JPH0853156A - Adhesive film for transferring electronic part, as well as method for transferring and peeling off part using the film - Google Patents

Abstract

PURPOSE:To improve the adhesion at the time of transfer and/or processing of electronic parts and facilitate the peeling-off of the electronic parts after transfer and/or processing. CONSTITUTION:A method for transferring electronic parts and a method for peeling electronic parts are provided, wherein an adhesive 2 is applied to a base material such as a plastic film 3 or paper to form an adhesive film 4 for use in transfer of electronic parts, and the adhesion of the film at a temperature below the melting point of the adhesive 2 is a third of the adhesion at a temperature higher than the melting point.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive film for carrying electronic parts and the like, and a parts carrying method and a parts peeling method using the same, and more particularly to an adhesive force during carrying and / or processing of electronic parts. The present invention relates to a pressure-sensitive adhesive film for transporting electronic components and the like, which is large and has a small adhesive force at the time of peeling after being transported and / or processed, and a component transport method and a component stripping method using the same.

[0002]

2. Description of the Related Art A conventional adhesive film for transporting electronic components has a large adhesive force so that the electronic components are not peeled off during transportation and / or processing, and also has a large adhesive force due to heat applied during processing. Therefore, it is difficult to peel off after transportation and / or processing, or there is a problem that peeling cannot be performed.
On the other hand, if the adhesive force is reduced to facilitate peeling after transportation and / or processing, electronic components or the like may be peeled off from the adhesive film for transportation during transportation and / or processing, and transportation and / or processing cannot be performed. The inconvenience occurs.

[0003]

The adhesive strength is high during the transportation and / or processing of electronic parts, etc., and the electronic parts, etc. are not peeled off from the adhesive film for transportation, and the electronic parts etc. are easy to carry after the transportation and / or processing. It has been desired to develop an adhesive film for transporting electronic parts that can be peeled off. The present invention provides an adhesive film for transporting electronic components and the like, which solves the problems of the conventional techniques described above, and a component transport method and a component peeling method using the same.

[0004]

The present inventors have arrived at the present invention as a result of earnest studies on the adhesive film for transporting electronic parts and the like of the above problems. The present invention comprises a plastic film or paper substrate coated with an adhesive, and the adhesive strength at a temperature below the melting point of the adhesive is 1/3 or less of the adhesive strength above the melting point. Adhesive film for transportation, transportation of electronic components and the like at a temperature exceeding the melting point of the adhesive of the adhesive film for transportation of electronic components, and / or processing, and component transportation for peeling electronic components at a temperature below the melting point of the adhesive The present invention relates to a method and a part peeling method.

In the present invention, if the adhesive force at a temperature below the melting point of the pressure-sensitive adhesive of the adhesive film for transporting electronic parts exceeds 1/3 of the adhesive force at a temperature above the melting point, the adhesive bond during transportation and / or processing. There is a case where the force is weak and the electronic component or the like is peeled off from the adhesive film for transportation, or when the peeling after transportation and / or processing is performed, on the contrary, the adhesive force is strong and the peeling is difficult. SUS- of adhesive film for transporting electronic parts
1 at a temperature at which the adhesive strength to the BA plate exceeds the melting point of the adhesive
If it is from 00 to 800 N / m, transport and / or
Alternatively, it is preferably peeled off during processing, which is preferable. Further, if the adhesive strength of the adhesive film to the SUS-BA plate is 100 N / m or less at a temperature equal to or lower than the melting point of the adhesive, it is preferable because the electronic component and the like can be easily peeled off after transportation and / or processing.

The plastic film used in the present invention is
Examples thereof include polyethylene, polypropylene, polyester, polyvinyl chloride, ethylene-vinyl acetate copolymer, and the paper includes crepe paper, kraft paper, Japanese paper, and the like, and these may be a single layer or a laminate of two or more layers. good.
It may also be a composite of film and paper. There are no particular restrictions on the type and structure of the film and paper. The thickness is preferably 20 to 200 μm. It is preferable that a plastic film such as polyethylene which is not easily attached with a pressure-sensitive adhesive is subjected to either or both physical and chemical treatments for the purpose of enhancing the adhesion with a pressure-sensitive adhesive to be applied later. Examples of the physical treatment include sandblasting and polishing treatment, and examples of the chemical treatment include corona treatment, plasma treatment, primer treatment, coupling agent treatment and the like, but are not limited thereto. Corona treatment is preferable from the viewpoint of the balance between treatment cost and effect.

The adhesive to be applied is a comb-shaped polymer, and it is preferable that the side chain of the polymer has 8 or more carbon atoms. In a comb-shaped polymer, one chain has a large number of branches, and the monomer constituting the polymer has a side chain having 4 or more carbon atoms. Examples thereof include poly α-olefin, polyalkyl acrylate, polyalkyl methacrylate, polyvinyl alkyl ether, polyvinyl alkyl ester, polyalkyl styrene and the like. In this,
Polymers of acrylic acid derivatives or methacrylic acid derivatives are preferred, and 50% by weight of the monomers that compose these polymers.
The above is preferably an alkyl ester having 8 or more carbon atoms, and more preferably 12 or more. This is because when the carbon number of the ester is 8 or more, the ester has side chain crystallinity and the first-order transition point (melting point) is observed.

Examples of these monomers include dodecyl acrylate, tetradecyl acrylate, pentadecyl acrylate, hexadecyl acrylate, octadecyl acrylate, docosane acrylate, dodecyl methacrylate, tetradecyl methacrylate, pentadecyl methacrylate, hexadecyl methacrylate, methacrylic acid. Octadecyl acid,
Examples thereof include docosane methacrylate. The alkyl ester may be linear or branched. If the amount of these long-chain ester monomers is less than 50% by weight of all the monomers, the adhesive strength at the melting point or lower of the polymer will not be sufficiently lowered, which is not preferable.

The type of long-chain ester monomer used is selected according to the desired melting point. The melting point is preferably 0 ° C. or higher, more preferably 10 ° C. or higher. Further, a general-purpose acrylic acid or methacrylic acid derivative may be used to impart desired properties such as introduction of a functional group and control of adhesive strength. Examples of these monomers as acrylic acid derivatives include acrylic acid, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, amide acrylate, glycidyl acrylate, 2-hydroxypropyl acrylate, and acrylate-2- Examples thereof include cyanoethyl, acrylonitrile, methyl acrylate, ethyl acrylate, -n-butyl acrylate, iso-butyl acrylate, and hexyl acrylate. The same applies to the methacrylic acid derivative.

Two or more kinds of homopolymers may be blended or copolymerized within a range that does not impair the object of the present invention. Rather, it is preferable to modify appropriately so as to satisfy the desired properties. The polymer of the derivative of acrylic acid or methacrylic acid used for the pressure-sensitive adhesive is polymerized by a conventional method, and there is no limitation on the polymerization method, solvent, polymerization initiator, etc., but its weight average molecular weight is 300,000 to 1,500,000 in terms of polystyrene. The range is preferable, and more preferably 500,000 to 1,500,000. If the molecular weight is small, the cohesive force of the pressure-sensitive adhesive will be poor, and if it is large, the pressure-sensitive adhesive force with the adherend will be too weak, or it will be difficult to dissolve in a general-purpose solvent, which is not preferable. The adhesive is a cross-linking agent,
It is also possible to add additives such as tacking agents and colorants.

A pressure-sensitive adhesive film for transporting electronic parts and the like is obtained by uniformly applying a pressure-sensitive adhesive to the above-mentioned plastic film or paper and drying it. There are no particular restrictions on the coating, conveying, and drying methods for producing the pressure-sensitive adhesive film. The coating thickness is determined in consideration of the adhesive force with the adherend,
Preferably 1 to 15 μm, more preferably 3 to 10 μm
Range. The electronic component or the like is attached to the adhesive film for transporting the electronic component or the like thus obtained. The sticking temperature is preferably higher than the melting point of the adhesive, and is 10
It is more preferable if it is higher than 0 ° C.

In this way, processing such as punching, cutting, and drying of the coated electronic components etc. is carried out. The temperature of this transportation and / or processing is preferably higher than the melting point of the pressure-sensitive adhesive as in the case of sticking, and more preferably 10 ° C. or more higher than the melting point. Finally, the electronic components and the like are peeled off from the adhesive film for transportation. There is no limitation on the peeling method, but the temperature is important. That is, it is preferably below the melting point of the adhesive, and more preferably below the melting point by 10 ° C. or more. If this temperature is high, peeling is not easy and it is not good.

1 to 6 show examples of use of an adhesive film for carrying electronic parts and the like. That is, FIGS. 1 and 2 are a sectional view and a perspective view showing a state in which a plate-shaped electronic component 1 is attached to an adhesive film 4 for transporting electronic components such as a plastic film 3 coated with an adhesive agent 2, FIG. 4 is an adhesive film 8 for transporting electronic components such as paper 7 coated with adhesive 6.
2 is a cross-sectional view and a perspective view showing a state in which a cylindrical electronic component 5 is attached, and FIGS. 5 and 6 show an adhesive film 1 for transporting electronic components such as a plastic film 11 coated with an adhesive 10.
Attach the thick film 13 to 2 and the thick film 1
3 is a cross-sectional view and a perspective view showing a state in which a rectangular electronic component 9 is attached to an adhesive film 12 for transporting electronic components or the like through holes provided intermittently in the longitudinal direction of FIG.

[0014]

EXAMPLES Next, examples of the present invention will be described, but the present invention is not limited to these examples.

Synthesis Examples 1 to 5 Hexadecyl acrylate (hereinafter abbreviated as C ₁₆ A), ethyl acrylate (hereinafter abbreviated as EA), acrylic acid (hereinafter abbreviated as AA), and azobisiso as a polymerization initiator. Butyronitrile (hereinafter abbreviated as AIBN) in a nitrogen stream using ethyl acetate (hereinafter abbreviated as Et) 7 as a solvent
Polymerization was performed at 0 ° C. for 4 hours to obtain an acrylic elastomer solution.
For the purpose of removing residual monomers and low molecular weight substances, the acrylic elastomer solution was stirred with approximately 10 times the volume of ethyl alcohol of this acrylic elastomer solution, and the precipitate was isolated. 80 the isolated acrylic elastomer in a vacuum dryer
It was dried at ℃ for 12 hours to obtain a dry elastomer. This dry elastomer was diluted with toluene so that the solid content concentration was 20% by weight to obtain an acrylic pressure-sensitive adhesive.

Synthesis Examples 6 to 10 Octadecyl acrylate (hereinafter referred to as C ₁₈ A instead of C ₁₆ A)
Acrylic adhesives were obtained in the same manner as in Synthesis Examples 1 to 5 except that Table 1 shows the charged amount of each material in Synthesis Examples 1 to 10 and the average molecular weight and melting point of the obtained acrylic elastomer. In Table 1, the molecular weight is the polystyrene-equivalent weight average molecular weight by GPC, and the melting point is the endothermic peak value by DSC (heating rate 10 ° C).
/ Min).

[0017]

[Table 1]

Examples 1 to 6 The acrylic pressure-sensitive adhesives obtained in Synthesis Examples 1 to 4, 7, and 8 were uniformly applied to a corona-treated polypropylene film having a thickness of 80 μm using a coating machine, and then dried. Remove the solvent,
An adhesive film for transporting electronic parts and the like was obtained. The coating thickness of the acrylic adhesive was 6 μm. Comparative Examples 1 to 4 Adhesive films for carrying electronic parts and the like were obtained in the same manner as in Examples 1 to 6 using the acrylic adhesives synthesized in Synthesis Examples 5, 6, 9, and 10.

[0019]

[Table 2]

The adhesive films for transporting electronic parts etc. obtained in the above Examples and Comparative Examples were applied at a temperature of 10 ° C. or more higher than the melting point of the adhesive at a sticking speed of 2 m / min and a sticking pressure of 5 kN.
/ M was rolled on a SUS-BA plate instead of an electronic component. After that, the pressure-sensitive adhesive film for transporting electronic components and the like was cooled to a temperature not higher than the melting point of the pressure-sensitive adhesive, the pressure-sensitive adhesive film for transporting electronic components and the like was peeled off, and the adhesive strength at a temperature not higher than the melting point of the pressure-sensitive adhesive was measured. On the other hand, another sample was used to measure the adhesive force at a temperature higher than the melting point of the pressure-sensitive adhesive. With respect to the sticking temperature of the adhesive film for transporting electronic parts, etc., to the SUS-BA plate, the adhesive force with the SUS-BA plate at a temperature higher than the melting point of the adhesive, and the SUS-BA plate at the melting point of the adhesive or less. The adhesive strength is shown in Table 2.

As is clear from Table 2, Comparative Examples 1, 3,
No. 4 had an adhesive force at a temperature below the melting point of the adhesive agent of more than 1/3 of the adhesive force at a temperature above the melting point, whereas all of the examples had an adhesive force of 1/3 or less (Comparative Example 2). Is 1 / 4.5, but the adhesive strength at temperatures above the melting point is small).

[0022]

EFFECTS OF THE INVENTION According to the present invention, the adhesive strength of the pressure-sensitive adhesive of the adhesive film for transporting electronic parts or the like at a temperature below the melting point is 1/3 or less of the adhesive strength at a temperature above the melting point, so that the transport and / or When the temperature during processing exceeds the melting point of the adhesive, the adhesive strength is great, so that electronic parts can be firmly fixed, while the temperature after the transportation and / or processing is below the melting point of the adhesive. , The adhesive strength is reduced,
It becomes possible to easily peel off electronic parts and the like from the adhesive film for transportation.

[Brief description of drawings]

FIG. 1 is a cross-sectional view in which an electronic component is attached to an adhesive film for carrying an electronic component or the like.

FIG. 2 is a perspective view of FIG.

FIG. 3 is a cross-sectional view in which an electronic component is attached to a paper-made adhesive film for transporting an electronic component or the like.

FIG. 4 is a perspective view of FIG.

FIG. 5 is a cross-sectional view in which an electronic component is attached to an adhesive film for transportation such as an electronic component with a thick film.

FIG. 6 is a perspective view of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Adhesive, 3 ... Plastic film, 4 ... Adhesive film for transporting electronic components, 5 ... Electronic component, 6 ... Adhesive, 7 ... Paper, 8 ... Adhesive film for transporting electronic components, 9 ... electronic parts, 10 ... adhesive, 11 ... plastic film, 12 ... adhesive film for transporting electronic parts,
13 ... Thick film

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical display location C09J 7/02 JJY JKF JLE 7/04 JHV H05K 13/02 B (72) Inventor Matsuo Kato Tokyo 2-1-1, Nishishinjuku, Shinjuku-ku, Hitachi Chemical Co., Ltd.

Claims (8)

[Claims] 1. An electronic component comprising a plastic film or paper base material coated with an adhesive, and the adhesive strength at a temperature below the melting point of the adhesive is 1/3 or less of the adhesive strength at a temperature above the melting point. Adhesive film for transporting etc. 2. The adhesive film for transporting electronic parts and the like according to claim 1, wherein the adhesive force to the SUS-BA plate is 100 to 800 N / m at a temperature exceeding the melting point of the adhesive. 3. The adhesive film for transporting electronic parts or the like according to claim 1, wherein the adhesive force to the SUS-BA plate is 100 N / m or less at a temperature equal to or lower than the melting point of the adhesive. 4. The melting point of the pressure-sensitive adhesive is 0 ° C. or higher.
Adhesive film for transporting electronic parts as described above. 5. The pressure-sensitive adhesive film for transporting electronic parts, etc. according to claim 2, 3 or 4, wherein the pressure-sensitive adhesive is a comb-shaped polymer, and the side chain of the polymer has 8 or more carbon atoms. 6. The pressure-sensitive adhesive film for transporting electronic parts, etc. according to claim 5, wherein 50% by weight or more of the monomer constituting the pressure-sensitive adhesive is composed of an acrylic acid ester and / or a methacrylic acid ester having 12 or more carbon atoms. 7. The electronic component or the like is transported and / or processed at a temperature exceeding the melting point of the adhesive of the adhesive film for transporting electronic components or the like according to claim 1, and the electronic component is at a temperature equal to or lower than the melting point of the adhesive. A component conveying method and a component peeling method, which are characterized by peeling the like. 8. The electronic component or the like is conveyed and / or processed at a temperature higher than the melting point of the adhesive by 10 ° C. or more, and the electronic component or the like is peeled off at a temperature lower than the melting point of the adhesive by 10 ° C. or more. A method for conveying a part and a method for separating a part as described.