JPH08330705A - Method of packaging electronic part - Google Patents

Abstract

PURPOSE: To provide a method of packaging electronic part capable of radiating heat requiring of the least fitting space yet without increasing the part numbers. CONSTITUTION: Within a method of packaging electronic parts applied to the circuit in the composition wherein the first and second electronic parts are simultaneously actuated not to cause simultaneous heat generation, the first and second electronic parts in a pair are arranged with respective walls 5 and 15 of outer structure thereof in contact with each other so that the heat generated in one of these first and second electronic parts may be transmitted from the walls 5, 15 of the outer structure of one part in the high temperature state to the walls 5, 15 of the outer structure of the other part in the low temperature state to be heat radiated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method for electronic parts, and more particularly to a mounting method for removing heat generated from electronic parts used in electronic units for automobiles.

[0002]

2. Description of the Related Art Among electronic components mounted on a circuit board in an electronic unit, some of them, such as output transistors, which operate with a large current, have a remarkable temperature rise during energization. Such a rise in the temperature of the components not only causes a malfunction, but also leads to performance degradation and inconvenience of shortening the life. Therefore, conventionally, electronic components such as FETs mounted on the circuit board in the electronic unit are mounted on the radiator plate with screws, the heat generated from the electronic components is transferred to the radiator plate, and the radiator plate radiates heat. The method of making is used. FIG. 4 illustrates such a conventional mounting method.

As shown in the figure, the electronic component 1 is screwed with the back surface 5 of the electronic component 1 in contact with the contact surface 40A of the heat sink 40, and the heat sink 40 is screwed into the screw hole 31B of the circuit board 31. It is locked. Here, the lead terminal 10 of the electronic component 1 is a lead terminal hole 31 provided in the circuit board 31.
It is inserted through A and is connected to the back surface of the circuit board 31 by soldering or the like.

According to this method, when the electronic component 1 generates heat during operation, this heat is transmitted from the back surface portion 5 of the electronic component 1 to the heat radiating plate 40 and is mainly radiated from the surface of the heat radiating plate 40. As a result, the heat generated in the electronic component 1 is removed, so that an undesired temperature rise of the electronic component 1 can be suppressed.

[0005]

In the conventional mounting method as described above, one heat dissipation plate is prepared for each electronic component. Moreover, the heat sink itself not only occupies a space but also needs a mounting place on the circuit board to be mounted. As a result, there is a problem that the electronic unit is hindered from being reduced in size and weight, and it cannot be applied when the circuit board is narrow and there is not enough space. In addition, each electronic component requires a dedicated radiator plate or a component such as a screw for attaching the radiator plate, which results in high cost.

The present invention has been made in order to solve the problems and drawbacks of the prior art, and its purpose is to mount an electronic component in a very small space and to radiate heat without increasing the number of components. To provide.

[0007]

In order to achieve the above object, an electronic component mounting method according to the present invention has a structure in which both the first electronic component and the second electronic component operate simultaneously and do not generate heat at the same time. It is applied to a circuit, wherein the first electronic component and the second electronic component are paired, and the outer wall of the first electronic component and the outer wall of the second electronic component are mutually connected to each other. The heat generated by one of the first electronic component and the second electronic component is placed in contact with each other and is transferred from the wall of the outer structure in the high temperature state to the wall of the outer structure of the other hand in the low temperature state. It is characterized by transmitting and radiating heat.

[0008]

According to the method of mounting an electronic component of the present invention, heat is transferred from the external wall of the high temperature electronic component in the heat generating state to the external wall of the low temperature electronic component, which is the opposite hand, and the low temperature The heat is dissipated by the external components of the electronic components.

[0009]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view illustrating an embodiment of a mounting method for electronic components according to the present invention. Further, FIG.
FIG. As shown in FIGS. 1 and 2,
A mounting method M of an electronic component according to the present invention pairs a first electronic component 1 and a second electronic component 2 that do not generate heat by being energized simultaneously. A field effect transistor (FET) or the like is applied to the first electronic component 1 and the second electronic component 2, for example.

The outer wall of the first electronic component 1, for example, the back surface 5 and the outer wall of the second electronic component 2, for example, the back surface 15, are arranged in contact with each other, and The locking hole 1A provided in the locking portion 1B, which is the upper part, and the second electronic component 2
The rivet 8 is pierced through the locking hole 2A provided in the locking portion 2B, which is the upper part, and is caulked, so that both back surface portions 5 and 15 are brought into close contact with each other.

The lead terminals 10 and 20 of the first electronic component 1 and the second electronic component 2 thus integrated are inserted into the lead terminal holes 30A of the circuit board 30 and soldered on the back surface. Connect and fix by.

It occurs when one of the first electronic component 1 and the second electronic component 2 assembled as described above, for example, the first electronic component 1 is energized to operate and heats up to a high temperature. The generated heat is transferred from the rear surface portion 5 of the outer structure in the high temperature state to the rear surface portion 15 of the outer structure of the second electronic component 2 in the low temperature state. The transferred heat is radiated by the external structure of the second electronic component 2. That is, the cold second which is not operating
The low-temperature outer structure of the electronic component 2 acts as a heat dissipation plate.

Next, if the power supply to the first electronic component 1 is stopped and the heat generation is stopped, while the second electronic component 2 is powered and operates to generate heat and reach a high temperature, the generated heat is high. Heat is transferred from the rear surface portion 15 of the outer structure in the state to the rear surface portion 5 of the outer structure of the first electronic component 1 in the low temperature state. The transferred heat is radiated by the external structure of the first electronic component 1. That is, the low-temperature first electronic component 1 that is not operating
The low temperature outside works as a heat sink. As described above, according to the electronic component mounting method of the present invention, both electronic components utilize the heat radiation function of the other external components to radiate the heat generated by themselves. Not only does the heat sink become unnecessary, the installation space can be saved, but the number of parts can be reduced and the cost can be reduced.

Note that FIG. 3 shows an example of a control circuit to which the electronic component mounting method according to the present invention is applied. As shown in the figure, the control circuit 21 includes two p-channel FETs 2
3A, 23B, two n-channel FETs 24A, 24
The reversible motor 22 is normally or reversely rotated by operating the control section 25 of any two of B. For example, the control unit 25 uses the FET 23A and the FE
When T24B is turned on and FET23B and FET24A are turned off, the reversible motor 22 rotates forward. Further, the control unit 25 turns off the FET 23A and the FET 24B,
When T23B and FET24A are turned on, the reversible motor 2
2 rotates in the reverse direction.

Such a control circuit is used for controlling the electric retractable mirror control, controlling the central door lock, controlling the power window, and the like. In the above, the FET
The method of the present invention can be applied with a configuration as shown in FIG. 1 using 23A and 23B as a pair, one as a first electronic component and the other as a second electronic component. Similarly, FETs 24A, 24B
The method of the present invention can be applied with a configuration as shown in FIG. 1 in which one is a first electronic component and the other is a second electronic component.

[0016]

As described above, the mounting method for electronic parts according to the present invention is a method for mounting electronic parts in an electronic unit such as an automobile, which are not energized at the same time and therefore do not generate heat at the same time. Since the heat from the high-temperature electronic components that are in a heat-generating state is radiated from the surface of the low-temperature electronic component that is the opposite hand by making contact with each other in pairs, a heat dissipation plate that mounts and dissipates the components Is not necessary, the number of parts is reduced, and the cost can be reduced. Moreover, there is an advantage that it can be applied without trouble even when the circuit board is small and there is no space in the space. Furthermore, not only the assembling property of the parts is improved, but also the space for mounting the parts can be saved and the electronic unit can be made smaller and lighter, which is effective in each aspect of manufacturing and operation.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating an embodiment of a method of mounting an electronic component according to the present invention.

FIG. 2 is a front view of FIG.

FIG. 3 is a circuit diagram of an example of an electronic circuit to which the method according to the present invention is applied.

FIG. 4 is a perspective view illustrating a conventional electronic component mounting method.

[Explanation of symbols]

 M Electronic Component Mounting Method 1 First Electronic Component 1A Locking Hole 1B Locking Part 2 Second Electronic Component 2A Locking Hole 2B Locking Part 5 Back Part 8 Rivet 10 Lead Terminal 15 Back Part 20 Lead Terminal 30 Circuit Board 30A Lead Terminal hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Gentatsu Matsunaga 206-1 Nunobikibara, Haibara-cho, Haibara-gun, Shizuoka Prefecture Yazaki Parts Co., Ltd.

Claims (1)

[Claims] 1. A first electronic component and a second electronic component, wherein the first electronic component and the second electronic component both operate simultaneously and do not generate heat at the same time. And a wall of the outer structure of the first electronic component and a wall of the outer structure of the second electronic component are arranged in contact with each other, and one of the first electronic component and the second electronic component is A mounting method of an electronic component, wherein the generated heat is transferred from the wall of the outer structure in a high temperature state to the wall of the outer structure in a low temperature state to radiate the heat.