JPH0869905A - Method and device for coating electrode - Google Patents

Abstract

PURPOSE: To provide a method and device for coating electrode by which a high-quality chip can be obtained at a high productive efficiency by easily forming electrodes at two or more spots at the end section of the chip. CONSTITUTION: An electrode forming material 6 is applied to chip parts 3 by using a device composed of a blade 7 and feed roll 8 for feeding the material 6, transfer roller 1 for applying the material 6 to the parts 3, chip carrier 4 for fixing and carrying the parts 3, and carrying belt 9 and table 10 for carrying them and attaching a metallic mask 2 having holes for applying the material 6 to the parts 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for applying electrodes on chip parts.

[0002]

2. Description of the Related Art In the manufacturing of parts and the like in the electronics industry, the electrodes are formed by a dip method of dipping the chip in the electrode material and applying it, or screen printing using a mask or squeegee of a specific pattern shape. A forming method such as a method is known. Furthermore, with the recent miniaturization and diversification of chips, some chips have several circuits, and the number of electrode locations is increasing.

[0003]

In the conventional dipping method, it is easy to attach electrodes to the entire end surface of the chip component. However, it is difficult to simultaneously form two or more electrode application points. On the other hand, in the screen printing method, it is possible to print the terminal electrodes, but due to the unevenness of the end portion of the sample, the screen may be damaged at the end portion of the screen pattern. In addition, it is necessary to adjust the squeegee pushing amount. Further, it is difficult to make the paste thickness at the end part constant and to keep it smooth. As a result, it becomes complicated to form a jig corresponding to it.

From the above, when it is attempted to form electrodes at two or more places, the electrode attaching process must be repeated, and the squeegee pushing amount is adjusted, the screen is damaged, and jig formation is complicated. However, there was a problem that the production efficiency did not increase so much.

The present invention eliminates the above-mentioned drawbacks, facilitates the formation of electrodes at two or more places at the ends, and provides an electrode forming method and apparatus capable of obtaining high-quality chip parts with good production efficiency. Is.

[0006]

According to the present invention, a chip component is installed on a chip carrier, a metal mask having an electrode coating hole is placed on the chip component, and the metal mask is guided to the chip carrier. Fix with pins, convey the chip carrier with a conveyor belt provided on the table, the electrode material supplied from the supply roll and blade,
It is a method of applying an electrode, wherein the chip component is applied by a transfer roll connected to the supply roll.

The present invention also includes a chip carrier on which a chip component is installed, a metal mask placed on the chip component, fixed to the chip carrier with a guide pin, and provided with an electrode coating hole. A conveyor belt for conveying the chip carrier provided on a table, a supply roll and a blade for supplying an electrode material, and a supply roll, which are connected to the supply roll and apply the electrode material to the chip component. And a transfer roll for the purpose.

[0008]

[Function] By using a transfer roll in which the thickness of the electrode material is adjusted and a metal mask having two or more holes according to the shape of the electrode pattern, the electrode material can be formed without forming a complicated jig. Since it can be uniformly applied to the chip component at one time, it is possible to easily form electrodes at two or more places, and since the strength is greater than that of the screen mesh, the screen plate is not damaged. It is possible to apply electrodes with high production efficiency.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view showing the overall configuration of the electrode coating apparatus in this embodiment. 2 is a partially enlarged view of a portion A and a portion B of FIG. 1, FIG. 2 (a) is a plan view of portion A, and FIG.
2 is a front view of part A, FIG. 2 (c) is a plan view of part B, and FIG.
(D) is a front view of A part. FIG. 3 is a plan view of the mask pattern used in this example. FIG. 4 is an external perspective view of the chip component after applying the electrode material.

As shown in FIG. 1, the electrode coating apparatus of the present invention comprises a blade 7 and a feed roll 8 for feeding the electrode material 6, and a transfer roll 1 for applying the electrode material 6 to the chip inductor element 3. A chip carrier 4 for fixing and carrying the chip inductor element 3, a carrying belt 9 for carrying them, and a table 10. The metal mask 2 is fixed to the chip carrier 4 by the guide pin 5.

Using this apparatus, a chip inductor element was coated with electrodes as follows. As a chip element, as shown in FIG. 1, a chip inductor (5.7 × 4.5 m
m) The device 3 was inserted into the chip carrier 4. The chip carrier 4 is made of resin processed so that about half of the chip inductor element is inserted. Thickness 0.1 on it
It was assembled in a configuration in which the metal mask 2 of mm of stainless steel is in contact. As shown in FIGS. 2 and 3, the metal mask 2 has an electrode coating hole 12 that is 0.1 mm larger than the electrode coating portion of the chip inductor element 3 in a state where only the electrode coating portion of the chip inductor element 3 has a hole. Is vacant.
Further, it is positioned by the guide pin 5 provided on the chip carrier 4.

Next, as shown in FIG. 1, the chip carrier 4 to which the metal mask 2 is attached is passed under the transfer roll 1 adjusted so that the adhesion thickness of the electrode material 6 is 0.1 mm. Therefore, the chip inductor element 3
Electrodes were applied to the end faces. As electrode material, viscosity is 30
A thick film silver paste of Pa · s was used. After that, only the metal mask was removed, and the chip inductor element 3 coated with the electrode material 6 as shown in FIG. 4 was leveled for 15 minutes and then dried at 120 ° C. in a dryer together with the chip carrier. After drying, the chip inductor element was taken out of the carrier and baked in the atmosphere at 600 ° C. to form an external electrode of the chip inductor element. The dimension of the electrode surrounding the chip inductor element side is 0.2 to 0.3 m
A stable value of m was obtained. Further, the obtained chip interactor element was soldered on a printed circuit board, and the shear strength was measured. As a result, the weight was 5.0 kg.

As a conventional example, by the screen printing method,
After inserting the chip inductor element having the same size and shape as those of the above-mentioned embodiment into the chip carrier, a 320 mesh stainless screen is used on the chip inductor element, and the pushing amount of the squeegee is adjusted so as to be in contact with the end surface of the chip inductor element. , Printed. As the electrode material, a thick film silver paste having a viscosity of 30 Pa · s was used. Then 1
After leveling for 5 minutes, the chip carrier was dried at 120 ° C. in a dryer. After drying, the chip inductor element was taken out from the carrier and baked in the atmosphere at 600 ° C. to form external electrodes of the chip inductor element.
The dimension of the electrode around the chip inductor element is
It became 0.1 mm or less. Further, the obtained chip inductor element was soldered on a printed circuit board, and the shear strength was measured. As a result, the weight was 2.1 kg.

As described above, in the present embodiment, it was possible to perform the electrode formation without adjusting the squeegee pushing amount and without damaging the mask, and without the complexity of jig formation.

[0015]

As described above, according to the present invention, it is possible to facilitate the formation of electrodes at two or more locations at the end of a chip component and to obtain a high-quality chip component with good production efficiency. And a device could be provided.

[Brief description of drawings]

FIG. 1 is a front view showing the overall configuration of an electrode coating apparatus according to an embodiment of the present invention.

FIG. 2 is a partially enlarged view of portions A and B of FIG. Figure 2
(A) is a top view of A part. FIG. 2B is a front view of part A. FIG. 2C is a plan view of part B. FIG. 2D is a front view of part B.

FIG. 3 is a plan view of a mask pattern used in an example of the present invention.

FIG. 4 is an external perspective view of a chip part after applying an electrode material.

[Explanation of symbols]

 1 Transfer Roll 2 Metal Mask 3 Chip Component (Chip Inductor Element) 4 Chip Carrier 5 Guide Pin 6 Electrode Material 7 Blade 8 Supply Roll 9 Conveyor Belt 10 Table 11 Guide Pin Hole 12 Electrode Coating Hole

Claims (2)

[Claims] 1. A chip component is installed on a chip carrier,
A metal mask with electrode application holes is placed on the chip component, the metal mask is fixed to the chip carrier with guide pins, and the chip carrier is conveyed by the conveyor belt provided on the table and supplied. An electrode application method, characterized in that an electrode material supplied from a roll and a blade is applied to the chip component by a transfer roll connected to the supply roll. 2. A chip carrier on which a chip component is installed, a metal mask mounted on the chip component, fixed to the chip carrier with a guide pin, and provided with an electrode coating hole, and provided on a table. A transfer belt for transferring the chip carrier, a supply roll and a blade for supplying an electrode material, and a transfer roll connected to the supply roll for applying the electrode material to the chip component An electrode coating device comprising: