JPH0894707A - Ic handler - Google Patents

Abstract

PURPOSE: To repeatedly test a same device under a plurality of temperature conditions with a single IC handler by using a lamination tray located at a customer tray as a buffer for temporarily storing the device to be tested. CONSTITUTION: An IC handler comprises a loader 110 for supplying a device 101 to be tested to a test tray 100 which is circulated and carried, and a first unloader 120 or a second unloader 130 for housing it, thus supplying/housing the device 101 to and from arbitrary lamination trays 340a-340n located at a customer tray part 320. Then, a control part 20 uses the trays 340a-340n as a temporary buffer and supplies the device 101 from an EXIT chamber 260 to a soak chamber 200 again, thus forming a circulation carrier cycle for repeatedly carrying the device 101 for an arbitrary number of times. Therefore, various kinds of device tests can be repeatedly executed by repeatedly carrying the device 101 by varying testing conditions with a single IC handler.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to I for device testing.
In C handler, one IC handler realizes repeated test of device under test under multiple temperature conditions.
Regarding the handler device.

[0002]

2. Description of the Related Art As an example of the prior art, there is a carrier type IC handler which is dropped by its own weight. This will be described with reference to FIG. The device transporting configuration includes a magazine 50, a magazine supply unit 52, a supply device transport mechanism 54, a test unit 56, a storage device transport mechanism 58, and a magazine storage unit 60.
This type of IC handler is of a self-weight drop type, and is a form of conveyance in which it slides and drops on the surface of the device. An outline of transportation and device testing will be described. Magazine 5
Reference numeral 0 denotes a rod-shaped container that houses the ICs in one row, and the container is different depending on the size and shape (DIP, ZIP, SOP) of the device. Many magazines 50 are accommodated in the magazine supply unit 52.

The supply device transport mechanism 54 tilts the magazine 50a by supporting one end of one magazine 50 from the magazine supply section 52 and lifting the other end to rotate. The devices are separated one by one by the I-rail 55a portion from the magazine 50a by their own weight due to the inclination angle and housed in the ER rail 55b. ER rail 5
5b has a plurality of rails accommodating therein, and the ER rail 55b is laterally moved by a unit pitch to provide the I
The devices 101 from the rails 55a are accommodated one by one. The accommodated ER rail 55b is laterally moved, aligned with the S rails 55c in a plurality of rows, and then slide-discharged to the S rails 55c. The S-rail 55c functions as a buffer for heating / cooling to a desired device temperature. Device 101 accumulated on this S rail 55c
It is made to slide in sequence and supplied to the test unit 56 side.

The test section 56 receives a plurality of devices from the S rail 55c, electrically contacts (contacts) the device 101 with the contact section 57, and conducts an electrical test such as pass / fail inspection or characteristic measurement under the currently set temperature condition. After that, the sheet is discharged to the storage device transport mechanism 58 side.

The storage device transport mechanism 58 includes a test unit 5
The devices from 6 are received, classified according to the quality and characteristics according to the inspection result, and stored in the magazine 50b corresponding to the classification of the storage magazine 50n having a plurality of rows. For this reason, the sorter 59 receives the device,
Lateral movement is carried to the corresponding row of magazines 50n, and slidingly accommodated in the inclined storage magazine 50b. The magazine accommodating section 60 has a magazine 50n for accommodating devices having a plurality of rows, and classifies and accommodates devices according to the characteristics of the inspection result. By repeating the above operation, devices are supplied by the magazine 50 and sorted and stored.

[0006]

Due to the mechanism as described above, it is not easy to return the ejecting device 101 from the storage device transporting mechanism 58 to the supply device transporting mechanism 54 side, and the magazine feeding unit 52 is not required to return it. Due to the lack of capacity for accommodating all of the devices in the transport mechanism path, the test cannot be repeated under a plurality of temperature conditions. For this reason, one IC handler cannot perform a test under a plurality of temperature conditions. Therefore, as shown in the example of FIG. 3, a plurality of handlers 510 to 540 are installed and each IC handler is set to a different test temperature, and the test is performed. The subsequent magazine 50 is supplied to the handler in the next stage and tested. However, it is uneconomical to install a plurality of IC handlers in the case of testing a small number of devices for which throughput is not required, although there is no problem in a manufacturing line for testing a large number of devices. In addition, if a conventional IC handler is repeatedly tested under a plurality of temperature conditions, it is necessary for a person to move from the magazine housing section 60 side to the magazine supply section 52 side, which is unmanned and cannot be automated. There was a practical inconvenience. Also, using the same IC,
If you want to obtain so-called correlation data, which is data for deviation between devices of the handler, or if you want to obtain temperature characteristic data for device evaluation, or apply arbitrary multi-point temperature stress to the device package. There is a test form in which evaluation data is obtained by using the above method, and even in such a case, it has been a difficulty in use.

Therefore, an object to be solved by the present invention is to realize an IC handler device capable of repeatedly executing tests on the same device under a plurality of temperature conditions with one IC handler.

[0008]

In order to solve the above-mentioned problems, in the structure of the present invention, the stack trays 340a to 340n in the tomato tray section 320 are connected to the device under test 101.
Is used as a buffer for temporarily storing the device under test 101 from the EXIT chamber 260 to the soak chamber 200 again, or the desired stacking tray 3 is controlled.
The control unit 20 for controlling the storage in 40a to 340n is provided. As a result, an IC handler device is realized in which the device under test 101 on the cast tomato tray 300 is repeatedly subjected to an electrical test. When performing a temperature test, the soak chamber 200 is added.

[0009]

Function: Loader 110 and first unloader 120 or second
The unloader 130 and the control unit 20 provide a function of supplying / accommodating the device under test 101 to / from any of the stacking trays 340a to 340n in the cast tomato tray unit 320, or a function as a buffer for temporarily accommodating the device under test 101.
The control unit 20 uses the stacking trays 340a to 340n as a temporary buffer to supply the device under test 101 from the EXIT chamber 260 to the soak chamber 200 again, thereby repeatedly carrying the device under test 101 any number of times. Has the effect of forming a cycle. 1
It is possible to realize the function of repeatedly carrying out the same device under test 101 by changing the test conditions and repeatedly performing the temperature test and various other device tests with the IC handler of the table.

[0010]

EXAMPLE An example of the present invention is an example in which a horizontal handler is used to circulate and control a test tray to enable repeated tests under a plurality of temperature conditions. This will be described with reference to FIG. The configuration of the apparatus is as follows: dust tomato tray 300, dust tomato tray unit 320, test tray 100, loader 110, soak chamber 200.
A first test chamber 220, a second test chamber 240, a contact part 250, and an EXIT chamber 2
60, the first unloader 120, and the second unloader 13
0, the control unit 20, and the IC tester 255.

The cast tomato lei 300 has a unique shape used by the user, and includes a large number of devices under test 10.
1 is a container for accommodating 1 and has a different shape depending on the type and shape of the device. The tomato tray unit 320 forms a stack of trays 340a to 340n in which a large number of the tomato trays 300 are stacked, and a plurality of the trays are arranged. 340. When supplying the device under test 101 to the loader 110 side, the uppermost device of the stacking tray 340 is picked up and placed on the test tray 100, and then transferred to the loader 110 side. When the uppermost tray of the stack tray 340 becomes empty, the empty trays are moved to the lowermost tray, and then the elevators 170a to 170n move up to replace the next tray of the tomato tray 300 and sequentially supply the device under test 101. . On the other hand, when accommodating the device under test 101 from the unloader side, the test tray 10 accommodating the device under test 101 is reversed by the reverse operation.
0 is accommodated by sequentially lowering the elevators 170a to 170n.

The test tray 100 is made of cast tomato lei 3.
It is a unit container for circulating and transporting the inside of the IC handler by changing it from 00, and is a container having a uniform outer shape for mounting a plurality of devices under test 101. On this upper surface, a device having a housing hole (pocket) corresponding to the shape of the device is used for each device. The loader 110 uses any of the stacking trays 340a to 340n in the cast tomato tray section 320.
This is a mechanism for picking up the device under test 101 on the uppermost castor tomato 300, placing it in a pocket on the test tray 100, placing it all, and then transporting the test tray 100 to the soak chamber 200.

The soak chamber 200 heats and cools the device under test 101 to a desired constant temperature state (hereinafter referred to as heat-up), and accommodates a large number of test trays 100 and sequentially heats them up. It is a constant temperature bath. Upon receiving the test tray 100 from the loader 110, the test tray 100 is set on the uppermost side of the constant temperature bath. The set trays are sequentially lowered one by one. Desired heating / cooling is performed by setting this fall time as desired. On the other hand,
The test tray 100c is output from the bottom of the constant temperature chamber, and the first test chamber 220 becomes vacant, or
It is transported and supplied to any of the second test chambers 240.

The first test chamber 220 or the second test chamber 240 is a mechanism portion for contacting the IC lead of the device under test 101 heated to a desired temperature to perform various electric tests, and is also a constant temperature layer. Test tray 100c from the soak chamber 200
In response, the device under test 101 is individually picked up and moved, and various electrical tests are performed at the contact section 250.
After the test, it is stored in the original test tray 100. Here, a configuration example is provided in which two systems of test chambers are provided and simultaneous measurement is performed to improve throughput. Contact part 2
The IC 50 has a plurality of IC sockets 251, for example, 16 IC sockets 251, and devices are attached to the IC sockets 251 to electrically connect the IC sockets 251.
0 notifies the IC tester 255 side of the mounting completion signal 20a. The IC tester 255 side receives the notification signal, performs simultaneous measurement of the devices, and notifies the control unit 20 side of the measurement completion signal 20b. In this way, the two cooperate to carry out the device test. The IC tester 255 here repeatedly performs measurement a desired number of times. After all devices have been tested, the test tray 100d is the EXIT chamber 260
Be transported to the side. Here, each device under test 101
Is given a unique uniform number in advance. That is, first, the control unit 20 stores and manages the position of the device placed on the dust tray 300 of the stacking tray 340 so that the device can be identified at any position during conveyance. are doing. And IC tester 25
On the No. 5 side, the measured data of the electrical test result is stored for each of the numbers.

The EXIT chamber 260 is a constant temperature chamber for returning the device under test 101 in a high temperature / low temperature heat-up state to normal temperature in order to prevent sudden temperature stress application and dew condensation, and a large number of test trays. It houses 100. The test tray 100 that has completed the electrical test is accommodated from the lowermost side, and rises in units of one test tray. After returning to the desired room temperature during this rise time,
The test tray 100h is conveyed from the top to the unloader side.

The first unloader 120 and the second unloader 130 are sorted and transferred according to the pass / fail or characteristics based on the electrical test result for each IC uniform number, and are housed therein.
r). Stack trays 340a to 340a on the device accommodation side
In the control unit 40n, which classification device is to be accommodated is determined in advance by the control unit 20. Upon receiving the test tray 100 from the EXIT chamber 260, each device under test 101 is picked up to obtain a desired classification destination. It is transferred to the position of the tomato tray 300 in the stack tray 340 of FIG. After accommodating all the devices on the test tray 100, the empty test tray 100 is reused as a tray on the loader 110 side, so that the test tray 100
Form a circular transport cycle.

As described above, the control unit 20 carries out a series of controls such as the conveyance control of the dust tray 300, the test tray 100 and the device, the heating / cooling control, and the device identification management together with the IC tester 255. ing. Also, this is managed by performing mutual communication with a host computer by a communication means 25 such as LAN or RS232C, and transmitting test result data or classification number information for each IC back number as necessary, Controls execution by receiving parameters such as IC handler test conditions.

Next, in such an IC handler,
The operation of repeating the test under a plurality of temperature conditions will be described.

The first test form is for obtaining temperature characteristic data for evaluation of pilot-produced prototype devices,
When the evaluation data is obtained by applying temperature stress to the device package, or when the correlation data between the IC sockets 251 are obtained, or when the IC tester 255 side is used by using a reference device having a known temperature characteristic. For example, when the correlation data for the temperature calibration of the entire measurement system including it is periodically acquired. For this reason, the temperature characteristic data of a single device or a plurality of the same devices are repeatedly measured at the same temperature to obtain an average value of the measured data to obtain a highly accurate measurement result. This is a usage mode in which the test data is obtained at each temperature point by switching to a plurality of desired temperature points and sequentially performing the same.

In these tests, the transfer control is performed so that the correlation of data change due to only the temperature factor can be obtained without changing the test conditions other than the temperature condition. For this purpose, each individual IC
The device having the uniform number is fixedly assigned to the mounting position of the IC socket 251 of the contact part 250 and mounted at the same position to perform an electrical test. In order to carry out this, the control unit 20
After setting the soak chamber 200 to the initial test temperature and setting it to the set temperature state, after sequentially conveying it through the test tray 100 to heat up the device under test 101,
It is transported to the first test chamber 220 or the second test chamber 240. Here, the control unit 20 transfers to the mounting position of the IC socket 251 corresponding to each IC back number and makes contact therewith, and then the IC tester 255 repeatedly performs a desired number of times to obtain repeated measurement data at the same temperature.

After the measurement is completed, it reaches the first unloader 120 or the second unloader 130 via the above-mentioned transport path. Here, the device under test 101 does not classify the test results according to the characteristics, and sequentially stacks the stacked trays 340a to 340a.
It will be housed in 340n. That is, the stacking trays 340a to 340n in this case are simply used as buffer trays for temporary storage. However, the device under test 1
When the number of 01s is small, it is placed on the test tray 100 that is being circulated and is kept waiting at the first unloader 120 position until the next temperature setting switching.

When all the devices have been measured at the first test temperature in this way, the soak chamber 200 is switched to the next test temperature and heated up, and then the loader 110 causes the stacking trays 340a ... 340
From n, the device under test 101 is placed on the test tray 100, conveyed to the soak chamber 200, and repeatedly circulated and conveyed to measure the temperature. At the end of the last temperature measurement,
The first unloader 120 and the second unloader 130 sequentially store the sheets in the stacking tray 340 to complete the temperature test.
By doing so, the temperature characteristic data or the correlation data of each device under test 101 at each temperature point becomes 1
Measurements can be automatically and continuously performed by the IC handler on the stand.

The second test mode is a test mode in which the device is switched to a plurality of temperatures and a normal device is inspected and passed, and classification according to characteristics is performed. One lot of devices housed in the tomato tray section 320 is inspected and classified. This is the case when they are stored separately. Similar to the first test mode described above, after the soak chamber 200 is set to the first test temperature and heated up, the devices under test 101 are sequentially heated up, and then the first test chamber 220 or the second test chamber 240.
Transport to. Here, the control unit 20 transfers each device to the IC socket 251, and after measuring with the IC tester 255,
In the same manner as described above, the first unloader 1 passes through the transfer route.
20 or the second unloader 130. At the time of this inspection, the device under test 101 having a defective characteristic is accommodated in the corresponding stacking tray 340 and removed. The remaining non-defective device 101 is accommodated in the buffer stacking trays 340a to 340n that are temporarily accommodated. When all the devices have been measured at the first test temperature in this way, the soak chamber 200 is set to the next test temperature and heated up, and then repeatedly circulated and conveyed in the same manner as described above to measure the temperature test. After the measurement at the final test temperature is completed, each device under test 101 is sorted and housed in the corresponding stacking tray 340 of the sorting destination, as described above. By doing so, the temperature test of the device under test 101 at a plurality of temperature points and the classification and accommodation based on the result are automatically realized.

The third test mode is a device temperature load test mode, in which 1 device accommodated in the cast tomato tray 320 is used.
Devices in a lot are subjected to various temperature stresses to acquire test data for device deterioration tendency and distribution data for characteristic changes. In the above description of the second test mode, the device under test 101 having the defective characteristic is excluded without performing the subsequent temperature test, but in the temperature load test mode, the exclusion control based on the pass / fail judgment is not performed. , Perform temperature test of all devices and acquire data. By controlling in this way, automatically
It is possible to perform a temperature test of the device under test 101 at a plurality of temperature points and obtain distribution data based on this result.

In the above embodiment, the case of the temperature test has been described, but the device under test 101 may be circulated and tested under other conditions besides the temperature, and the same test can be performed.

In the above embodiment, the I having the temperature test function is used.
As explained in the case of C handler, soak chamber 2
00 or an IC handler not having the EXIT chamber 260, the device test can be repeated in the same manner.

[0027]

Since the present invention is configured as described above, it has the following effects. The device under test 101 is placed on the test tray 100 that is circulated and conveyed.
First unloader 1 that accommodates the loader 110 that supplies
20 or the second unloader 130, and any of the stacking trays 340a to 340n in the cast tomato section 320.
By supplying / accommodating the device under test 101 to and from the device under test and using it as a buffer for temporarily accommodating,
The device under test 101 from the chamber 260 is again supplied to the soak chamber 200 and repeatedly conveyed to enable the device test. As a result, the device under test 101 can be repeatedly formed to form a circulation conveyance cycle and the device can be conveyed. effective.

An arbitrary stacking tray 34 is controlled by the control unit 20.
By supplying the device under test 101 from 0 or controlling the storage in the arbitrary stacking tray 340, the effect of repeatedly supplying the device under test 101 to the soak chamber 200 side can be obtained. As a whole, one IC handler changes the test condition and repeatedly conveys the same device under test 101 to perform temperature test, device evaluation, correlation data acquisition, distribution data acquisition and various other tests. The stacking trays 340a to 340 can be repeatedly executed and can be classified into a desired classification based on the intermediate / final test result.
Since a series of tests can be consistently and automatically carried out by accommodating in n, the effect of improving the efficiency of device tests and inspection work can be obtained.

[0029]

[Brief description of drawings]

FIG. 1 is a configuration diagram of a main part of an IC handler for carrying out a device under test 101 by circulating control of a test tray 100 of the present invention.

FIG. 2 is a configuration diagram of a main part of a conventional IC handler of a self-weight drop transfer system.

FIG. 3 is an example of a conventional temperature test mode in which a plurality of handlers 510 to 540 are installed and executed.

[Explanation of symbols]

 20 control unit 20a mounting completion signal 20b measurement completion signal 25 communication means 50, 50a, 50n, 50b magazine 52 magazine supply unit 54 supply device transport mechanism 55a I rail 55b ER rail 55c S rail 56 test unit 57, 250 contacts Part 58 Storage device transport mechanism 59 Sorter 60 Magazine storage part 100, 100c, 100d, 100h Test tray 101 Device 110 Loader 120 First unloader 130 Second unloader 170a, 170n Elevator 200 Soak chamber 220 First test chamber 240 Second test chamber 251 IC socket 255 IC tester 260 EXIT chamber 300 Cast tomato lei 320 Cast tomato lei 340a, 340n, 340 Stacking tray 51 , 540 handler

Claims (2)

[Claims] 1. A castor tomato lei (300) having a cast tomato lei (320) and a test tray (100).
In the IC handler device for repeating the electric test of the device under test (101) a plurality of times, the stacking tray (340) in the dust tray (320) is used.
a to 340n) are used as a buffer for temporarily storing the device under test (101), and are controlled to be transferred to the EXIT chamber (2).
The device under test (101) from 60) is conveyed to the soak chamber (200) again, or a control unit (20) for controlling the storage of the device under test (101) in a desired stacking tray (340a to 340n) is provided. An IC handler device comprising the above. 2. A cast tray tray (320), a test tray (100), and a soak chamber 200,
Device under test (10)
In the IC handler device for repeating the temperature test 1) a plurality of times, the stacking tray (340) in the dust tray (320) is used.
a to 340n) are used as a buffer for temporarily storing the device under test (101), and are controlled to be transferred to the EXIT chamber (2).
The device under test (101) from 60) is conveyed to the soak chamber (200) again, or a control unit (20) for controlling the storage of the device under test (101) in a desired stacking tray (340a to 340n) is provided. An IC handler device comprising the above.