JPH0853655A - Hardenable pressure-sensitive adhesive tape and method of using it - Google Patents

Abstract

PURPOSE:To obtain a hardenable pressure-sensitive adhesive tape which can be used as a dicing tape in dicing, e.g. a silicon wafer and as an adhesive in mounting by using a specified copolymer. CONSTITUTION:This tape has a hardenable pressure-sensitive adhesive layer formed from a composition consisting of an actinic-radiation-curable copolymer (A) which is obtained by reacting an acrylic copolymer having functional monomer units with an unsaturated compound having substituents reactive with the functional groups of the monomer and which has unsaturated groups polymerizable by actinic radiation on the side chain and a molecular weight of at least 100,000, an epoxy resin (B) and a heat-activatable latent curing agent (C) for epoxy resin. The composition may also contain an acrylic polymer (D) having a molecular weight of at least 100,000 and a glass transition temperature of 10 deg.C or lower and/or a photopolymerization initiator (E). It is desirable that the hardenable pressure-sensitive adhesive layer is formed on a light- transmitting support having a surface tension of at most 40dyn/cm.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a novel tacky adhesive tape and a method of using the same. More specifically, the present invention relates to an adhesive tape particularly suitable for use in the step of dicing a silicon wafer or the like and further die bonding it to a lead frame, and a method of using the same.

[0002]

TECHNICAL BACKGROUND OF THE INVENTION Semiconductor wafers such as silicon and gallium arsenide are manufactured in a large diameter state, and the wafer is cut (diced) into element small pieces (IC chips) and then subjected to the next mounting step. It has been moved. At this time, the semiconductor wafer is subjected to the steps of dicing, washing, drying, expanding, and picking up in a state of being adhered to the adhesive sheet in advance, and then transferred to the bonding step of the next step.

The adhesive sheet used in the processes from the dicing process to the pickup process of such a semiconductor wafer has a sufficient adhesive force to the wafer chip from the dicing process to the drying process, and the wafer is picked up at the time of picking up. It is desired that the chip has an adhesive strength such that the adhesive does not adhere to the chip.

The picked-up chip is bonded to a lead frame through a die bonding adhesive such as an epoxy adhesive in a die bonding process to manufacture a semiconductor device. However, when the chip is very small, it is difficult to apply an appropriate amount of adhesive, and the adhesive may stick out of the IC chip, or
If the C chip is large, the amount of adhesive will be insufficient, etc.
There has been a problem that the bonding cannot be performed so as to have a sufficient adhesive force. Further, the work of applying such a die-bonding adhesive is complicated, and improvement is required to simplify the process.

In order to solve such a problem, various wafer sticking pressure-sensitive adhesive sheets having a wafer fixing function and a die bonding function at the same time have been proposed (for example, JP-A-2-32181).

JP-A-2-32181 discloses a composition comprising a (meth) acrylic acid ester copolymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat-activatable latent epoxy resin curing agent and a photopolymerization initiator. An adhesive / adhesive tape comprising an adhesive / adhesive layer formed of a material and a substrate is disclosed. This adhesive layer has a function of fixing the wafer during wafer dicing, and is cured by irradiation with an energy ray after completion of dicing, so that the adhesive force between the adhesive layer and the substrate is lowered. Therefore, when the chip is picked up, the adhesive layer peels off together with the chip. I with an adhesive layer
When the C chip is placed on the lead frame and heated, the adhesive layer develops an adhesive force, and the adhesion between the IC chip and the lead frame is completed.

The pressure-sensitive adhesive sheet for wafer attachment disclosed in the above publication enables so-called direct die bonding, and the step of applying an adhesive for die attachment can be omitted.

Curing of the tacky adhesive layer in such a tacky adhesive tape is carried out by irradiating the photopolymerizable low molecular weight compound contained in the tacky adhesive layer with energy rays to form a three-dimensional network in the tacky adhesive layer. It is based on the principle of giving a structure and significantly reducing its fluidity.

By the way, in the adhesive layer of the adhesive tape, the majority of the composition is formed of low molecular weight components. Such a low molecular weight component-based adhesive composition is
Generally, the viscosity of the coating liquid when drying at high temperature is low, and the tape substrate has a low surface energy of 40 dyne / cm, so the wettability of the coating liquid is low, and it repels even when applied to the substrate. Easily occurs and the yield is low. Furthermore, apply the above coating solution to the release material treated with silicone release agent.
So-called transfer coating for drying and laminating on a tape substrate was more difficult with a coating solution of the composition.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned prior art, and has energy ray curability and heat curability, and can be used as a dicing tape during dicing. It is an object of the present invention to provide an adhesive tape that can be used as an adhesive during mounting and a method of using the adhesive tape. Further, the present invention aims to improve the coating suitability of an adhesive composition and to provide an adhesive tape having an adhesive layer having high holding power and good heat resistance after curing, and a method for using the same. The purpose is to do.

[0011]

SUMMARY OF THE INVENTION A pressure-sensitive adhesive tape according to the present invention comprises (A) an acrylic copolymer having a functional group-containing monomer unit,
An energy ray-curable copolymer having a molecular weight of 100,000 or more and having an energy ray-polymerizable unsaturated group in a side chain, which is obtained by reacting an unsaturated group-containing compound having a substituent reactive with the functional group, It is characterized by having an adhesive / bonding layer formed from an adhesive / adhesive composition comprising (B) an epoxy resin and (C) a heat-activatable latent epoxy resin curing agent.

The adhesive composition further comprises (D) a molecular weight of 100,000 or more and a glass transition temperature of 10.
An acrylic polymer having a temperature of not higher than 0 ° C. and / or (E) a photopolymerization initiator may be further contained.

The adhesive layer is preferably provided on a light transmissive support having a surface tension of 40 dyn / cm or less. The method of using the adhesive tape according to the present invention is
An IC chip is attached to the adhesive layer of the adhesive tape, the energy chip is irradiated to fix the IC chip to the adhesive layer, and then the IC chip is placed on a lead frame. It is characterized in that the IC chip and the lead frame are bonded to each other by placing the IC chip and the lead frame by placing them on the substrate and then heating.

Ultraviolet rays are preferred as the energy rays for irradiation.

[0015]

DETAILED DESCRIPTION OF THE INVENTION The tacky-adhesive tape according to the present invention and the method of using the same will be specifically described below.

The adhesive layer of the adhesive tape according to the present invention is
(A) an energy ray-curable copolymer, (B) an epoxy resin, and (C) a heat-activatable latent epoxy resin curing agent, and (D) a molecular weight of 100,000 or more, and, if desired, It may further contain an acrylic polymer having a glass transition temperature of 10 ° C. or lower and / or (E) a photopolymerization initiator.

The energy ray-curable copolymer (A) is an acrylic copolymer (a) having a functional group-containing monomer unit.
It is obtained by reacting 1) with an unsaturated group-containing compound (a2) having a substituent that reacts with the functional group.

The functional group-containing monomer is a monomer having a polymerizable double bond and a functional group such as a hydroxyl group, a carboxyl group, an amino group and a substituted amino group in the molecule,
Preferably, a hydroxyl group-containing unsaturated compound and a carboxyl group-containing unsaturated compound are used.

More specific examples of such a functional group-containing monomer include 2-hydroxyethyl acrylate,
2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, hydroxyl group-containing acrylate such as 2-hydroxypropyl methacrylate, acrylic acid,
Examples thereof include carboxyl group-containing compounds such as methacrylic acid and itaconic acid.

The above functional group-containing monomers may be used alone or in combination of two or more. The acrylic copolymer (a1) is composed of a structural unit derived from the above functional group-containing monomer and a structural unit derived from a (meth) acrylic acid ester monomer or its derivative. As the (meth) acrylic acid ester monomer,
(Meth) acrylic acid cycloalkyl ester, (meth)
Acrylic acid benzyl ester, alkyl group has 1 carbon
A (meth) acrylic acid alkyl ester of -18 is used. Among these, particularly preferred are (meth) acrylic acid alkyl esters in which the alkyl group has 1 to 18 carbon atoms, such as methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate. , Butyl acrylate, butyl methacrylate and the like are used.

The acrylic copolymer (a1) usually contains 5 to 100 structural units derived from the above functional group-containing monomer.
%, Preferably 10 to 50% by weight, particularly preferably 20 to 40% by weight, and the constituent unit derived from the (meth) acrylic acid ester monomer or its derivative is usually 0 to 95% by weight, preferably The content is 50 to 90% by weight, particularly preferably 60 to 80% by weight.

The acrylic copolymer (a1) can be obtained by copolymerizing a functional group-containing monomer as described above with a (meth) acrylic acid ester monomer or a derivative thereof by a conventional method. In addition, in the (meth) acrylic acid ester monomer, a glycidyl group-containing monomer such as glycidyl (meth) acrylate in an amount of 50% by weight or less, preferably 5 to 40% by weight,
Vinyl formate, vinyl acetate, styrene, etc. may be copolymerized. Among these monomers, glycidyl group-containing monomers such as glycidyl (meth) acrylate are preferable.

The acrylic copolymer (a1) having the functional group-containing monomer unit is reacted with the unsaturated group-containing compound (a2) having a substituent reactive with the functional group to produce an energy ray-curable copolymer. A combination (A) is obtained.

The unsaturated group-containing compound (a2) contains a substituent capable of reacting with the functional group in the acrylic copolymer (a1). The substituent varies depending on the type of the functional group. For example, when the functional group is a hydroxyl group or a carboxyl group, the substituent is preferably an isocyanate group, an epoxy group or the like, and when the functional group is an amino group or a substituted amino group, the substituent is preferably an isocyanate group or the like. One such substituent is contained in each molecule of the unsaturated group-containing compound (a2).

The unsaturated group-containing compound (a2) contains an energy ray-polymerizable carbon-carbon double bond in an amount of 1 for each molecule.
.About.5, preferably 1 to 2 are included. Specific examples of the unsaturated group-containing compound (a2) include, for example, methacryloyloxyethyl isocyanate and meta-.
Isopropenyl-α, α-dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate; acryloyl monoisocyanate compound obtained by reacting a diisocyanate compound or polyisocyanate compound with hydroxyethyl (meth) acrylate; Acryloyl monoisocyanate compound obtained by the reaction of an isocyanate compound or a polyisocyanate compound, a polyol compound, and hydroxyethyl (meth) acrylate; glycidyl (meth)
Acrylate etc. are mentioned.

The unsaturated group-containing compound (a2) is usually 20 to 100 equivalents, preferably 40 to 9 per 100 equivalents of the functional group-containing monomer of the acrylic copolymer (a1).
It is used in a ratio of 5 equivalents, particularly preferably 60 to 90 equivalents.

The reaction between the acrylic copolymer (a1) and the unsaturated group-containing compound (a2) is usually carried out at room temperature and atmospheric pressure for about 24 hours. This reaction is
For example, it is preferable to use a catalyst such as dibutyltin laurate in a solution such as ethyl acetate.

As a result, the functional group present in the side chain in the acrylic copolymer (a1) and the unsaturated group-containing compound (a
The substituents in 2) react with each other, the unsaturated groups are introduced into the side chains of the acrylic copolymer (a1), and the energy ray-curable copolymer (A) is obtained. The reaction rate between the functional group and the substituent in this reaction is usually 70% or more, preferably 80%.
% Or more, and unreacted functional groups may remain in the energy ray-curable copolymer (A).

The molecular weight of the energy ray-curable copolymer (A) is 100,000 or more, preferably 150,
000 to 1,500,000, particularly preferably 2
It is from 0,000 to 1,000,000. The glass transition temperature of the copolymer (A) is usually 20 ° C. or lower, preferably about −70 to 0 ° C., and it has tackiness at room temperature (23 ° C.). Furthermore, in the energy ray-curable copolymer (A), it is usually 1 × 10 ²² per 100 parts by weight.
〜1 × 10 ²⁴ pieces, preferably 2 × 10 ²² 〜5 × 10
^It contains ²³ , particularly preferably 5 × 10 ²² to 2 × 10 ²³ energy ray-polymerizable unsaturated groups.

Since the energy ray-curable copolymer (A) contains an energy ray-polymerizable unsaturated group, it is polymerized and cured by irradiation with energy rays. As the epoxy resin (B) used in the present invention, various conventionally known epoxy resins are used, but usually,
A resin having a molecular weight of about 300 to 2000 is preferable, and a blend of a normal liquid epoxy resin having a molecular weight of 300 to 500, preferably 330 to 400, and a normal solid epoxy resin having a molecular weight of 400 to 2000, preferably 500 to 1500 is blended. It is desirable to use. The epoxy equivalent of the epoxy resin preferably used in the present invention is usually 50 to 5000 g / eq. Specific examples of such an epoxy resin include glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenyl novolac and cresol novolac; glycidyl ethers of alcohols such as butanediol, polyethylene glycol and polypropylene glycol; Glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidyl-type or alkylglycidyl-type epoxy resins in which the active hydrogen bonded to the nitrogen atom such as aniline isocyanurate is replaced with a glycidyl group; vinylcyclohexane diepoxide, 3,4-epoxycyclohexylmethyl-3,4
-Dicyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spiro (3,4-epoxy) cyclohexane-m-dioxane, etc. A so-called alicyclic epoxide in which epoxy is introduced by oxidation can be mentioned.

Among these, bisphenol glycidyl type epoxy resins, o-cresol novolac type epoxy resins and phenol novolac type epoxy resins are preferably used in the present invention. Specific examples of such a bisphenol-based glycidyl-type epoxy resin include Epicoat 828 ^™ (produced by Yuka Shell Epoxy Co., Ltd., molecular weight 380), Epicoat 834 ^™ (produced by Yuka Shell Epoxy Co., Ltd., molecular weight 470), Epicoat 10
01 ^TM (Okaka Shell Epoxy Co., Ltd., molecular weight 90
0), Epicoat 1002 ^™ (made by Yuka Shell Epoxy Co., Ltd., molecular weight 1060), Epicoat 1055 ^™ (made by Yuka Shell Epoxy Co., Ltd., molecular weight 1350), Epicoat 1007 ^™ (made by Yuka Shell Epoxy Co., Ltd., molecular weight 2900) Etc. can be used. Specific examples of the o-cresol novolac type epoxy resin include Epicoat 180S65 ^™ (produced by Yuka Shell Epoxy Co., Ltd.), EOCN-102S ^™ (produced by Nippon Kayaku Co., Ltd.),
EOCN-103S ^™ (Nippon Kayaku Co., Ltd.), EOC
N-104S ^™ (Nippon Kayaku Co., Ltd.), EOCN-1
020 ^™ (manufactured by Nippon Kayaku Co., Ltd.) and the like can be used. As the phenol novolac type epoxy resin, Epicoat 152 ^™ (produced by Yuka Shell Epoxy Co., Ltd.), Epicoat 154 ^™ (produced by Yuka Shell Epoxy Co., Ltd.), EPPN-201 ^™ (produced by Nippon Kayaku Co., Ltd.) and the like are used. can do.

These epoxy resins can be used alone or in combination of two or more. The epoxy resin (B) as described above is usually 100 to 1000 with respect to 100 parts by weight of the energy ray-curable copolymer (A).
It is used in a proportion of parts by weight, preferably 400 to 800 parts by weight, particularly preferably 600 to 800 parts by weight.

The heat-activatable latent epoxy resin curing agent (C) used in the present invention is a type of curing that does not react with the epoxy resin at room temperature but is activated by heating above a certain temperature and reacts with the epoxy resin. It is an agent.

Thermally active latent epoxy resin curing agent (C)
The activation method is to generate active species (anions, cations) by a chemical reaction by heating; it is stably dispersed in the epoxy resin (B) at around room temperature and is compatible and soluble with the epoxy resin at high temperature. , A method of initiating a curing reaction; a method of initiating a curing reaction by elution at a high temperature with a molecular sieve-encapsulating type curing agent; and a method of using microcapsules.

Thermally activated latent used in the present invention
Specific examples of the epoxy resin curing agent (C) include ADEKA
Puton CP-66^TM(Made by Asahi Denka Kogyo Co., Ltd.), San-E
Id SI-60, 80 and 100^TM(Sanshin Chemical Industry Co., Ltd.
Various onium salts (made by Shikisha Co., Ltd.); dicyandiamide, two
As a basic acid dihydrazide compound, ADH^TM(Japan Hide
(Radin Industry Co., Ltd.), SDH^TM(Japan Hydrazine Engineering
Industry Co., Ltd.), IDH ^TM(Japan Hydrazine Industrial Stock Association
Company), N-12^TM(Japan Hydrazine Industry Co., Ltd.
Made), LDH^TM(Manufactured by Ajinomoto Co., Inc.), UDH^TM(Of taste
Amine adduct type curing agent
Cure PN-23^TM(Manufactured by Ajinomoto Co., Inc.)
MY-23^TM(Manufactured by Ajinomoto Co., Inc.), Amicure PN-
H^TM(Manufactured by Ajinomoto Co., Inc.), Amicure MY-H^TM(taste
Nomoto Co., Ltd.); as an imidazole compound, cure
Zol 2PHZ^TMCure (manufactured by Shikoku Chemicals Co., Ltd.)
Zol 2MZ-A^TM(Manufactured by Shikoku Chemicals Co., Ltd.)
Azole 2MZ-OK^TM(Manufactured by Shikoku Chemicals Co., Ltd.), etc.
The high melting point active hydrogen compound and the like can be mentioned.

These heat-activatable latent epoxy resin curing agents can be used alone or in combination of two or more. The heat-activatable latent epoxy resin curing agent (C) as described above is usually 0.1 to 20 parts by weight, preferably 1 to 10 parts by weight, and particularly preferably 3 to 100 parts by weight of the epoxy resin (B). It is used in a proportion of from 10 to 10 parts by weight.

The tacky-adhesive tape according to the present invention has a tacky-adhesive layer formed from the tacky-adhesive composition comprising the above components (A) to (C). In the pressure-sensitive adhesive composition used in the present invention, an acrylic polymer (D) and / or a photopolymerization initiator (E) may be further added, if desired, in addition to the components (A) to (C). It can be added.

Unlike the energy ray-curable copolymer (A), the acrylic polymer (D) has no activity against energy rays. Such an acrylic polymer (D)
Has been widely used as a pressure-sensitive adhesive from the past, and specifically, a homopolymer and a copolymer having (meth) acrylic acid ester as a main constituent monomer unit, or a mixture thereof is used. Here, the (meth) acrylic acid ester has a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 18 carbon atoms, a (meth) acrylic acid alkyl ester having a hydroxy group, and a glycidyl group (meth). Acrylic acid alkyl esters and the like are preferably used. Among the above, when a (meth) acrylic acid alkyl ester having a glycidyl group is used, the adhesive force between the lead frame and the chip after thermosetting is improved.

In addition to these monomers, (meth) acrylic acid, vinyl acetate, styrene, vinyl chloride and the like may be copolymerized. The molecular weight of the acrylic polymer (D) is 100,000 or more, preferably 150,0.
0 to 1,500,000, particularly preferably 20
It is from 10,000 to 1,000,000. The glass transition temperature of the acrylic polymer (D) is usually 10 ° C. or lower,
The temperature is preferably about -70 to -10 ° C, and the room temperature (23
It has tackiness at (° C). As a more specific example of such an acrylic polymer (D), the same as the above-mentioned acrylic copolymer (a1) can be exemplified.

The mixing ratio of the component (D) in the adhesive composition used in the present invention can be set arbitrarily, but the total amount of (A) and (B) is 100 parts by weight. On the other hand, the amount is preferably 50 parts by weight or less, particularly preferably 30 parts by weight or less, and further preferably 20 parts by weight or less.

In such an adhesive composition, the energy ray-curable copolymer (A) is polymerized and cured by irradiation with energy rays. As the energy rays, specifically, ultraviolet rays, electron beams and the like are used.

When ultraviolet rays are used as the energy rays, by mixing the photopolymerization initiator (E) in the above composition, the polymerization and curing time and the light irradiation amount can be shortened.

As such a photopolymerization initiator (E),
Specifically, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, α -Hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, β
-Crawl anthraquinone and the like. The photopolymerization initiator (E) is used in an amount of 0.1 to 10 parts by weight, particularly 0.5 to 5 parts by weight, based on 100 parts by weight of the total of (A), (B) and (C). It is preferably used.

Further, in order to control the curing characteristics against energy rays, a low molecular weight energy ray-polymerizable compound may be added to the energy ray-curable pressure-sensitive adhesive composition.

The adhesive composition used in the present invention comprises an energy ray-curable copolymer (A) as described above, an epoxy resin (B), and a heat-activatable latent epoxy resin curing agent (C). And, if desired, the acrylic polymer (D) and / or the photopolymerization initiator (E) are mixed by a conventional method.

The adhesive composition further contains silver such as gold, silver, copper, nickel, aluminum, stainless steel, carbon, or ceramic, or nickel or aluminum for the purpose of imparting conductivity after die bonding. Conductive fillers such as those coated with may be added,
Further, for the purpose of imparting heat conductivity, a metal material such as gold, silver, copper, nickel, aluminum, stainless steel, silicon, germanium, or a heat conductive substance such as an alloy thereof may be added. These additives are used in the adhesive composition (A +
It may be blended in a proportion of about 10 to 400 parts by weight with respect to 100 parts by weight of B + C).

Various fillers may be added to the adhesive composition for the purpose of improving the rigidity, mechanical strength and heat resistance of the composition after die bonding. Specifically, kaolin, talc, calcium silicate, fused silica, glass fiber, alumina and the like are preferably used for the purpose of improving mechanical strength. Further, for the purpose of improving heat resistance, silica, alumina, glass fiber, mica, kaolin, titanium oxide, aluminum hydroxide and the like are preferably used. These additives are adhesive composition (A + B +
C) It may be mixed in a ratio of about 400 parts by weight or less with respect to 100 parts by weight.

An organic polyvalent isocyanate compound, an organic polyvalent imine compound, etc. may be added to the above-mentioned adhesive composition in order to adjust the initial adhesive force and cohesive force before irradiation with energy rays.

As the organic polyvalent isocyanate compound, aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds and trimers of these polyvalent isocyanate compounds, In addition, a terminal isocyanate urethane prepolymer obtained by reacting these polyvalent isocyanate compounds with a polyol compound can be used. More specific examples of the organic polyvalent isocyanate compound include, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate and diphenylmethane-4. , 4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine isocyanate And so on.

Specific examples of the organic polyvalent imine compound include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate. , Tetramethylolmethane-
Tri-β-aziridinyl propionate, N, N'-toluene-
2,4-bis (1-aziridinecarboxamide) triethylenemelamine and the like can be mentioned.

The adhesive composition can be given a new function by containing various additives. For example, a colorant by an energy ray described in JP-B-2-15595, an expanding agent described in JP-B-2-51948, an abrasive grain described in JP-B-2-51948, and JP-A-63-299246. And the antistatic agent.

The adhesive / adhesive tape of the present invention has an adhesive / adhesive layer comprising the above components, and the adhesive / adhesive tape of the present invention having such an adhesive / adhesive layer comprises a base material. Instead of being used, it may be a thin film of the composition comprising the above components, or may be a multi-layer structure comprising a tacky adhesive layer formed on the substrate using the above composition.

Examples of the base material of the pressure-sensitive adhesive sheet of the present invention include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, and chloride when ultraviolet rays are used as energy rays. Vinyl copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film A transparent film such as a polystyrene film or a polycarbonate film is used. Further, these crosslinked films are also used. Further, a laminated film of these may be used. Further, when an electron beam is used as the energy beam, it is not necessary to be transparent, and therefore, in addition to the above transparent film, an opaque film, a fluororesin film or the like obtained by coloring these can be used.

Further, the surface tension of the substrate is preferably 40.
The dyne / cm is preferably not more than 37 dyne / cm, more preferably not more than 35 dyne / cm.
Such a base material having a low surface tension can be obtained by appropriately selecting the material, or can be obtained by applying a silicone resin or the like to the surface of the base material and subjecting it to a mold release treatment. .

The film thickness of such a substrate is usually 10 to 3
The thickness is 00 μm, preferably 20 to 200 μm, and particularly preferably 50 to 150 μm.

The pressure-sensitive adhesive tape according to the present invention is obtained by applying the above-mentioned pressure-sensitive adhesive composition onto a release sheet according to a generally known method such as a comma coater, gravure coater, die coater, reverse coater and drying. Can be obtained by forming a tacky adhesive layer and removing the release sheet. When the above-mentioned base material is used, a tacky-adhesive tape is produced by applying the tacky-adhesive composition onto the base material by the same method and drying it to form a tacky-adhesive layer. can do. The pressure-sensitive adhesive composition can be applied by dissolving or dispersing it in a solvent, if necessary.

The thickness of the adhesive layer thus formed is usually 3 to 100 μm, preferably 10 to 60 μm.
It is desirable that it is m. The adhesive tape obtained as described above is used as follows.

First, the adhesive tape is fixed on the dicing device. At this time, when the adhesive tape does not have a base material, it is preferable to lay a release sheet on the dicing stage. After sticking the adhesive tape of the present invention on one surface of the silicon wafer, the above silicon wafer and the adhesive tape are cut using a cutting means such as a dicing saw to obtain an IC chip. The adhesive force between the silicon wafer and the adhesive tape at this time is usually 50 to 200.
It is 0 g / 25 mm, preferably 100 to 1500 g / 25 mm, while the adhesive force between the adhesive layer of the adhesive tape and the substrate (or release sheet) is usually 500 g / 25 mm or less.

Then, the adhesive tape attached to the IC chip obtained as described above is irradiated with energy rays. Examples of energy rays that can be used in the present invention include ultraviolet rays (center wavelength = about 365 nm) and electron rays. When ultraviolet rays are used as the energy rays, the illuminance is usually set within the range of 20 to 500 mW / cm ² , and the irradiation time is set within the range of 0.1 to 150 seconds. Also, for example, when irradiating with an electron beam, various conditions can be set in accordance with the above-mentioned case of ultraviolet irradiation. It is also possible to supplementarily heat at the time of the energy ray irradiation as described above.

By thus irradiating with energy rays, the energy ray-curable copolymer (A) is cured, and the adhesive force between the silicon wafer and the adhesive layer is usually 50.
~ 4000 g / 25 mm, preferably 100-3000 g /
Increase to 25 mm. On the other hand, the adhesive force between the adhesive layer of the adhesive tape and the substrate (or release sheet) is usually 1 to 500 g /
It is 25 mm, preferably 100 g / 25 mm or less.

Therefore, by irradiating the energy beam as described above, the adhesive layer can be fixedly left on the surface of the IC chip and peeled from the base material (or the release sheet).

The energy irradiation may be performed before the dicing step. In this way, the IC chip to which the tacky adhesive layer is fixed is placed on the lead frame and then heated to cure the epoxy resin in the tacky adhesive layer and to bond the IC chip and the lead frame. . The heating temperature in this case is usually 100 to 300.
C., preferably about 130 to 250.degree. C., and the heating time is usually 1 to 120 minutes, preferably 5 to 60 minutes.
It's a minute. By such heating, the IC chip and the lead frame can be firmly bonded.

The adhesive tape of the present invention can be used for adhering semiconductor compounds, glass, ceramics, metals, etc., in addition to the above-mentioned usage.

[0064]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.

In the following examples and comparative examples, "repellency during tape production", "tape holding force" and "shear strength" were evaluated as follows. Repelling at the time of tape production 1) Tape production method
It is applied to the treated side of PET film with silicone release on one side and dried for 1 minute at 100 ° C, then the surface tension is 34 dyne / c.
A tape was prepared by laminating it with a polyolefin film of m 2. 2) Evaluation The presence or absence of cissing was visually confirmed on the paste surface after drying at 100 ° C. for 1 minute.

In the table, "○" indicates that repelling did not occur, "△" indicates that repelling occurred partly, "x" indicates repelling, and a testable sample was prepared. Indicates that there was not. Tape holding power Peel off the peeling film of the created tape, 25mm × 25
The area of mm is attached to a SUS plate, and a 2 kg pressure roll is reciprocated 5 times. After crimping, it is left in 23 ° C. × 65% RH for 15 minutes, then set in a creep tester (40 ° C.) and left for 15 minutes. Then, a load of 1 kg is applied to start the measurement. The holding power is defined as the number of seconds during which the test piece slipped off the SUS plate. Shear strength A silicon wafer is attached to the adhesive tape prepared above, after irradiation with ultraviolet rays, dicing (2 mm x 2 mm), then attachment to a lead frame and holding at 160 ° C for 30 minutes,
The adhesive layer was cured. Then, the shear strength at room temperature,
The shear strength on a hot plate heated to 200 ° C. was measured.

Further, in the following examples, the energy ray-curable copolymer (A), the epoxy resin (B), the heat-activable latent epoxy resin curing agent (C), the acrylic polymer (D) and the photopolymer are used. The following were used as the polymerization initiator (E). Energy ray-curable copolymer (A) (A1): 100 parts by weight of a copolymer obtained by copolymerizing 70 parts by weight of butyl acrylate and 30 parts by weight of 2-hydroxyethyl acrylate, and 24 parts by weight of methacryloyloxyethyl isocyanate. With 100 parts by weight (weight average molecular weight 600,000). (A2): Butyl acrylate 50
100 parts by weight of a copolymer obtained by copolymerizing 20 parts by weight of glycidyl methacrylate and 30 parts by weight of 2-hydroxyethyl acrylate, and a reaction product of 24 parts by weight of methacryloyloxyethyl isocyanate (weight average molecular weight 850, 000). Epoxy resin (B) (B1): Bisphenol-based epoxy resin (epoxy equivalent 190) (B2): Cresol novolac epoxy resin (epoxy equivalent 220) (B3): Bisphenol epoxy resin (epoxy equivalent 650) Thermally active latent Epoxy resin curing agent (C) (C1): Aliphatic sulfonium salt (C2): Dicyandiamide acrylic polymer (D) (D): 50 parts by weight of butyl acrylate, 20 parts by weight of glycidyl methacrylate and 30 parts by weight of 2-hydroxyethyl acrylate Weight average molecular weight of 8
Copolymer photoinitiator (E) (E): 50,000, glass transition temperature -26 ° C .: α-hydroxycyclohexyl phenyl ketone Other API: Aromatic polyisocyanate DPHA: Dipentaerythritol hexaacrylate UA: Bifunctional Urethane acrylate (weight average molecular weight 7
000)

[0068]

Example 1 100 parts by weight of the above component (A1), (B1)
300 parts by weight, (B3) 300 parts by weight, (C1) 18 parts by weight, (D) 100 parts by weight, (E) 3 parts by weight, API3
Parts by weight were mixed to obtain an adhesive composition. Using this adhesive composition, an adhesive tape was obtained according to the method described above.

Using the obtained adhesive tape, "repellency during tape production", "tape holding power" and "shear strength"
Was evaluated as described above. The results are shown in Table 1.

[0070]

Example 2 Component (A2) 100 instead of component (A1)
The same operation as in Example 1 was carried out except that parts by weight were used and component (D) was not used. The results are shown in Table 1.

[0071]

Example 3 Component (B2) 300 instead of component (B3)
The same operation as in Example 1 was carried out except that 45 parts by weight of the component (C2) was used in place of the parts by weight and the component (C1). The results are shown in Table 1.

[0072]

Example 4 Component (A2) 100 instead of component (A1)
The same operation as in Example 3 was performed except that the parts by weight were used and the component (D) was not used. The results are shown in Table 1.

[0073]

Comparative Example 1 The same operation as in Example 1 was carried out except that 100 parts by weight of DPHA was used in place of the component (A1).
The results are shown in Table 1.

[0074]

Comparative Example 2 The same operation as in Example 1 was carried out except that 100 parts by weight of UA was used instead of the component (A1). The results are shown in Table 1.

[0075]

Comparative Example 3 The same operation as in Example 3 was carried out except that 100 parts by weight of DPHA was used in place of the component (A1).
The results are shown in Table 1.

[0076]

Comparative Example 4 The same operation as in Example 3 was carried out except that 100 parts by weight of UA was used instead of the component (A1). The results are shown in Table 1.

[0077]

[Table 1]

[0078]

EFFECTS OF THE INVENTION As is clear from Table 1, in the pressure-sensitive adhesive composition of Comparative Example, the repelling of the coating liquid occurred on the surface of the release material, which made it difficult to produce the pressure-sensitive adhesive tape. On the other hand, it can be seen that the tacky-adhesive compositions of the examples have no repellency, have a good yield, and can produce the tacky-adhesive tape of the present invention. Further, it is found that the adhesive compositions of the examples are excellent in high holding power and shear strength at room temperature and high temperature after curing.

As described above, according to the present invention, a tacky adhesive tape that can be used as a dicing tape during dicing and can be used as an adhesive during mounting is stably provided. Further, since the adhesive / bonding tape of the present invention has excellent adhesive performance after curing, the reliability of the IC device manufactured using the adhesive / sticky tape of the present invention is improved.

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 21/52 E

Claims (6)

[Claims] 1. An energy ray in a side chain obtained by reacting (A) an acrylic copolymer having a functional group-containing monomer unit with an unsaturated group-containing compound having a substituent reactive with the functional group. A molecular weight of 100 having a polymerizable unsaturated group,
000 or more energy ray-curable copolymer, (B) an epoxy resin, and (C) a heat-activatable latent epoxy resin curing agent. An adhesive tape characterized by having. 2. The adhesive composition further comprises (D) a molecular weight of 100,000 or more and a glass transition temperature of 10.
The pressure-sensitive adhesive tape according to claim 1, which contains an acrylic polymer having a temperature of not higher than 0 ° C. 3. The pressure-sensitive adhesive tape according to claim 1, wherein the pressure-sensitive adhesive composition further contains (E) a photopolymerization initiator. 4. The pressure-sensitive adhesive according to claim 1, wherein the pressure-sensitive adhesive layer is provided on a light-transmissive support having a surface tension of 40 dyn / cm or less. Wearing tape. 5. An IC chip is affixed to the adhesive layer of the adhesive tape according to claim 1, and the IC chip is fixed to the adhesive layer by irradiating with energy rays. After
The IC chip is placed on a lead frame via the adhesive / adhesive layer, and then heated to cause the adhesive force to develop in the adhesive / adhesive layer to adhere the IC chip and the lead frame. How to use adhesive tape. 6. The method of using the pressure-sensitive adhesive tape according to claim 5, wherein the energy beam for irradiation is ultraviolet light.