JP2003055632A - Pressure-sensitive adhesive tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape having a pressure- sensitive adhesive layer which gives a pressure-sensitive adhesive reduced in water absorbency and which can realize the lowering of elastic modulus on thermal contact bonding. SOLUTION: This pressure-sensitive adhesive tape consists of a base material and a pressure-sensitive adhesive layer formed thereon and consisting of (A) a pressure-sensitive adhesive component, (B) an epoxy resin containing a dicyclopentadiene skeleton, and (C) a heat-activatable latent curing agent for epoxy resin.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a novel tacky adhesive tape. More specifically, the present invention relates to a tacky adhesive tape that is particularly suitable for use in joining electronic components to substrates and the like.

[0002]

2. Description of the Related Art In the manufacture of semiconductor elements and electronic parts, various resin adhesive tapes are used for various purposes due to their adhesive properties and electrical insulation properties. Examples of the application of the adhesive tape include an adhesive tape for die bonding, a tape for TAB, an adhesive tape for fixing a lead frame, and a tape for protecting a flexible substrate. However, most of the adhesive tapes used for these applications have to be pressure-bonded to an adherend at high pressure and high temperature in order to obtain high adhesive strength.

On the other hand, since the tacky adhesive tape is tacky at room temperature, it is not necessary to apply a high pressure at room temperature or a relatively low temperature for sticking it to an adherend. Since the temporary adhesion is performed in this state, unless the excessive stress is applied, it is not peeled off and various treatments can be performed between the steps from the adhesion to the curing.
Therefore, when the adhesive tape is used, the load on the adherend is reduced and the application range of the treatment is widened. Then, the adhesive layer is heat-cured to change to a strong adhesive state with the adherend.

The basic structure of the adhesive layer of the adhesive tape is, for example, Japanese Patent Publication No. 7-98927 and Japanese Patent No. 260.
As described in No. 8743, it comprises an acrylic copolymer, an epoxy resin, and a curing agent for epoxy resin. By the way, in a semiconductor product, an adhesive tape is exposed to a high temperature condition in a process of resin sealing with an epoxy resin or the like and a solder reflow process. At this time, if moisture is absorbed in the adhesive layer, the moisture may be vaporized and expanded to cause package cracks.

Further, since the surface of the adherend is not necessarily in a smooth surface state, air may be trapped in the interface with the adherend during the temporary adhesion. The trapped air not only lowers the adhesive strength after heat curing, but also causes package cracks. In order for the pressure-sensitive adhesive tape to follow the surface of the adherend having irregularities well without depending on the high pressure, it is necessary to have a low elastic modulus in the temperature region during pressure bonding. However, it is difficult for the conventional tacky-adhesive to have both a low moisture content and a low elastic modulus, and there is still a demand for improvement in this respect.

[0006]

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above-mentioned prior art, and reduces the water absorption rate of a cured product of a pressure-sensitive adhesive, and also the elastic modulus at the time of thermocompression bonding. It is an object of the present invention to provide a tacky-adhesive tape having a tacky-adhesive layer capable of reducing the pressure drop.

[0007]

The tacky-adhesive tape according to the present invention comprises a base material and an adhesive component (A) formed thereon.
The adhesive layer comprises (B) a dicyclopentadiene skeleton-containing epoxy resin and (C) a heat-activable latent epoxy resin curing agent. In the present invention, the dicyclopentadiene skeleton-containing epoxy resin (B) is

[0008]

[Chemical 2]

The resin represented by the formula (n is an integer of 0 to 10) is preferable. According to the present invention as described above, it is possible to prevent a package crack at the time of reflow due to the low water absorption of the adhesive / cured adhesive cured product, and to reduce the elastic modulus at the time of thermocompression bonding to the adherend surface. An adhesive / adhesive tape having an adhesive / adhesive layer having excellent followability is provided.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION As described above, the pressure-sensitive adhesive tape according to the present invention comprises a substrate, an adhesive component (A) formed on the substrate, (B) an epoxy resin containing a dicyclopentadiene skeleton, and ( C) An adhesive layer made of a heat-activatable latent epoxy resin curing agent. First, each component constituting the adhesive layer will be specifically described.

As the pressure-sensitive adhesive component (A), various general-purpose pressure-sensitive adhesives such as acrylic type, polyester type, urethane type, silicone type and natural rubber type can be used. In the present invention, an acrylic type adhesive is particularly preferable. It is preferably used.
Examples of the acrylic pressure-sensitive adhesive include a (meth) acrylic acid ester copolymer composed of a structural unit derived from a (meth) acrylic acid ester monomer and a (meth) acrylic acid derivative. Here, as the (meth) acrylic acid ester monomer, a (meth) acrylic acid cycloalkyl ester, a (meth) acrylic acid benzyl ester, or a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 18 carbon atoms is used. . Among these, particularly preferred are (meth) acrylic acid alkyl esters in which the alkyl group has 1 to 18 carbon atoms, such as methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate. , Butyl acrylate, butyl methacrylate and the like are used. Examples of the (meth) acrylic acid derivative include glycidyl (meth) acrylate having a glycidyl group and hydroxyethyl acrylate having a hydroxyl group.

The content of the component unit derived from glycidyl (meth) acrylate in the copolymer is usually 0 to
It is 80 mol%, preferably 5 to 50 mol%. By introducing a glycidyl group into the copolymer, the compatibility with the epoxy resin is improved, the Tg after curing is increased, and the heat resistance is also improved. Further, by introducing a hydroxyl group-containing monomer such as hydroxyethyl acrylate into the copolymer, it becomes easy to control the adhesiveness to the adherend and the adhesive property.

The molecular weight of the acrylic pressure-sensitive adhesive is preferably 100,000 or more, particularly preferably 150,000.
Is 1,000,000. The glass transition temperature of the acrylic pressure-sensitive adhesive is usually 20 ° C. or lower, preferably −70 to 0.
It is about 0 ° C, and has adhesiveness at room temperature (23 ° C). Epoxy resin containing dicyclopentadiene skeleton (B)
Is a resin having a dicyclopentadiene skeleton and a reactive epoxy group in the molecule, and is usually solid in the normal state, and its softening point is preferably 40 to 90 ° C., more preferably 45 to 80 ° C. And particularly preferably about 50 to 70 ° C. The molecular weight of the dicyclopentadiene skeleton-containing epoxy resin (B) is preferably 430 to 3000,
More preferably 700 to 2500, particularly preferably 1
It is 000-2000. Further, the epoxy equivalent of the dicyclopentadiene skeleton-containing epoxy resin (B) is preferably 190 to 1000 g / eq, more preferably 20.
0 to 800 g / eq, particularly preferably 210 to 400 g / eq.

As such a dicyclopentadiene skeleton-containing epoxy resin (B), an epoxy resin represented by the following formula is preferably used.

[0015]

[Chemical 3]

In the above formula, n is 0 to 10, preferably 0.
7, more preferably an integer of 0-5. As the dicyclopentadiene skeleton-containing epoxy resin (B), n is supplied as a mixture of 0 to 10, specifically, XD
-1000-L (trade name: manufactured by Nippon Kayaku Co., Ltd.), XD-1000-2L
(Trade name: manufactured by Nippon Kayaku Co., Ltd.) and the like.

These dicyclopentadiene skeleton-containing epoxy resins may be used alone or in combination of two or more. The dicyclopentadiene skeleton-containing epoxy resin (B) is the adhesive component (A) 100
With respect to parts by weight, preferably 5 to 1000 parts by weight, more preferably 50 to 800 parts by weight, particularly preferably 100.
It is used in a proportion of up to 600 parts by weight.

Further, the dicyclopentadiene skeleton-containing epoxy resin (B) may be used in combination with another general-purpose epoxy resin (B '). In this case, the general-purpose epoxy resin preferably has a molecular weight of about 300 to 2000, and particularly, a normal liquid epoxy resin having a molecular weight of 300 to 500 and a normal solid epoxy resin having a molecular weight of 400 to 2000 are used in a blended form. Is desirable. The epoxy equivalent of a general-purpose epoxy resin is usually 50 to 5000 g / eq.
Specific examples of such an epoxy resin include glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenyl novolac and cresol novolac; glycidyl ethers of alcohols such as butanediol, polyethylene glycol and polypropylene glycol; Glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidyl-type or alkylglycidyl-type epoxy resins in which the active hydrogen bonded to the nitrogen atom such as aniline isocyanurate is replaced with a glycidyl group; vinylcyclohexane diepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spiro (3,4-
Epoxy) cyclohexane-m-dioxane, etc.,
The so-called alicyclic epoxide in which epoxy is introduced by, for example, oxidizing a carbon-carbon double bond in the molecule can be mentioned.

Among these, a bisphenol glycidyl type epoxy resin is preferably used as a general-purpose epoxy resin. Such a general-purpose epoxy resin,
They may be used alone or in combination of two or more. When the dicyclopentadiene skeleton-containing epoxy resin (B) and the general-purpose epoxy resin (B ′) are used in combination, the total amount of the epoxy resins is preferably 5 with respect to 100 parts by weight of the adhesive component (A). To 1000 parts by weight, more preferably 50 to 800 parts by weight, and particularly preferably 100 to 600 parts by weight. In this case, the ratio of the epoxy resin (B) having a dicyclopentadiene skeleton and the general-purpose epoxy resin (B ') is preferably 1:99 to 99: 1, more preferably 5: 9.
5 to 50:50, particularly preferably 10:90 to 40: 6
It is in the range of 0.

Thermally active latent epoxy resin curing agent (C)
Is a curing agent of the type that does not react with the epoxy resin at room temperature, but is activated by heating above a certain temperature and reacts with the epoxy resin. As a method for activating the heat-activable latent epoxy resin curing agent (C), a method of generating active species (anion, cation) by a chemical reaction by heating; stable dispersion in the epoxy resin at room temperature and high temperature And a method of initiating the curing reaction by being compatible with and dissolving with the epoxy resin; a method of initiating the curing reaction by elution at a high temperature with a molecular sieve encapsulating type curing agent;

These heat-activatable latent epoxy resin curing agents (C) can be used alone or in combination of two or more. Among the above, dicyandiamide, an imidazole compound or a mixture thereof is particularly preferable. The heat-activatable latent epoxy resin curing agent (C) as described above includes a dicyclopentadiene skeleton-containing epoxy resin (B) and a general-purpose epoxy resin (B ′) in total of 10
It is usually used in an amount of 0.1 to 20 parts by weight, preferably 0.5 to 15 parts by weight, particularly preferably 1 to 10 parts by weight, relative to 0 parts by weight.

The tacky adhesive layer of the tacky adhesive tape of the present invention comprises the above-mentioned (A) adhesive component, (B) dicyclopentadiene skeleton-containing epoxy resin, and (C) heat-activatable latent epoxy resin curing agent. Is formed as an essential component. The tacky-adhesive layer comprising the above components has tackiness and heat-curability, and is used as a pressure-sensitive adhesive that can be attached to an adherend at room temperature or at relatively low temperature and low pressure before curing. be able to. This thermocompression bonding is usually carried out under heating at 80 to 150 ° C., but the adhesive layer of the present invention has a low elastic modulus in such a temperature range and follows unevenness of the adherend surface well. Therefore, it is possible to reliably bond the uneven surface without entraining air.

Next, after heat curing, a cured product having high impact resistance can be finally given, and further, the balance between shear strength and peel strength is excellent, and sufficient adhesive property even under severe heat and humidity conditions. Can hold. Further, since the cured product of the adhesive / bonding agent layer has a low water absorption rate, when used in the manufacture of a semiconductor device, package cracks in the reflow step can be reduced.

The adhesive / adhesive layer is further coated with gold, silver, copper, nickel, aluminum, stainless steel, carbon, or ceramic, or nickel, aluminum, etc., with silver for the purpose of imparting conductivity after adhesion. Conductive fillers such as those described above may be added, and for the purpose of imparting thermal conductivity, metal materials such as gold, silver, copper, nickel, aluminum, stainless steel, silicon, and germanium, and their alloys, etc. A conductive substance may be added.
These additives may be mixed in a ratio of about 10 to 400 parts by weight with respect to 100 parts by weight of the adhesive layer (A + B + C).

The adhesive / adhesive layer contains an organic polyvalent isocyanate compound in order to adjust the initial adhesive force and cohesive force.
It is also possible to add an organic polyvalent imine compound or the like. The organic polyvalent isocyanate compound, aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds and trimers of these polyvalent isocyanate compounds, and these poly Examples thereof include a terminal isocyanate urethane prepolymer obtained by reacting a valent isocyanate compound with a polyol compound. More specific examples of the organic polyvalent isocyanate compound include, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, and 1,4-xylene diisocyanate. Nato, diphenylmethane-4,4 '
-Diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,
4'-diisocyanate, dicyclohexylmethane-
2,4'-diisocyanate, lysine isocyanate and the like can be mentioned.

Specific examples of the organic polyvalent imine compound include N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate. , Tetramethylolmethane-
Tri-β-aziridinyl propionate, N, N'-toluene-
2,4-bis (1-aziridinecarboxamide) triethylenemelamine and the like can be mentioned.

The organic polyvalent isocyanate compound or the organic polyvalent imine compound is usually 0 to 10 parts by weight, preferably 0.1 to 5 parts by weight, and particularly preferably 0.1 to 100 parts by weight of the adhesive component (A). It is preferable to add 5 to 2 parts by weight. Furthermore, an antistatic agent can be added to the above-mentioned adhesive layer. By adding an antistatic agent, static electricity generated during expanding or picking up can be suppressed, so that the reliability of the chip is improved. As the antistatic agent, specifically, anionic, cationic,
A generally known activator such as nonionic or amphoteric is used. The antistatic agent is preferably used in the adhesive layer in an amount of 0 to 50% by weight, particularly 0 to 30% by weight.

Examples of the base material of the pressure-sensitive adhesive tape of the present invention include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film,
Vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film,
Transparent films such as ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, and polyimide film are used. Further, these crosslinked films are also used. Further, a laminated film of these may be used. In addition to the above-mentioned transparent films, colored opaque films, fluororesin films and the like can be used.

When the pressure-sensitive adhesive tape is used as a die-bonding adhesive sheet described later, the pressure-sensitive adhesive layer is transferred from the base material to the adherend. Therefore, the surface tension of the substrate is preferably 40 dyne / cm or less, more preferably 3 dyne / cm or less.
It is preferably 7 dyne / cm or less, particularly preferably 35 dyne / cm or less. As a result, in the pressure-sensitive adhesive tape of the present invention, the pressure-sensitive adhesive layer is easily transferred to the silicon chip during die bonding. Such a base material having a low surface tension can be obtained by appropriately selecting the material, or can be obtained by applying a silicone resin or the like to the surface of the base material and subjecting it to a mold release treatment. .

The thickness of such a substrate is usually 10 to 3
The thickness is 00 μm, preferably 20 to 200 μm, and particularly preferably 50 to 150 μm. The tacky-adhesive tape according to the present invention is obtained by coating a tacky-adhesive composition comprising the above components on a base material according to a generally known method such as a roll knife coater, a gravure coater, a die coater, a reverse coater, and drying. It can be obtained by forming an adhesive layer. In addition, the above-mentioned adhesive composition can be dissolved or dispersed in a solvent and applied when necessary.

The thickness of the adhesive layer thus formed is usually 3 to 100 μm, preferably 10 to 60 μm.
It is desirable that it is m. The adhesive tape obtained as described above is used, for example, as the following adhesive sheet for die bonding. After sticking the pressure-sensitive adhesive tape of the present invention on one surface of a silicon wafer, it is fixed on a dicing device via the pressure-sensitive adhesive tape, and a cutting means such as a dicing saw is used to bond the silicon wafer The adhesive tape is cut to obtain an IC chip.

Next, when the IC chip is peeled off, the adhesive force between the adhesive layer and the chip is larger than the adhesive force between the base material and the adhesive layer, so the adhesive layer is fixed to one side of the IC chip. It can be left and peeled from the substrate. In this way, the IC chip to which the adhesive layer is fixed is placed on the lead frame, and then the epoxy resin in the adhesive layer is cured by heating, and thermocompression bonding between the IC chip and the lead frame is performed. To do. The heating temperature in this case is usually 80
To about 300 ° C, preferably about 80 to 250 ° C, more preferably about 80 to 150 ° C, and the heating time is
Usually, it is 1 to 120 minutes, preferably 5 to 60 minutes. By such heating, the thermosetting adhesive component is hardened, and the IC chip and the lead frame can be firmly bonded. In addition, the tacky adhesive layer composed of the above-mentioned special components has a small elastic modulus at the time of thermocompression bonding and follows the irregularities of the adherend surface well, so that the adherend and the chip have sufficient strength. Can be glued. That is, the elastic modulus (150 ° C.) of the adhesive layer before heat curing is preferably 1.0 × 10 ^{1 to} 3.0 × 10 ³ P
a, more preferably 3.0 × 10 ^{1 to} 1.0 × 10 ³ Pa, and particularly preferably 5.0 × 10 ^{1 to} 8.0 × 10 ² Pa.

The final cured product obtained by curing the epoxy resin has a very low water absorption rate, and even if it is exposed to a high temperature during reflow, moisture does not evaporate, so that the occurrence of package cracks can be reduced. That is, the water absorption (85 ° C., 85% RH, 168 hours) of the finally cured adhesive layer is preferably 2.0% or less, more preferably 1.9% or less, particularly preferably 1% or less. It is in the range of 0.8% or less.

The adhesive tape of the present invention can be used for adhering semiconductor compounds, glass, ceramics, metals, etc., in addition to the above-mentioned usage.

[0035]

According to the present invention as described above,
Adhesives Cured adhesives with low water absorption can prevent package cracks during reflow, and can reduce elastic modulus during thermocompression bonding, so adhesives with excellent conformability to the adherend surface An adhesive tape with layers is provided.

[0036]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. In addition, in the following Examples and Comparative Examples, "water absorption" and "elastic modulus" were evaluated as follows.

"Water absorption" Laminated pieces of adhesive tape after thermosetting and laminated to a thickness of 1.0 ± 0.2 mm, 50 mm x 50
After cutting it to a size of mm and irradiating it with ultraviolet rays from both sides, 1
The water absorption of the sample heat-cured at 60 ° C for 1 hour at 85 ° C and a relative humidity of 85% was determined from the weight increase after standing for 168 hours.

"Elastic Modulus" Adhesives of Examples and Comparative Examples were prepared without heat-acting latent epoxy resin curing agent (C), and the adhesives were twisted and sheared at 150 ° C. Rheometrics R
It was measured at 1 Hz using DA II. "Peeling strength" Adhesive tape is attached to the surface of a silicon wafer of 350 μm thickness and # 2000 polished, and 10 mm x 10
It was diced to mm. Next, the adhesive-bonded silicon chip obtained by peeling off the adhesive layer from the base material
A copper plate having a thickness of 50 mm and a thickness of 150 μm was pressure-bonded at 150 ° C. for 1 second, and then left in a constant temperature bath at 160 ° C. for 1 hour to heat-cure the adhesive layer to prepare a sample for peel strength measurement.

The silicon chip side of this sample was adhesively fixed, and the adhesive strength (mN / 10 mm) when the copper plate was peeled off by 90 ° peel was measured. The peeling speed is
It was performed at 50 mm / min. In the following examples and comparative examples, (A) adhesive component, (B) epoxy resin and (C)
The following were used as the heat-activatable latent epoxy resin curing agent.

(A) Adhesive component 55 parts by weight of butyl acrylate, 10 parts by weight of methyl methacrylate, 20 parts by weight of glycidyl methacrylate and 2 parts by weight
-Copolymer (B) having a weight average molecular weight of 900,000 and a glass transition temperature of -28 ° C, which is obtained by copolymerizing 15 parts by weight of hydroxyethyl acrylate (B) epoxy resin containing dicyclopentadiene skeleton (B-1): dicyclopentadiene Skeleton-containing epoxy resin (Nippon Kayaku Co., Ltd., trade name: 1000-L, epoxy equivalent: 24
0 to 250, softening point: 66 ° C., n = 0.6 to 0.7) (B-2): epoxy resin containing dicyclopentadiene skeleton (Nippon Kayaku Co., Ltd., trade name: 1000-2L, epoxy) Equivalent: 2
40-250, softening point: 57 ° C, n = 0.3-0.4) (B ') General-purpose epoxy resin (B'-1): Liquid bisphenol A type epoxy resin (epoxy equivalent: 180-200, softening) Points: None, molecular weight: about 4
20) (B'-2): Solid bisphenol A type epoxy resin (epoxy equivalent: 800 to 900, softening point: 93 ° C, molecular weight: about 1700) (B'-3): solid o-cresol novolac type epoxy resin ( Epoxy equivalent: 210 to 230, softening point: 92 ° C., molecular weight: about 1650) (C) Thermally active latent epoxy resin curing agent (epoxy hard)
Agent) (C-1): dicyandiamide (manufactured by Asahi Denka Co., Ltd., trade name: HARDNER 3636AS) (C-2): 2-phenyl-4,5-hydroxymethylimidazole (manufactured by Shikoku Chemicals Co., Ltd., Product Name: Curesol 2PH
Z) (D) Other cross-linking agent: aromatic polyisocyanate (toluylene diisocyanate trimethylolpropane adduct)

[0041]

Example 1 The components were mixed in the proportions shown in Table 1 to obtain a tacky adhesive composition. This adhesive composition is treated with plasticized PV
A laminated film having a thickness of 90 μm formed by laminating a C layer and an ethylene / methacrylic acid copolymer layer is used as a base material, and this ethylene / methacrylic acid copolymer layer side (surface tension 35 dyn / c
m) was transfer-coated so that the pressure-sensitive adhesive layer had a thickness of 20 μm to obtain an adhesive tape.

Using the obtained adhesive tape, "water absorption", "elastic modulus" and "peel strength" were evaluated as described above. The results are shown in Table 1.

[0043]

Examples 2 and 3 and Comparative Example 1 The same operation as in Example 1 was carried out except that the blending ratio of each component was changed as shown in Table 1. The results are shown in Table 1.

[0044]

[Table 1]

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takashi Sugino             1-13-18-401 Saiwaicho, Kawaguchi City, Saitama Prefecture (72) Inventor Hideo Seo             3-33-2-405 Totsuka, Kawaguchi City, Saitama Prefecture F-term (reference) 4J004 AA10 AA13 AB05 CA04 CA05                       CA06 CB03 EA06 FA05                 4J040 DF032 EC061 EC071 EC141                       EC211 GA05 GA11 HC12                       HC24 JA12 JB02 JB07 KA16                       KA32 KA42 LA01 MA10 MA11                       MB09 NA19 NA20 PA23 PA30                 5F047 AA11 BA34 BB03 BB18 BB19

Claims (2)

[Claims] 1. A tacky adhesive comprising a base material, an adhesive component (A) formed on the base material, an epoxy resin (B) containing a dicyclopentadiene skeleton, and a (C) curing agent for a heat-activatable latent epoxy resin. Adhesive tape consisting of layers. 2. The epoxy resin (B) containing a dicyclopentadiene skeleton is: The adhesive tape according to claim 1, which is a resin represented by the formula (n is an integer of 0 to 10).