JPH083996Y2 - 自動ハンダ付け機用プリント基板搬送爪 - Google Patents
自動ハンダ付け機用プリント基板搬送爪Info
- Publication number
- JPH083996Y2 JPH083996Y2 JP5816790U JP5816790U JPH083996Y2 JP H083996 Y2 JPH083996 Y2 JP H083996Y2 JP 5816790 U JP5816790 U JP 5816790U JP 5816790 U JP5816790 U JP 5816790U JP H083996 Y2 JPH083996 Y2 JP H083996Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- claw
- soldering
- mounts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 210000000078 claw Anatomy 0.000 title claims description 99
- 238000005476 soldering Methods 0.000 title claims description 68
- 229920003002 synthetic resin Polymers 0.000 claims description 32
- 239000000057 synthetic resin Substances 0.000 claims description 32
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000005299 abrasion Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 26
- 230000004907 flux Effects 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 9
- 229920006351 engineering plastic Polymers 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5816790U JPH083996Y2 (ja) | 1990-06-01 | 1990-06-01 | 自動ハンダ付け機用プリント基板搬送爪 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5816790U JPH083996Y2 (ja) | 1990-06-01 | 1990-06-01 | 自動ハンダ付け機用プリント基板搬送爪 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0416892U JPH0416892U (enrdf_load_stackoverflow) | 1992-02-12 |
| JPH083996Y2 true JPH083996Y2 (ja) | 1996-01-31 |
Family
ID=31583533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5816790U Expired - Fee Related JPH083996Y2 (ja) | 1990-06-01 | 1990-06-01 | 自動ハンダ付け機用プリント基板搬送爪 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083996Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-06-01 JP JP5816790U patent/JPH083996Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416892U (enrdf_load_stackoverflow) | 1992-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |