JPH08334547A - Method and apparatus for testing large-current electronic component - Google Patents

Abstract

PURPOSE: To enhance the durability and the reliability of an apparatus by a method wherein a pin at an electronic component to be tested is pressed by conductive plates from both sides, a large current is supplied (or taken out), a monitoring pin is brought automatically into contact with the pin or a wiring part and a voltage is detected. CONSTITUTION: An air cylinder at a movement mechanism 5 is operated, and a pin 2 which is inserted between conductive plates 3 is pressed under a constant pressure from both sides. The pin 2 is pressed by the plates 3 from both sides so as to be set to a state that it is electrically connected satisfactorily. When the plates 3 are moved, a voltage monitoring pin 4 is set to a state that it is brought into contact with the base of the pin 2. In a state that a large current has been supplied to (or taken out from) the plates 3 from a testing means, the voltage of the pin 4, that of a pin coming into contact with a voltage monitoring pin 12, and that of an interconnection are measured by a multimeter 6, and the quality of an electronic component 1 is judged. After the finish of the measurement, the air cylinder at the mechanism 5 is operated, the plates 3 are opened to both sides so as to be separated from the pin 2, and the component 1 is moved and conveyed by a conveyance mechanism so as to be discharged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a testing method and a testing apparatus for a high-current electronic component which detects a voltage and conducts a test while a current is applied to a pin of the electronic component.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a product in which a pin is provided on a HiC (hybrid IC) and the pin is inserted into an IC socket arranged on a substrate, the HiC is assembled and then tested individually. As shown schematically in FIG. 3, an apparatus for performing this test is provided with an IC socket into which the HiC pin is inserted, and a current is supplied while the HiC pin is inserted into the IC socket, which is used when the HiC pin is inserted into the IC socket. After the voltage was detected and the test was conducted, it was extracted and the test was passed when it was OK.

[0003]

Conventionally, as shown in FIG. 3 described above, a HiC pin is inserted into a socket of a test apparatus to supply a current, and a voltage at that time is detected to judge whether the test is successful or not. After that, since HiC was repeatedly extracted from the socket, especially when the HiC is an IC that supplies a large current such as a power supply IC or a motor driver (for example, a DC-DC converter IC), a predetermined large current is applied to the pin during the test. Therefore, if the HiC pin is repeatedly inserted into and removed from the socket on the test apparatus, the difference in contact potential between the socket and the pin gradually increases, which makes it difficult to perform an accurate test. As a result of conducting many insertion / removal tests, when a current of 6 A was passed between the HiC pin and the socket of the test apparatus, the contact potential difference between the pin and the socket was initially 15 mV, but the difference was 50 times. It was revealed that the situation could increase to about 50 mV by inserting and removing (see Fig. 2). For this reason, there is a problem that an accurate test cannot be performed by measuring the potential on the socket side.

The present invention solves these problems.
The pins of the electronic component under test are pressed against the conductive plates from both sides to supply (take out) a large current, and the voltage monitor pin is automatically contacted with the pin of the electronic component or the wiring part of the electronic component to obtain an accurate test voltage. It is intended to detect (apply) the voltage to perform a test, improve the measurement accuracy during the test, and improve the durability and reliability of the current supply / extraction portion of the test apparatus.

[0005]

[Means for Solving the Problems] Means for solving the problems will be described with reference to FIG. In FIG. 1, the electronic component 1 is provided with a pin 2 for inputting and outputting a current, detecting a voltage, and applying a voltage.

The pin 2 is a terminal for inputting / outputting a current and detecting / applying a voltage. The conductive plate 3 has pins 2
Are pressure-contacted from both sides to make electrical contact. The voltage monitor pin 4 contacts the pin 2 to detect the voltage.

The moving mechanism 5 is for moving the conductive plate 3 with an air cylinder or the like so as to sandwich it from both sides of the pin 2 and press it into contact therewith. The multimeter 6 measures the voltage of the voltage monitor pin 4, measures the current flowing through the conductive plate 3, and the like.

The wiring 11 is a wiring on the electronic component 1.
The voltage monitor pin 12 detects the voltage by contacting the wiring of the electronic component 1.

[0009]

According to the present invention, as shown in FIG. 1, the pin 2 of the electronic component 1 is carried between the conductive plates 3 and is moved by the moving function 5 in the direction in which the conductive plates 3 are sandwiched so as to come into pressure contact with each other to generate a current. Is supplied to (or taken out from) the electronic component 1, and at the same time, the voltage of the voltage monitor pins 4 and 12 that are in automatic contact with the pin 2 of the electronic component 1 or the wiring 11 of the electronic component 1 is detected (or applied) to test the electronic component 1. I am trying.

Further, when the electronic component 1 is conveyed to a predetermined position, the pins 2 of the electronic component 1 are pressed from both sides by the moving mechanism 5 to supply (or take out) an electric current, and the conductive plate 3 is conveyed or conveyed. Electronic component 1 when pressed
Voltage monitor pins 4 and 12 that detect (or apply) a voltage by contacting the pin 2 of the electronic component 1 or the wiring 11 of the electronic component 1.
And detecting (or applying) by the voltage monitor pins 4 and 12 in a state where current is supplied (taken out) to the conductive plate 3.
And a test means for performing a test based on the applied voltage.

At this time, the moving mechanism 5 makes the pressure contact constant by the air cylinder. Also,
In a state where the pin 2 of the electronic component 1 is conveyed between the conductive plates 3, the pin 2 of the electronic component 1 is pressed by the conductive plate 3 and the voltage monitor pins 4 and 12 are pressed by the operation of the moving mechanism 5 including an air cylinder. The pin 2 of the electronic component 1 or the wiring 11 of the electronic component 1 is contacted.

Further, when the pin 2 of the electronic component 1 is conveyed between the conductive plates 3, the voltage monitor pin 12 is arranged on the surface facing in the conveying direction to contact the wiring 11 or the pin 2 of the electronic component 1. I am trying.

Therefore, the pins 2 of the electronic component 1 to be tested are pressed against the conductive plates 3 from both sides to supply (or take out) a large current, and at the same time, the pins 2 of the electronic component 1 or the wiring 11 of the electronic component 1 are connected. By automatically contacting the voltage monitor pins 4 and 12 to the part to detect (or apply) an accurate test voltage, the test measurement accuracy is improved and the durability and reliability of the current supply part of the test equipment are improved. It has become possible to improve the productivity.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the construction and operation of an embodiment of the present invention will be described in detail with reference to FIGS.

FIG. 1 shows a block diagram of an embodiment of the present invention.
In FIG. 1, the electronic component 1 is a HiC (Hybrid I
An electronic component such as C), which is provided with a pin 2 for incorporation into a product. Similar to the IC pins, a plurality of pins 2 are provided to supply current from the outside, take out current, apply voltage, and detect voltage. In the figure, the electronic component 1 is a flat substrate (otherwise, it may be box-shaped like an IC),
The pins 2 are provided at both ends as shown (actually, a plurality of pins are provided like IC pins). The pin 2 is connected to the wiring of the electronic component 1.

A plurality of pins 2 are provided at both ends of the electronic component 1,
It is for inputting / outputting a current and for applying / detecting a voltage. The conductive plate 3 is a conductive plate (for example, a copper plate) for supplying (or extracting) a large current by press-contacting each other from both sides of the pin 2, in this example, the inner side and the outer side. Or multiple pins (when one pin has insufficient current capacity, the number of pins corresponding to the current capacity is connected in parallel, so each pin connected in parallel) is pressed from both sides. ing. The conductive plate 3 is moved by the air cylinder that constitutes the moving mechanism 5 so that the pin 2 of the electronic component 1 is pinched and pressed from both sides when the pin 2 of the electronic component 1 is transported to the position shown in the figure by the transport mechanism. .

The voltage monitor pin 4 detects (or applies) the voltage of the pin 2 at the root of the pin 2.
As a result, a large current is supplied (or taken out) from the conductive plate 3 to the same pin 2, and the voltage monitor pin 4 is brought into contact with the root of the same pin to detect the voltage. An accurate voltage can be detected without being affected by the contact potential difference between the two.

The moving mechanism 5 is such that the conductive plate 3 is pressed against both sides of the pin 2 at a constant pressure by an air cylinder. The multimeter 6 measures voltage and current, and here measures the voltage of the voltage monitor pins 4 and 12 and the current input to or output from the conductive plate 3 not shown. Is.

The wiring 11 is a wiring provided on the electronic component 1, and here is a wiring to which the voltage monitor pin 12 is brought into contact to detect (or apply) a voltage. The voltage monitor pin 12 is a retractable pin that is arranged at a position opposite to the moving direction in which the pin 2 of the electronic component 1 is moved from the upper position to the lower position in the figure, and when the electronic component 1 is moved downward. The voltage is automatically detected by contacting a predetermined wiring.

The panel 13 is for contracting when the wiring 11 of the electronic component 1 comes into contact with the voltage monitor pin 12 and is further pressed so that the wiring 11 and the voltage monitor pin 12 are kept in good contact with each other. .

Next, under the configuration shown in FIG. 1, the electronic component 1 is conveyed, the conductive plate 3 is pressed against the pin 2, and the voltage is detected while a large current is being supplied (or taken out), and a test is conducted. The procedure for doing this will be described in detail.

(1) The electronic component 1 is horizontally transported by a transport mechanism (not shown), and the horizontal transport is temporarily stopped when the pin 2 of the electronic component 1 is detected to reach the upper position in the figure. Then, it moves to the position shown in the figure such that the pins 2 of the electronic component 1 are inserted while the conductive plates 3 are moved downward and opened mutually. In this state, the pin 2 is inserted between the conductive plates 3 that are slightly open to the left and right, and the electronic component 1
The wiring 11 is in contact with the voltage monitor pin 12.

(2) The air cylinder of the moving mechanism 5 is operated so that the pin 2 inserted between the conductive plates 3 is moved from both sides and pressed against each other with a constant pressure. In this state, the pin 2 is pressed by the conductive plate 3 from both sides to be electrically connected well, and the movement of the conductive plate 3 causes the voltage monitor pin 2 to be in contact with the base of the pin 2. .

(3) The test means (not shown) is the conductive plate 3
Voltage monitor pin 4 and voltage monitor pin 1 with a large current (for example, 6 A) being supplied to (or taken out from)
The voltage of the pin and wiring which are in contact with 2 is measured by the multimeter 6 to determine the quality of the electronic component 1.

(4) After the measurement of (3) is completed, the air cylinder of the moving mechanism 5 is operated to drive the conductive plate 3 so as to open it to the left and right to separate it from the pin 2, and a transport mechanism (not shown) is used. After moving the electronic component 1 in the upward direction, the electronic component 1 is conveyed in the horizontal direction and discharged, and (1) to (4) are repeated for the next electronic component 1.

As described above, the electronic component 1 is automatically conveyed, the pin 2 of the electronic component 1 is inserted between the conductive plates 3, and the wiring 11 of the electronic component 1 is automatically brought into contact with the voltage monitor pin 12, and then the conductive component 3 is electrically connected. The pressure plate 3 is pressed against both sides by a moving mechanism 5 such as an air cylinder and the voltage monitor pin 4
Is brought into contact with the base of the pin 2 to supply or take out a large current from the conductive plate 3, and the electronic component 1 is tested based on the voltage detected or input from the voltage monitor pins 4 and 12. After the test, the conductive plate 3 is opened by the moving mechanism 5, the electronic component 1 is automatically conveyed and taken out, and the next electronic component is repeated. With these, a large current is supplied from the conductive plate 3 to the pin 2 or a large current is taken out from the pin 2 by the conductive plate 3, and the voltage is detected by the voltage monitor pin 4 from the root of the pin 2 and the voltage monitor pin 12 from the wiring 11. It becomes possible to perform a test by applying a voltage or by applying a voltage, and an accurate test is performed by detecting a voltage or applying a voltage without being affected by a contact potential difference when a large current is applied to pin 2. In addition, it is possible to reliably hold the contact between the pin 2 and the conductive plate 3 even when a large number of electronic components are tested, and prevent the adverse effect that the contact potential difference increases.

FIG. 2 shows an experimental example of the present invention. this is,
The degree of change in the contact potential difference of the pin 2 is experimentally obtained when the conventional IC socket is used and when the test is performed using the conductive plate 3 shown in FIG. .

Electronic component 1 using a conventional IC socket
When pin 2 of is repeatedly inserted into the IC socket 50 times, the initial value was 5 mV with a potential difference of 15 mV.
At the 0th time, the potential difference became 50 mV, and the error increased to 35 mV.

On the other hand, when the copper plate (conductive plate 3) of the present invention was pressure-welded, the initial value was 3 mV, but the potential difference was only 3.2 mV even at the 50th time, which was only 0.2.
It was found that the test can be performed with extremely high accuracy only by increasing the mV.

[0030]

As described above, according to the present invention,
The pins 2 of the electronic component 1 to be tested are pressed from both sides by the conductive plates 3 to supply (or take out) a large current, and the voltage monitor pin 4 is provided at the pin 2 of the electronic component 1 or the wiring 11 of the electronic component 1. , 12 are automatically contacted and an accurate test voltage is detected (or applied) to perform the test, so that the measurement accuracy of the test in which a large current is supplied (or taken out) to the electronic component 1 is improved. In addition to the above, the durability and reliability of the current supply portion of the test apparatus could be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is an experimental example of the present invention.

FIG. 3 is an explanatory diagram of a conventional technique.

[Explanation of symbols]

 1: Electronic component 2: Pin 3: Conductive plate 4, 12: Voltage monitor pin 5: Moving mechanism 6: Multimeter 11: Wiring of electronic component 13: Spring

Claims (5)

[Claims] 1. A test method in which a voltage is detected while an electric current is applied to a pin of an electronic component to perform a test, the pin of the electronic component is conveyed between conductive plates, and the pin of the electronic component is connected by the conductive plate. The electronic component is moved by pressing it in the direction of sandwiching it to supply (or take out) a current to the electronic component, and at the same time, detect (or apply) a voltage from the voltage monitor pin that automatically contacts the pin of the electronic component or the wiring of the electronic component. Test method for high-current electronic components to perform the test. 2. A test apparatus for detecting a voltage and conducting a test while a current is applied to a pin of an electronic component, wherein the pin of the electronic component is pressed from both sides when the electronic component is conveyed to a predetermined position. A conductive plate that supplies (or takes out) an electric current, and a voltage monitor pin that detects (or applies) a voltage by contacting the pin of the electronic component or the wiring of the electronic component when being conveyed or pressed. Supplied (or removed) current to the plate
A test apparatus for high-current electronic components, comprising: a test means for performing a test based on the voltage detected (or applied) by the voltage monitor pin in this state. 3. The test apparatus for a large current electronic component according to claim 2, wherein the pressure contact is made constant by an air cylinder. 4. A pin of the electronic component is conveyed between the conductive plates, the pin of the electronic component is pressed by the conductive plate by the operation of the air cylinder, and the voltage monitor pin is connected to the pin of the electronic component. Alternatively, the test apparatus for a high-current electronic component according to claim 2 or 3, which is brought into contact with the wiring of the electronic component. 5. When the pin of the electronic component is conveyed between the conductive plates, the voltage monitor pin is arranged on the surface facing in the conveying direction and brought into contact with the wiring or pin of the electronic component. Claims 2 to 4
Test equipment for any of the high-current electronic components described.