JPH0845976A - Electronic element package and its production - Google Patents

Abstract

PURPOSE:To restrain an electronic element from inclining in a package or being exposed to the outside of the package by interposing a spacer between a lead wire and the outer edge of a protective member extending in parallel with the surface of the electronic element. CONSTITUTION:An electronic element 7 bonded with a film carrier is set in a molding die formed between upper and lower dies 8, 9 and a molding material 11 is injected through a gate 10 made in the lower die 9 before being heated. In this regard, it is urged against a surface extending in parallel with the surface of an inner lead 2 and the surface of the electronic element 7 set in the upper die 8. The gate 10 is provided on the side of the lower die 9 so that the electronic element 7 and the inner lead 2 is slightly subjected to the flow of the molding material 1 on the side of the spacer 5. This structure restrains the electronic element from inclining in the package.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device package in which an electronic device is protected by a protective member and a method for manufacturing the same.

[0002]

2. Description of the Related Art Electronic devices such as ICs are generally used as an independent electronic device package by being sealed with a protective member unless they are directly mounted on an electronic circuit board. This electronic element package is used by, for example, soldering its lead wire to an electronic circuit board or inserting it into a socket soldered to the electronic circuit board. TAB (Tape Automated Bonding) technology is one of the technologies for manufacturing such electronic element packages.

In the TAB technique, electronic device packages are manufactured, for example, by carrying out the following steps.
That is, (1) thickness reaching from a position corresponding to an electrode provided on an outer edge portion of an electronic element to a position corresponding to a connection portion of an external circuit to be connected (a pattern or socket such as an electric circuit board connecting the electronic element). A conductive pattern having a size of several tens of μm is formed on a substrate tape made of polyimide or the like to prepare a film carrier. (2) A part of the film carrier corresponding to the electrode of the electronic element, its vicinity and the conductive A portion of the substrate tape that was in close contact with the pattern is removed by a method such as etching (the hole thus formed is called a "device hole"), and the conductive pattern is moved from the outside to the inside of the device hole. Lead wire (the side of this lead wire that protrudes into the device hole is the "inner lead", the external circuit The side connected to is called an "outer lead"), (3) the inner lead is plated with gold or tin, and (4) the electrode of the electronic element is provided with a conductive bump made of gold or the like. , (5) Position the electronic element so that the electrode corresponding to the tip of the inner lead is positioned, (6) Use a metal pillar jig called a bonding tool to attach the tip of the inner lead to the semiconductor through the conductive bump. Pressure is applied to the electrodes while heating, and these are mechanically and electrically bonded to each other. (7) The electronic elements are packaged by encapsulating them with resin or the like so as to wrap them.
(8) The inner lead or the outer lead extending to the outside of the package is shaped so as to be easily connected (inserted) to an external circuit (socket).

The TAB technique has the feature that each electrode of the electronic element and the inner lead can be connected at the same time, so that the productivity can be improved as compared with a method such as wire bonding. In particular, it is advantageous that the electronic device has a large number of electrodes. Therefore, the recent trend of increasing the number of electrodes of electronic devices is further enhancing the superiority of TAB technology.

Another advantage of the TAB technology is that it is easy to reduce the thickness of the electronic device package. TAB is becoming thinner for portable electronic devices such as calculators.
It is considered unthinkable without technology.

Further, there is a transfer bump TAB technique as an improved technique of the TAB technique. In this transfer bump TAB technology, instead of forming the conductive bumps on the electrode side of the electronic element in the above step (4), the conductive bumps separately formed on the inner lead side are first joined and then the inner lead with the conductive bumps is formed. Is bonded to the electrode of the electronic element. The transfer bump TAB technique does not require the formation of conductive bumps directly on the electrodes of the electronic device, and thus can be widely used for ordinary electronic devices that do not have a special design or process for that purpose. In addition, there are various variations in TAB technology.

Further, instead of the above (1) to (6), the lead wire and the electrode of the electronic element are joined by a method such as wire bonding, and the following are the above steps (7) to (7) of the TAB technique.
There is also a technique of manufacturing an electronic element package by sealing the electronic element into a package and shaping the lead wire extending from the package in the same manner as (8).

As a method of sealing the electronic element in the step (7), an electronic element having lead wires such as inner leads joined is placed inside a mold formed by combining upper and lower molds, and this mold is used. It is widely practiced to inject a mold material such as resin into a mold to manufacture a mold package.

As an example of a method of manufacturing such an electronic element package, a method of manufacturing an electronic element package described in Japanese Patent Laid-Open No. 5-343477 is known.

FIG. 5 is a plan view of a film carrier-bonded electronic element manufactured by this method of manufacturing an electronic element package. To the electrodes arranged on the four sides of the electronic element 27,
An inner lead 22 formed by etching or the like is adhered to the substrate film 21 of the film carrier and joined. The inner leads 22 are simultaneously connected by a dam bar 24 integrally formed with the inner leads 22.

FIG. 6 is a cross-sectional view showing a state in which the film carrier-bonded electronic element of FIG. 5 is placed in a mold and packaged. An electronic element 27 in which an inner lead 22 of a film carrier is bonded to an electrode is sandwiched between an upper mold 28 and a lower mold 29 and placed inside a mold formed between them. A mold material 31 is injected from the gate 30 into the inside of the mold to fill the mold so as to enclose the electronic element 27. At this time, the dam bar 24 fills a gap between the upper die 28 and the lower die 29 in the outer peripheral portion of the package, and the molding material 31 is prevented from leaking from this gap. Before injection of the molding material, the electronic element 27 is supported by the inner leads 22 and held in a floating state in the molding die so as not to come into contact with the molding die.

After the molding material 31 is solidified, the upper die 28
The lower die 29 is removed, and the portion of the inner lead 22 (or the outer lead 23) extending from the package is shaped to form an electronic element package.

The inventors of the present invention have reduced the yield when manufacturing a thin electronic element package and the reliability of the manufactured electronic element package in such a conventional method of manufacturing an electronic element package. I found that there are cases. That is, if the electronic element 27 held in the mold by the inner leads 22 happens to be slightly inclined or the flow of the molding material 31 is uneven, the lead wire receives the force of the flow of the molding material 31. In some cases, a part of the electronic element 27 was exposed to the outside of the package or was greatly tilted inside the package. If a part of the lead wire or the electronic element 27 is exposed to the outside of the package, the reliability of the electronic element 27 is greatly impaired. Further, if the inclination of the electronic element 27 exceeds a certain range, defects such as contact between the inner leads 22 or disconnection of the inner leads 22 occur. Since this tendency is stronger as the package is thinner, the yield is reduced as the package is thinner.

Further, in the electronic element package in which the electronic element is greatly inclined inside the package, unreliable stress is exerted on the lead wire and the like and the bondability with the electrode is deteriorated, so that the reliability is low.

[0015]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art. Even in a thin electronic element package, the inclination of the electronic element inside the package and A method of manufacturing an electronic element package with good yield by suppressing the exposure of the electronic element to the outside of the package, and a highly reliable electronic element package in which the electronic element is not exposed outside the package and the electronic element is not tilted inside the package. To provide.

[0016]

An electronic device package of the present invention that achieves the above object is an electronic device, a protective member that contains the electronic device, and an external device that is bonded to the electronic device and is exposed to the outside of the protective member. It is characterized in that it is provided with a lead wire and a spacer provided between an outer edge surface of the protection member parallel to the electronic element surface and the lead wire.

According to another aspect of the electronic element package of the present invention, an electronic element formed by joining one end of a lead wire is placed in a mold, and a mold material is injected into the mold to obtain the mold. And a spacer is provided between the lead wire and a surface of the mold that is parallel to the electronic element surface of the mold, and the mold material is injected into the mold. It is characterized by being done.

A preferred aspect of the electronic element package of the present invention is characterized in that the spacer is provided with a covering member made of the same kind of material as the protecting member on the outer edge surface side of the protecting member.

A preferred aspect of the electronic element package of the present invention is characterized in that the lead wire is joined to the electrode of the electronic element via a conductive bump.

Another aspect of the electronic device package of the present invention is an electronic device, an inner lead whose one end is joined to an electrode of the electronic device, and a part of a substrate film of a film carrier is in close contact, and the electronic device. And a protective member molded so as to expose the other end of the inner lead to the outside, and the substrate film is arranged on an outer edge surface of the protective member which is parallel to the electronic element surface. It is characterized in that it is closely attached to the plurality of inner leads.

In the method of manufacturing an electronic device package of the present invention, an electronic device having one end of a lead wire joined is placed in a mold, a mold material is injected into the mold, and then the mold is used. When manufacturing an electronic device package by removing the mold, a spacer is provided between the lead wire and a surface of the mold that is parallel to the electronic device surface, and the molding material is injected into the mold. Is characterized by. In a preferred aspect of the method for manufacturing an electronic device package of the present invention, the lead wire is joined to the electrode of the electronic device via a conductive bump.

In a preferred aspect of the method for manufacturing an electronic device package of the present invention, a molding material is placed in the mold while urging the spacer toward a surface of the mold that is parallel to the electronic device surface. It is characterized by injecting.

Further, in a preferred aspect of the method for manufacturing an electronic device package of the present invention, the molding material is injected in a direction in which the spacer is biased with respect to a surface of the molding die parallel to the electronic device. Is characterized by.

In a preferred aspect of the method for manufacturing an electronic device package of the present invention, the spacer is biased against a surface of the mold that is parallel to the electronic device surface by the elastic force of the lead wire. It is characterized by injecting a molding material into the mold.

A preferred embodiment of the method for manufacturing an electronic element package of the present invention is characterized in that the spacer used is one in which the mold side is covered with the same kind of material as the molding material.

A preferred embodiment of the method of manufacturing an electronic element package of the present invention is characterized in that the spacers used are in close contact with a plurality of lead wires. Another aspect of the method for manufacturing an electronic device package of the present invention is to bond an electronic device to an inner lead of a film carrier, place the electronic device in a mold, and inject a molding material into the mold, Then, when the mold is removed to manufacture an electronic device package, a part of the inner lead that is placed in the mold is in close contact with a part of the substrate film of the film carrier. It is characterized by that.

Further, in another aspect of the method for manufacturing an electronic element package of the present invention, the close contact portion of the substrate film with the inner lead is such that the mold side is covered with the same material as the molding material. It is characterized by that.

[0028]

The present invention will be described below with reference to the drawings.

In the present invention, various semiconductor ICs and LSIs, and dielectric optical circuit elements are preferably used as the electronic element.

In the present invention, the protective member includes the electronic element so that moisture, harmful rays or heat do not reach the electronic element (enclose the electronic element so as not to be exposed to the outside). Any member can be used as long as it is a member that protects and protects it. For example, a material obtained by solidifying a paste-like inorganic or organic material by physical stimulus such as heating or irradiation of radiation or lapse of time is preferably used. For example, it is formed by injecting a mixture of various thermosetting resins such as epoxy and the like and a curing material or a filler such as silica into a mold in which an electronic element is placed and heating. In addition, a method in which the powder of the above mixture is formed into a tablet shape in advance, and the powder is supplied to the entrance (gate) of the mold and melted by heating and pressurizing to form a paste is supplied into the mold ( Transfer mold method)
Is also preferably performed.

In the present invention, the lead wire may be any member as long as it is a member joined to an electronic element and exposed to the outside of the package. For example, it is preferable to use a conductive foil called an inner lead or an outer lead of the TAB technique, a bonding wire of the wire bonding technique, or a conductive lead wire to be joined thereto. Inner leads and outer leads of the film carrier in the TAB technique are preferable because they have appropriate rigidity. The lead wire may or may not be conductive. Further, the lead wire may transmit a signal or electric power to the electronic element, but it does not necessarily have to have such a function. It only needs to be exposed to the outside of the package and does not need to extend. Further, in the present invention, “parallel to” a certain plane means extending one-dimensionally or two-dimensionally in a direction substantially parallel to the plane. For example, the outer edge surface parallel to the electronic element surface of the protection member (the surface having the largest area of the surfaces forming the electronic element or the surface facing the same) is the outer edge surface of the protection member and is the electronic element surface. Refers to the surface in a direction substantially parallel to. Similarly, the surface parallel to the electronic element surface of the mold type refers to an inner surface of the mold type and a surface oriented substantially parallel to the electronic element surface.

In the present invention, the spacer keeps the lead wire from the outer edge of the protective member at a certain distance or more so that the lead wire does not touch (or is exposed to the outside) the outer edge of the protective member when the electronic device is packaged. Used to separate by a distance. For example, when placing an electronic element to which a lead wire is bonded in a mold and injecting a molding material into the mold, the spacer is located between the mold and the lead wire, and the distance between the lead wire and the mold is maintained. It has a function of keeping the thickness equal to or larger than the spacer thickness. Since the lead wire is bonded to the electronic element, this can also keep the distance between the electronic element and the mold to be a certain distance or more, and prevent the electronic element from being exposed to the outside of the package or being greatly inclined inside the package. You can In addition, the spacer is used as an electronic element 2
By placing it between the lead wire joined to the above side and the mold, the inclination of the electronic element inside the package can be effectively suppressed. As a result, the lead wire is prevented from being unduly stressed and the lead wire is prevented from being broken. Further, when placing a spacer between the lead wire joined to the electrodes along a plurality of sides and the mold, it is preferable to provide the spacer on all the sides where the lead wire is provided, because the spacer strength is improved. In order to secure the space, it is preferable that adjacent spacers are combined as shown in FIG. 1, for example. In FIG. 1, all the spacers in the directions along the four sides are combined and are substantially integrated. On the other hand, the spacer is provided between the lead wire joined to the plurality of electrodes provided on one side and the mold,
It is not limited to one continuously provided as one piece corresponding to the side. That is, as shown in FIG. 8, the spacers arranged on one side may be composed of a plurality of pieces instead of one continuous piece.

The spacer itself may or may not be exposed to the outside of the package. However, depending on the combination of the material of the spacer and the material of the protective member of the package, a gap may be formed between the spacer and the package due to the aging of the package, and moisture or the like may enter the package through the gap. In such a case, it is preferable to coat the surface of the spacer with a material having a good affinity with the protective member.

Further, by providing the spacer, it is possible to increase the degree of freedom in setting the position for injecting the molding material into the mold. This is because the force of the flow of the molding material is applied to the electronic element or the lead wire in the direction in which the electronic element or the lead wire is biased toward the side where the spacer is present, so that the electronic element is not exposed to the outside of the package. Rather, it is preferable to apply the force in such a direction to stabilize the position of the electronic element in the mold.

Further, it is preferable that the spacer is in close contact with the lead wire so that the spacer does not move when the molding material is injected into the mold. It is also preferable that the spacer is in close contact with a plurality of lead wires to connect the lead wires to each other. This can supplement the rigidity of the lead wires and reduce the possibility that the lead wires will come into contact with each other when the molding material is injected into the mold. On the other hand, when the viscosity of the molding material is relatively high, as shown in FIG. 7, spacers are provided in the direction along only two opposite sides of the electronic element, or spacers arranged on one side as shown in FIG. By using not one continuous piece but a plurality of pieces, the mold can be filled while keeping the flow of the molding material good, which is preferably adopted.

The spacer may be on the side of the electronic element or on the opposite side of the lead wire. When injecting the molding material into the mold, strong force of the flow of the molding material may not be applied in the direction in which the electronic element and the lead wire have no spacer. In addition, spacers may be provided both on the electronic element side of the lead wire and on the opposite side. In this case, it is preferable that the electronic element is not tilted or exposed to the outside of the package regardless of the direction of the flow force of the molding material.

Further, when the force of the flow of the molding material is applied in the direction of the side without the spacer on the electronic element or the lead wire due to the shape of the package or the shape of the mold,
For example, it is preferable to inject the molding material into the mold while biasing the spacer against the surface of the mold parallel to the surface of the electronic element by the elastic force of the lead wire. Further, even when the force of the flow of the molding material is not applied to the side without the spacer with respect to the electronic element or the lead wire, it is preferable to use the elastic force of the lead wire or the like to apply the bias. Further, it is more preferable to inject the molding material so that the force of the flow of the molding material is applied in the direction in which the spacer is biased with respect to the surface parallel to the surface of the mold type electronic element.

By biasing in this way, the positions of the electronic element and the lead wire during the injection of the molding material are stabilized, and it is possible to prevent the electronic element and the lead wire from being exposed to the outside of the package and the electronic element from being tilted. .

Further, it is preferable that a covering member is provided on the outer peripheral surface side of the protective member of the spacer. The covering member is preferably made of the same material as the molding material (having a chemical affinity with the molding material). This allows
Since the spacer is less likely to be exposed at the outer edge of the package and a gap is less likely to occur between the spacer and the molding material, it is possible to reduce the possibility that moisture will be transmitted to the lead wire. The thickness of the covering member is preferably about 20 to 200 μm.

Further, in the TAB technique, a part of the substrate film of the film carrier can be left on the inner lead and used as a spacer. For this purpose, for example, as shown in FIG. 1, the substrate film of the film carrier 1 may be etched so that the spacers 5 remain on the inner leads 2 of the film carrier 1. In the manufacturing process of the film carrier, the conductive patterns such as the inner leads 2 are formed by, for example, electrolytic plating.
Generally, it is easy to increase the adhesion between the inner lead 2 and the spacer 5. Further, it is easy to form a spacer that is in close contact with the plurality of inner leads. Due to such characteristics, the electronic device package manufactured by the TAB technique is preferable as an application target of the present invention.

In the present invention, as a mold die, an upper die and a lower die as shown in FIG. 3 are combined,
A mold having a package shape in the gap is preferably used. Further, as the material of the mold, metal or ceramic is used. The position of injecting the molding material is preferably determined so that the force of the flow of the molding material does not urge the electronic element or the lead wire to the side without the spacer. For example, when the spacer 5 is provided between the upper mold 8 and the electronic element 7 as shown in FIG. 3, it is preferable that the injection position of the molding material (gate 10) is provided on the lower mold 9 side as shown in FIG. . It is preferable to inject the molding material from such a position because a force in the direction in which the spacer is urged by the surface of the mold is often applied. Further, the injection position of the molding material may be provided on both the upper mold 8 side and the lower mold 9 side, and the injection amount on the lower mold 9 side may be made larger than the injection amount on the upper mold 8. In this case, the force of the flow of the molding material is not applied in the direction in which the electronic element 7 or the like is urged toward the side without the spacer, and the upper die 8 of the electronic element 7 is
Since enough mold material can be supplied to the side,
preferable.

When the spacer is urged toward the mold by the force of the flow of the molding material, a gate is provided on the surface of the lower mold 9 parallel to the electronic element 7 in FIG. May be.

Further, when the spacer is biased toward the mold by the force of the flow of the molding material, the spacer can be molded in a state in which the spacer is substantially in close contact with the mold. In this case, the outer edge surface of the electronic element package and the electronic element surface are substantially parallel to each other, and the inclination of the electronic element in the package can be minimized, which is preferable. Also,
In such a case, if the thickness of the spacer is set to about half of the thickness of the electronic element package minus the thickness of the lead wire, the electronic element can be reliably arranged in the approximate center of the package, preferable.

[0044]

【Example】

Example 1 An electronic device package of the present invention was manufactured through the steps shown in FIGS.

First, a film carrier-bonded electronic element as shown in FIG. 1 was manufactured. The film carrier 1
(1) Conductive patterns such as inner leads 2, outer leads 3 and dam bars 4 are formed on a polyimide substrate film by electrolytic plating, and (2) the substrate film is subsequently etched to leave spacers 5 and leave device holes 6 Is formed by forming. The inner leads 2 of the film carrier 1 were joined to the electrodes arranged on the four sides of the electronic element 7 by the inner lead bonder usually used in the TAB technique.

Next, as shown in FIG. 2, the electronic element 7 having the film carrier bonded thereto is placed inside the mold formed between the upper mold 8 and the lower mold 9, and the molding material 1
1 was injected from the gate 10 provided in the lower mold 9 and heated. At this time, the distance between the surface of the inner lead 2 and the surface of the upper die 8 parallel to the surface of the electronic element 7 was set shorter than the thickness of the spacer 5. As a result, the spacer 5 was biased by the elastic force of the inner lead 2 against the surface parallel to the surface.
In addition, the gate 10 is provided on the side of the lower mold 9, and the molding material 1
The flow force of 1 is slightly applied to the spacer 5 side with respect to the electronic element 7 and the inner lead 2. The molding material used was an epoxy resin mixed with a filler and a curing material.

After heating, as shown in FIG. 3, the upper die 8 and the lower die 9 are formed.
Was removed, and the manufacturing of the electronic device package 13 was completed.

The electronic element package 13 has a thickness of 0.
Although the thickness was very thin as 5 mm, there were almost no defects such as the electronic element 7 being exposed to the outside of the package or being greatly inclined inside the package.

Example 2 An electronic device package similar to that of Example 1 was manufactured except that a covering member was provided on the surface of the spacer. FIG. 4 is a cross-sectional view showing a step corresponding to FIG. The covering member 12 was provided on the surface of the spacer 5 with the same material as the molding material 11. The thickness of the covering member 12 was 40 μm. The covering member 12 is the spacer 5 of the film carrier 1 before being bonded to the electronic element 7.
It was formed by applying it to only the part that is in close contact with the drawing-type resin applying device.

In the completed electronic device package, the spacer was not exposed to the outside of the package, and there was almost no possibility of water entering between the protective member and the spacer.

Example 3 An electronic element package similar to that of Example 1 was manufactured, except that only spacers extending in the direction along two opposite sides of the electronic element were provided and a resin having high viscosity was used. FIG. 7 is a plan view showing a process corresponding to FIG. The spacers 5 are arranged so as to be parallel to the resin flow direction at the time of resin injection. As a result, even when a resin having a high viscosity was used, the resin could be filled in the mold while maintaining good flow, and an electronic element package could be manufactured.

Example 4 An electronic device package similar to that of Example 1 was manufactured except that a plurality of independent spacers were provided along the four sides of the electronic device. FIG. 8 is a plan view showing a process corresponding to FIG. As shown in FIG. 8, the spacers 5 are a plurality of independent pieces and are provided in a discontinuous arrangement. As a result, the degree of freedom of resin flow on the upper surface of the electronic device is increased, and even when a resin having a high viscosity is used, the resin can be filled in the mold while maintaining good flow, and an electronic device package can be manufactured.

[0053]

According to the electronic device package of the present invention,
The inclination of the electronic element inside the package can be reduced. As a result, even in a thin package, the lead wire is not unduly stressed, so that the package has high reliability.

Further, according to the method for manufacturing an electronic element package of the present invention, the inclination of the electronic element is not extremely increased in the mold, and the electronic element is exposed to the outside of the package or is packaged. In addition, it is possible to improve yields by preventing defects such as contact between lead wires and disconnection of lead wires from occurring.

Further, according to the method of manufacturing an electronic element package of the present invention, the position of the electronic element in the mold is stable and a defect is unlikely to occur, so that the electronic element package can be manufactured with high yield.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a film carrier-bonded electronic device used in a method for manufacturing an electronic device package of the present invention.

FIG. 2 is a diagram showing a step in one embodiment of the method for manufacturing an electronic device package of the present invention.

FIG. 3 is a diagram showing a step of another embodiment of the method for manufacturing an electronic device package of the present invention.

FIG. 4 is a diagram showing an embodiment of an electronic device package of the present invention.

FIG. 5 is a plan view showing an example of a film carrier-bonded electronic device used in a conventional method for manufacturing an electronic device package.

FIG. 6 is a diagram showing an example of a conventional electronic device package.

FIG. 7 is a plan view showing another embodiment of a film carrier-bonded electronic element used in the method for manufacturing an electronic element package of the present invention.

FIG. 8 is a plan view showing another embodiment of a film carrier-bonded electronic element used in the method for manufacturing an electronic element package of the present invention.

[Explanation of symbols]

 1: Film carrier 2: Inner lead 3: Outer lead 4: Dam bar 5: Spacer 6: Device hole 7: Electronic element 8: Upper mold 9: Lower mold 10: Gate 11: Mold material 12: Coating member 13: Electronics Element package 21: Film carrier 22: Inner lead 23: Outer lead 24: Dam bar 26: Device hole 27: Electronic element 28: Upper mold 29: Lower mold 30: Gate 31: Mold material

─────────────────────────────────────────────────── ───Continued from the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01L 23/50 Y G

Claims (14)

[Claims] 1. An electronic element, a protective member that encloses the electronic element, a lead wire that is bonded to the electronic element and is exposed to the outside of the protective member, and an outer edge of the protective member that is parallel to the electronic element surface. And a spacer provided between the surface and the lead wire. 2. An electronic element package, wherein an electronic element having one end of a lead wire joined is placed in a mold, a molding material is injected into the mold, and the mold is removed, An electronic element package, wherein a spacer is provided between a surface of the mold that is parallel to the electronic element surface and the lead wire, and the molding material is injected into the mold. 3. The electronic element package according to claim 1, wherein the spacer is provided with a covering member made of the same material as that of the protective member on the outer peripheral surface side of the protective member. 4. The electronic element package according to claim 1, wherein the lead wire is bonded to an electrode of the electronic element via a conductive bump. 5. An electronic element, an inner lead whose one end is joined to an electrode of the electronic element and a part of a substrate film of a film carrier is in close contact with the electronic element, and the electronic element is enclosed and the other end of the inner lead is externally connected. Having a protective member molded so as to be exposed to, and the substrate film is aligned with an outer edge surface of the protective member that is aligned with the electronic element surface and is in close contact with the plurality of inner leads. An electronic device package characterized by the following. 6. An electronic element package in which an electronic element having one end of a lead wire bonded is placed in a mold, a molding material is injected into the mold, and then the mold is removed to manufacture an electronic element package. At this time, a method of manufacturing an electronic element package, characterized in that a spacer is provided between a surface of the mold that is parallel to the electronic element surface and the lead wire, and the molding material is injected into the mold. 7. The method of manufacturing an electronic element package according to claim 6, wherein the lead wire is bonded to an electrode of the electronic element via a conductive bump. 8. The molding material is injected into the mold while urging the spacer toward a surface of the mold that is parallel to the electronic element surface. A method of manufacturing the electronic device package described. 9. The electronic device package according to claim 8, wherein the molding material is injected in a direction in which the spacer is biased with respect to a surface of the molding die parallel to the electronic device. Production method. 10. The molding material is injected into the mold while biasing the spacer against the surface of the mold that is parallel to the electronic element surface by the elastic force of the lead wire. A method of manufacturing an electronic device package according to claim 8. 11. The manufacturing of an electronic element package according to claim 6, wherein as the spacer, the one on the side of the mold is covered with the same material as the molding material. Method. 12. The spacer, which is in close contact with a plurality of lead wires, is used as the spacer.
12. The method for manufacturing an electronic element package according to any one of 11. 13. An electronic element is formed by bonding an electronic element to an inner lead of a film carrier, placing the electronic element in a mold, injecting a molding material into the mold, and then removing the mold. A method of manufacturing an electronic element package, wherein a part of the inner lead placed in the mold is in close contact with a part of a substrate film of the film carrier when the package is manufactured. 14. The electronic element package according to claim 13, wherein a portion of the substrate film which is in close contact with the inner lead is covered on the mold side by a material similar to the molding material. Production method.