやすい。 In the conventional method for manufacturing a connection structure using solder particles (conductive particles) or an anisotropic conductive material containing conductive particles having a solder layer on the surface, as described in Patent Document 1, during heating, The conductive particles may move in the anisotropic conductive material. For this reason, position shift of connection object members, such as a flexible printed circuit board and a glass substrate, tends to arise.
　また、異方性導電材料の上面に接続対象部材を配置する際に、接続対象部材の位置ずれが生じやすい。 Further, when the connection target member is arranged on the upper surface of the anisotropic conductive material, the connection target member is likely to be displaced.
　また、接続構造体を得る際の加熱時に熱風を用いると、加熱効率を高めることができる。しかし、熱風を用いた場合に、熱風によって接続対象部材の位置ずれが生じやすい。 Also, if hot air is used during heating when obtaining the connection structure, the heating efficiency can be increased. However, when hot air is used, the displacement of the connection target member is likely to occur due to the hot air.
　接続構造体の位置ずれが生じると、得られる接続構造体において、電極間の導通信頼性が低くなる。また、近年、電極の微細化が進行している。電極の微細化によって、電極間の導通を確実に果たすことがより一層困難になっており、導通不良が生じやすくなっている。 When the displacement of the connection structure occurs, the conduction reliability between the electrodes in the obtained connection structure is lowered. In recent years, miniaturization of electrodes has progressed. With the miniaturization of electrodes, it has become even more difficult to reliably achieve conduction between electrodes, and poor conduction is likely to occur.
　本発明の目的は、電極間の導通信頼性を高めることができる接続構造体の製造方法を提供することである。また、本発明の目的は、電極間の導通信頼性が高められた接続構造体を得ることができる固定治具、及び蓋部材を備えた固定治具を提供することである。 An object of the present invention is to provide a method for manufacturing a connection structure that can improve the conduction reliability between electrodes. Moreover, the objective of this invention is providing the fixing jig provided with the fixing jig which can obtain the connection structure with which the conduction | electrical_connection reliability between electrodes was improved, and the cover member.
　本発明の広い局面によれば、複数のはんだ粒子及びバインダーを含む導電材料と、第１の電極を上面に有する第１の接続対象部材と、第２の電極を下面に有する第２の接続対象部材とを用いる接続構造体の製造方法であって、前記第１の接続対象部材の上面に、前記導電材料を配置する第１の配置工程と、前記第１の電極と前記第２の電極とが対向するように、前記導電材料の上面に、前記第２の接続対象部材を配置する第２の配置工程と、前記はんだ粒子の融点以上に加熱することで、前記第１の接続対象部材と前記第２の接続対象部材とを接続している接続部を、前記導電材料により形成し、かつ、前記第１の電極と前記第２の電極とを、前記接続部中のはんだ部により電気的に接続する加熱工程とを備え、前記加熱工程において、前記第１の接続対象部材を固定治具に固定した状態で、加熱を行う、接続構造体の製造方法が提供される。 According to a wide aspect of the present invention, a conductive material including a plurality of solder particles and a binder, a first connection target member having a first electrode on an upper surface, and a second connection target having a second electrode on a lower surface A connection structure manufacturing method using a member, the first placement step of placing the conductive material on the upper surface of the first connection target member, the first electrode, the second electrode, The second connection step of disposing the second connection target member on the upper surface of the conductive material, and heating to a temperature equal to or higher than the melting point of the solder particles, A connection part connecting the second connection target member is formed of the conductive material, and the first electrode and the second electrode are electrically connected by a solder part in the connection part. A heating step connected to the heating step, While fixing the first connection object member to the fixture, heat, manufacturing method of the connecting structure is provided.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記固定治具が上面に第１の凹部を有し、前記固定治具の前記第１の凹部の内側に、前記第１の接続対象部材を配置する。 In a specific aspect of the method for manufacturing a connection structure according to the present invention, the fixing jig has a first recess on an upper surface, and the first jig is formed on the inner side of the first recess of the fixing jig. A connection target member is arranged.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記第２の配置工程において、前記第１の接続対象部材を前記固定治具に固定した状態で、前記導電材料の上面に、前記第２の接続対象部材を配置する。 In a specific aspect of the method for manufacturing a connection structure according to the present invention, in the second arrangement step, the first connection target member is fixed to the fixing jig, and the upper surface of the conductive material is The second connection target member is disposed.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記第２の接続対象部材が、前記第２の配置工程において、前記導電材料の上面に配置される第１の領域と、前記第２の配置工程において、前記導電材料の上面に配置されない第２の領域とを有し、前記第２の配置工程において、前記導電材料の上面に、前記第２の接続対象部材の前記第１の領域を配置し、前記導電材料の上面に、前記第２の接続対象部材の前記第２の領域を配置せず、前記固定治具の上面に、前記第２の接続対象部材の前記第２の領域を配置する。 In a specific aspect of the manufacturing method of the connection structure according to the present invention, the second connection target member is a first region arranged on the upper surface of the conductive material in the second arrangement step, and A second region not disposed on the top surface of the conductive material in the second placement step, and the first region of the second connection target member on the top surface of the conductive material in the second placement step. The second region of the second connection target member is not disposed on the upper surface of the fixing jig without disposing the second region of the second connection target member on the upper surface of the conductive material. Place the area.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記固定治具の前記第２の接続対象部材の前記第２の領域が配置される上面が、外側から内側にむけて、下側に傾斜している。 In a specific aspect of the manufacturing method of the connection structure according to the present invention, an upper surface on which the second region of the second connection target member of the fixing jig is disposed is directed downward from the outside to the inside. Inclined to the side.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記加熱工程において、前記第２の接続対象部材の前記第１の領域を、一方側から他方側にむけて、下側に向かって傾斜させる。 In a specific aspect of the method for manufacturing a connection structure according to the present invention, in the heating step, the first region of the second connection target member is directed from one side to the other side and directed downward. And tilt.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記固定治具が上面に、前記第１の凹部とは異なる第２の凹部を有し、前記固定治具の前記第２の凹部の内側に、前記第２の接続対象部材の前記第２の領域を配置する。 In a specific aspect of the method for manufacturing a connection structure according to the present invention, the fixing jig has a second recess different from the first recess on the upper surface, and the second of the fixing jig The second region of the second connection target member is disposed inside the recess.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記固定治具の前記第１の接続対象部材が上方に位置する上面部分の材質が、セラミック、アルミニウム合金、チタン合金又はステンレスである。 In a specific aspect of the manufacturing method of the connection structure according to the present invention, the material of the upper surface portion of the fixing jig on which the first connection target member is located is ceramic, aluminum alloy, titanium alloy, or stainless steel. is there.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記加熱工程において、前記第２の接続対象部材の上方に、蓋部材を配置する。 In a specific aspect of the method for manufacturing a connection structure according to the present invention, a lid member is disposed above the second connection target member in the heating step.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記蓋部材が、前記固定治具に接続されている。 In a specific aspect of the method for manufacturing the connection structure according to the present invention, the lid member is connected to the fixing jig.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記加熱工程において、前記第２の接続対象部材の上面に、前記蓋部材を接触させる。 In a specific aspect of the method for manufacturing a connection structure according to the present invention, the lid member is brought into contact with the upper surface of the second connection target member in the heating step.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記蓋部材の前記第２の接続対象部材が下方に位置する下面部分の材質が、セラミック、アルミニウム合金、チタン合金又はステンレスである。 On the specific situation with the manufacturing method of the connection structure which concerns on this invention, the material of the lower surface part in which the said 2nd connection object member of the said cover member is located below is a ceramic, an aluminum alloy, a titanium alloy, or stainless steel. .
　本発明に係る接続構造体の製造方法のある特定の局面では、前記固定治具の前記第１の接続対象部材が上方に位置する上面部分の材質の熱伝導率が、前記蓋部材の前記第２の接続対象部材が下方に位置する下面部分の材質の熱伝導率よりも高い。 In a specific aspect of the manufacturing method of the connection structure according to the present invention, the thermal conductivity of the material of the upper surface portion of the fixing jig on which the first connection target member is located is the first of the lid member. The heat conductivity of the material of the lower surface part where 2 connection object members are located below is higher.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記加熱工程において、前記第１の接続対象部材、前記導電材料及び前記第２の接続対象部材に対して非接触の加熱手段により、加熱を行う。 In a specific aspect of the method for manufacturing a connection structure according to the present invention, in the heating step, the first connection target member, the conductive material, and the second connection target member are heated by a non-contact heating unit. , Heating.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記加熱工程において、熱風により、加熱を行う。 In a specific aspect of the method for manufacturing a connection structure according to the present invention, heating is performed with hot air in the heating step.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記加熱工程において、前記第１の電極と前記第２の電極との間に位置していない前記はんだ粒子を、前記第１の電極と前記第２の電極との間に移動させる。 In a specific aspect of the method for manufacturing a connection structure according to the present invention, in the heating step, the solder particles that are not positioned between the first electrode and the second electrode are Move between the electrode and the second electrode.
　本発明に係る接続構造体の製造方法のある特定の局面では、前記第１の電極と前記接続部と前記第２の電極との積層方向と直交する方向に接続構造体をみたときに、前記第１の電極と前記第２の電極との対向し合う部分に、前記接続部中の前記はんだ部１００％中の７０％以上が配置されている接続構造体を得る。 In a specific aspect of the manufacturing method of the connection structure according to the present invention, when the connection structure is viewed in a direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode, A connection structure is obtained in which 70% or more of 100% of the solder portion in the connection portion is disposed at a portion where the first electrode and the second electrode face each other.
　本発明の広い局面によれば、第１の電極を上面に有する第１の接続対象部材と、第２の電極を下面に有する第２の接続対象部材と、前記第１の接続対象部材と前記第２の接続対象部材とを接続しており、かつ、複数のはんだ粒子及びバインダーを含む導電材料により形成された接続部とを備え、前記第１の電極と前記第２の電極とが前記接続部中のはんだ部により電気的に接続されている接続構造体を得るために用いられる固定治具であって、固定治具は、前記第１の接続対象部材の上面に、前記導電材料を配置する第１の配置工程と、前記第１の電極と前記第２の電極とが対向するように、前記導電材料の上面に、前記第２の接続対象部材を配置する第２の配置工程と、前記はんだ粒子の融点以上に加熱することで、前記第１の接続対象部材と前記第２の接続対象部材とを接続している接続部を、前記導電材料により形成し、かつ、前記第１の電極と前記第２の電極とを、前記接続部中のはんだ部により電気的に接続する加熱工程とを経て、前記接続構造体を得るために用いられ、固定治具は、上面に第１の凹部を有し、固定治具は、前記接続構造体を得る際に、前記第１の凹部の内側に、前記第１の接続対象部材を配置して用いられる、固定治具が提供される。 According to a wide aspect of the present invention, a first connection target member having a first electrode on an upper surface, a second connection target member having a second electrode on a lower surface, the first connection target member, and the A connection portion formed of a conductive material including a plurality of solder particles and a binder, wherein the first electrode and the second electrode are connected to each other. A fixing jig used for obtaining a connection structure electrically connected by a solder part in the part, wherein the fixing jig arranges the conductive material on the upper surface of the first connection target member And a second arrangement step of arranging the second connection target member on the upper surface of the conductive material so that the first electrode and the second electrode face each other. By heating to above the melting point of the solder particles, the first connection object A connecting portion connecting a material and the second connection target member is formed of the conductive material, and the first electrode and the second electrode are formed by a solder portion in the connecting portion. It is used to obtain the connection structure through a heating step for electrical connection, the fixing jig has a first recess on the upper surface, and the fixing jig is used to obtain the connection structure. A fixing jig is provided which is used by arranging the first connection target member inside the first recess.
　本発明に係る固定治具のある特定の局面では、前記第２の接続対象部材が、前記第２の配置工程において、前記導電材料の上面に配置される第１の領域と、前記第２の配置工程において、前記導電材料の上面に配置されない第２の領域とを有し、固定治具は、前記第２の配置工程において、前記導電材料の上面に、前記第２の接続対象部材の前記第１の領域を配置し、前記導電材料の上面に、前記第２の接続対象部材の前記第２の領域を配置せずに、前記接続構造体を得るために用いられ、固定治具の前記第２の接続対象部材の前記第２の領域が配置される上面が、外側から内側にむけて、下側に傾斜している。 In a specific aspect of the fixing jig according to the present invention, the second connection target member includes a first region arranged on an upper surface of the conductive material in the second arrangement step, and the second A second jig that is not arranged on the upper surface of the conductive material in the arranging step, and the fixing jig is arranged on the upper surface of the conductive material in the second arranging step. The first region is disposed and used to obtain the connection structure without disposing the second region of the second connection target member on the upper surface of the conductive material. The upper surface on which the second region of the second connection target member is disposed is inclined downward from the outside toward the inside.
　本発明に係る固定治具のある特定の局面では、前記第２の接続対象部材が、前記第２の配置工程において、前記導電材料の上面に配置される第１の領域と、前記第２の配置工程において、前記導電材料の上面に配置されない第２の領域とを有し、固定治具は、上面に前記第１の凹部とは異なる第２の凹部を有し、固定治具は、前記第２の凹部の内側に、前記第２の接続対象部材の前記第２の領域を配置して用いられる。 In a specific aspect of the fixing jig according to the present invention, the second connection target member includes a first region arranged on an upper surface of the conductive material in the second arrangement step, and the second And the fixing jig has a second concave portion different from the first concave portion on the upper surface, and the fixing jig has the second region not disposed on the upper surface of the conductive material. The second region of the second connection object member is disposed and used inside the second recess.
　本発明に係る固定治具のある特定の局面では、前記固定治具の前記第１の接続対象部材が上方に位置する上面部分の材質が、セラミック、アルミニウム合金、チタン合金又はステンレスである。 In a specific aspect of the fixing jig according to the present invention, the material of the upper surface portion on which the first connection target member of the fixing jig is located is ceramic, aluminum alloy, titanium alloy, or stainless steel.
　本発明の広い局面によれば、上述した固定治具と、蓋部材とを備え、前記加熱工程において、前記第２の接続対象部材の上方に、前記蓋部材を配置して、前記接続構造体を得るために用いられる、蓋部材を備えた固定治具が提供される。 According to a wide aspect of the present invention, the connection structure includes the fixing jig described above and a lid member, and the lid member is disposed above the second connection target member in the heating step. There is provided a fixing jig having a lid member, which is used to obtain the above.
　本発明に係る蓋部材を備えた固定治具のある特定の局面では、前記蓋部材が、前記固定治具に接続されている。 In a specific aspect of the fixing jig provided with the lid member according to the present invention, the lid member is connected to the fixing jig.
　本発明に係る蓋部材を備えた固定治具のある特定の局面では、前記蓋部材の前記第２の接続対象部材が下方に位置する下面部分の材質が、セラミック、アルミニウム合金、チタン合金又はステンレスである。 In a specific aspect of the fixing jig provided with the lid member according to the present invention, the material of the lower surface portion of the lid member on which the second connection target member is located is ceramic, aluminum alloy, titanium alloy, or stainless steel. It is.
　本発明に係る蓋部材を備えた固定治具のある特定の局面では、前記固定治具の前記第１の接続対象部材が上方に位置する上面部分の材質の熱伝導率が、前記蓋部材の前記第２の接続対象部材が下方に位置する下面部分の材質の熱伝導率よりも高い。 In a specific aspect of the fixing jig including the lid member according to the present invention, the thermal conductivity of the material of the upper surface portion where the first connection target member of the fixing jig is located above is determined by the lid member. The second connection object member is higher than the thermal conductivity of the material of the lower surface portion located below.
　本発明に係る接続構造体の製造方法は、複数のはんだ粒子及びバインダーを含む導電材料と、第１の電極を上面に有する第１の接続対象部材と、第２の電極を下面に有する第２の接続対象部材とを用いる接続構造体の製造方法であって、上記第１の接続対象部材の上面に、上記導電材料を配置する第１の配置工程と、上記第１の電極と上記第２の電極とが対向するように、上記導電材料の上面に、上記第２の接続対象部材を配置する第２の配置工程と、上記はんだ粒子の融点以上に加熱することで、上記第１の接続対象部材と上記第２の接続対象部材とを接続している接続部を、上記導電材料により形成し、かつ、上記第１の電極と上記第２の電極とを、上記接続部中のはんだ部により電気的に接続する加熱工程とを備え、上記加熱工程において、上記第１の接続対象部材を固定治具に固定した状態で、加熱を行うので、電極間の導通信頼性を高めることができる。 The manufacturing method of the connection structure according to the present invention includes a conductive material including a plurality of solder particles and a binder, a first connection target member having a first electrode on an upper surface, and a second electrode having a second electrode on a lower surface. A connection structure using the first connection target member, the first placement step of placing the conductive material on the upper surface of the first connection target member, the first electrode, and the second electrode. A second arrangement step of arranging the second connection object member on the upper surface of the conductive material so as to face the electrode, and heating to a temperature equal to or higher than the melting point of the solder particles. A connection portion connecting the target member and the second connection target member is formed of the conductive material, and the first electrode and the second electrode are connected to a solder portion in the connection portion. A heating process that is electrically connected to the heating process. There, in the state of fixing the first connection object member to the fixture, since the heating can increase the conduction reliability between electrodes.
　本発明に係る固定治具は、第１の電極を上面に有する第１の接続対象部材と、第２の電極を下面に有する第２の接続対象部材と、上記第１の接続対象部材と上記第２の接続対象部材とを接続しており、かつ、複数のはんだ粒子及びバインダーを含む導電材料により形成された接続部とを備え、上記第１の電極と上記第２の電極とが上記接続部中のはんだ部により電気的に接続されている接続構造体を得るために用いられる固定治具であって、固定治具は、上記第１の接続対象部材の上面に、上記導電材料を配置する第１の配置工程と、上記第１の電極と上記第２の電極とが対向するように、上記導電材料の上面に、上記第２の接続対象部材を配置する第２の配置工程と、上記はんだ粒子の融点以上に加熱することで、上記第１の接続対象部材と上記第２の接続対象部材とを接続している接続部を、上記導電材料により形成し、かつ、上記第１の電極と上記第２の電極とを、上記接続部中のはんだ部により電気的に接続する加熱工程とを経て、上記接続構造体を得るために用いられ、固定治具は、上面に第１の凹部を有し、固定治具は、上記接続構造体を得る際に、上記第１の凹部の内側に、上記第１の接続対象部材を配置して用いられるので、電極間の導通信頼性が高められた接続構造体を得ることができる。 The fixing jig according to the present invention includes a first connection target member having a first electrode on an upper surface, a second connection target member having a second electrode on a lower surface, the first connection target member, and the above A connection portion formed of a conductive material including a plurality of solder particles and a binder, wherein the first electrode and the second electrode are connected to each other. A fixing jig used for obtaining a connection structure electrically connected by a solder portion in the portion, wherein the fixing jig arranges the conductive material on the upper surface of the first connection target member. And a second arrangement step of arranging the second connection target member on the upper surface of the conductive material so that the first electrode and the second electrode face each other. By heating above the melting point of the solder particles, the first connection target part And the second connection target member are formed of the conductive material, and the first electrode and the second electrode are electrically connected by the solder portion in the connection portion. Is used to obtain the connection structure through a heating step, and the fixing jig has a first recess on the upper surface, and the fixing jig obtains the connection structure, Since the first connection target member is disposed and used inside the first recess, a connection structure with improved conduction reliability between the electrodes can be obtained.
図１は、本発明の一実施形態に係る接続構造体の製造方法により得られる接続構造体を模式的に示す正面断面図である。FIG. 1 is a front sectional view schematically showing a connection structure obtained by a method for manufacturing a connection structure according to an embodiment of the present invention. 図２は、本発明の一実施形態に係る接続構造体の製造方法により得られる接続構造体を模式的に示す側面断面図である。FIG. 2 is a side cross-sectional view schematically showing a connection structure obtained by the method for manufacturing a connection structure according to one embodiment of the present invention. 図３（ａ）～（ｄ）は、本発明の一実施形態に係る接続構造体の製造方法の各工程を説明するための側面断面図である。3 (a) to 3 (d) are side cross-sectional views for explaining each step of the method for manufacturing the connection structure according to one embodiment of the present invention. 図４は、本発明の一実施形態に係る接続構造体の製造方法において得られる積層体を説明するための正面断面図である。FIG. 4 is a front cross-sectional view for explaining a laminated body obtained in the method for manufacturing a connection structure according to one embodiment of the present invention. 図５は、接続構造体の変形例を示す側面断面図である。FIG. 5 is a side sectional view showing a modification of the connection structure. 図６は、本発明の一実施形態に係る蓋部材を備えた固定治具を示す平面図である。FIG. 6 is a plan view showing a fixing jig provided with a lid member according to an embodiment of the present invention. 図７（ａ）～（ｅ）は、本発明の一実施形態に係る蓋部材を備えた固定治具を示す断面図である。7A to 7E are cross-sectional views showing a fixing jig provided with a lid member according to an embodiment of the present invention. 図８（ａ）は、図６に対応した平面図であり、図８（ｂ）は、図７（ｄ）に対応した断面図である。8A is a plan view corresponding to FIG. 6, and FIG. 8B is a cross-sectional view corresponding to FIG. 7D.
　以下、本発明の詳細を説明する。 Hereinafter, the details of the present invention will be described.
　本発明に係る接続構造体の製造方法では、導電材料と、第１の接続対象部材と、第２の接続対象部材とを用いる。上記導電材料は、複数のはんだ粒子と、バインダーとを含む。上記第１の接続対象部材は、第１の電極を上面（表面）に有する。上記第２の接続対象部材は、第２の電極を下面（表面）に有する。 In the method for manufacturing a connection structure according to the present invention, a conductive material, a first connection target member, and a second connection target member are used. The conductive material includes a plurality of solder particles and a binder. The first connection object member has a first electrode on an upper surface (surface). The second connection target member has a second electrode on the lower surface (front surface).
　本発明に係る接続構造体の製造方法は、上記第１の接続対象部材の上面に、上記導電材料を配置する第１の配置工程と、上記第１の電極と上記第２の電極とが対向するように、上記導電材料の上面に、上記第２の接続対象部材を配置する第２の配置工程と、上記はんだ粒子の融点以上に加熱することで、上記第１の接続対象部材と上記第２の接続対象部材とを接続している接続部を、上記導電材料により形成し、かつ、上記第１の電極と上記第２の電極とを、上記接続部中のはんだ部により電気的に接続する加熱工程とを備える。 In the method for manufacturing a connection structure according to the present invention, the first arrangement step of arranging the conductive material on the upper surface of the first connection target member, and the first electrode and the second electrode are opposed to each other. As described above, the second connection step of disposing the second connection target member on the upper surface of the conductive material, and heating to a temperature equal to or higher than the melting point of the solder particles, the first connection target member and the first A connecting portion connecting two connection target members is formed of the conductive material, and the first electrode and the second electrode are electrically connected by a solder portion in the connecting portion. Heating step.
　本発明に係る接続構造体の製造方法では、上記加熱工程において、上記第１の接続対象部材を固定治具に固定した状態で、加熱を行う。 In the method for manufacturing a connection structure according to the present invention, in the heating step, heating is performed in a state where the first connection target member is fixed to a fixing jig.
　本発明に係る接続構造体の製造方法では、上記第１の接続対象部材と、上記第２の接続対象部材と、上記第１の接続対象部材と上記第２の接続対象部材とを接続しており、かつ、複数のはんだ粒子及びバインダーを含む導電材料により形成された接続部とを備え、上記第１の電極と上記第２の電極とが上記接続部中のはんだ部により電気的に接続されている接続構造体を得ることができる。 In the manufacturing method of the connection structure according to the present invention, the first connection target member, the second connection target member, the first connection target member, and the second connection target member are connected. And a connection portion formed of a conductive material containing a plurality of solder particles and a binder, wherein the first electrode and the second electrode are electrically connected by the solder portion in the connection portion. Connection structure can be obtained.
　本発明に係る接続構造体の製造方法では、上記の構成が備えられているので、電極間の導通信頼性を高めることができる。上記加熱工程において、はんだ粒子が流動したとしても、第１の接続対象部材の移動が規制されていることによって、上記第１の電極と上記第２の電極との位置ずれを防ぐことができる。結果として、上記第１の電極と上記第２の電極との導通信頼性を高めることができる。本発明に係る接続構造体の製造方法では、導通信頼性が高くなり、狭ピッチ化に対応することができる。 In the method for manufacturing a connection structure according to the present invention, since the above-described configuration is provided, the conduction reliability between the electrodes can be improved. Even if the solder particles flow in the heating step, positional displacement between the first electrode and the second electrode can be prevented by restricting the movement of the first connection target member. As a result, the conduction reliability between the first electrode and the second electrode can be increased. In the manufacturing method of the connection structure according to the present invention, the conduction reliability is increased and the pitch can be reduced.
　本発明に係る接続構造体の製造方法では、上記第２の配置工程において、上記第１の接続対象部材を固定治具に固定した状態で、上記導電材料の上面に、上記第２の接続対象部材を配置することが好ましい。特に、上記第２の配置工程において、上記導電材料の上面に上記第２の接続対象部材を配置する際に、上記第１の電極と上記第２の電極とを精度よく対向させることができ、更に上記第１の電極と上記第２の電極との位置ずれを防ぐことができる。結果として、上記第１の電極と上記第２の電極との導通信頼性を高めることができる。本発明に係る接続構造体の製造方法では、導通信頼性が高くなり、狭ピッチ化に対応することができる。 In the manufacturing method of the connection structure according to the present invention, in the second arrangement step, the second connection target is formed on the upper surface of the conductive material in a state where the first connection target member is fixed to a fixing jig. It is preferable to arrange the members. In particular, in the second arrangement step, when the second connection target member is arranged on the upper surface of the conductive material, the first electrode and the second electrode can be opposed to each other with high accuracy. Further, it is possible to prevent the positional deviation between the first electrode and the second electrode. As a result, the conduction reliability between the first electrode and the second electrode can be increased. In the manufacturing method of the connection structure according to the present invention, the conduction reliability is increased and the pitch can be reduced.
　本発明に係る接続構造体の製造方法では、上記固定治具が上面に第１の凹部を有することが好ましい。本発明に係る接続構造体の製造方法では、上記固定治具の上記第１の凹部の内側に、上記第１の接続対象部材を配置することが好ましい。この場合には、上記第１の接続対象部材を所定の位置に固定することが容易である。 In the method for manufacturing a connection structure according to the present invention, the fixing jig preferably has a first recess on the upper surface. In the method for manufacturing a connection structure according to the present invention, it is preferable that the first connection target member is disposed inside the first recess of the fixing jig. In this case, it is easy to fix the first connection target member at a predetermined position.
　本発明に係る固定治具は、第１の電極を上面に有する第１の接続対象部材と、第２の電極を下面に有する第２の接続対象部材と、上記第１の接続対象部材と上記第２の接続対象部材とを接続しており、かつ、複数のはんだ粒子及びバインダーを含む導電材料により形成された接続部とを備え、上記第１の電極と上記第２の電極とが上記接続部中のはんだ部により電気的に接続されている接続構造体を得るために用いられる。 The fixing jig according to the present invention includes a first connection target member having a first electrode on an upper surface, a second connection target member having a second electrode on a lower surface, the first connection target member, and the above A connection portion formed of a conductive material including a plurality of solder particles and a binder, wherein the first electrode and the second electrode are connected to each other. It is used to obtain a connection structure that is electrically connected by a solder part in the part.
　本発明に係る固定治具は、上記第１の接続対象部材の上面に、上記導電材料を配置する第１の配置工程と、上記第１の電極と上記第２の電極とが対向するように、上記導電材料の上面に、上記第２の接続対象部材を配置する第２の配置工程と、上記はんだ粒子の融点以上に加熱することで、上記第１の接続対象部材と上記第２の接続対象部材とを接続している接続部を、上記導電材料により形成し、かつ、上記第１の電極と上記第２の電極とを、上記接続部中のはんだ部により電気的に接続する加熱工程とを経て、上記接続構造体を得るために用いられる。 In the fixing jig according to the present invention, the first arrangement step of arranging the conductive material on the upper surface of the first connection target member, and the first electrode and the second electrode face each other. The second connection step of disposing the second connection target member on the upper surface of the conductive material, and heating the first connection target member and the second connection by heating above the melting point of the solder particles. A heating step of forming a connection portion connecting the target member with the conductive material and electrically connecting the first electrode and the second electrode with a solder portion in the connection portion. And is used to obtain the connection structure.
　本発明に係る固定治具は、上面に第１の凹部を有する。 The fixing jig according to the present invention has a first recess on the upper surface.
　本発明に係る固定治具は、上記接続構造体を得る際に、上記第１の凹部の内側に、上記第１の接続対象部材を配置して用いられる。 The fixing jig according to the present invention is used by arranging the first connection object member inside the first recess when the connection structure is obtained.
　本発明に係る固定治具では、上記の構成が備えられているので、電極間の導通信頼性が高められた接続構造体を得ることができる。特に、上記第２の配置工程において、上記導電材料の上面に上記第２の接続対象部材を配置する際に、上記第１の電極と上記第２の電極とを精度よく対向させることができ、更に上記第１の電極と上記第２の電極との位置ずれを防ぐことができる。さらに、上記加熱工程において、はんだ粒子が流動したとしても、第１の接続対象部材の移動が規制されていることによって、上記第１の電極と上記第２の電極との位置ずれを防ぐことができる。結果として、上記第１の電極と上記第２の電極との導通信頼性を高めることができる。本発明に係る固定治具を用いることで、導通信頼性が高くなり、狭ピッチ化に対応することができる。 Since the fixing jig according to the present invention has the above-described configuration, a connection structure with improved conduction reliability between the electrodes can be obtained. In particular, in the second arrangement step, when the second connection target member is arranged on the upper surface of the conductive material, the first electrode and the second electrode can be opposed to each other with high accuracy. Further, it is possible to prevent the positional deviation between the first electrode and the second electrode. Further, in the heating step, even if the solder particles flow, the movement of the first connection target member is restricted, thereby preventing misalignment between the first electrode and the second electrode. it can. As a result, the conduction reliability between the first electrode and the second electrode can be increased. By using the fixing jig according to the present invention, the conduction reliability is increased and it is possible to cope with a narrow pitch.
　上記第２の接続対象部材が、上記第２の配置工程において、上記導電材料の上面に配置される第１の領域と、上記第２の配置工程において、上記導電材料の上面に配置されない第２の領域とを有することが好ましい。上記第２の配置工程において、上記導電材料の上面に、上記第２の接続対象部材の上記第１の領域を配置し、上記導電材料の上面に、上記第２の接続対象部材の上記第２の領域を配置せず、上記固定治具の上面に、上記第２の接続対象部材の上記第２の領域を配置することが好ましい。このような場合には、第１の接続対象部材と第２の接続対象部材とが部分的に対向している接続構造体を得ることができる。 The second connection target member is not disposed on the top surface of the conductive material in the second region, and the first region disposed on the top surface of the conductive material in the second placement step. It is preferable to have these areas. In the second arranging step, the first region of the second connection target member is arranged on the upper surface of the conductive material, and the second of the second connection target member is arranged on the upper surface of the conductive material. It is preferable to arrange the second region of the second connection target member on the upper surface of the fixing jig without arranging the region. In such a case, a connection structure in which the first connection target member and the second connection target member are partially opposed can be obtained.
　上記導電材料は、導電ペーストであってもよく、導電フィルムであってもよい。 The conductive material may be a conductive paste or a conductive film.
　上記導電材料及び上記バインダーは、熱可塑性成分又は熱硬化性成分を含むことが好ましい。上記導電材料は、熱硬化性成分を含んでいてもよく、熱可塑性成分を含んでいてもよい。上記はんだ粒子を溶融させる加熱時に硬化可能であることから、上記導電材料は、熱硬化性成分を含むことが好ましい。 The conductive material and the binder preferably contain a thermoplastic component or a thermosetting component. The said electrically-conductive material may contain the thermosetting component and may contain the thermoplastic component. The conductive material preferably contains a thermosetting component because it can be cured at the time of heating to melt the solder particles.
　はんだ粒子及び電極の表面の酸化膜を効果的に除去し、導通信頼性をより一層高める観点からは、上記導電材料は、フラックスを含むことが好ましい。 From the viewpoint of effectively removing the solder particles and the oxide film on the surface of the electrode and further improving the conduction reliability, the conductive material preferably contains a flux.
　上記導電材料は、必要に応じて、例えば、充填剤、増量剤、軟化剤、可塑剤、重合触媒、硬化触媒、着色剤、酸化防止剤、熱安定剤、光安定剤、紫外線吸収剤、滑剤、帯電防止剤及び難燃剤等の各種添加剤を含んでいてもよい。 The conductive material may be, for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, and a lubricant as necessary. In addition, various additives such as an antistatic agent and a flame retardant may be included.
　以下、図面を参照しつつ、本発明の具体的な実施形態を説明する。 Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.
　図１は、本発明の一実施形態に係る接続構造体の製造方法により得られる接続構造体を模式的に示す正面断面図である。図２は、本発明の一実施形態に係る接続構造体の製造方法により得られる接続構造体を模式的に示す側面断面図である。図２では、図１のＩ－Ｉ線に沿う断面図が拡大して示されている。 FIG. 1 is a front cross-sectional view schematically showing a connection structure obtained by a method for manufacturing a connection structure according to an embodiment of the present invention. FIG. 2 is a side cross-sectional view schematically showing a connection structure obtained by the method for manufacturing a connection structure according to one embodiment of the present invention. 2 is an enlarged cross-sectional view taken along the line II of FIG.
　図１，２に示す接続構造体１は、第１の接続対象部材２と、第２の接続対象部材３と、第１の接続対象部材２と第２の接続対象部材３とを接続している接続部４とを備える。接続部４の材料は、複数のはんだ粒子と、バインダーとを含む導電材料である。接続部４は、複数のはんだ粒子と、バインダーとを含む導電材料により形成されている。本実施形態では、上記バインダーは、熱硬化性成分を含む。なお、上記バインダーは、熱硬化性成分を含んでいなくてもよい。 The connection structure 1 shown in FIGS. 1 and 2 connects the first connection target member 2, the second connection target member 3, the first connection target member 2, and the second connection target member 3. A connecting portion 4. The material of the connection part 4 is a conductive material including a plurality of solder particles and a binder. The connection part 4 is formed of a conductive material containing a plurality of solder particles and a binder. In this embodiment, the binder includes a thermosetting component. In addition, the said binder does not need to contain the thermosetting component.
　接続部４は、複数のはんだ粒子が集まり互いに接合したはんだ部４Ａと、熱硬化性成分が熱硬化された硬化物部４Ｂとを有する。本実施形態では、はんだ部４Ａを形成するために、導電性粒子として、はんだ粒子を用いている。はんだ粒子は、中心部分及び導電部の外表面部分のいずれもが、はんだであり、はんだにより形成されている。 The connecting portion 4 includes a solder portion 4A in which a plurality of solder particles are gathered and joined to each other, and a cured product portion 4B in which a thermosetting component is thermally cured. In the present embodiment, solder particles are used as the conductive particles in order to form the solder portion 4A. In the solder particles, both the central portion and the outer surface portion of the conductive portion are solder, and are formed of solder.
　第１の接続対象部材２は表面（上面）に、複数の第１の電極２ａを有する。複数の第１の電極２ａは、図１の手前側から奥側及び図２の右側から左側に向けて、並んで配置されている。第２の接続対象部材３は表面（下面）に、複数の第２の電極３ａを有する。複数の第２の電極３ａは、図１の手前側から奥側及び図２の右側から左側に向けて、並んで配置されている。図１に示すように、第１の電極２ａと対向している第２の電極３ａ部分は、第２の接続対象部材３の中央よりも一端３ｂ側において位置している。 The first connection object member 2 has a plurality of first electrodes 2a on the surface (upper surface). The plurality of first electrodes 2a are arranged side by side from the near side to the far side in FIG. 1 and from the right side to the left side in FIG. The second connection target member 3 has a plurality of second electrodes 3a on the surface (lower surface). The plurality of second electrodes 3a are arranged side by side from the near side to the far side in FIG. 1 and from the right side to the left side in FIG. As shown in FIG. 1, the portion of the second electrode 3 a facing the first electrode 2 a is located closer to the one end 3 b than the center of the second connection target member 3.
　第１の電極２ａと第２の電極３ａとが、はんだ部４Ａにより電気的に接続されている。従って、第１の接続対象部材２と第２の接続対象部材３とが、はんだ部４Ａにより電気的に接続されている。なお、接続部４において、第１の電極２ａと第２の電極３ａとの間に集まったはんだ部４Ａとは異なる領域（硬化物部４Ｂ部分）では、はんだは存在しない。はんだ部４Ａとは異なる領域（硬化物部４Ｂ部分）では、はんだ部４Ａと離れたはんだは存在しない。なお、少量であれば、第１の電極２ａと第２の電極３ａとの間に集まったはんだ部４Ａとは異なる領域（硬化物部４Ｂ部分）に、はんだが存在していてもよい。 The first electrode 2a and the second electrode 3a are electrically connected by a solder portion 4A. Therefore, the first connection target member 2 and the second connection target member 3 are electrically connected by the solder portion 4A. In the connection portion 4, no solder exists in a region (cured product portion 4B portion) different from the solder portion 4A gathered between the first electrode 2a and the second electrode 3a. In an area different from the solder part 4A (hardened product part 4B part), there is no solder separated from the solder part 4A. If the amount is small, the solder may be present in a region (cured product portion 4B portion) different from the solder portion 4A gathered between the first electrode 2a and the second electrode 3a.
　図１，２に示すように、接続構造体１では、第１の電極２ａと第２の電極３ａとの間に、複数のはんだ粒子が集まり、複数のはんだ粒子が溶融した後、はんだ粒子の溶融物が電極の表面を濡れ拡がった後に固化して、はんだ部４Ａが形成されている。このため、はんだ部４Ａと第１の電極２ａ、並びにはんだ部４Ａと第２の電極３ａとの接続面積が大きくなる。このことによっても、接続構造体１における導通信頼性が高くなり、また接続構造体１の接続信頼性も高くなる。なお、導電材料にフラックスが含まれる場合に、フラックスは、一般に、加熱により次第に失活する。 As shown in FIGS. 1 and 2, in the connection structure 1, a plurality of solder particles gather between the first electrode 2 a and the second electrode 3 a, and after the plurality of solder particles melt, After the melt wets and spreads on the surface of the electrode, it solidifies to form a solder portion 4A. For this reason, the connection area of 4 A of solder parts and the 1st electrode 2a, and 4 A of solder parts, and the 2nd electrode 3a becomes large. This also increases the conduction reliability in the connection structure 1 and also increases the connection reliability of the connection structure 1. In addition, when a flux is contained in the conductive material, the flux is generally gradually deactivated by heating.
　接続構造体１では、第１の接続対象部材２と接続部４と第２の接続対象部材３との積層部分（図１の破線で囲まれた領域）において、第２の接続対象部材３が、一方側から他方側にむけて傾斜している。第２の接続対象部材３の一端３ｂと他端３ｃを結ぶ方向に、第１の接続対象部材２に対して、第２の接続対象部材３が１度以上（図１に示す傾斜角度α）傾いている。一端３ｂ側では他端３ｃ側よりも、第１の接続対象部材２と第２の接続対象部材３との間の距離が狭い。 In the connection structure 1, the second connection target member 3 is formed in a layered portion (a region surrounded by a broken line in FIG. 1) of the first connection target member 2, the connection portion 4, and the second connection target member 3. , Inclined from one side to the other side. The second connection target member 3 is at least 1 degree with respect to the first connection target member 2 in the direction connecting the one end 3b and the other end 3c of the second connection target member 3 (inclination angle α shown in FIG. 1). Tilted. The distance between the first connection target member 2 and the second connection target member 3 is narrower on the one end 3b side than on the other end 3c side.
　本発明に係る接続構造体の製造方法により得られる接続構造体では、第１の接続対象部材と接続部と第２の接続対象部材との積層部分において、第２の接続対象部材の一端と他端とを結ぶ方向に、第１の接続対象部材に対して、第２の接続対象部材は傾いていなくてもよい。 In the connection structure obtained by the method for manufacturing the connection structure according to the present invention, one end of the second connection target member and the other in the laminated portion of the first connection target member, the connection portion, and the second connection target member. The second connection target member may not be inclined with respect to the first connection target member in the direction connecting the ends.
　接続構造体において、第１の接続対象部材と接続部と第２の接続対象部材との積層部分において、第２の接続対象部材の一端と他端を結ぶ方向にて、第１の接続対象部材に対する第２の接続対象部材の傾斜角度αは、０度以上であってもよく、好ましくは１度以上、より好ましくは２度以上であり、好ましくは１０度以下、より好ましくは８度以下である。 In the connection structure, in the stacked portion of the first connection target member, the connection portion, and the second connection target member, the first connection target member in a direction connecting one end and the other end of the second connection target member. The inclination angle α of the second connection target member may be 0 ° or more, preferably 1 ° or more, more preferably 2 ° or more, preferably 10 ° or less, more preferably 8 ° or less. is there.
　なお、第１の接続対象部材２では、第２の電極３ａと対向される第１の電極２ａ部分の側方、及び接続部４の側方において、第１の電極２ａの表面上にソルダーレジスト膜５が形成されている。ソルダーレジスト膜の形成によって、導通信頼性及び高速伝送適合性がより一層高くなる。第２の接続対象部材３では、第１の電極２ａと対向される第２の電極３ａ部分の側方において、第２の電極３ａの表面上にカバーレイ６が形成されている。 In the first connection object member 2, a solder resist is formed on the surface of the first electrode 2 a on the side of the first electrode 2 a facing the second electrode 3 a and on the side of the connection portion 4. A film 5 is formed. By forming the solder resist film, conduction reliability and high-speed transmission compatibility are further enhanced. In the second connection target member 3, a coverlay 6 is formed on the surface of the second electrode 3 a on the side of the second electrode 3 a portion facing the first electrode 2 a.
　なお、図２に示す接続構造体１では、はんだ部４Ａの全てが、第１，第２の電極２ａ，３ａ間の対向している領域に位置している。図５に示す変形例の接続構造体１Ｘは、接続部４Ｘのみが、図２に示す接続構造体１と異なる。接続部４Ｘは、はんだ部４ＸＡと硬化物部４ＸＢとを有する。接続構造体１Ｘのように、はんだ部４ＸＡの多くが、第１，第２の電極２ａ，３ａの対向している領域に位置しており、はんだ部４ＸＡの一部が第１，第２の電極２ａ，３ａの対向している領域から側方にはみ出していてもよい。第１，第２の電極２ａ，３ａの対向している領域から側方にはみ出しているはんだ部４ＸＡは、はんだ部４ＸＡの一部であり、はんだ部４ＸＡから離れたはんだではない。なお、本実施形態では、はんだ部から離れたはんだの量を少なくすることができるが、はんだ部から離れたはんだが硬化物部中に存在していてもよい。 In addition, in the connection structure 1 shown in FIG. 2, all of the solder portions 4A are located in the opposing region between the first and second electrodes 2a and 3a. The connection structure 1X of the modification shown in FIG. 5 is different from the connection structure 1 shown in FIG. 2 only in the connection portion 4X. The connection part 4X has the solder part 4XA and the hardened | cured material part 4XB. As in the connection structure 1X, most of the solder portions 4XA are located in regions where the first and second electrodes 2a and 3a are opposed to each other, and a part of the solder portion 4XA is first and second. You may protrude to the side from the area | region which electrode 2a, 3a has opposed. The solder part 4XA protruding laterally from the region where the first and second electrodes 2a and 3a are opposed is a part of the solder part 4XA and is not a solder separated from the solder part 4XA. In the present embodiment, the amount of solder away from the solder portion can be reduced, but the solder away from the solder portion may exist in the cured product portion.
　はんだ粒子の使用量を少なくすれば、接続構造体１を得ることが容易になる。はんだ粒子の使用量を多くすれば、接続構造体１Ｘを得ることが容易になる。 If the amount of solder particles used is reduced, the connection structure 1 can be easily obtained. If the amount of the solder particles used is increased, it becomes easy to obtain the connection structure 1X.
　はんだ粒子を電極上により一層効率的に配置するために、上記導電材料の２５℃での粘度（η２５）は好ましくは１０Ｐａ・ｓ以上、より好ましくは２０Ｐａ・ｓ以上、更に好ましくは５０Ｐａ・ｓ以上であり、好ましくは８００Ｐａ・ｓ以下、より好ましくは６００Ｐａ・ｓ以下、更に好ましくは５００Ｐａ・ｓ以下である。上記粘度が上記下限以上であると、導電材料が塗布直後に過度に流れ出しにくくなる。上記粘度が上記上限以下であると、はんだがより一層効率的に凝集する。 In order to more efficiently arrange the solder particles on the electrode, the viscosity (η25) at 25 ° C. of the conductive material is preferably 10 Pa · s or more, more preferably 20 Pa · s or more, and further preferably 50 Pa · s or more. Preferably, it is 800 Pa · s or less, more preferably 600 Pa · s or less, and still more preferably 500 Pa · s or less. When the viscosity is equal to or higher than the lower limit, the conductive material does not easily flow out immediately after application. When the viscosity is not more than the above upper limit, the solder is more efficiently aggregated.
　上記粘度は、配合成分の種類及び配合量に適宜調整可能である。また、フィラーの使用により、粘度を比較的高くすることができる。 The viscosity can be appropriately adjusted depending on the type and amount of the compounding component. Further, the use of a filler can make the viscosity relatively high.
　上記粘度は、例えば、Ｅ型粘度計（東機産業社製）等を用いて、２５℃及び５ｒｐｍの条件で測定可能である。 The viscosity can be measured under conditions of 25 ° C. and 5 rpm using, for example, an E-type viscometer (manufactured by Toki Sangyo Co., Ltd.).
　次に、本発明の一実施形態に係る接続構造体の製造方法を説明する。 Next, a method for manufacturing a connection structure according to an embodiment of the present invention will be described.
　本発明の一実施形態に係る接続構造体の製造方法を説明する前に、本発明の一実施形態に係る接続構造体の製造方法に用いることができる本発明の一実施形態に係る蓋部材を備えた固定治具を説明する。 Before describing a method for manufacturing a connection structure according to an embodiment of the present invention, a lid member according to an embodiment of the present invention that can be used in the method for manufacturing a connection structure according to an embodiment of the present invention. The fixing jig provided will be described.
　図６は、本発明の一実施形態に係る蓋部材を備えた固定治具２０を示す平面図である。図７（ａ）～（ｅ）は、本発明の一実施形態に係る蓋部材を備えた固定治具２０を示す断面図である。図７（ａ）は、図６のＩ－Ｉ線に沿う断面図であり、図７（ｂ）は、図６のＩＩ－ＩＩ線に沿う断面図であり、図７（ｃ）は、図６のＩＩＩ－ＩＩＩ線に沿う断面図であり、図７（ｄ）は、図６のＩＶ－ＩＶ線に沿う断面図であり、図７（ｅ）は、図６のＶ－Ｖ線に沿う断面図である。図８（ａ）は、図６に対応した平面図であり、図８（ｂ）は、図７（ｄ）に対応した断面図である。 FIG. 6 is a plan view showing a fixing jig 20 provided with a lid member according to an embodiment of the present invention. FIGS. 7A to 7E are cross-sectional views showing a fixing jig 20 provided with a lid member according to an embodiment of the present invention. 7A is a cross-sectional view taken along the line II of FIG. 6, FIG. 7B is a cross-sectional view taken along the line II-II of FIG. 6, and FIG. 6 is a sectional view taken along line III-III in FIG. 6, FIG. 7D is a sectional view taken along line IV-IV in FIG. 6, and FIG. 7E is taken along line VV in FIG. It is sectional drawing. 8A is a plan view corresponding to FIG. 6, and FIG. 8B is a cross-sectional view corresponding to FIG. 7D.
　蓋部材を備えた固定治具２０は、固定治具２１と、蓋部材２２とを備える。蓋部材２２は、固定治具２１に接続されている。蓋部材を備えた固定治具２０は、接続部材２３をさらに備える。接続部材２３により、蓋部材２２が、固定治具２１に接続されている。接続部材２３は、例えばヒンジである。 The fixing jig 20 provided with a lid member includes a fixing jig 21 and a lid member 22. The lid member 22 is connected to the fixing jig 21. The fixing jig 20 provided with the lid member further includes a connection member 23. The lid member 22 is connected to the fixing jig 21 by the connecting member 23. The connecting member 23 is a hinge, for example.
　蓋部材は、固定治具に接続されていなくてもよい。 The lid member may not be connected to the fixing jig.
　なお、図６及び図８（ａ）では、蓋部材２２が開いた状態が示されており、図７（ａ）～（ｅ）及び図８（ｂ）では、蓋部材２２が閉じた状態が示されている。 6 and 8A show a state in which the lid member 22 is opened, and in FIGS. 7A to 7E and FIG. 8B, a state in which the lid member 22 is closed is shown. It is shown.
　固定治具２１は、上面に第１の凹部２１ａを有する。図８（ａ），（ｂ）に示すように、第１の凹部２１ａは、第１の凹部２１ａの内側に、第１の接続対象部材２を配置するために設けられている。 The fixing jig 21 has a first recess 21a on the upper surface. As shown in FIGS. 8A and 8B, the first recess 21a is provided inside the first recess 21a in order to place the first connection target member 2.
　固定治具は、複数の第１の接続対象部材を配置可能であるように、複数の第１の凹部を有していてもよい。 The fixing jig may have a plurality of first recesses so that a plurality of first connection target members can be arranged.
　固定治具２１は、上面に複数の第２の凹部２１ｂを有する。第２の凹部２１ｂは、第１の凹部２１ａと異なる。第２の凹部２１ｂは、第２の凹部２１ｂの内側に、第２の接続対象部材３を配置するために設けられている。 The fixing jig 21 has a plurality of second recesses 21b on the upper surface. The second recess 21b is different from the first recess 21a. The 2nd recessed part 21b is provided in order to arrange | position the 2nd connection object member 3 inside the 2nd recessed part 21b.
　第２の凹部２１ｂの下端の上面の高さ位置は、第１の凹部２１ａの上面（上端）の高さ位置よりも高い。第２の凹部２１ｂは、第１の凹部２１ａよりも外側に位置している部分を有する。第２の凹部２１ｂの第１の凹部２１ａよりも外側に位置している部分は、上記第２の接続対象部材の上記第２の領域を配置するために設けられている。 The height position of the upper surface of the lower end of the second recess 21b is higher than the height position of the upper surface (upper end) of the first recess 21a. The 2nd recessed part 21b has a part located in the outer side rather than the 1st recessed part 21a. The portion of the second recess 21b located outside the first recess 21a is provided to arrange the second region of the second connection target member.
　第１の凹部２１ａの深さは、第１の接続対象部材２と、第１の接続対象部材２の上面に配置される接続部４との合計の厚みを考慮して選ばれる。第１の凹部２１ａの深さは、例えば、第１の接続対象部材２と接続部４との合計の厚み－３０μｍ以上であることが好ましく、第１の接続対象部材２と接続部４との合計の厚み以上であることが好ましい。第１の凹部２１ａの上面（上端）から、第２の凹部２１ｂの下端の上面までの深さは、例えば、第１の接続対象部材２と接続部４との合計の厚み±３０μｍであることが好ましく、第１の接続対象部材２と接続部４との合計の厚み以上、第１の接続対象部材２と、第１の接続対象部材２と接続部４との合計の厚み＋３０μｍ以下であることが好ましい。 The depth of the first recess 21a is selected in consideration of the total thickness of the first connection target member 2 and the connection portion 4 disposed on the upper surface of the first connection target member 2. The depth of the first recess 21a is preferably, for example, a total thickness of the first connection target member 2 and the connection portion 4 of −30 μm or more, and the first connection target member 2 and the connection portion 4 It is preferable that the total thickness or more. The depth from the upper surface (upper end) of the first recess 21a to the upper surface of the lower end of the second recess 21b is, for example, the total thickness of the first connection target member 2 and the connection portion 4 ± 30 μm. Preferably, the thickness is equal to or greater than the total thickness of the first connection target member 2 and the connection portion 4, and is equal to or less than the total thickness of the first connection target member 2, the first connection target member 2 and the connection portion 4 +30 μm. It is preferable.
　上記固定治具の上記第２の接続対象部材の上記第２の領域が配置される上面が、外側から内側にむかって、下側に傾斜していることが好ましい。上記第２の凹部の上面が、外側から内側（例えば、得られる接続構造体の中心に対応する位置）にむかって、下側に傾斜していることが好ましい。この傾斜角度αは、好ましくは１度以上、より好ましくは２度以上であり、好ましくは１０度以下、より好ましくは８度以下である。この場合には、第２の接続対象部材の第１の領域において、より一層強固な接続を行うことができる結果、導通信頼性がより一層高くなる。特に、第２の接続対象部材が、樹脂フィルム、フレキシブルプリント基板、フレキシブルフラットケーブル又はリジッドフレキシブル基板であっても、第２の接続対象部材の導通信頼性を高めることができる。 It is preferable that an upper surface of the fixing jig on which the second region of the second connection target member is disposed is inclined downward from the outside toward the inside. The upper surface of the second recess is preferably inclined downward from the outside toward the inside (for example, a position corresponding to the center of the obtained connection structure). This inclination angle α is preferably 1 degree or more, more preferably 2 degrees or more, preferably 10 degrees or less, more preferably 8 degrees or less. In this case, in the first region of the second connection target member, the connection reliability can be further enhanced as a result of the further strong connection. In particular, even when the second connection target member is a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board, the conduction reliability of the second connection target member can be increased.
　図８（ａ），（ｂ）に示すように、固定治具２１では、第１の凹部２１ａの４つの角部２１ｃの内側に、第１の接続対象部材２を配置することができる。角部２１ｃによって、第１の接続対象部材２の移動を規制することができる。 8A and 8B, in the fixing jig 21, the first connection target member 2 can be disposed inside the four corners 21c of the first recess 21a. The movement of the first connection target member 2 can be restricted by the corner portion 21c.
　固定治具２１は、第１の凹部２１ａに連なる隙間部２１ｄを有する。図８（ａ）に示すように、第１の凹部２１ａの内側に、第１の接続対象部材２を配置したときに、第１の接続対象部材２の側面の側方に、隙間部２１ｄによる隙間が確保される。第１の接続対象部材２を配置したときに、隙間部２１ｄにおいて、第１の接続対象部材２の側面は、固定治具２１と接触しない。さらに、隙間部２１ｄにおいて、得られる接続構造体１の側面は、固定治具２１と接触しない。この結果、第１の接続対象部材２及び得られる接続構造体１を取り出すことが容易である。 The fixing jig 21 has a gap portion 21d connected to the first recess 21a. As shown in FIG. 8A, when the first connection target member 2 is arranged inside the first recess 21a, the gap 21d is formed on the side of the side surface of the first connection target member 2. A gap is secured. When the first connection target member 2 is disposed, the side surface of the first connection target member 2 does not contact the fixing jig 21 in the gap portion 21d. Furthermore, the side surface of the obtained connection structure 1 does not contact the fixing jig 21 in the gap portion 21 d. As a result, it is easy to take out the first connection target member 2 and the resulting connection structure 1.
　上記固定治具の上記第１の接続対象部材が上方に位置する上面部分の材質、及び、上記固定治具の上記第２の接続対象部材の上記第２の領域が上方に位置する上面部分の材質としては、セラミック、アルミニウム合金、チタン合金及びステンレス等が挙げられる。熱伝導性に優れていることから、上記固定治具の上記第１の接続対象部材が上方に位置する上面部分の材質、及び、上記固定治具の上記第２の接続対象部材の上記第２の領域が上方に位置する上面部分の材質は、セラミック、アルミニウム合金、チタン合金又はステンレスであることが好ましく、アルミニウム合金であることがより好ましい。 The material of the upper surface portion where the first connection target member of the fixing jig is located above, and the upper surface portion where the second region of the second connection object member of the fixing jig is located above. Examples of the material include ceramic, aluminum alloy, titanium alloy, and stainless steel. Since it is excellent in thermal conductivity, the material of the upper surface portion where the first connection target member of the fixing jig is located above, and the second of the second connection target member of the fixing jig. The material of the upper surface portion in which the region is located is preferably ceramic, aluminum alloy, titanium alloy or stainless steel, and more preferably aluminum alloy.
　上記蓋部材の上記第２の接続対象部材が下方に位置する下面部分の材質としては、セラミック、アルミニウム合金、チタン合金又はステンレス等が挙げられる。耐熱性に優れていることから、上記蓋部材の上記第２の接続対象部材が下方に位置する下面部分の材質は、セラミック、アルミニウム合金、チタン合金又はステンレスであることが好ましく、セラミックであることがより好ましい。この場合には、蓋部材の厚みが薄くても、耐熱性を高めることができ、熱変形及び熱劣化を抑えることができる。 The material of the lower surface portion of the lid member on which the second connection target member is positioned below is ceramic, aluminum alloy, titanium alloy, stainless steel, or the like. Since the heat resistance is excellent, the material of the lower surface portion of the lid member where the second connection target member is located below is preferably ceramic, aluminum alloy, titanium alloy or stainless steel, and is ceramic. Is more preferable. In this case, even if the lid member is thin, the heat resistance can be increased and thermal deformation and thermal deterioration can be suppressed.
　上記固定治具の上記第１の接続対象部材が上方に位置する上面部分の材質の熱伝導率（Ａ１）が、上記蓋部材の上記第２の接続対象部材が下方に位置する下面部分の材質の熱伝導率（Ｂ）よりも高いことが好ましい。上記固定治具の上記第２の接続対象部材の上記第２の領域が上方に位置する上面部分の材質の熱伝導率（Ａ２）が、上記蓋部材の上記第２の接続対象部材が下方に位置する下面部分の材質の熱伝導率（Ｂ）よりも高いことが好ましい。 The thermal conductivity (A1) of the material of the upper surface portion where the first connection object member of the fixing jig is located above is the material of the lower surface portion where the second connection object member of the lid member is located below. It is preferable that the thermal conductivity (B) is higher. The thermal conductivity (A2) of the material of the upper surface portion where the second region of the second connection target member of the fixing jig is located above is lower than the second connection target member of the lid member. It is preferable that it is higher than the thermal conductivity (B) of the material of the lower surface part located.
　上記固定治具の上記第１の接続対象部材が上方に位置する上面部分の材質の熱伝導率（Ａ１）、及び、上記固定治具の上記第２の接続対象部材の上記第２の領域が上方に位置する上面部分の材質の熱伝導率（Ａ２）は、好ましくは１０Ｗ／ｍ・Ｋ以上、より好ましくは２０Ｗ／ｍ・Ｋ以上である。上記熱伝導率（Ａ１），（Ａ２）は高いほどよい。 The thermal conductivity (A1) of the material of the upper surface portion where the first connection target member of the fixing jig is located above, and the second region of the second connection target member of the fixing jig are The thermal conductivity (A2) of the material of the upper surface portion located above is preferably 10 W / m · K or more, more preferably 20 W / m · K or more. The higher the thermal conductivity (A1) and (A2), the better.
　放熱性を効果的に高め、耐久性をより一層高め、かつ、取扱い性をより一層高める観点からは、上記固定治具の上記第１の接続対象部材が上方に位置する部分の厚みは、好ましくは１ｍｍ以上であり、より好ましくは３ｍｍ以上、好ましくは２０ｍｍ以下、より好ましくは１０ｍｍ以下である。 From the viewpoint of effectively improving heat dissipation, further improving durability, and further improving handleability, the thickness of the portion of the fixing jig where the first connection target member is positioned is preferably Is 1 mm or more, more preferably 3 mm or more, preferably 20 mm or less, more preferably 10 mm or less.
　耐熱性をより一層高め、かつ、取扱い性をより一層高める観点からは、上記蓋部材の上記第２の接続対象部材が下方に位置する部分の厚みは、好ましくは０．０５ｍｍ以上、より好ましくは０．１ｍｍ以上であり、好ましくは１ｍｍ以下、より好ましくは０．５ｍｍ以下である。 From the viewpoint of further improving the heat resistance and further improving the handleability, the thickness of the portion where the second connection target member of the lid member is positioned below is preferably 0.05 mm or more, more preferably It is 0.1 mm or more, preferably 1 mm or less, more preferably 0.5 mm or less.
　蓋部材を備えた固定治具２０を用いて、接続構造体１は、以下のようにして得ることができる。 Using the fixing jig 20 provided with a lid member, the connection structure 1 can be obtained as follows.
　図３（ａ）～（ｄ）は、図２に対応する部分の側面断面図である。図４は、図１に対応する部分の正面断面図である。 3 (a) to 3 (d) are side sectional views of a portion corresponding to FIG. FIG. 4 is a front sectional view of a portion corresponding to FIG.
　第１の電極２ａを上面（表面）に有する第１の接続対象部材２を用意する。また、蓋部材を備えた固定治具２０を用意する。 1st connection object member 2 which has the 1st electrode 2a on the upper surface (surface) is prepared. Moreover, the fixing jig 20 provided with the cover member is prepared.
　図３（ａ）に示すように、具体的には図８（ａ），（ｂ）に示す位置に、固定治具２０の第１の凹部２１ａの内側に、第１の接続対象部材２を配置する。角部２１ｃによって、第１の接続対象部材２の移動が規制される。第１の接続対象部材２の側方に、第１の凹部２１ａの内壁部が位置していることが好ましい。 As shown in FIG. 3A, specifically, the first connection target member 2 is placed inside the first recess 21a of the fixing jig 20 at the position shown in FIGS. Deploy. The movement of the first connection target member 2 is restricted by the corner portion 21c. It is preferable that the inner wall portion of the first concave portion 21 a is located on the side of the first connection target member 2.
　次に、図３（ｂ）に示すように、第１の接続対象部材２の上面に、バインダーである熱硬化性成分１１Ｂと、複数のはんだ粒子１１Ａとを含む導電材料１１を配置する（第１の配置工程）。なお、バインダーは、熱硬化性成分を含んでいなくてもよい。 Next, as shown in FIG. 3B, a conductive material 11 including a thermosetting component 11B as a binder and a plurality of solder particles 11A is disposed on the upper surface of the first connection target member 2 (first). 1 arrangement step). In addition, the binder does not need to contain the thermosetting component.
　第１の接続対象部材２の第１の電極２ａが設けられた表面上に、導電材料１１を配置する。導電材料１１の配置の後に、はんだ粒子１１Ａは、第１の電極２ａ（ライン）上と、第１の電極２ａが形成されていない領域（スペース）上との双方に配置されている。 The conductive material 11 is disposed on the surface of the first connection target member 2 on which the first electrode 2a is provided. After the conductive material 11 is disposed, the solder particles 11A are disposed both on the first electrode 2a (line) and on a region (space) where the first electrode 2a is not formed.
　導電材料１１の配置方法としては、特に限定されないが、ディスペンサーによる塗布、スクリーン印刷、及びインクジェット装置による吐出等が挙げられる。 The arrangement method of the conductive material 11 is not particularly limited, and examples thereof include application by a dispenser, screen printing, and discharge by an inkjet device.
　また、第２の電極３ａを下面（表面）に有する第２の接続対象部材３を用意する。次に、図３（ｃ）に示すように、第１の接続対象部材２の上面上の導電材料１１において、導電材料１１の上面に、第２の接続対象部材３を配置して、積層体を得る（第２の配置工程、積層体を得る工程）。上記第２の配置工程において、第１の接続対象部材３を固定治具２１に固定した状態で、導電材料１１の上面に、第２の接続対象部材３を配置する。導電材料１１の上面に、第２の電極３ａ側から、第２の接続対象部材３を配置する。このとき、第１の電極２ａと第２の電極３ａとを対向させる。 Moreover, the 2nd connection object member 3 which has the 2nd electrode 3a in a lower surface (surface) is prepared. Next, as shown in FIG. 3C, in the conductive material 11 on the upper surface of the first connection target member 2, the second connection target member 3 is arranged on the upper surface of the conductive material 11, and the laminated body (2nd arrangement | positioning process, the process of obtaining a laminated body). In the second arrangement step, the second connection target member 3 is arranged on the upper surface of the conductive material 11 in a state where the first connection target member 3 is fixed to the fixing jig 21. On the upper surface of the conductive material 11, the second connection target member 3 is disposed from the second electrode 3a side. At this time, the first electrode 2a and the second electrode 3a are opposed to each other.
　はんだ粒子を電極上により一層効率的に配置する観点からは、上記第２の配置工程において、第２の接続対象部材を加圧しないか、又は０．１ＭＰａ以下（より好ましくは０．０５ＭＰａ以下、更に好ましくは０．０２ＭＰａ以下）の圧力で加圧することが好ましく、加圧しないことがより好ましい。上記第２の配置工程において、第２の接続対象部材を加圧せず、導電材料に第２の接続対象部材の重量が加わることが好ましい。 From the viewpoint of more efficiently arranging the solder particles on the electrode, in the second arranging step, the second connection target member is not pressurized or 0.1 MPa or less (more preferably 0.05 MPa or less, More preferably, pressurization is preferably performed at a pressure of 0.02 MPa or less, and more preferably, no pressurization is performed. In the second arranging step, it is preferable that the second connection target member is not pressurized and the weight of the second connection target member is added to the conductive material.
　上記第２の配置工程において、導電材料１１の上面に、第２の接続対象部材３の上記第１の領域を配置し、導電材料１１の上面に、第２の接続対象部材３の上記第２の領域を配置しないことが好ましい。固定治具２１の上面に、第２の接続対象部材３の上記第２の領域を配置することが好ましい。固定治具２１の第２の凹部２１ｂの内側に、第２の接続対象部材３の上記第２の領域を配置することが好ましい。第２の接続対象部材３の側方に、第２の凹部２１ｂの内壁部が位置していることが好ましい。 In the second arrangement step, the first region of the second connection target member 3 is arranged on the upper surface of the conductive material 11, and the second of the second connection target member 3 is arranged on the upper surface of the conductive material 11. It is preferable not to arrange the region. It is preferable to arrange the second region of the second connection target member 3 on the upper surface of the fixing jig 21. It is preferable to arrange the second region of the second connection target member 3 inside the second recess 21 b of the fixing jig 21. It is preferable that the inner wall part of the 2nd recessed part 21b is located in the side of the 2nd connection object member 3. As shown in FIG.
　図３（ｃ）に対応する図４に示すように、上記第２の配置工程において、第１の接続対象部材２と導電材料１１と第２の接続対象部材３との積層部分（図４の破線で囲まれた領域）において、第２の接続対象部材３の一端３ｂと他端３ｃを結ぶ方向に、第１の接続対象部材２に対して、第２の接続対象部材３を１度以上（傾斜角度α）傾けて配置することが好ましい。第２の接続対象部材３の第２の電極３ａがある一端３ｂ側で、第２の接続対象部材３の一端３ｂ側とは反対の他端３ｃ側よりも、第１の接続対象部材２と第２の接続対象部材３との間の距離が狭くなる。 As shown in FIG. 4 corresponding to FIG. 3C, in the second arrangement step, the laminated portion of the first connection target member 2, the conductive material 11, and the second connection target member 3 (in FIG. 4). In the direction of connecting the one end 3b and the other end 3c of the second connection target member 3 to the first connection target member 2 in the direction surrounded by the broken line), the second connection target member 3 is moved at least once. (Inclination angle α) It is preferable to dispose them. The first connection target member 2 is closer to the one end 3b side where the second electrode 3a of the second connection target member 3 is located than the other end 3c side opposite to the one end 3b side of the second connection target member 3. The distance between the second connection target member 3 is reduced.
　上記第２の配置工程において、第１の接続対象部材２に対して、第２の接続対象部材３の傾斜角度αは１度以上であることが好ましい。 In the second arrangement step, the inclination angle α of the second connection target member 3 with respect to the first connection target member 2 is preferably 1 degree or more.
　電極間の導通信頼性を高める観点からは、加熱前の上記積層体において、第１の接続対象部材と導電材料と第２の接続対象部材との積層部分において、上記傾斜角度αは好ましくは２度以上であり、好ましくは１０度以下、より好ましくは８度以下である。 From the viewpoint of increasing the reliability of conduction between the electrodes, the inclination angle α is preferably 2 in the laminated portion before heating in the laminated portion of the first connection target member, the conductive material, and the second connection target member. It is more than 10 degrees, preferably 10 degrees or less, more preferably 8 degrees or less.
　次に、はんだ粒子１１Ａの融点以上に導電材料１１を加熱する（加熱工程）。上記加熱工程において、第１の接続対象部材２を固定治具２１に固定した状態で、加熱を行う。好ましくは、熱硬化性成分１１Ｂ（バインダー）の硬化温度以上に導電材料１１を加熱する。上記加熱工程において、第１の接続対象部材２に対して、第２の接続対象部材３が傾いた状態で、加熱を開始することが好ましい。この加熱時には、電極が形成されていない領域に存在していたはんだ粒子１１Ａは、第１の電極２ａと第２の電極３ａとの間に集まる（自己凝集効果）。導電フィルムではなく、導電ペーストを用いた場合には、はんだ粒子１１Ａが、第１の電極２ａと第２の電極３ａとの間に効果的に集まる。また、はんだ粒子１１Ａは溶融し、互いに接合する。また、熱硬化性成分１１Ｂは熱硬化する。この結果、図３（ｄ）に示すように、第１の接続対象部材２と第２の接続対象部材３とを接続している接続部４を、導電材料１１により形成する。導電材料１１により接続部４が形成され、複数のはんだ粒子１１Ａが接合することによってはんだ部４Ａが形成され、熱硬化性成分１１Ｂが熱硬化することによって硬化物部４Ｂが形成される。 Next, the conductive material 11 is heated above the melting point of the solder particles 11A (heating step). In the heating step, heating is performed in a state where the first connection target member 2 is fixed to the fixing jig 21. Preferably, the conductive material 11 is heated above the curing temperature of the thermosetting component 11B (binder). In the heating step, it is preferable to start heating in a state where the second connection target member 3 is inclined with respect to the first connection target member 2. At the time of this heating, the solder particles 11A that existed in the region where no electrode is formed gather between the first electrode 2a and the second electrode 3a (self-aggregation effect). When the conductive paste is used instead of the conductive film, the solder particles 11A are effectively collected between the first electrode 2a and the second electrode 3a. Also, the solder particles 11A are melted and joined together. Further, the thermosetting component 11B is thermoset. As a result, as shown in FIG. 3D, the connection portion 4 that connects the first connection target member 2 and the second connection target member 3 is formed of the conductive material 11. The connection part 4 is formed of the conductive material 11, the solder part 4A is formed by joining a plurality of solder particles 11A, and the cured part 4B is formed by thermosetting the thermosetting component 11B.
　上記加熱工程において、第２の接続対象部材３の上記第１の領域を、一方側から他方側にむけて、下側に向かって傾斜させることが好ましい。 In the heating step, it is preferable that the first region of the second connection target member 3 is inclined downward from one side to the other side.
　本実施形態では、第１の接続対象部材２と接続部４と第２の接続対象部材３との積層部分において、第２の接続対象部材３の一端３ｂと他端３ｃを結ぶ方向に、第１の接続対象部材２に対して、第２の接続対象部材３が１度以上、１０度以下で傾いている接続構造体を得ている。 In the present embodiment, in the stacked portion of the first connection target member 2, the connection portion 4, and the second connection target member 3, the second connection target member 3 is connected in the direction connecting the one end 3 b and the other end 3 c. A connection structure is obtained in which the second connection target member 3 is inclined at 1 degree or more and 10 degrees or less with respect to one connection target member 2.
　上記第１の接続対象部材と上記接続部と上記第２の接続対象部材との積層部分において、上記第２の接続対象部材の上記一端と他端を結ぶ方向に、上記第１の接続対象部材に対して、上記第２の接続対象部材が１度以上、１０度以下で傾いている接続構造体を得ることが好ましい。 In the stacked portion of the first connection target member, the connection portion, and the second connection target member, the first connection target member is connected in a direction connecting the one end and the other end of the second connection target member. On the other hand, it is preferable to obtain a connection structure in which the second connection target member is inclined at 1 degree or more and 10 degrees or less.
　第２の接続対象部材の傾斜が小さいことが求められる場合には、上記第１の接続対象部材と上記接続部と上記第２の接続対象部材との積層部分において、上記第２の接続対象部材の上記一端と他端を結ぶ方向に、上記第１の接続対象部材に対して、上記第２の接続対象部材が傾いていないか又は１度未満で傾いている接続構造体を得てもよい。 In the case where the inclination of the second connection target member is required to be small, the second connection target member in the laminated portion of the first connection target member, the connection portion, and the second connection target member. In the direction connecting the one end and the other end, a connection structure body may be obtained in which the second connection target member is not tilted or tilted at less than 1 degree with respect to the first connection target member. .
　図３（ｄ）に示すように、本実施形態では、第２の接続対象部材の移動を抑えることができることから、上記加熱工程において、第２の接続対象部材３の上方に、蓋部材２２を配置している。第２の接続対象部材３の移動を抑えることができることから、上記加熱工程において、第２の接続対象部材３の上面に、蓋部材２２を接触させることが好ましい。 As shown in FIG.3 (d), in this embodiment, since the movement of a 2nd connection object member can be suppressed, the cover member 22 is provided above the 2nd connection object member 3 in the said heating process. It is arranged. Since the movement of the second connection target member 3 can be suppressed, it is preferable that the lid member 22 is brought into contact with the upper surface of the second connection target member 3 in the heating step.
　上記加熱工程において、加熱部に固定治具及び積層体を配置してもよい。上記加熱工程において、加熱された空間に固定治具及び積層体を配置してもよい。上記加熱工程において、加熱部材上に固定治具を配置してもよい。 In the above heating step, a fixing jig and a laminate may be disposed in the heating part. In the heating step, a fixing jig and a laminated body may be disposed in the heated space. In the heating step, a fixing jig may be disposed on the heating member.
　導通信頼性をより一層高める観点からは、上記加熱工程において、上記第１の接続対象部材、上記導電材料及び上記第２の接続対象部材に対して非接触の加熱手段により、加熱を行うことが好ましい。 From the viewpoint of further improving the conduction reliability, in the heating step, the first connection target member, the conductive material, and the second connection target member may be heated by a non-contact heating means. preferable.
　効率的に加熱を行う観点からは、上記加熱工程において、熱風により、加熱を行うことが好ましい。また、上記加熱工程において、第２の接続対象部材の上方に、蓋部材を配置する場合には、熱風により加熱を行ったとしても、第２の接続対象部材に直接熱風があたらず、第２の接続対象部材等の移動を抑えることができる。このため、導通信頼性により一層優れた接続構造体が得られる。 From the viewpoint of efficient heating, it is preferable to perform heating with hot air in the heating step. In the heating step, when the lid member is disposed above the second connection target member, the second connection target member is not directly exposed to hot air even when heated by hot air. The movement of the connection target member or the like can be suppressed. For this reason, the connection structure which was further excellent by conduction | electrical_connection reliability is obtained.
　はんだ粒子を電極上により一層効率的に配置する観点からは、上記加熱工程において、第２の接続対象部材を加圧しないか、又は０．１ＭＰａ以下（より好ましくは０．０５ＭＰａ以下、更に好ましくは０．０２ＭＰａ以下）の圧力で加圧することが好ましく、加圧しないことがより好ましい。 From the viewpoint of more efficiently arranging the solder particles on the electrode, in the heating step, the second connection target member is not pressurized, or is 0.1 MPa or less (more preferably 0.05 MPa or less, more preferably It is preferable to pressurize at a pressure of 0.02 MPa or less, and it is more preferable not to pressurize.
　上記加熱工程において、第１の電極２ａと第２の電極３ａとの間に位置していない上記はんだ粒子１１Ａを、第１の電極２ａと第２の電極３ａとの間に移動させることが好ましい。導通信頼性をより一層高める観点からは、上記第１の電極と上記接続部と上記第２の電極との積層方向と直交する方向に接続構造体をみたときに、上記第１の電極と上記第２の電極との対向し合う部分に、上記接続部中の上記はんだ部１００％中の５０％以上（好ましくは６０％以上、より好ましくは７０％以上）が配置されている接続構造体を得ることが好ましい。 In the heating step, it is preferable to move the solder particles 11A that are not positioned between the first electrode 2a and the second electrode 3a between the first electrode 2a and the second electrode 3a. . From the viewpoint of further improving the conduction reliability, when the connection structure is viewed in a direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode, the first electrode and the above A connection structure in which 50% or more (preferably 60% or more, more preferably 70% or more) of 100% of the solder portion in the connection portion is disposed in a portion facing the second electrode. It is preferable to obtain.
　上記加熱工程における上記加熱温度は、好ましくは１４０℃以上、より好ましくは１６０℃以上であり、好ましくは４５０℃以下、より好ましくは２５０℃以下、更に好ましくは２００℃以下である。 The heating temperature in the heating step is preferably 140 ° C. or higher, more preferably 160 ° C. or higher, preferably 450 ° C. or lower, more preferably 250 ° C. or lower, and further preferably 200 ° C. or lower.
　上記のようにして、図１，２に示す接続構造体１が得られる。上記加熱工程後に、蓋部材を備えた固定治具２０から、接続構造体１を取り出すことができる。固定治具２１は隙間部２１ｄを有するので、接続構造体１を容易に取り出すことができる。 As described above, the connection structure 1 shown in FIGS. 1 and 2 is obtained. After the heating step, the connection structure 1 can be taken out from the fixing jig 20 provided with the lid member. Since the fixing jig 21 has the gap portion 21d, the connection structure 1 can be easily taken out.
　上記第１，第２の接続対象部材は、特に限定されない。上記第１，第２の接続対象部材としては、具体的には、半導体チップ、半導体パッケージ、ＬＥＤチップ、ＬＥＤパッケージ、コンデンサ及びダイオード等の電子部品、並びに樹脂フィルム、プリント基板、フレキシブルプリント基板、フレキシブルフラットケーブル、リジッドフレキシブル基板、ガラスエポキシ基板及びガラス基板等の回路基板などの電子部品等が挙げられる。上記第１，第２の接続対象部材は、電子部品であることが好ましい。 The first and second connection target members are not particularly limited. Specifically as said 1st, 2nd connection object member, electronic components, such as a semiconductor chip, a semiconductor package, LED chip, LED package, a capacitor | condenser, a diode, and a resin film, a printed circuit board, a flexible printed circuit board, flexible Examples include electronic components such as flat cables, rigid flexible substrates, glass epoxy substrates, and circuit boards such as glass substrates. The first and second connection target members are preferably electronic components.
　上記第１の接続対象部材及び上記第２の接続対象部材の内の少なくとも一方が、樹脂フィルム、フレキシブルプリント基板、フレキシブルフラットケーブル又はリジッドフレキシブル基板であることが好ましい。上記第２の接続対象部材が、樹脂フィルム、フレキシブルプリント基板、フレキシブルフラットケーブル又はリジッドフレキシブル基板であることが好ましい。樹脂フィルム、フレキシブルプリント基板、フレキシブルフラットケーブル及びリジッドフレキシブル基板は、柔軟性が高く、比較的軽量であるという性質を有する。このような接続対象部材の接続に導電フィルムを用いた場合には、はんだが電極上に集まりにくい傾向がある。これに対して、導電ペーストを用いた場合には、樹脂フィルム、フレキシブルプリント基板、フレキシブルフラットケーブル又はリジッドフレキシブル基板を用いたとしても、導電ペーストを用いてはんだを電極上に効率的に集めることで、電極間の導通信頼性を十分に高めることができる。樹脂フィルム、フレキシブルプリント基板、フレキシブルフラットケーブル又はリジッドフレキシブル基板を用いる場合に、半導体チップなどの他の接続対象部材を用いた場合と比べて、本発明による電極間の導通信頼性の向上効果がより一層効果的に得られる。 It is preferable that at least one of the first connection target member and the second connection target member is a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board. The second connection target member is preferably a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board. Resin films, flexible printed boards, flexible flat cables, and rigid flexible boards have the property of being highly flexible and relatively lightweight. When a conductive film is used for connection of such a connection object member, there exists a tendency for a solder not to gather on an electrode. On the other hand, when a conductive paste is used, even if a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board is used, solder can be efficiently collected on the electrode using the conductive paste. The conduction reliability between the electrodes can be sufficiently increased. When using a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible circuit board, the effect of improving the conduction reliability between the electrodes according to the present invention is greater than when using other connection target members such as a semiconductor chip. It can be obtained more effectively.
　上記接続対象部材に設けられている電極としては、金電極、ニッケル電極、錫電極、アルミニウム電極、銅電極、モリブデン電極、銀電極、ＳＵＳ電極、及びタングステン電極等の金属電極が挙げられる。上記接続対象部材がフレキシブルプリント基板である場合には、上記電極は金電極、ニッケル電極、錫電極、銀電極又は銅電極であることが好ましい。上記接続対象部材がガラス基板である場合には、上記電極はアルミニウム電極、銅電極、モリブデン電極、銀電極又はタングステン電極であることが好ましい。なお、上記電極がアルミニウム電極である場合には、アルミニウムのみで形成された電極であってもよく、金属酸化物層の表面にアルミニウム層が積層された電極であってもよい。上記金属酸化物層の材料としては、３価の金属元素がドープされた酸化インジウム及び３価の金属元素がドープされた酸化亜鉛等が挙げられる。上記３価の金属元素としては、Ｓｎ、Ａｌ及びＧａ等が挙げられる。 Examples of the electrode provided on the connection target member include metal electrodes such as a gold electrode, a nickel electrode, a tin electrode, an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, a SUS electrode, and a tungsten electrode. When the connection object member is a flexible printed board, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, a silver electrode, or a copper electrode. When the connection target member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, or a tungsten electrode. In addition, when the said electrode is an aluminum electrode, the electrode formed only with aluminum may be sufficient and the electrode by which the aluminum layer was laminated | stacked on the surface of the metal oxide layer may be sufficient. Examples of the material for the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al, and Ga.
　以下、実施例及び比較例を挙げて、本発明を具体的に説明する。本発明は、以下の実施例のみに限定されない。 Hereinafter, the present invention will be specifically described with reference to examples and comparative examples. The present invention is not limited only to the following examples.
　（実施例１）
　実施例１では、図６、図７（ａ）～（ｅ）及び図８に示す蓋を備えた固定治具２０を用いた。実施例１では、図３（ａ）～（ｄ）及び図４に示す各工程を経て、図１，２に示す接続構造体１を作製した。 Example 1
In Example 1, the fixing jig 20 provided with the lid shown in FIGS. 6, 7A to 7E and FIG. 8 was used. In Example 1, the connection structure 1 shown in FIGS. 1 and 2 was manufactured through the steps shown in FIGS. 3A to 3D and FIG.
　ポリマーであるフェノキシ樹脂２５重量部と、熱硬化性化合物であるレゾルシノール型エポキシ化合物１５重量部と、熱硬化剤であるペンタエリスリトールテトラキス（３－メルカプトブチレート）１０重量部と、フラックスであるグルタル酸２重量部と、はんだ粒子４８重量部をと含む導電ペーストを用意した。 25 parts by weight of a phenoxy resin as a polymer, 15 parts by weight of a resorcinol type epoxy compound as a thermosetting compound, 10 parts by weight of pentaerythritol tetrakis (3-mercaptobutyrate) as a thermosetting agent, and glutaric acid as a flux A conductive paste containing 2 parts by weight and 48 parts by weight of solder particles was prepared.
　Ｌ／Ｓが３００μｍ／２００μｍ、電極長さ３ｍｍの銅電極パターン（銅電極の厚み１２μｍ）を上面に有するガラスエポキシ基板（ＦＲ－４基板、厚み０．６ｍｍ）（第１の接続対象部材）を用意した。 A glass epoxy substrate (FR-4 substrate, thickness 0.6 mm) (first connection target member) having a copper electrode pattern (copper electrode thickness 12 μm) on the top surface with an L / S of 300 μm / 200 μm and an electrode length of 3 mm Prepared.
　Ｌ／Ｓが３００μｍ／２００μｍ、電極長さ５ｍｍの銅電極パターン（銅電極の厚み１２μｍ）を下面に有するフレキシブルプリント基板（ポリイミドにより形成されている、第２の接続対象部材、厚み０．１ｍｍ）を用意した。 A flexible printed circuit board having a copper electrode pattern (copper electrode thickness 12 μm) with an L / S of 300 μm / 200 μm and an electrode length of 5 mm on the lower surface (second connection target member formed of polyimide, thickness 0.1 mm) Prepared.
　上述した蓋部材を備えた固定治具２０における固定治具２１の第１の凹部２１ａ内に、上記ガラスエポキシ基板を配置した。 The glass epoxy substrate was placed in the first recess 21a of the fixing jig 21 in the fixing jig 20 provided with the lid member described above.
　上記ガラスエポキシ基板の上面に、上記導電ペーストを、ガラスエポキシ基板の電極上で厚さ１００μｍとなるように、メタルマスクを用い、スクリーン印刷にて塗工し、導電ペースト層を形成した（第１の配置工程）。次に、導電ペースト層の上面に上記フレキシブルプリント基板を、電極同士が対向するように積層した（第２の配置工程）。このとき、第２の凹部２１ｂの内側にフレキシブルプリント基板を配置した。次に、蓋部材２２を閉じた。その後、導電ペースト層の温度が１９０℃となるように、熱風で加熱しながら、はんだを溶融させ、かつ導電ペースト層を１９０℃及び１０秒で硬化させた（加熱工程）。この加熱時に、第１の電極と第２の電極との間に位置していない上記はんだ粒子を、上記第１の電極と上記第２の電極との間に移動させて、接続構造体を得た。なお、上記第２の配置工程及び上記加熱工程において、フレキシブルプリント基板を加圧しなかった。 On the upper surface of the glass epoxy substrate, the conductive paste was applied by screen printing using a metal mask so as to have a thickness of 100 μm on the electrode of the glass epoxy substrate to form a conductive paste layer (first paste) Placement process). Next, the flexible printed circuit board was laminated on the upper surface of the conductive paste layer so that the electrodes face each other (second arrangement step). At this time, the flexible printed circuit board was arrange | positioned inside the 2nd recessed part 21b. Next, the lid member 22 was closed. Thereafter, the solder was melted while being heated with hot air so that the temperature of the conductive paste layer was 190 ° C., and the conductive paste layer was cured at 190 ° C. for 10 seconds (heating step). During the heating, the solder particles that are not positioned between the first electrode and the second electrode are moved between the first electrode and the second electrode to obtain a connection structure. It was. Note that the flexible printed circuit board was not pressurized in the second arrangement step and the heating step.
　得られた接続構造体において、第１の電極と接続部と第２の電極との積層方向と直交する方向に接続構造体をみたときに、第１の電極と第２の電極との対向し合う部分に、接続部中のはんだ部１００％中の７０％以上が配置されていた。 In the obtained connection structure, when the connection structure is viewed in a direction perpendicular to the stacking direction of the first electrode, the connection portion, and the second electrode, the first electrode and the second electrode are opposed to each other. 70% or more of 100% of the solder part in the connection part was disposed in the matching part.
　得られた接続構造体２０個において、上下の電極間の１接続箇所当たりの接続抵抗をそれぞれ、４端子法により、測定した。接続抵抗の平均値を算出した。なお、電圧＝電流×抵抗の関係から、一定の電流を流した時の電圧を測定することにより接続抵抗を求めることができる。得られた接続構造体における接続抵抗の平均値は５０ｍΩ以下であり、導通信頼性に優れていた。 In each of the 20 connection structures obtained, the connection resistance per connection point between the upper and lower electrodes was measured by a four-terminal method. The average value of connection resistance was calculated. Note that the connection resistance can be obtained by measuring the voltage when a constant current is passed from the relationship of voltage = current × resistance. The average value of the connection resistance in the obtained connection structure was 50 mΩ or less, and the conduction reliability was excellent.
　（実施例２）
　上記第２の配置工程において、０．０２ＭＰａの圧力でフレキシブルプリント基板を加圧したこと以外は実施例１と同様にして、接続構造体を得た。 (Example 2)
In the second arrangement step, a connection structure was obtained in the same manner as in Example 1 except that the flexible printed circuit board was pressurized with a pressure of 0.02 MPa.
　実施例２で得られた接続構造体の接続抵抗の平均値は、実施例１で得られた接続構造体の接続抵抗の平均値の１．０２倍であった。 The average value of the connection resistance of the connection structure obtained in Example 2 was 1.02 times the average value of the connection resistance of the connection structure obtained in Example 1.
　（実施例３）
　上記第２の配置工程において、０．０５ＭＰａの圧力でフレキシブルプリント基板を加圧したこと以外は実施例１と同様にして、接続構造体を得た。 (Example 3)
In the second arrangement step, a connection structure was obtained in the same manner as in Example 1 except that the flexible printed circuit board was pressurized with a pressure of 0.05 MPa.
　実施例３で得られた接続構造体の接続抵抗の平均値は、実施例１で得られた接続構造体の接続抵抗の平均値の１．０５倍であった。 The average connection resistance of the connection structure obtained in Example 3 was 1.05 times the average connection resistance of the connection structure obtained in Example 1.
　（実施例４）
　上記第２の配置工程において、０．１ＭＰａの圧力でフレキシブルプリント基板を加圧したこと以外は実施例１と同様にして、接続構造体を得た。 Example 4
In the second arranging step, a connection structure was obtained in the same manner as in Example 1 except that the flexible printed circuit board was pressurized with a pressure of 0.1 MPa.
　実施例４で得られた接続構造体の接続抵抗の平均値は、実施例１で得られた接続構造体の接続抵抗の平均値の１．１倍であった。 The average value of the connection resistance of the connection structure obtained in Example 4 was 1.1 times the average value of the connection resistance of the connection structure obtained in Example 1.
　（実施例５）
　上記第２の配置工程において、０．２ＭＰａの圧力でフレキシブルプリント基板を加圧したこと以外は実施例１と同様にして、接続構造体を得た。 (Example 5)
In the second arranging step, a connection structure was obtained in the same manner as in Example 1 except that the flexible printed circuit board was pressurized with a pressure of 0.2 MPa.
　実施例５で得られた接続構造体の接続抵抗の平均値は、実施例１で得られた接続構造体の接続抵抗の平均値の１．５倍であった。 The average connection resistance of the connection structure obtained in Example 5 was 1.5 times the average connection resistance of the connection structure obtained in Example 1.
　１，１Ｘ…接続構造体
　２…第１の接続対象部材
　２ａ…第１の電極
　３…第２の接続対象部材
　３ａ…第２の電極
　３ｂ…一端
　３ｃ…他端
　４，４Ｘ…接続部
　４Ａ，４ＸＡ…はんだ部
　４Ｂ，４ＸＢ…硬化物部
　５…ソルダーレジスト膜
　６…カバーレイ
　１１…導電材料
　１１Ａ…はんだ粒子
　１１Ｂ…熱硬化性成分
　２０…蓋部材を備えた固定治具
　２１…固定治具
　２１ａ…第１の凹部
　２１ｂ…第２の凹部
　２１ｃ…角部
　２１ｄ…隙間部
　２２…蓋部材
　２３…接続部材（ヒンジ） DESCRIPTION OF SYMBOLS 1,1X ... Connection structure 2 ... 1st connection object member 2a ... 1st electrode 3 ... 2nd connection object member 3a ... 2nd electrode 3b ... One end 3c ... Other end 4, 4X ... Connection part 4A, 4XA ... solder part 4B, 4XB ... cured product part 5 ... solder resist film 6 ... coverlay 11 ... conductive material 11A ... solder particle 11B ... thermosetting component 20 ... fixing jig with lid member 21 ... fixing jig 21a ... 1st recessed part 21b ... 2nd recessed part 21c ... Corner | angular part 21d ... Clearance part 22 ... Lid member 23 ... Connection member (hinge)

Claims (25)

  1. 　複数のはんだ粒子及びバインダーを含む導電材料と、第１の電極を上面に有する第１の接続対象部材と、第２の電極を下面に有する第２の接続対象部材とを用いる接続構造体の製造方法であって、
    　前記第１の接続対象部材の上面に、前記導電材料を配置する第１の配置工程と、
    　前記第１の電極と前記第２の電極とが対向するように、前記導電材料の上面に、前記第２の接続対象部材を配置する第２の配置工程と、
    　前記はんだ粒子の融点以上に加熱することで、前記第１の接続対象部材と前記第２の接続対象部材とを接続している接続部を、前記導電材料により形成し、かつ、前記第１の電極と前記第２の電極とを、前記接続部中のはんだ部により電気的に接続する加熱工程とを備え、
    　前記加熱工程において、前記第１の接続対象部材を固定治具に固定した状態で、加熱を行う、接続構造体の製造方法。     Manufacturing of a connection structure using a conductive material including a plurality of solder particles and a binder, a first connection target member having a first electrode on an upper surface, and a second connection target member having a second electrode on a lower surface A method,
    A first arrangement step of arranging the conductive material on an upper surface of the first connection target member;
    A second arrangement step of arranging the second connection target member on the upper surface of the conductive material so that the first electrode and the second electrode face each other;
    By heating to the melting point or higher of the solder particles, a connection part connecting the first connection target member and the second connection target member is formed of the conductive material, and the first A heating step of electrically connecting the electrode and the second electrode by a solder portion in the connection portion;
    A method for manufacturing a connection structure, wherein in the heating step, heating is performed in a state where the first connection target member is fixed to a fixing jig.
  2. 　前記固定治具が上面に第１の凹部を有し、
    　前記固定治具の前記第１の凹部の内側に、前記第１の接続対象部材を配置する、請求項１に記載の接続構造体の製造方法。     The fixing jig has a first recess on an upper surface;
    The manufacturing method of the connection structure of Claim 1 which arrange | positions the said 1st connection object member inside the said 1st recessed part of the said fixing jig.
  3. 　前記第２の配置工程において、前記第１の接続対象部材を前記固定治具に固定した状態で、前記導電材料の上面に、前記第２の接続対象部材を配置する、請求項１又は２に記載の接続構造体の製造方法。 The said 2nd connection object member is arrange | positioned in the said 2nd arrangement | positioning process in the state which fixed the said 1st connection object member to the said fixing jig on the upper surface of the said electrically-conductive material. The manufacturing method of the connection structure of description.
  4. 　前記第２の接続対象部材が、前記第２の配置工程において、前記導電材料の上面に配置される第１の領域と、前記第２の配置工程において、前記導電材料の上面に配置されない第２の領域とを有し、
    　前記第２の配置工程において、前記導電材料の上面に、前記第２の接続対象部材の前記第１の領域を配置し、前記導電材料の上面に、前記第２の接続対象部材の前記第２の領域を配置せず、
    　前記固定治具の上面に、前記第２の接続対象部材の前記第２の領域を配置する、請求項１～３のいずれか１項に記載の接続構造体の製造方法。     The second connection target member is not disposed on the upper surface of the conductive material in the second arrangement step, and the first region disposed on the upper surface of the conductive material in the second arrangement step. And having an area of
    In the second arrangement step, the first region of the second connection target member is arranged on the upper surface of the conductive material, and the second of the second connection target member is arranged on the upper surface of the conductive material. Without placing the area of
    The method for manufacturing a connection structure according to any one of claims 1 to 3, wherein the second region of the second connection target member is disposed on an upper surface of the fixing jig.
  5. 　前記固定治具の前記第２の接続対象部材の前記第２の領域が配置される上面が、外側から内側にむけて、下側に傾斜している、請求項４に記載の接続構造体の製造方法。 5. The connection structure according to claim 4, wherein an upper surface of the fixing jig on which the second region of the second connection target member is disposed is inclined downward from the outside toward the inside. Production method.
  6. 　前記加熱工程において、前記第２の接続対象部材の前記第１の領域を、一方側から他方側にむけて、下側に向かって傾斜させる、請求項４又は５に記載の接続構造体の製造方法。 6. The manufacturing of the connection structure according to claim 4, wherein in the heating step, the first region of the second connection target member is inclined downward from one side to the other side. Method.
  7. 　前記固定治具が上面に、前記第１の凹部とは異なる第２の凹部を有し、
    　前記固定治具の前記第２の凹部の内側に、前記第２の接続対象部材の前記第２の領域を配置する、請求項４～６のいずれか１項に記載の接続構造体の製造方法。     The fixing jig has a second recess different from the first recess on the upper surface;
    The method for manufacturing a connection structure according to any one of claims 4 to 6, wherein the second region of the second connection target member is disposed inside the second recess of the fixing jig. .
  8. 　前記固定治具の前記第１の接続対象部材が上方に位置する上面部分の材質が、セラミック、アルミニウム合金、チタン合金又はステンレスである、請求項１～７のいずれか１項に記載の接続構造体の製造方法。 The connection structure according to any one of claims 1 to 7, wherein a material of an upper surface portion of the fixing jig on which the first connection target member is located is ceramic, aluminum alloy, titanium alloy, or stainless steel. Body manufacturing method.
  9. 　前記加熱工程において、前記第２の接続対象部材の上方に、蓋部材を配置する、請求項１～８のいずれか１項に記載の接続構造体の製造方法。 The method for manufacturing a connection structure according to any one of claims 1 to 8, wherein a lid member is arranged above the second connection target member in the heating step.
  10. 　前記蓋部材が、前記固定治具に接続されている、請求項９に記載の接続構造体の製造方法。 The method for manufacturing a connection structure according to claim 9, wherein the lid member is connected to the fixing jig.
  11. 　前記加熱工程において、前記第２の接続対象部材の上面に、前記蓋部材を接触させる、請求項９又は１０に記載の接続構造体の製造方法。 The method for manufacturing a connection structure according to claim 9 or 10, wherein, in the heating step, the lid member is brought into contact with an upper surface of the second connection target member.
  12. 　前記蓋部材の前記第２の接続対象部材が下方に位置する下面部分の材質が、セラミック、アルミニウム合金、チタン合金又はステンレスである、請求項９～１１のいずれか１項に記載の接続構造体の製造方法。 The connection structure according to any one of claims 9 to 11, wherein a material of a lower surface portion of the lid member on which the second connection target member is positioned is ceramic, aluminum alloy, titanium alloy, or stainless steel. Manufacturing method.
  13. 　前記固定治具の前記第１の接続対象部材が上方に位置する上面部分の材質の熱伝導率が、前記蓋部材の前記第２の接続対象部材が下方に位置する下面部分の材質の熱伝導率よりも高い、請求項９～１２のいずれか１項に記載の接続構造体の製造方法。 The heat conductivity of the material of the upper surface portion where the first connection target member of the fixing jig is located above is the heat conductivity of the material of the lower surface portion of the lid member where the second connection object member is located below. The method for manufacturing a connection structure according to any one of claims 9 to 12, wherein the connection structure is higher than the rate.
  14. 　前記加熱工程において、前記第１の接続対象部材、前記導電材料及び前記第２の接続対象部材に対して非接触の加熱手段により、加熱を行う、請求項１～１３のいずれか１項に記載の接続構造体の製造方法。 The heating process according to any one of claims 1 to 13, wherein in the heating step, the first connection target member, the conductive material, and the second connection target member are heated by a non-contact heating unit. Method for manufacturing the connection structure of the present invention.
  15. 　前記加熱工程において、熱風により、加熱を行う、請求項１～１４のいずれか１項に記載の接続構造体の製造方法。 The method for manufacturing a connection structure according to any one of claims 1 to 14, wherein heating is performed with hot air in the heating step.
  16. 　前記加熱工程において、前記第１の電極と前記第２の電極との間に位置していない前記はんだ粒子を、前記第１の電極と前記第２の電極との間に移動させる、請求項１～１５のいずれか１項に記載の接続構造体の製造方法。 The said heating process WHEREIN: The said solder particle which is not located between the said 1st electrode and the said 2nd electrode is moved between the said 1st electrode and the said 2nd electrode. 16. A method for manufacturing a connection structure according to any one of items 15 to 15.
  17. 　前記第１の電極と前記接続部と前記第２の電極との積層方向と直交する方向に接続構造体をみたときに、前記第１の電極と前記第２の電極との対向し合う部分に、前記接続部中の前記はんだ部１００％中の７０％以上が配置されている接続構造体を得る、請求項１～１６のいずれか１項に記載の接続構造体の製造方法。 When the connection structure is viewed in a direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode, the first electrode and the second electrode are opposed to each other. The method for manufacturing a connection structure according to any one of claims 1 to 16, wherein a connection structure in which 70% or more of the solder part 100% in the connection part is arranged is obtained.
  18. 　第１の電極を上面に有する第１の接続対象部材と、第２の電極を下面に有する第２の接続対象部材と、前記第１の接続対象部材と前記第２の接続対象部材とを接続しており、かつ、複数のはんだ粒子及びバインダーを含む導電材料により形成された接続部とを備え、前記第１の電極と前記第２の電極とが前記接続部中のはんだ部により電気的に接続されている接続構造体を得るために用いられる固定治具であって、
    　固定治具は、前記第１の接続対象部材の上面に、前記導電材料を配置する第１の配置工程と、前記第１の電極と前記第２の電極とが対向するように、前記導電材料の上面に、前記第２の接続対象部材を配置する第２の配置工程と、前記はんだ粒子の融点以上に加熱することで、前記第１の接続対象部材と前記第２の接続対象部材とを接続している接続部を、前記導電材料により形成し、かつ、前記第１の電極と前記第２の電極とを、前記接続部中のはんだ部により電気的に接続する加熱工程とを経て、前記接続構造体を得るために用いられ、
    　固定治具は上面に第１の凹部を有し、
    　固定治具は、前記接続構造体を得る際に、前記第１の凹部の内側に、前記第１の接続対象部材を配置して用いられる、固定治具。     Connecting the first connection target member having the first electrode on the upper surface, the second connection target member having the second electrode on the lower surface, and the first connection target member and the second connection target member. And a connection portion formed of a conductive material containing a plurality of solder particles and a binder, wherein the first electrode and the second electrode are electrically connected by the solder portion in the connection portion. A fixing jig used to obtain a connected connection structure,
    The fixing jig includes a first placement step of placing the conductive material on an upper surface of the first connection target member, and the conductive material so that the first electrode and the second electrode face each other. A second arrangement step of arranging the second connection target member on the upper surface of the substrate, and heating the melting point of the solder particles to a temperature equal to or higher than the first connection target member and the second connection target member. A connecting part that is connected is formed of the conductive material, and the first electrode and the second electrode are electrically connected by a solder part in the connecting part, and a heating step, Used to obtain the connection structure,
    The fixing jig has a first recess on the upper surface,
    The fixing jig is a fixing jig that is used by arranging the first connection target member inside the first recess when the connection structure is obtained.
  19. 　前記第２の接続対象部材が、前記第２の配置工程において、前記導電材料の上面に配置される第１の領域と、前記第２の配置工程において、前記導電材料の上面に配置されない第２の領域とを有し、
    　固定治具は、前記第２の配置工程において、前記導電材料の上面に、前記第２の接続対象部材の前記第１の領域を配置し、前記導電材料の上面に、前記第２の接続対象部材の前記第２の領域を配置せずに、前記接続構造体を得るために用いられ、
    　固定治具の前記第２の接続対象部材の前記第２の領域が配置される上面が、外側から内側にむけて、下側に傾斜している、請求項１８に記載の固定治具。     The second connection target member is not disposed on the upper surface of the conductive material in the second arrangement step, and the first region disposed on the upper surface of the conductive material in the second arrangement step. And having an area of
    In the second arrangement step, the fixing jig arranges the first region of the second connection target member on the upper surface of the conductive material, and the second connection target on the upper surface of the conductive material. Used to obtain the connection structure without disposing the second region of the member;
    The fixing jig according to claim 18, wherein an upper surface of the fixing jig on which the second region of the second connection target member is disposed is inclined downward from the outside toward the inside.
  20. 　前記第２の接続対象部材が、前記第２の配置工程において、前記導電材料の上面に配置される第１の領域と、前記第２の配置工程において、前記導電材料の上面に配置されない第２の領域とを有し、
    　固定治具は、前記第２の配置工程において、前記導電材料の上面に、前記第２の接続対象部材の前記第１の領域を配置し、前記導電材料の上面に、前記第２の接続対象部材の前記第２の領域を配置せずに、前記接続構造体を得るために用いられ、
    　固定治具は、上面に前記第１の凹部とは異なる第２の凹部を有し、
    　固定治具は、前記第２の凹部の内側に、前記第２の接続対象部材の前記第２の領域を配置して用いられる、請求項１８又は１９に記載の固定治具。     The second connection target member is not disposed on the upper surface of the conductive material in the second arrangement step, and the first region disposed on the upper surface of the conductive material in the second arrangement step. And having an area of
    In the second arrangement step, the fixing jig arranges the first region of the second connection target member on the upper surface of the conductive material, and the second connection target on the upper surface of the conductive material. Used to obtain the connection structure without disposing the second region of the member;
    The fixing jig has a second recess different from the first recess on the upper surface,
    The fixing jig according to claim 18 or 19, wherein the fixing jig is used by arranging the second region of the second connection target member inside the second recess.
  21. 　固定治具の前記第１の接続対象部材が上方に位置する上面部分の材質が、セラミック、アルミニウム合金、チタン合金又はステンレスである、請求項１８～２０のいずれか１項に記載の固定治具。 The fixing jig according to any one of claims 18 to 20, wherein a material of an upper surface portion of the fixing jig on which the first connection target member is located is ceramic, aluminum alloy, titanium alloy, or stainless steel. .
  22. 　請求項１８～２１のいずれか１項に記載の固定治具と、
    　蓋部材とを備え、
    　前記加熱工程において、前記第２の接続対象部材の上方に、前記蓋部材を配置して、前記接続構造体を得るために用いられる、蓋部材を備えた固定治具。     A fixing jig according to any one of claims 18 to 21,
    A lid member,
    A fixing jig provided with a lid member, which is used for obtaining the connection structure by disposing the lid member above the second connection target member in the heating step.
  23. 　前記蓋部材が、前記固定治具に接続されている、請求項２２に記載の蓋部材を備えた固定治具。 The fixing jig provided with the lid member according to claim 22, wherein the lid member is connected to the fixing jig.
  24. 　前記蓋部材の前記第２の接続対象部材が下方に位置する下面部分の材質が、セラミック、アルミニウム合金、チタン合金又はステンレスである、請求項２２又は２３に記載の蓋部材を備えた固定治具。 The fixing jig provided with the lid member according to claim 22 or 23, wherein a material of a lower surface portion of the lid member on which the second connection target member is located is ceramic, aluminum alloy, titanium alloy, or stainless steel. .
  25. 　前記固定治具の前記第１の接続対象部材が上方に位置する上面部分の材質の熱伝導率が、前記蓋部材の前記第２の接続対象部材が下方に位置する下面部分の材質の熱伝導率よりも高い、請求項２２～２４のいずれか１項に記載の蓋部材を備えた固定治具。 The heat conductivity of the material of the upper surface portion where the first connection target member of the fixing jig is located above is the heat conductivity of the material of the lower surface portion of the lid member where the second connection object member is located below. The fixing jig provided with the lid member according to any one of claims 22 to 24, which is higher than the ratio.
PCT/JP2016/083184 2015-11-10 2016-11-09 Method for producing connected structure, fixing jig, and fixing jig provided with cover member WO2017082277A1 (en)

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JPH0463174U (en) * 1990-10-03 1992-05-29
JPH04293296A (en) * 1991-03-22 1992-10-16 Murata Mfg Co Ltd Circuit substrate
JPH0897551A (en) * 1994-09-26 1996-04-12 Nec Kansai Ltd Board holding jig
JP2004260131A (en) * 2003-02-05 2004-09-16 Japan Science & Technology Agency Connection method between terminals, and packaging method of semiconductor device
JP2008021888A (en) * 2006-07-14 2008-01-31 Nec Electronics Corp Jig device

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